JP2553387B2 - Bonding device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a bonding apparatus for performing wire bonding or die bonding on a faux made of a material that is easily oxidized.

[Prior Art] The case of wire bonding will be described below as an example. When a material that easily oxidizes, such as a copper-based material, is used for the substrate (including the lead frame) itself or the leads formed on the substrate, the substrate of the faux is heated as shown in Japanese Patent Publication No. 53-9838, for example. A cover-type sample transfer path is formed by covering the upper part of the heat block with a cover, and a reducing gas or an inert gas or a mixed gas of a reducing gas and an inert gas (hereinafter referred to as a reducing gas) is formed in the faux transfer path. , And the bonding is done through a bonding window formed on the cover to prevent oxidation of the faux.

Further, as shown in Japanese Patent Laid-Open No. 59-25232, there is also known one in which a cover plate which covers a cover and has a bonding window is provided so as to interlock with an XY table for driving a bonding tool in the XY directions. ing.

[Problems to be Solved by the Invention] In the above-described conventional technique, most of the reducing gas supplied into the fuchs conveying path flows out through the bonding window.

By the way, the organic resin applied to the substrate material, the bad mark ink applied on the die, and the organic components in the die attachment adhesive are heated by the heat block and evaporated.
Since this organic component is blown out from the bonding window together with the reducing gas, the organic component adheres to components such as the camera, the bonding tool, and the clamper located above the bonding window, resulting in dirt on the camera and dirt on the wire path.

If organic components adhere to the lens surface of the camera, image recognition failure will occur. Further, if the organic component adheres to the constituent parts of the wire path, the wire cannot be fed smoothly, a wire loop shape defect occurs, and a wire breakage occurs.

Therefore, conventionally, it was necessary to clean the components of the camera and the wire path about once a day.

Also, for example, when N ₂ H ₂ gas is used as the reducing gas, most of the gas in the fuchs conveyance path is blown out from the small bonding window having the size necessary for bonding, so the H ₂ concentration near the bonding window is reduced. Is high and dangerous.

An object of the present invention is to provide a bonding apparatus capable of reducing the amount of gas containing an organic component discharged from a bonding window and preventing an increase in H ₂ concentration.

[Means for Solving the Problem] Means of the present invention for achieving the above-mentioned object are a closed work transfer path for transferring a work made of a material whose surface easily oxidizes, and a work transfer path disposed in the work transfer path. A heating block for heating the work, a gas supply means for making a reducing gas atmosphere in the work transfer path, and a bonding tool for performing bonding through a bonding window provided so as to communicate with the work transfer path from above. A gas exhaust unit configured to exhaust a gas containing an organic component generated from the work from the work by the heating of the heat block from the work transport path, and transporting the work to a bonding window while heating the work in the work transport path. In a bonding apparatus that performs a bonding process with a bonding tool, the gas supply unit is the work The first gas supply means is arranged near the entrance of the transfer path, and the second gas supply means is arranged near the front of the bonding window for bonding. The gas exhaust means is provided in the work transfer path. It is characterized in that it is arranged between the first gas supply means and the second gas supply means.

[Action]

Most of the gas containing an organic component generated from the work being transported while being heated by the heat block in the transport path is supplied to the first gas supply means near the inlet of the transport path and the second gas near the bonding window. The gas is exhausted by a gas exhaust means arranged between the gas supply means.

And the gas blown out from the bonding window is mainly
The reducing gas is supplied from the second gas supply means.
As a result, the bonding area can be kept in a stable reducing gas atmosphere, the work can be effectively prevented from oxidizing, and the gas containing the organic components generated from the work does not adversely affect the bonding and the cleaning frequency can be improved. Is drastically reduced.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. In this embodiment, as shown in FIG. 6, a plurality of dies 3 (3a, 3b, 3c, 3d, 3e) are formed on a substrate 2 on which leads 1 are formed.
The following shows the case where the present invention is applied to a wire bonding apparatus for connecting wires to the pads of the die 3 and the leads 1 in the fake 4 to which is attached.

First, the same parts as in the conventional example will be described, then, although not conventionally known, a structure unrelated to the features of the present invention will be described, and finally, an embodiment of a structure that is a feature of the present invention will be described.

