JP2531777B2 - Copper alloy rolled foil for flexible printing - Google Patents
Copper alloy rolled foil for flexible printingInfo
- Publication number
- JP2531777B2 JP2531777B2 JP1045610A JP4561089A JP2531777B2 JP 2531777 B2 JP2531777 B2 JP 2531777B2 JP 1045610 A JP1045610 A JP 1045610A JP 4561089 A JP4561089 A JP 4561089A JP 2531777 B2 JP2531777 B2 JP 2531777B2
- Authority
- JP
- Japan
- Prior art keywords
- foil
- copper alloy
- plating
- thickness
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011888 foil Substances 0.000 title claims description 29
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 19
- 239000012535 impurity Substances 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 24
- 238000005530 etching Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- VAKIVKMUBMZANL-UHFFFAOYSA-N iron phosphide Chemical compound P.[Fe].[Fe].[Fe] VAKIVKMUBMZANL-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000969 carrier Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、フレキシブルプリント用銅合金圧延箔に係
り、詳細には、たとえば、プリント回路、テープキャリ
ヤなどの配線回路に使用されるフレキシブルプリント用
銅合金圧延箔に関するものである。さらに詳しくは、極
微細加工性、Snめっき被覆時の耐ウイスカ性、耐熱性お
よび導電性に優れるフレキシブルプリント用銅合金圧延
箔に関するものである。Description: TECHNICAL FIELD The present invention relates to a copper alloy rolled foil for flexible printing, and more specifically, for flexible printing used in wiring circuits such as printed circuits and tape carriers. The present invention relates to a copper alloy rolled foil. More specifically, the present invention relates to a copper alloy rolled foil for flexible printing, which is excellent in ultrafine workability, whisker resistance when coated with Sn plating, heat resistance and conductivity.
［従来の技術］ プリント回路などの電気回路には５〜40μｍの厚さの
銅箔が多用されている。このような銅箔には電解銅箔と
圧延銅箔がある。[Prior Art] Copper foil with a thickness of 5 to 40 μm is frequently used for electric circuits such as printed circuits. Such copper foil includes electrolytic copper foil and rolled copper foil.
プリント回路基板には、ガラスエポキシ、紙フェノー
ルなどの基板上に銅箔をクラッドした後、レジストエッ
チング法により所望の回路パターンに形成した基板のほ
かに、ポリイミドなどのフィルムに銅箔を張り合せでき
るフレキシブル回路基板もある。これらの一部はテープ
キャリヤ、TAB（Tape Automated Bonding）リードとし
て半導体チップの実装に使用されている。フレキシブル
回路基板にはフレキシビリティの点で優る圧延箔が使用
される。For printed circuit boards, after clad with copper foil on a substrate such as glass epoxy or paper phenol, you can attach a copper foil to a film such as polyimide in addition to a substrate formed into a desired circuit pattern by resist etching method. There is also a flexible circuit board. Some of these are used for mounting semiconductor chips as tape carriers and TAB (Tape Automated Bonding) leads. Rolled foil, which is superior in flexibility, is used for the flexible circuit board.
近年、電気機器の小型化と高密度化と多機能化にとも
なって、プリント回路基板の高密度が強く求められてお
り、このため小型チップ部品を高密度実装ができる表面
実装方式が次第に採用され始めた。In recent years, with the miniaturization, high density, and multi-functionalization of electrical equipment, there is a strong demand for high density of printed circuit boards. Therefore, the surface mounting method capable of high density mounting of small chip components is gradually adopted. I started.
テープキャリヤやTABのリードは、最近では、ピッチ
間距離が80μｍ以下にも近接するようになってきてい
る。Recently, tape carriers and TAB leads have come close to each other with a pitch distance of 80 μm or less.
［発明が解決しようとする課題］ 圧延箔としては通常タフピッチ銅および無酸素銅が使
用されているが、いずれもリードとして使用する場合、
電子デバイスと接合する部分は厚さ５μｍのNi下地めっ
きを形成し、さらに、その上に厚さ１μｍのAuめっきを
形成している。[Problems to be Solved by the Invention] Tough pitch copper and oxygen-free copper are usually used as rolled foils, but when both are used as leads,
In the portion to be joined to the electronic device, a Ni undercoat having a thickness of 5 μm is formed, and further, a Au plating having a thickness of 1 μm is formed thereon.
