JP2552476B2 - High-speed plating device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a high-speed plating apparatus for partially plating a work surface.

[Conventional technology]

When a work such as etching or plating is applied to a work in electroplating work, if the object to be processed is housed in a processing chamber having a relatively small volume and the processing is performed while the processing solution is flowing, the processing solution close to the surface of the work It is known that processing can be done in a short period of time, because, for example, Japanese Patent Publication Sho 60
There is one disclosed in Japanese Patent Laid-Open No. 1958. This is provided with a plating chamber whose both ends are open, and a pair of holders which are arranged so that they can be inserted into and removed from the plating chamber and close both open ends of the plating chamber. The plating treatment is performed by holding the plating chamber in the plating chamber.

[Problems to be solved by the invention]

However, in such a structure, masking treatment is performed to protect the non-processed surface of the work, and the plating solution is discharged every time the work is finished to empty the plating chamber, and then the work is replaced. In order to have to
There was a problem that workability could not always be improved.

[Means for solving problems]

The present invention has been made in view of the above circumstances, and provides a high-speed plating apparatus capable of improving workability. A high-speed plating apparatus according to the present invention includes a main body having a plurality of liquid passages formed in a V-shaped cross section and opened upward at the top, and a plurality of works facing the opening and only a portion to be plated. A work jig that is supported in a state of being exposed downward, an upper electrode that presses the work to seal the space between the work and the liquid passage via a sealing material, and a work jig that is arranged facing the upper electrode to the main body. A pair of guide rails that engage the lower electrodes provided with the flanges projecting from both sides of the work jig and guide the work jig from the work jig conveying device to above the main body, and An elevating device that elevates and lowers the guide rail between a plating position where the work jig is mounted on the main body and a transfer position where the work jig is separated upward from the main body; and the work jig along the guide rail. It is obtained by a transfer device for workpiece fixture for reciprocating between said transport position and the transport device.

[Action]

In the present invention, when the work jig is positioned above the main body and the work is pressed from above by the upper electrode, the top opening of the liquid passage is sealed by the work so that only the plated portion of the work comes into contact with the plating solution. Therefore, a plurality of works are plated at the same time while being supported by the work jig.

〔Example〕

An embodiment of the present invention will be described in detail below with reference to the drawings.
FIG. 1 is a sectional view showing a main part of a high-speed plating apparatus according to the present invention, and FIG. 2 is a perspective view showing the same whole. In these drawings, reference numeral 1 indicates a work such as a rocker arm of an engine. Reference numeral 2 denotes a plate-shaped work jig that supports the four works 1 ... In the state of being fitted into the recessed portions 3. 4 is a transfer device for transferring the work jig 2,
The carrying device 4 is composed of a carrying rail 5 supported so as to face each other, and a plurality of rollers 6 supported by the carrying rail 5 so as to be rotatable.

Reference numeral 11 denotes a plating processing unit disposed in the middle of the transfer device 3. The plating unit 11 is provided with a main body 12 to which a plating solution is supplied, and flanges 13 provided on both sides of the main body 12 and projecting from both side surfaces of the work jig 2.
And guide rails 14, 14 for guiding the work jig 2 to the upper side of the main body 12 by holding the guide rails 14, and a cylinder device as a lifting device according to the present invention for driving the guide rails 14, 14 up and down. 15, 15 and a plurality of upper electrodes 16 facing the main body 12 via the work jig 2 and the like. Inflow passage 17 for flowing the plating solution into the main body 12
Further, an outflow passage 18 for outflowing the plating liquid is provided in parallel to the length direction, and these passages are connected by a plurality of flow passages 19 provided in the width direction of the main body 12. Liquid passage 19
Is formed in a V shape in cross section and is opened upward at the top. Reference numeral 21 is a concave portion provided on the upper surface of the main body 1, and 22 is a protruding portion provided on the lower surface of the work jig 2 so as to face the concave portion 21. That is, the work jig 2 is a cylinder device.
When the guide rail 14 is lowered at 15, the protrusion 22 fits into the recess 21, so that it is supported in a state of being positioned on the upper surface of the main body 12. Reference numeral 23 denotes a sealing material loaded in an annular groove 24 provided on the bottom surface of the concave portion 21 of the main body 12.
And the work jig 2 are sealed.

