JP2534839B2 - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JP2534839B2 JP2534839B2 JP6232734A JP23273494A JP2534839B2 JP 2534839 B2 JP2534839 B2 JP 2534839B2 JP 6232734 A JP6232734 A JP 6232734A JP 23273494 A JP23273494 A JP 23273494A JP 2534839 B2 JP2534839 B2 JP 2534839B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- temperature
- heat
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating processes for reflow soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は半田付け装置に関し、特
にプリント基板を外部から加熱することにより、プリン
ト基板に部品を半田付けする半田付け装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device, and more particularly to a soldering device for soldering a component to a printed board by heating the printed board from the outside.
【０００２】[0002]
【従来の技術】従来の半田付け装置は、赤外線ランプや
ハロゲンランプ等の発熱ランプを使用し、プリント基板
を所定時間照射して半田付けに適した温度に加熱し、プ
リント基板に部品を半田付けしている。2. Description of the Related Art A conventional soldering apparatus uses a heat generating lamp such as an infrared lamp or a halogen lamp, irradiates a printed circuit board for a predetermined time to heat it to a temperature suitable for soldering, and solders components to the printed circuit board. are doing.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このような従
来の半田付け装置では、発熱ランプの配置状態や照射時
間等によってプリント基板上に大きな温度差が生じ易
く、プリント基板の半田付け領域を一様に所定温度とす
ることが困難であり、このため半田付けの信頼性が低下
するという問題点を有している。However, in such a conventional soldering apparatus, a large temperature difference is likely to occur on the printed circuit board depending on the arrangement state of the heat generating lamps, the irradiation time, etc., so that the soldering area of the printed circuit board is reduced. As described above, it is difficult to maintain the temperature at a predetermined temperature, and therefore, there is a problem that reliability of soldering is lowered.
【０００４】本発明の目的は、プリント基板上の温度分
布が一様に所定温度となるように加熱制御でき、半田付
けの信頼性を向上できる半田付け装置を提供することに
ある。An object of the present invention is to provide a soldering apparatus which can control heating so that the temperature distribution on the printed circuit board uniformly reaches a predetermined temperature and improve the reliability of soldering.
【０００５】[0005]
【課題を解決するための手段】本発明の半田付け装置
は、プリント基板を加熱してプリント基板上の部品を半
田付けする半田付け装置において、制御信号に応じて発
熱量を制御しながら前記プリント基板を外部から加熱す
る加熱手段と、前記プリント基板上に設けられて温度に
よって変色する感熱材と、前記プリント基板を撮像する
カラーテレビカメラと、このカラーテレビカメラからの
画像データに基づき前記感熱材の温度を示す温度データ
を出力する画像処理手段と、前記温度データに基づき前
記プリント基板が一様に所定温度となるように前記制御
信号を生成する温度制御手段とを備える。The soldering apparatus of the present invention is a soldering apparatus for heating a printed circuit board to solder components on the printed circuit board, while controlling the amount of heat generation according to a control signal. A heating means for heating the substrate from the outside, a heat sensitive material provided on the printed circuit board and discolored by temperature, a color television camera for imaging the printed circuit board, and the heat sensitive material based on image data from the color television camera. Image processing means for outputting temperature data indicating the temperature of the printed circuit board, and temperature control means for generating the control signal so that the printed circuit board uniformly reaches a predetermined temperature based on the temperature data.