配線のリード間ピッチが80μｍと狭い接続部分には上
記のNi下地めっきとAuめっき被覆が常識とされていた。It was common knowledge that the above-mentioned Ni undercoat and Au plating were coated on the connection portion where the lead pitch of the wiring was as narrow as 80 μm.
Ni下地めっき上にAuめっきを行ったものは信頼性の高
いものではあるが、高価なものであるため、それに代る
安価なSnめっきが試みられている。しかし、Snめっきの
場合は短時間でのウイスカ発生による配線間の短絡が生
ずるという課題がある。一方、ウイスカ対策のためSnめ
っきに代えはんだめっきが検討されている。しかし、は
んだめっきでははんだ密着性不良という不具合いが生じ
るため、この考え方は実用化には至っていない。Although Au plating over Ni undercoating is highly reliable, it is expensive, so inexpensive Sn plating has been attempted instead. However, in the case of Sn plating, there is a problem that short circuits between wirings occur due to whiskers occurring in a short time. On the other hand, solder plating is being considered instead of Sn plating to prevent whiskers. However, solder plating has a problem of poor solder adhesion, so this idea has not been put to practical use.
本発明は銅合金系圧延箔に係るもので、従来のCu圧延
箔の代りに、接合部およびその近傍のめっきを、Niめっ
きとAuめっきの２層めっきからSnめっきないしはんだめ
っきに置き代えることが可能となり、しかも、そのSnめ
っき層がウイスカを全く生じず、はんだ接合時の280℃
での加熱によっても母材が軟化せず、錫およびはんだの
剥離も150℃×1000Hr保持後にも起こらず、また、強度
導電率も高い箔であって、しかも、５μｍの厚さで80μ
ｍ程度のピッチでレジストエッチングしても目標通りに
非常にきれいにエッチングできるフレキシブルプリント
用銅合金圧延箔を提供することを目的とする。The present invention relates to a copper alloy-based rolled foil, in which the conventional Cu rolled foil is replaced with a plating in the joint and its vicinity by replacing two-layer plating of Ni plating and Au plating with Sn plating or solder plating. In addition, the Sn plating layer does not cause whiskers at all, and the solder joint temperature is 280 ℃.
The base material does not soften even when heated at 80 ° C, the peeling of tin and solder does not occur even after holding at 150 ℃ × 1000Hr, and the foil has high strength and electrical conductivity, and the thickness of 5μm is 80μ.
It is an object of the present invention to provide a copper alloy rolled foil for flexible printing, which can be etched very neatly as intended even if the resist is etched at a pitch of about m.
［課題を解決するための手段］ 本願発明の第１の要旨は、Fe:0.05〜0.20％、P:0.02
〜0.05％、Zn:1.0〜5.0％（ただし、1.0％は除く）を必
須的に含有し、残部Cuからなるフレシキブルプリント用
銅合金箔において、不純物Ｓを10ppm以下に制限したこ
とを特徴とするフレシキブルプリント用銅合金箔に存在
する。[Means for Solving the Problems] The first gist of the present invention is that Fe: 0.05 to 0.20%, P: 0.02.
.About.0.05%, Zn: 1.0 to 5.0% (excluding 1.0%) as an essential component, and a copper alloy foil for flexible print comprising the balance Cu, characterized in that the impurity S is limited to 10 ppm or less. Present in copper alloy foil for flexible printing.
本願発明の第２の要旨は、Fe:0.05〜0.20％、P:0.02
〜0.05％、Zn:1.0〜5.0％（ただし、1.0％は除く）を必
須的に含有し、残部Cuからなるフレシキブルプリント用
銅合金箔において、不純物Ｓを10ppm以下に制限し、ま
た、Ｓ以外の不純物と酸素との合計を50ppm以下に制限
したことを特徴とするフレシキブルプリント用銅合金箔
に存在する。The second gist of the present invention is Fe: 0.05 to 0.20%, P: 0.02
-0.05%, Zn: 1.0-5.0% (excluding 1.0%) as an essential component, and in the copper alloy foil for flexible prints, the balance of which is Cu, the impurity S is limited to 10 ppm or less, and other than S Exists in the copper alloy foil for flexible prints, which is characterized by limiting the total amount of the impurities and oxygen to 50 ppm or less.