First, a known structure will be described. The hooks 4 are positioned and mounted on the carrier 5 at equal intervals.
Inside the housing 10 in which the guide grooves 10a for guiding both sides of the are formed, a heat block 11 which is vertically driven by a vertically driving means (not shown) is arranged. The carrier 5 is pitch-fed by inserting the feed claws 12. This feed claw 12
Is fixed to a claw lever 13 which is driven in the up and down direction and the X direction by a driving means (not shown). A fook holding plate 14 having a fook holding part 14a for pressing the both sides of the faux 4 which is still in the bonding part against the heat block 11 is provided, and the fook holding plate 14 is moved up and down by a driving means (not shown). .

A bonding head 20 is disposed on the side of the housing 10 corresponding to the fuch presser plate 14, and a bonding arm 22 having a bonding tool 21 fixed to one end of the bonding head 20 is provided as a vertical driving means (not shown). It is provided so that it can be driven up and down. A camera support arm 23 is fixed to the bonding head 20, and the camera support arm 23 has the bonding tool 21 attached thereto.
A television camera 24, which is arranged with a certain distance offset in the X direction, is fixed. The bonding head
20 is fixed on an XY table 25 having a known structure.
The XY table 25 is a Y table whose lower stage is driven in the Y direction.
It is 26, and the upper table is driven in the X direction by the X table.
It is 27.

Next, a structure which has not been publicly known in the past but has no relation to the features of the present invention will be described. Rollers 30 and 31 are arranged on both sides of the housing 10 corresponding to the fuch presser plate 14, and both sides of the rollers 30 and 31 are rotatably supported by roller support plates 32 and 33 fixed to the housing 10. Has been done. Here, the rollers 30 and 31 are arranged such that the upper surfaces thereof coincide with the upper surface of the faux pressing plate 14 or are positioned slightly below the upper surface of the faux pressing plate 14. A shielding plate 34 made of a bendable thin plate is hung on the rollers 30 and 31. One end of the shield plate 34 is fixed to the Y table 26 of the XY table 25 through a roller 35 rotatably supported by the roller support plate 33. A spring 36 is attached to the other end of the shield plate 34.
The other end of the spring 36 is hooked on a spring hooking pin 37 fixed to the fixing portion of the device. The shielding plate 34
At the portion corresponding to the bonding tool 21, a small bonding window 34a necessary for wire bonding work of one die 3 is formed.

Next, one embodiment of the structure that characterizes the present invention will be described. Covers 50 and 51 are fixed to the upper surface of the housing 10 on the left side (loader side) and the right side (unloader side) of the shielding plate 34 so as to cover the heat block 11. On the shield plate 34 side of the covers 50 and 51, slide surfaces 50a and 51a on which the lower surface of the shield plate 34 slides are provided, and eaves portions 50b and 51b are provided at the tip ends of the slide surfaces 50a and 51a. There is. Further, the covers 50 and 51 are formed with claw escape holes 50c and 51c into which the feed claws 12 are inserted. A slide groove 50d is formed in the cover 50 along the claw escape hole 50c, and a slide plate 52 is slidably arranged in the slide groove 50d. Further, the slide plate 52 is formed with a pawl insertion hole 52a into which the feed pawl 12 is inserted, and the feed pawl 12 is inserted into the pawl escape hole 50c through the pawl insertion hole 52a.

Grooves 50e and 50f are formed on the lower surface of the cover 50 at the inlet side and the outlet side of a fook conveying path 53 formed by the housing 10 and the cover 50, the grooves 50e and 50f being orthogonal to the fook conveying path 53.
First and second gas supply pipes 54 and 55 are provided at e and 50f. Also, adjacent to the groove 50f, the groove 50e
g is formed, and the gas exhaust pipe 56
Are arranged. The first gas supply pipe 54 has gas ejection holes 54a formed directly below and obliquely downward in the inlet side direction, and the second gas supply pipe 55 also similarly has gas ejection holes 54a downward and obliquely downward in the outlet side direction. 55a is formed, and a gas suction hole 56a is formed in the gas exhaust pipe 56 directly below and obliquely downward in the inlet side direction.

Gas exhaust pipe 56 of the first gas supply pipe 54
In the upper surface of the cover 50 between the
The gas reservoir 50h has a large number of gas ejection holes 50i penetrating the hook conveying path 53. Further, a cover 57 is fixed to the cover 50 so as to cover the gas storage chamber 50h, and the gas storage chamber 50h is attached to the cover 57.
A third gas supply pipe 58 for supplying a reducing gas to is fixed.