【０００６】本発明の半田付け装置は、プリント基板を
加熱してプリント基板上の部品を半田付けする半田付け
装置において、前記プリント基板の半田付け領域を複数
に分割しこの複数の領域を外部からそれぞれ加熱する複
数の発熱源と、これら複数の発熱源の発熱量を制御信号
に応じてそれぞれ制御する発熱制御手段と、前記プリン
ト基板の前記複数の領域にそれぞれ設けられ温度によっ
て変色する感熱材と、前記プリント基板を撮像するカラ
ーテレビカメラと、このカラーテレビカメラからの画像
データに基づき前記複数の領域毎の前記感熱材の温度デ
ータを出力する画像処理手段と、前記温度データに基づ
き前記プリント基板の各半田付け領域が一定温度となる
ように前記制御信号を生成する温度制御手段とを備え
る。The soldering apparatus of the present invention is a soldering apparatus for heating a printed circuit board to solder components on the printed circuit board, wherein a soldering area of the printed circuit board is divided into a plurality of areas, and the plurality of areas are externally connected. A plurality of heat sources to be respectively heated, heat generation control means for controlling heat generation amounts of the plurality of heat sources according to control signals, and a heat sensitive material provided in each of the plurality of regions of the printed circuit board to change color depending on temperature. A color television camera for imaging the printed circuit board, image processing means for outputting temperature data of the heat-sensitive material for each of the plurality of regions based on image data from the color television camera, and the printed circuit board based on the temperature data And temperature control means for generating the control signal so that each soldering area has a constant temperature.
【０００７】[0007]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【０００８】図１は本発明の一実施例を示す図であり、
ここでは、発熱器４によりプリント基板１を加熱して、
プリント基板に部品２ａ，２ｂ，２ｃをそれぞれ半田付
けする。FIG. 1 is a diagram showing an embodiment of the present invention.
Here, the printed circuit board 1 is heated by the heater 4,
The components 2a, 2b and 2c are soldered to the printed circuit board.
【０００９】ところで、プリント基板１の表面には、図
２に示すように、半田付けする部品２ａ，２ｂ，２ｃの
他に、各部品の近傍に感熱材３ａ，３ｂ，３ｃを配設し
ている。感熱材は、特定の温度になったときに特定の色
に変色するものや、温度に応じて色が変化していくもの
等があるが、半田付けに適した温度になると特定の色に
変色するものを選定する。また、プリント基板１の半田
付け領域をＡ，Ｂ，Ｃにそれぞれ分割し、半田付け領域
Ａには部品２ａおよび感熱材３ａを、領域Ｂには部品２
ｂおよび感熱材３ｂを、領域Ｃには部品２ｃおよび感熱
材３ｃをそれぞれ配置している。By the way, as shown in FIG. 2, on the surface of the printed circuit board 1, heat sensitive materials 3a, 3b and 3c are provided in the vicinity of the respective parts 2a, 2b and 2c to be soldered. There is. Some heat-sensitive materials change color to a specific color when the temperature reaches a specific temperature, and those that change color depending on the temperature.The color changes to a specific color when the temperature is suitable for soldering. Select what you want to do. Further, the soldering area of the printed circuit board 1 is divided into A, B, and C, respectively.
b and the heat sensitive material 3b are arranged in the region C, and the component 2c and the heat sensitive material 3c are arranged in the area C, respectively.
【００１０】さて、図１において、発熱器４は、発熱源
４１ａ，４１ｂ，４１ｃおよび発熱制御部４２ａ，４２
ｂ，４２ｃをそれぞれ有しており、発熱源４１ａが半田
付け領域Ａを、発熱源４１ｂが半田付け領域Ｂを、発熱
源４１ｃが半田付け領域Ｃをそれぞれ加熱するように配
設されている。また、発熱制御部４２ａ，４２ｂ，４２
ｃは、温度制御部７からの制御信号Ｃａ，Ｃｂ，Ｃｃを
それぞれ受けて発熱源４１ａ，４１ｂ，４１ｃの発熱量
を制御する。In FIG. 1, the heat generator 4 includes heat sources 41a, 41b and 41c and heat generation control sections 42a and 42.
b and 42c respectively, and the heat source 41a is arranged so as to heat the soldering area A, the heat source 41b to heat the soldering area B, and the heat source 41c to heat the soldering area C. Further, the heat generation control units 42a, 42b, 42
c receives the control signals Ca, Cb, and Cc from the temperature controller 7, and controls the heat generation amount of the heat sources 41a, 41b, and 41c.