本発明の第３の要旨は、箔の厚さを40μｍ以下とした
ことを特徴とする請求項１または請求項２に記載のフレ
キシブルプリント用銅合金圧延箔に存在する。A third aspect of the present invention resides in the copper alloy rolled foil for flexible printing according to claim 1 or 2, wherein the foil has a thickness of 40 µm or less.
［作 用］ 本発明の含有元素の作用効果および限定理由を説明す
る。[Operation] The function and effect of the contained element of the present invention and the reason for limitation will be described.
Znは、Sn被覆材のウイスカ発生を制御し、Snめっきな
いしはんだめっきの密着性を向上させ、導電率を高め
る。そのためには、１％を超えてZnを含有させる必要が
ある。Zn controls the generation of whiskers in the Sn coating material, improves the adhesion of Sn plating or solder plating, and increases the conductivity. For that purpose, it is necessary to contain Zn in excess of 1%.
Znを１％を超えて含有させると、密着性を悪くする金
属間化合物（Cu3Sn）相の生成を抑制でき、Cu3Sn相の母
材側に生ずるカーケンダールホイドの生成を抑制でき、
密着性が向上するものと考えられる。When Zn is contained in an amount of more than 1%, it is possible to suppress the formation of an intermetallic compound (Cu 3 Sn) phase that deteriorates the adhesiveness, and suppress the formation of Kirkendall hood that occurs on the base metal side of the Cu 3 Sn phase. ,
It is considered that the adhesion is improved.
また、Snめっき中へ微量のZnが拡散し、Snの内部応力
を緩和するため、ウイスカ成長を制御していると思われ
る。In addition, it is thought that whisker growth is controlled because a small amount of Zn diffuses into the Sn plating and relaxes the internal stress of Sn.
しかし、Znが５％を超えると耐ウイスカ性には問題は
ないが、導電率が60％IACS未満となったり、黄銅独特の
応力腐食割れを生じやすい性質を保有してくるという短
所が表れてくるので、Znは５％以下とする。However, if the Zn content exceeds 5%, whisker resistance will not be a problem, but the electrical conductivity will be less than 60% IACS, and there will be disadvantages such that brass has the property of easily causing stress corrosion cracking. Therefore, Zn should be 5% or less.
次に不純物Ｓに許容量の上限を定めた理由について記
述する。従来の銅合金においては、銅合金中ではＳは多
くはCuSとして存在し、MnあるいはMgが不純物として含
有されていると、MnSとして存在する。いずれも、粒界
中に局在し、そのためにエッチング時の不具合が生じる
ことを知見した。従来の銅合金においては、特に、５〜
40μｍ厚さの箔となるとレジストエッチングする場合に
エッチング液をはじいたりして、エッチングむらなどの
不具合を生じていた。本発明者は、その原因の探究を行
った。その結果、その原因はＳに存在することを知見し
た。したがって、不具合の発生を防ぐためには、Ｓを完
全に除去することが望ましいが、原料・炉材、被覆木
炭、燃料などからの混入は避け難く、10ppm以下と定め
た。Next, the reason why the upper limit of the allowable amount of the impurity S is set will be described. In the conventional copper alloy, most of S exists in the copper alloy as CuS, and when Mn or Mg is contained as an impurity, it exists as MnS. It was found that all of them are localized in the grain boundaries, which causes problems during etching. In conventional copper alloys, especially 5 to
When the thickness of the foil was 40 μm, the etching solution was repelled when resist etching was performed, and problems such as uneven etching occurred. The present inventor investigated the cause. As a result, it was found that the cause was in S. Therefore, in order to prevent the occurrence of defects, it is desirable to completely remove S, but it is unavoidable to mix it from raw materials / furnace materials, coated charcoal, fuel, etc.