The concave portion 3 of the work jig 2 is provided in a portion facing the opening of the liquid passage 19 so that the work 1 faces the opening of the liquid passage 19. Only the plated portion of the work 1 is exposed downward at the bottom. An opening is provided. Reference numeral 25 denotes a sealing material provided on the edge of the opening, which elastically deforms when the work 1 is pressed by the upper electrode 16 and seals between the work 1 and the opening of the liquid passage 19.

The upper electrode 16 is disposed by a support plate 26 at a position facing the liquid passage 19 via the work jig 2, and is supported by a cylinder device 27 so as to be able to move up and down. Also the upper electrode 16
Has flanges on both upper and lower ends, a projection 28 for engaging the work 1 is provided on the lower end flange, and a power supply wiring connected to the negative side of the DC power supply on the upper end flange.
29 is connected.

Reference numeral 31 is a lower electrode arranged so as to face the upper electrode 16. The lower electrode 31 is a recess 32 provided on the bottom surface of the liquid passage 19.
Is fixed to the main body 12 with bolts 33, and the upper surface is the liquid passage.
It is exposed within 19. Reference numeral 34 is a copper bus bar electrically connected to the bolt 33, and is connected to the positive side of the direct current by the power supply wiring 35.

Reference numeral 41 denotes a plating liquid tank in which a plating liquid such as a chromic acid solution is stored, and is arranged below the main body 12. 42 is a supply pipe that connects the plating liquid tank 41 and the inflow path 17 of the main body 12,
Reference numeral 43 denotes a recovery pipe that connects the plating liquid tank 41 and the outflow passage 18 with each other. An inflow path for sucking up the plating solution in the middle of the supply pipe 42
A pump 44 for pumping pressure is provided in the inside.

Reference numeral 51 denotes a cylinder device arranged at a portion of the transfer device 4 that faces the plating processing unit 11, and is connected to the plating processing unit 11 to perform a plating process on the work jig 2 that is transferred on the transfer rail 5. This is for returning the work jig 2 that has been supplied or plated to the transport rail 5 again. The cylinder device 51 constitutes the work jig transfer device according to the present invention.

In the high-speed plating apparatus configured as described above, the cylinder jig 51 supplies the work jig 2 above the main body 12,
First, the main body 12 is positioned at the carrying position. Next, when the cylinder devices 15 and 15 are driven to lower the guide rails 14 and 14, the projecting portion 22 fits into the recessed portion 21 and the work jig 2 is supported by the main body 12 and positioned at the plating position. Here, when the upper electrode 16 is lowered by the cylinder device 27, the work 1 is pressed and the space between the work 1 and the liquid passage 19 is sealed by the sealing material 25.
Will be sealed through.

Therefore, the top opening of the liquid passage 19 can be sealed by utilizing the plated portion of the work 1. When the pump 44 is driven in this state, the plating liquid flows in the liquid passage 19 and the work 1 is plated. Since the plating liquid comes into contact with only the portion, it is possible to simultaneously perform the plating treatment while the plurality of works 1 are supported by the work jig 2. Here, since the liquid passage 19 is V-shaped, it is possible to flow the plating liquid so as to abut the portion to be plated of the work 1 and to make the contact more effectively.

Then, after the plating process is completed, the pump 44 is stopped and the upper electrode 16 and the guide rails 14, 14 are raised, so that the work jig 2 is separated upward from the main body 12. At this time, the liquid passage 19 is unsealed, but the structure is such that the top of the liquid passage 19 is opened.If the pump 44 is stopped, the plating liquid will flow down due to gravity, so the plating liquid may overflow. Absent. The work jig 2 lifted from the main body 12 is returned to the transfer device 4 by the cylinder device 51 and transferred to the next step.

Therefore, since it is possible to perform the plating process only on the plated portions of the plurality of works 1, it is not necessary to perform the masking process. Further, by opening the top of the liquid passage 19, the plating liquid does not overflow even when the work jig 2 is detached from the main body 12. Therefore, the plating liquid is discharged when the work is replaced. There is no need to empty the inside of the main body 12.

