JP2530989B2 - Optical switch module structure - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of an optical switch module.

[0002]

2. Description of the Related Art FIG. 3 is an explanatory view showing a conventional optical switch module structure. In the figure, 1 is a silica-based optical waveguide substrate on which an optical waveguide is formed, 2 is a large radiating fin on which the silica-based optical waveguide substrate 1 is mounted, 3a,
Reference numeral 3b denotes a board with a connector (PC
B), 4 is a connector pin provided on the board with connectors 3a, 3b, and 5 is a connecting wire for electrically connecting the quartz optical waveguide board 1 and the boards with connectors 3a, 3b by wire bonding. Reference numeral 6 is an input-side fiber pigtail with respect to the silica-based optical waveguide substrate 1, and 7 is an output-side fiber pigtail.
Are fixed on the radiation fin 2 by fixing tools 8 and 9.

According to the above construction, the quartz optical waveguide substrate 1 is electrically connected to the external device by connector connection with the external device by the connector pin 4, and the optical signal input from the fiber pigtail 6 on the input side is transmitted. The optical switch module was operated by passing through the waveguide on the quartz optical waveguide substrate 1 and being output from the fiber pigtail 7 on the output side.

[0004]

However, in the above-mentioned conventional optical switch module structure, the fiber pigtail for inputting and outputting the optical signal is adhered and fixed to the end of the silica-based optical waveguide substrate. When a stress is applied to the mounting portion for the optical waveguide substrate, the mounting portion is damaged. Therefore, as a method of fixing the fiber pigtail, a fixing tool is used for fixing the fiber pigtail at a predetermined distance, for example, 20 mm from the mounting portion for the silica optical waveguide substrate. It has a structure to prevent the stress at the time of wiring to the fiber pigtail by fixing it to the heat radiation fin. To fix the fiber pigtail to the heat radiation fin,
The length of the heat radiation fin is 1 for the quartz optical waveguide substrate at the present time.
It must be about 78 (mm), and accordingly, the height from the tip of the heat radiation fin is also increased to about 35 (mm), the heat radiation fin becomes larger, and the quartz optical waveguide substrate is formed on the heat radiation fin. Since the boards with connectors are mounted side by side, the width from the end of one board with connector 3 to the end of the other board with connector is about 120 (mm), which is a large optical switch module. There's a problem.

The present invention secures heat by fixing the fiber pigtail to a radiation fin in order to prevent the attachment of the fiber pigtail and the silica-based optical waveguide substrate from being damaged by the stress applied to the fiber pigtail described above. This was done to solve the problem that the fins become large and the entire optical switch module becomes large, and it is possible to fix the fiber pigtails by preventing damage due to stress applied to the fiber pigtails without increasing the size of the heat radiation fins. By doing so, it is an object of the present invention to provide an optical switch module structure that can be downsized as a whole.

[0006]

To achieve this object, the present invention provides an optical waveguide substrate for processing an optical signal, and an input side connected to the optical waveguide substrate for inputting an optical signal to the optical waveguide substrate. A fiber pigtail, an output-side fiber pigtail connected to the optical waveguide substrate to output an optical signal from the optical waveguide substrate, an electrical circuit board electrically connected to the optical waveguide substrate to process an electrical signal, and In an optical switch module structure including a circuit board and a heat radiation fin that radiates heat generated in the optical waveguide board, the heat radiation fin has a size substantially equal to that of the optical waveguide board and protrudes from both sides of the heat radiation fin. The optical waveguide substrate includes: a fixture having an arm portion having a length; and a mounting member that fixes the fixture and the radiation fin to the back surface of the electric circuit board together. Mounted on a surface of the electric circuit board,
The input side fiber pigtail connected to this optical waveguide board was fixed to one end of the arm protruding from the heat radiation fin of the fixture, and the output side fiber pigtail was fixed to the other end of the arm. Characterize.

[0007]

According to the present invention having the above-described structure, the optical signal input from the input side fiber pigtail is driven by the external device connected through the electric circuit board to pass through the optical waveguide board and the output side fiber pigtail. Is output from. Here, the input and output fiber pigtails are
Since they are respectively fixed to the fixtures protruding from both sides of the radiation fin, the stress applied to the input and output fiber pigtails can be prevented.