【００１１】カラーテレビカメラ５は、プリント基板１
を撮像して画像データＤ１を画像処理部６へ送出する。
画像処理部６は、カラーテレビカメラ５からの画像デー
タＤ１に基づきプリント基板１上の各感熱材３ａ，３
ｂ，３ｃの色を検出し、検出した色データに基づき各感
熱材３ａ，３ｂ，３ｃの温度を示す温度データＤ２を出
力する。この場合、色データを温度データに変換するた
めの変換テーブルを予め設定しておき、この変換デーブ
ルを参照して温度データＤ２を生成する。The color television camera 5 includes a printed circuit board 1
Is imaged and the image data D1 is sent to the image processing unit 6.
The image processing unit 6 uses the image data D1 from the color television camera 5 to detect the heat-sensitive materials 3a, 3a on the printed circuit board 1.
The colors b and 3c are detected, and temperature data D2 indicating the temperatures of the heat sensitive materials 3a, 3b and 3c are output based on the detected color data. In this case, a conversion table for converting color data into temperature data is set in advance, and the temperature data D2 is generated by referring to this conversion table.
【００１２】温度制御部７は、温度データＤ２に基づき
プリント基板１の温度分布状態を検知し、プリント基板
１の各半田付け領域が所定の温度になるように制御信号
をＣａ，Ｃｂ，Ｃｃをそれぞれ生成し、発熱制御部４２
ａ，４２ｂ，４２ｃへ出力する。表示器８は、カラーテ
レビカメラ５が撮像したプリント基板１の画像および温
度データ等を画面上に表示する。The temperature controller 7 detects the temperature distribution state of the printed circuit board 1 based on the temperature data D2 and outputs control signals Ca, Cb, Cc so that each soldering area of the printed circuit board 1 reaches a predetermined temperature. Each is generated and the heat generation control unit 42
a, 42b, 42c. The display 8 displays an image of the printed circuit board 1 captured by the color television camera 5 and temperature data on the screen.
【００１３】このようにすることにより、プリント基板
の半田付け領域全体を半田付けに適した所定温度に大き
な温度差が生じることなく加熱できる。By doing so, the entire soldering area of the printed board can be heated without causing a large temperature difference to a predetermined temperature suitable for soldering.
【００１４】なお、発熱源４１としてはハロゲンランプ
やレーザビームであってもよく、また、ホットエアある
いはヒータチップ等を使用しても同様な効果が得られ
る。、ホットエアあるいはヒータチップ等を使用しても
同様な効果が得られる。A halogen lamp or a laser beam may be used as the heat source 41, and the same effect can be obtained by using hot air or a heater chip. The same effect can be obtained by using hot air, a heater chip, or the like.
【００１５】[0015]
【発明の効果】以上説明したように本発明によれば、温
度によって変色する感熱材を半田付けする部品と共にプ
リント基板上に配設し、感熱材の色変化をカラーテレビ
カメラで撮像し、感熱材の色からプリント基板の温度分
布状態を検知してプリント基板を加熱する発熱源を制御
することにより、プリント基板を一様に所定温度に加熱
することができ、半田付けの信頼性を向上できる。As described above, according to the present invention, a heat sensitive material that changes color depending on temperature is arranged on a printed circuit board together with a component to be soldered, and the color change of the heat sensitive material is imaged by a color television camera. By detecting the temperature distribution state of the printed circuit board from the color of the material and controlling the heat source that heats the printed circuit board, the printed circuit board can be uniformly heated to a predetermined temperature and the reliability of soldering can be improved. .
【図１】本発明の一実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】図１に示したプリント基板１の表面図である。FIG. 2 is a front view of the printed circuit board 1 shown in FIG.