The high-speed plating apparatus according to the present invention may perform the plating process as described above, and the work 1 may be subjected to the etching process by connecting the upper electrode 16 to the plus side and the lower electrode 31 to the minus side. it can.

〔The invention's effect〕

As described above, according to the present invention, a main body having a plurality of liquid passages formed in a V-shape in cross section and opened upward at the top, and a plurality of works facing the opening and a portion to be plated. Since the work jig is supported in a state where only the work is exposed downward, and the upper electrode that seals between the work and the liquid passage through the seal material by pressing the work is provided, the plated portion of the work Can be used to seal the top opening of the liquid passage, and the plating liquid can be brought into contact with only the plated portions of the plurality of works.

Therefore, it is possible not only to perform the plating treatment only on the plated portions of the plurality of workpieces, but also to prevent the plating solution from overflowing when the workpieces are replaced. As a result, the work of masking the non-processed surface of the work,
Workability can be improved because the work of discharging the plating solution when replacing the work is not required.

Further, since the top of the liquid passage formed in a V-shape in cross section is opened and the opening is closed by the plated portion of the work, the plated portion changes the flowing direction of the plating liquid in the liquid passage. Therefore, new plating liquid is always supplied to the plated portion in the plating process, and when the plating liquid flows, it always passes through the plated portion. Therefore, the plating process can be performed efficiently, and the plating process can be performed in a short time.

Further, when closing the opening of the liquid passage with the portion to be plated, the work and the work jig are pressed from above by the upper electrodes, and the guide rails that engage with the flanges on both sides of the work jig are lowered by the lifting device. Since it is configured by this, the driving force of the lifting device is applied to both sides of the work jig via the flange and the guide rail in addition to the pressing force applied from the upper electrode. Therefore, even if the flow rate of the plating solution is high, the plating solution does not leak from the seal portion, so that the flow rate of the plating solution can be increased to further improve the plating efficiency and further shorten the plating process time. You can

Furthermore, the guide rail is configured to guide the work jig from the work jig conveying device to above the opening,
Further, since the work jig transfer device for reciprocating the work jig along the guide rail is provided, the work jig transfer device for transferring the work jig in the order of the manufacturing process of the work transfers the guide rail and the work jig. After being conveyed above the opening by the device, the guide rail is lowered by the elevating device to start the plating process. For this reason, the plating process can be performed without removing the work and the work jig from the transfer system, so that the time required to transfer the work from the pre-process to the plating process or from the plating process to the post-process may be short.

Therefore, according to the high-speed plating apparatus according to the present invention,
Not only the time for plating can be shortened, but also the time for transferring the work between the plating step and the preceding and subsequent steps can be shortened, and the time for the entire plating step can be shortened.

[Brief description of drawings]

FIG. 1 is a sectional view showing a main part of a high-speed plating apparatus according to the present invention, and FIG. 2 is a perspective view showing the same as a whole. 1 …… Workpiece, 2 …… Work jig, 12 …… Main body, 14 ……
Guide rail, 16 …… upper electrode, 17 …… inflow path, 18 ……
Outflow passage, 19 ... Liquid passage, 23 ... Sealing material.

Claims (1)

(57) [Claims] 1. A main body, which is formed in a V-shaped cross section between a parallel inflow path and an outflow path and is communicated with a plurality of liquid paths opened upward at the top, and an upper surface of the main body. And a work jig that is supported in a state in which a plurality of works are opposed to the opening and only the plated portion is exposed downward, and the work jig is capable of moving up and down to a portion facing the opening through the work jig. An upper electrode which is disposed and seals the space between the work and the liquid passage through a sealing material by pressing the work, a lower electrode which is disposed on the main body so as to face the upper electrode, and the work jig A pair of guide rails which are engaged with flanges projecting on both sides and guide the work jig from the work jig conveying device to above the main body, and these work guide jigs are attached to the main body. Plating position and the book And a transfer position for moving the work jig back and forth between the work jig transfer device and the transfer device along the guide rail. A high-speed plating device, which is equipped with a device.