[0008]

Embodiments Embodiments will be described below with reference to the drawings. 1 and 2 are explanatory views showing an optical switch module structure in one embodiment of the present invention, FIG. 1 (a) is a plan view of the optical switch module, and FIG. 1 (b) is a side view of the optical switch module. 2A is a bottom view of the optical switch module, and FIG. 2B is a front view of a main part of the optical switch module. In the figure, 10 is a silica-based optical waveguide substrate on which an optical waveguide is formed, and 11 is this silica-based optical waveguide substrate 1.
The fiber pigtail on the input side to the silica-based optical waveguide substrate 10 connected to 0, and the fiber pigtail on the output side to the silica-based optical waveguide substrate 10 connected to the silica-based optical waveguide substrate 10, the fiber pigtail Reference numerals 11 and 12 are adhesively fixed to the end surface of the silica-based optical waveguide substrate 10.

Reference numeral 13 is a ceramic substrate on which a circuit for processing electric signals for driving the silica-based optical waveguide substrate 10 is formed, and 14 is used to adhere and fix the silica-based optical waveguide substrate 10 to the ceramic substrate 13. The quartz optical waveguide substrate 10 is mounted on the surface of the ceramic substrate 13 with a silicon adhesive, and the ceramic substrate 13 is provided with notches for avoiding the fiber pigtails 11 and 12. There is. The ceramic substrate 13 has a size of about 100 × 100 × 2 (mm) here. Reference numeral 15 is a connector pin provided on the ceramic substrate 13, and the quartz optical waveguide substrate 10 and the ceramic substrate 13 are electrically connected by wire bonding (not shown).

Reference numeral 16 is a heat radiation fin attached to the back surface side of the ceramic substrate 13, and the size of the heat radiation fin 16 is reduced to the same size as that of the quartz optical waveguide substrate 10. Reference numeral 17 denotes a fixture for fixing the fiber pigtails 11 and 12. The fixture 17 includes a plate-shaped arm portion 17a having a length protruding from both sides of the heat radiation fin 16 and both ends of the arm portion 17a. Are provided in each
It is composed of a fixing portion 17b for fixing the fiber pigtails 11 and 12.

Reference numeral 18 is a ceramic substrate 13 and a radiation fin 1.
6, a spacer for mounting the radiating fin 16 on the back surface side of the ceramic substrate 13 and a screw 19 projecting from the spacer 18 for radiating the fin 1
The groove portion 1 in which the fin 16a is not formed in the central portion of 6
6b is provided, and a hole 16c into which the screw 19 of the spacer 18 is inserted is formed in the bottom surface of the groove portion 16b. Then, the fixing member 17 is provided in the groove portion 16b of the heat radiation fin 16.
The arm portion 17a of the fixing member 17 is inserted, and the arm portion 17a of the fixture 17 is also provided with a hole into which the screw 19 of the spacer 18 is inserted. Reference numeral 20 is a nut that can be fastened to the screw 19.

Reference numeral 21 denotes a stopper for fixing the fiber pigtails 11 and 12 to the fixing portion 17b at both ends of the fixing member 17, and 22 denotes a stopper 23 for fixing the fiber pigtails 11 and 12 to the fixing portion 17b.
Screws 23 and 24 for fixing the fiber pigtails 11 and 12 fixed by the stopper 21 are silicon rubbers.

In the above structure, in order to attach the heat radiation fin 16 and the fixture 17 to the ceramic substrate 13, the heat radiation fin 16 is coated with silicon grease, and the spacer 18 adhered and fixed to the back surface of the ceramic substrate 13 by a silicon adhesive. Then, the heat radiation fins 16 are mounted so that the holes 16c enter the screws 19. Next, the fixing tool 17 is mounted in the groove portion 16c of the heat radiation fin 16 so that the hole formed in the fixing tool 17 is inserted into the screw 19, and the nut 20 is tightened to the screw 19, whereby the heat radiation fin 16 and the fixing tool 17 are fixed. Together with the ceramic substrate 13. In this way, the spacer 18 for attaching the heat radiation fins 16 to the ceramic substrate 13 is used, and the fixture 17 is also fixed to the ceramic substrate 13 together with the heat radiation fins 16 without using a separate attachment member. This simplifies the assembly process.