Next, the operation of the bonding device having such a structure will be described with reference to FIG.

First, the operation of the characteristic configuration of the present invention will be described. Gas supply first, second and third gas supply pipes
Reducing gas is externally supplied to 54, 55, and 58.
Further, the gas exhaust pipe 56 is connected to a suction means for sucking from the outside. The reducing gas supplied to the first gas supply pipe 54 is supplied from the gas ejection holes 54a to the fuke carrier passage 53.
A part of the gas blows out into the inside of the fuchs conveying path 53 to prevent air from flowing in from the entrance side, and a part of the inside of the faux conveying path 53 becomes a gas atmosphere. Similarly, the reducing gas supplied to the second gas supply pipe 55 is also ejected from the gas ejection holes 55a into the fuchs conveying path 53, and a part of the reducing gas flows into the bonding window 34a so that the air inflows from the bonding window 34a. To prevent this, a part of the inside of the faux transport path 53 is made into a gas atmosphere. The reducing gas supplied to the third gas supply pipe 58 enters the gas storage chamber 50h, and is ejected from the gas ejection holes 50i to the fuchs conveying path 53 to make the inside of the fooks conveying path 53 into a gas atmosphere.

By the way, as described in the section of the problem to be solved by the invention, the organic component generated by heating the faux 4 is
Bonding window 34 together with the reducing gas in the fuchs carrier path 53
Although it flows toward a, it is exhausted from the gas suction hole 56a of the gas exhaust pipe 56 before that. For this reason, the bonding window 3
Blowout of organic components from 4a is reduced.

As a result, almost no organic component adheres to the lens, wire clamper, etc. at the tip of the camera 24, so that it can be detected clearly, and there is no wire breakage or wire loop abnormality due to dirt on the clamp surface, and good wire bonding is possible. Also, for maintenance, the number of cleanings for stains is improved once a month, which significantly reduces the number of cleanings.

Next, the operation of the configuration unrelated to the features of the present invention will be described. The state in which the television camera 24 is located above the bonding center line 60 shown in FIG. 5 will be described. That is, since the TV camera 24 is offset from the bonding tool 21 by a certain distance in the X direction, the TV camera 24 is moved above the bonding window 34a by moving the X table 27 by the offset distance from the state shown in FIG. Located.

First, while the heat block 11 is in the lowered state, the carrier 5 is fed by the feed claws 12 by one pitch, and the die 3a for the first bonding of the hook 4 is positioned on the bonding center line 60 as shown in FIG. 5 (a). Then, the Y table 26 is moved in the Y direction and the television camera 24 is positioned above the die 3a which is first bonded. In this case, since the shield plate 34 has one end fixed to the Y table 26, it moves together with the Y table 26 when it moves in the Y direction as described above. That is, the bonding window 34 of the shielding plate 34
The a is also located above the die 3a that is first bonded. When the carrier 5 is sent and the die 3a to be bonded first is located at the bonding center line 60 as described above, the heat block 11 is lifted and the faux 4 is pressed against the faux holding plate 14 and clamped. TV camera with hook 4 clamped and as described above
After 24 is located above the first bonded die 3a, the pattern of the die 3a portion is detected by the television camera 24 through the bonding window 34a, and the position of the bonding point is corrected by an arithmetic device (not shown).

Next, the X table 27 is driven by the offset distance between the bonding tool 21 and the television camera 24 so that the bonding tool 21 is located above the die 3a, that is, the bonding window 34a. Then, the bonding tool 21 follows the corrected bonding data of the die 3a part.
The XY table 25 is driven to connect wires to the pads of the die 3a and the leads 1. Since this wire connecting method is well known, its detailed description is omitted.

When all the wire bonding of the die 3a part is completed,
Next, as shown in FIG. 5 (b), the Y table 26 is driven in the Y direction so that the television camera 24 and the bonding window 34a are located above the second die 3b. In the same manner as described above, the putter of the die 3b portion is detected through the bonding window 34a, and the position of the bonding point is corrected by the arithmetic unit (not shown). After that, the bonding tool 21 is moved to the die 3, that is, the bonding window as described above.
The X table 27 is driven by an offset distance between the bonding tool 21 and the television camera 24 so as to be located above 34a. And the bonding tool 21 is the die
The XY table 25 is driven according to the corrected bonding data of the 3b portion, and the wire bonding of the die 3b portion is performed.