１ プリント基板 ２ａ，２ｂ，２ｃ 部品 ３ａ，３ｂ，３ｃ 感熱材 ４ 発熱器 ４１ａ，４１ｂ，４１ｃ 発熱源 ４２ａ，４２ｂ，４２ｃ 発熱制御部 ５ カラーテレビカメラ ６ 画像処理部 ７ 温度制御部 Ｄ１ 画像データ Ｄ２ 温度データ 1 Printed Circuit Board 2a, 2b, 2c Parts 3a, 3b, 3c Heat Sensitive Material 4 Heater 41a, 41b, 41c Heat Source 42a, 42b, 42c Heat Generation Control Section 5 Color Television Camera 6 Image Processing Section 7 Temperature Control Section D1 Image Data D2 Temperature data
Claims (2)
の部品を半田付けする半田付け装置において、制御信号
に応じて発熱量を制御しながら前記プリント基板を外部
から加熱する加熱手段と、前記プリント基板上に設けら
れて温度によって変色する感熱材と、前記プリント基板
を撮像するカラーテレビカメラと、このカラーテレビカ
メラからの画像データに基づき前記感熱材の温度を示す
温度データを出力する画像処理手段と、前記温度データ
に基づき前記プリント基板が一様に所定温度となるよう
に前記制御信号を生成する温度制御手段とを備えること
を特徴とする半田付け装置。1. A soldering device for heating a printed circuit board to solder components on the printed circuit board, the heating means heating the printed circuit board from the outside while controlling the amount of heat generation according to a control signal; A heat-sensitive material provided on a substrate and changing color with temperature, a color television camera for capturing an image of the printed circuit board, and image processing means for outputting temperature data indicating the temperature of the heat-sensitive material based on image data from the color television camera. And a temperature control unit that generates the control signal so that the printed circuit board uniformly reaches a predetermined temperature based on the temperature data.
の部品を半田付けする半田付け装置において、前記プリ
ント基板の半田付け領域を複数に分割しこの複数の領域
を外部からそれぞれ加熱する複数の発熱源と、これら複
数の発熱源の発熱量を制御信号に応じてそれぞれ制御す
る発熱制御手段と、前記プリント基板の前記複数の領域
にそれぞれ設けられ温度によって変色する感熱材と、前
記プリント基板を撮像するカラーテレビカメラと、この
カラーテレビカメラからの画像データに基づき前記複数
の領域毎の前記感熱材の温度データを出力する画像処理
手段と、前記温度データに基づき前記プリント基板の各
半田付け領域が一定温度となるように前記制御信号を生
成する温度制御手段とを備えることを特徴とする半田付
け装置。2. A soldering device for heating a printed circuit board to solder a component on the printed circuit board, wherein a plurality of heat-generating regions are formed by dividing a soldering area of the printed circuit board into a plurality of areas and heating the plurality of areas from the outside. A heat source, heat generation control means for controlling heat generation amounts of the plurality of heat sources according to control signals, heat sensitive materials provided in the plurality of regions of the printed circuit board and discolored by temperature, and an image of the printed circuit board. A color television camera, image processing means for outputting temperature data of the heat-sensitive material for each of the plurality of areas based on image data from the color television camera, and soldering areas of the printed circuit board based on the temperature data. A soldering device, comprising: temperature control means for generating the control signal so that a constant temperature is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6232734A JP2534839B2 (en) | 1994-09-28 | 1994-09-28 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6232734A JP2534839B2 (en) | 1994-09-28 | 1994-09-28 | Soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0897548A JPH0897548A (en) | 1996-04-12 |
| JP2534839B2 true JP2534839B2 (en) | 1996-09-18 |
Family
ID=16943945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6232734A Expired - Lifetime JP2534839B2 (en) | 1994-09-28 | 1994-09-28 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2534839B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100368006B1 (en) * | 2000-11-28 | 2003-01-14 | 유일반도체 주식회사 | Heater assembly and heating system of a substrate utilizing the same |
| DE202017105967U1 (en) * | 2017-09-29 | 2018-01-31 | Airbus Operations Gmbh | Color-based heating system |
| KR101881449B1 (en) * | 2018-02-12 | 2018-07-24 | 주식회사 쎌텍 | Reflow soldering machine |
-
1994
- 1994-09-28 JP JP6232734A patent/JP2534839B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0897548A (en) | 1996-04-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960514 |