The optical waveguide substrate 10 is mounted on the surface of the ceramic substrate 13 with the silicon adhesive 14, and the fixture 1 protruding from both sides of the heat radiation fin 16 is provided.
The fiber pigtails 11 and 12 are sandwiched by the silicon rubbers 23 and 24 on the fixing portions 17b provided at both ends of the arm portion 17a of FIG. 7, and the fasteners 21 are mounted and the screws 22 are tightened. , 12 are fixed to a fixture 17 so that the positions of the fiber pigtails 11 and 12 separated from the mounting portion of the silica-based optical waveguide substrate 10 by a predetermined amount do not move.

Here, the input side fiber pigtail 1
Fixture 1 from the end on the side where 1 is fixed to the end on the side where the fiber pigtail 12 on the output side is fixed
The length of 7 is the same as the size of the ceramic substrate 13 described above.
When it is 00 × 100 (mm), it can be about 140 (mm). Further, the height of the radiation fin 16 from the tip of the fin can be about 23 (mm). Since the fiber pigtails 11 and 12 are adhesively fixed to the end face of the silica-based optical waveguide substrate 10 as described above, the holding force by the stopper 21 is lower than the fixing force by this adhesion.

According to the above configuration, the silica-based optical waveguide substrate 10 is electrically connected to the external device by connector connection with the external device by the connector pin 15, and the optical signal input from the fiber pigtail 11 on the input side is transmitted. The optical switch module operates by passing through the waveguide on the silica-based optical waveguide substrate 10 and being output from the fiber pigtail 12 on the output side.

[0017]

As described above, according to the present invention, the optical waveguide board is mounted on the front surface side of the electric circuit board, the radiation fins are mounted on the back surface side, and the arm portions protruding from both sides of the radiation fin are provided. Attach the fixing tool to the radiating fin, fix the fiber pigtail on the input side to one end protruding from the radiating fin of this fixing tool, and fix the fiber pigtail on the output side to the other end. Since the fins can be downsized and the heat radiation fins can be downsized, there is an effect that the entire optical switch module can be downsized.

Further, since the optical switch module can be downsized, there is an effect that the mounting density on the optical IMC device rack can be increased. Furthermore, since the heat radiation fin and the fixture can be fixed together on the electric circuit board, there is an effect that the assembling process can be simplified.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an optical switch module structure according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing the structure of an optical switch module according to an embodiment of the present invention.

FIG. 3 is an explanatory view showing a conventional optical switch module structure.

[Explanation of symbols]

 10 Quartz-based Optical Waveguide Substrate 11 Fiber Pigtail 12 Fiber Pigtail 13 Ceramic Substrate 16 Radiating Fin 17 Fixing Tool 18 Spacer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Jiro Utsunomiya 1-7-12 Toranomon, Minato-ku, Tokyo Inside Oki Electric Industry Co., Ltd. (72) Inventor Saburo Iida 1-7-12 Toranomon, Minato-ku, Tokyo Oki Denki Kogyo Co., Ltd. (72) Inventor Ryo Nagase 1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (72) Inventor Akira Himeno 1-1-6, Uchiyuki-cho, Chiyoda-ku, Tokyo Japan Telegraph and Telephone Corporation (72) Inventor Kuniharu Kato 1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (72) Inventor Masayuki Okuno 1-1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation Telephone Co., Ltd. (56) Reference JP-A-2-73207 (JP, A)

Claims (1)

(57) [Claims] 1. An optical waveguide substrate for processing an optical signal, an input side fiber pigtail connected to the optical waveguide substrate for inputting an optical signal to the optical waveguide substrate, and an optical waveguide substrate connected to the optical waveguide substrate. Output side fiber pigtail for outputting an optical signal from the optical circuit board, an electric circuit board electrically connected to the optical waveguide board to process the electric signal, and a radiation fin for radiating heat generated in the electric circuit board and the optical waveguide board In the optical switch module structure including, the heat dissipation fin has a size comparable to that of the optical waveguide substrate, and a fixture having arm portions projecting from both sides of the heat dissipation fin, and the fixture. An optical waveguide board mounted on the front surface of the electric circuit board; The input side fiber pigtail connected to the plate is fixed to one end of the arm protruding from the heat radiation fin of the fixture, and the output side fiber pigtail is fixed to the other end of the arm. Optical switch module structure.