また、酸素とＳ以外の不純物とについても、不純物が
酸化物の状態で存在すると、５〜40μｍの厚さの箔で
は、上記のＳと同様、エッチング時の微細加工を阻害す
ることが分かり、50ppm以下と定めた。Also, regarding oxygen and impurities other than S, when the impurities exist in the state of oxides, it is found that, in the case of a foil having a thickness of 5 to 40 μm, as in the case of S described above, it hinders fine processing during etching, It was defined as 50ppm or less.
Ｓ、酸素および不純物は、厚さが0.1mm以上の板・条
では、表面に現れても、それらの化合物の大きさ・数・
量は僅かであり、通常混入する量を制限する必要はない
が、厚さ５〜40μｍの箔になると、圧延時のピンホール
の発生、圧延切れ、さらには、前述のレジストの接着不
良、エッチング不良などが生じることを本発明者は知見
し、前述の上限に定める。S, oxygen, and impurities, even if they appear on the surface of a plate or strip with a thickness of 0.1 mm or more, the size, number, and
Although the amount is small, it is not usually necessary to limit the amount to be mixed, but when the foil has a thickness of 5 to 40 μm, pinholes are generated during rolling, rolling is broken, and further, the above-mentioned resist adhesion failure and etching. The present inventors have found that defects and the like occur, and set the above-mentioned upper limit.
FeはＰと燐化鉄を形成し、強度の向上とはんだ付け温
度条件での軟化を防止するための必須の元素である。し
かし、0.05％未満ではＰ（含有量0.02〜0.05％）の一部
と化合して、燐化鉄を形成しても、強度向上の効果は期
待できない。また、Fe含有量が0.15％を超えると、燐化
鉄を形成し得ない固溶Feが増加し、導電率を低下させる
ように作用する。よって、Feの含有量は0.05〜0.15％と
する。Fe is an essential element for forming iron phosphide with P, improving strength and preventing softening under soldering temperature conditions. However, if it is less than 0.05%, even if it is combined with a part of P (content 0.02 to 0.05%) to form iron phosphide, the effect of improving the strength cannot be expected. On the other hand, when the Fe content exceeds 0.15%, the amount of solid solution Fe that cannot form iron phosphide increases, which acts to reduce the conductivity. Therefore, the Fe content is 0.05 to 0.15%.
ＰはFeと燐化鉄を形成して強度の向上、軟化温度の向
上に寄与する元素であるが、含有量が0.02％未満では強
度向上等に寄与できる程ではなく、含有量が0.05％を超
えると燐化鉄を形成し得ない固溶Ｐが増加し、導電率を
低下させるようになる。よって、Ｐ含有量は0.02〜0.05
％とする。P is an element that forms iron and iron phosphide to improve strength and softening temperature, but if the content is less than 0.02%, it does not contribute to strength improvement and the content is 0.05%. When it exceeds, the amount of solid solution P that cannot form iron phosphide increases, and the conductivity decreases. Therefore, the P content is 0.02 to 0.05.
%.
［実施例］ 以下、本発明を実施例によって説明する。[Examples] Hereinafter, the present invention will be described with reference to Examples.
第１表に示す各種合金を黒鉛ツボで溶解して、金型鋳
造した。鋳塊を機械加工により表裏面を各2.5mm面削し
て50mmt×70mmw×200mmlとし、900℃の温度で厚さ10mm
まで熱間圧延し、600℃以上の温度から水冷し、スケー
ル除去後厚さ0.2mmまで冷間圧延し、ついで500℃×1Hr
の中間焼鈍を行った。次に、入念に酸洗し、さらに冷間
圧延を繰り返し、厚さ35μｍの箔を製作し、ピンホー
ル、圧延切れを観察した。Various alloys shown in Table 1 were melted in a graphite pot and cast into a mold. The front and back sides of the ingot are machined to 2.5mm each to 50mmt x 70mmw x 200mml, and a thickness of 10mm at 900 ℃.
Hot-rolled up to 600 ℃, water-cooled, scale removed, cold-rolled to a thickness of 0.2mm, then 500 ℃ × 1Hr
Intermediate annealing was performed. Next, after carefully pickling and repeating cold rolling, a foil having a thickness of 35 μm was manufactured, and pinholes and rolling cuts were observed.
また、同様の手順によって、厚さ５μｍと65μｍの箔
とを作製した。Further, foils having a thickness of 5 μm and a thickness of 65 μm were produced by the same procedure.
（エッチング性） これらの箔について、幅100μｍ、間隔80μｍ、長さ2
0μｍで50本のレジストを焼きつけ、塩化第２鉄溶液40
％でケミカルミーリングして、50本のリードを製作その
健全性を調査した。(Etching property) These foils have a width of 100 μm, a gap of 80 μm, and a length of 2
Baking 50 resists at 0 μm, ferric chloride solution 40
% Of 50 leads were manufactured by chemical milling and their soundness was investigated.
（ウイスカの発生程度） アルカリ中で電界脱脂後硫酸浴中で電流密度3A/dm2に
よって厚さ1.5μｍのSnめっきを行い、エポキシ樹脂系
の接着材でSnめっきと反対側面を0.2mm銅合金板で貼り
つけ、曲げによって約4kg/mm2の圧縮応力を加え、室温
で１年間放置後、ウイスカの発生の有無を調査した。(Amount of whiskers generated) After electric field degreasing in alkali, Sn plating with a thickness of 1.5 μm was performed in a sulfuric acid bath with a current density of 3 A / dm 2 , and an epoxy resin adhesive was used for Sn plating and the opposite side was 0.2 mm copper alloy. After sticking with a plate and applying a compressive stress of about 4 kg / mm 2 by bending and leaving it for 1 year at room temperature, it was examined whether whiskers were generated.
（軟化特性、導電率） 軟化特性については、木炭で被覆下で電気炉中で1Hr
保持し、引張強度の６割の値を維持する温度を求めた。
導電率は、JISH0505に基づいた。(Softening characteristics, conductivity) Regarding softening characteristics, 1Hr in an electric furnace under charcoal coating
The temperature was maintained and the temperature at which 60% of the tensile strength was maintained was determined.
The conductivity was based on JISH0505.
以上の試験結果をまとめて第１表に示した。 The above test results are summarized in Table 1.
Znを１〜５％含む合金は、表面にSnめっきが行われて
も、ウイスカが生ずることもなく、また、Ｓおよび酸素
とその他の不純物とを規制することによって厚さ５〜40
μｍの箔においてもレジストエッチング後の不良率が２
％以上と良好となった。The alloy containing 1 to 5% of Zn does not cause whiskers even if Sn plating is applied to the surface, and the thickness of the alloy is 5 to 40% by controlling S and oxygen and other impurities.
Even with a foil of μm, the defect rate after resist etching is 2
It was good at over%.
特に、他の合金箔では、５〜40μｍと厚みが薄くなる
と、エッチング性の低下が著しいが、本発明の合金では
ほとんど低下しない。In particular, in the case of other alloy foils, when the thickness is reduced to 5 to 40 μm, the etching property is remarkably deteriorated, but the alloy of the present invention hardly deteriorates.
また、はんだ付けなどの加熱によっても、1Hrの加熱
によっても、軟化温度280℃以上を示している。なお、
表中には従来合金としてタフピッチ銅（No.8）を併記し
た。In addition, the softening temperature of 280 ° C. or higher is exhibited both by heating such as soldering and by heating for 1 hour. In addition,
In the table, tough pitch copper (No. 8) is also shown as a conventional alloy.
［発明の効果］ 本発明によれば、従来のNiとAuとのめっきの代わり
に、Snめっきを行っても、ウイスカ性を全く生ずること
もない。[Effects of the Invention] According to the present invention, whiskers are not generated at all even when Sn plating is performed instead of the conventional plating of Ni and Au.
また、極微細加工後の歩留も向上する。 Further, the yield after ultrafine processing is also improved.
さらに、従来材より格段に優れる引張強度を有してい
る。Furthermore, it has a far superior tensile strength than conventional materials.
このように、本発明は、フレキシブルプリント用銅合
金箔として優れた特性を有しており、電子機器の小型化
高密度実装化、多機能化のための材料として優れた特性
を有している。As described above, the present invention has excellent properties as a copper alloy foil for flexible printing, and has excellent properties as a material for downsizing, high-density mounting, and multifunction of electronic devices. .
───────────────────────────────────────────────────── フロントページの続き (72)発明者 田中 仁 福岡県北九州市門司区片上１番32号 (56)参考文献 特開 昭63−133402（ＪＰ，Ａ) 特開 昭64−11931（ＪＰ，Ａ) 特開 昭64−12539（ＪＰ，Ａ) 特開 昭63−310935（ＪＰ，Ａ) 特開 昭64−56842（ＪＰ，Ａ) 特開 昭63−93837（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hitoshi Tanaka 1-32 Katagami, Moji-ku, Kitakyushu, Fukuoka Prefecture (56) References JP-A-63-133402 (JP, A) JP-A-64-11931 (JP, A) JP 64-12539 (JP, A) JP 63-310935 (JP, A) JP 64-56842 (JP, A) JP 63-93837 (JP, A)
Claims (3)
0.02〜0.05％、Zn:1.0〜5.0％（ただし、1.0％は除く）
を必須的に含有し、残部Cuからなるフレシキブルプリン
ト用銅合金箔において、不純物Ｓを10ppm以下に制限し
たことを特徴とするフレシキブルプリント用銅合金箔。1. Fe: 0.05 to 0.20% (same as below by weight%), P:
0.02 to 0.05%, Zn: 1.0 to 5.0% (excluding 1.0%)
A copper alloy foil for flexible prints, which essentially contains, and has the balance Cu, wherein the impurity S is limited to 10 ppm or less.
0〜5.0％（ただし、1.0％は除く）を必須的に含有し、
残部Cuからなるフレシキブルプリント用銅合金箔におい
て、不純物Ｓを10ppm以下に制限し、また、Ｓ以外の不
純物と酸素との合計を50ppm以下に制限したことを特徴
とするフレシキブルプリント用銅合金箔。2. Fe: 0.05-0.20%, P: 0.02-0.05%, Zn: 1.
Essentially contains 0-5.0% (excluding 1.0%),
A copper alloy foil for flexible print, comprising the balance Cu, wherein the impurity S is limited to 10 ppm or less, and the total amount of impurities other than S and oxygen is limited to 50 ppm or less.
する請求項１または請求項２に記載のフレキシブルプリ
ント用銅合金圧延箔。3. The rolled copper alloy foil for flexible printing according to claim 1, wherein the foil has a thickness of 40 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1045610A JP2531777B2 (en) | 1989-02-27 | 1989-02-27 | Copper alloy rolled foil for flexible printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1045610A JP2531777B2 (en) | 1989-02-27 | 1989-02-27 | Copper alloy rolled foil for flexible printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02225638A JPH02225638A (en) | 1990-09-07 |
| JP2531777B2 true JP2531777B2 (en) | 1996-09-04 |
Family
ID=12724139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1045610A Expired - Fee Related JP2531777B2 (en) | 1989-02-27 | 1989-02-27 | Copper alloy rolled foil for flexible printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531777B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4524471B2 (en) | 2004-08-30 | 2010-08-18 | Ｄｏｗａメタルテック株式会社 | Copper alloy foil and manufacturing method thereof |
| WO2013153771A1 (en) * | 2012-04-13 | 2013-10-17 | 日本発條株式会社 | Copper-based circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133402A (en) * | 1986-11-21 | 1988-06-06 | 古河電気工業株式会社 | Foil for electric circuit |
| JPH0815170B2 (en) * | 1987-07-07 | 1996-02-14 | 株式会社ジャパエナジー | Method of manufacturing film carrier |
| JPS63310935A (en) * | 1987-06-11 | 1988-12-19 | Kobe Steel Ltd | High electroconductive copper alloy having excellent migration resistance |
| JPH08940B2 (en) * | 1987-07-03 | 1996-01-10 | 古河電気工業株式会社 | Copper alloy for flexible printing |
| JP2505481B2 (en) * | 1987-08-27 | 1996-06-12 | 日鉱金属株式会社 | Copper alloy foil for flexible circuit boards |
-
1989
- 1989-02-27 JP JP1045610A patent/JP2531777B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02225638A (en) | 1990-09-07 |
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