Next, the heat block 11 descends to release the clamp on the faux 4. After that, the carrier 5 is sent 1 pitch and 3
The second die 3c is sent to the bonding center line 60, and then the heat block 11 is lifted as described above.
The television camera 24 and the bonding window 34a are driven in the Y direction and positioned above the die 3c, and the pattern of the die 3c is detected. After that, the bonding tool 21 is driven in the X direction and positioned above the die 3c as described above.
Wire bonding of the portion of the die 3c is performed. This completes the wire bonding of one faux 4. After that, the same operation as described above is repeated to perform wire bonding of the next faux 4.

In addition, in the above-described embodiment, the case where the invention is applied to the wire phone ding device has been described.
It can also be applied to a die-bonding device for bonding. In this case, it goes without saying that the bonding tool 21 needs to be configured to suck the die 3 with a vacuum device. When applied to a die bonding apparatus, dirt on the camera and dirt on the suction part of the bonding tool are prevented.

Although the case where the fuchs 4 is placed on the carrier 5 and the carrier 5 is sent has been described, the substrate 2 itself is sent if the substrate 2 is a long one such as a lead frame and does not need to be attached to the carrier 5. You may

Further, although the case where the faux holding plate 14 is provided has been described, the faux holding plate 14 may be omitted depending on the type of the faux 4.

Further, the structure in which the covers 50 and 51 are fixed to the housing 10 has been described, but the covers 50 and 51 may be fixed to the heat block 11 as shown in, for example, JP-A-59-25232.

Although the case where the shielding plate 34 is provided has been described, the shielding plate 34 may not be provided, and the covers 50 and 51 may be provided with a bonding window of a size necessary for bonding. Of course, the cover
It goes without saying that 50 and 51 may be one member.

Further, as a gas supply means for making most of the inside of the fuchs conveyance path 53 into a gas atmosphere, it is supplied to the gas storage chamber 50h and ejected from the gas ejection hole 50i. However, the first gas supply pipe 54 or the second A large number of gas supply pipes having the same structure as the gas supply pipe 55 may be arranged.

[Effects of the Invention] As is clear from the above description, according to the bonding apparatus of the present invention, most of the gas containing an organic component generated from the work conveyed while being heated by the heat block in the conveyance path The gas is exhausted by the gas exhaust means arranged between the first gas supply means near the entrance of the transport path and the second gas supply means near the front of the bonding window. And the gas blown out from the bonding window is
The reducing gas is mainly supplied from the second gas supply means. As a result, the bonding area can be kept in a stable reducing gas atmosphere, the work can be effectively prevented from being oxidized, and the bonding by the gas containing the organic components generated from the work is not adversely affected. Is drastically reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
FIG. 3 is an enlarged sectional view of the cover portion, FIG. 4 is a sectional view taken along the line BB of FIG. 1, and FIG. 5 (a).
(B) and (c) are plan views showing the position of the bonding window of the shielding plate, and FIG. 6 is a plan view showing an example of the faux. 4: Hook, 10: Housing, 11: Heat block, 21: Bonding tool, 34a: Bonding window, 50, 51: Cover, 50h: Gas storage chamber, 50i: Gas ejection hole, 53: Fook transportation path, 54, 55 : First and second gas supply pipes, 54a, 55a: Gas ejection hole 56: Gas exhaust pipe, 56a: Gas suction hole, 57: Cover, 58: Gas supply pipe.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masafumi Kudaka 1-1, Yamashita-cho, Kokubun-shi, Kagoshima Kyocera Co., Ltd. Kokubun Factory, Kagoshima (72) Tsutomu Oda 1-1, Yamashita-cho, Kokubun-shi, Kagoshima Kyocera Kagoshima Kokubu Plant Co., Ltd. (56) Reference JP-A-59-92539 (JP, A) JP-A-59-23534 (JP, A)

Claims (1)

(57) [Claims] 1. A closed work transfer path for transferring a work made of a material whose surface is easily oxidized, a heat block for arranging the work transfer path to heat the work, and a inside of the work transfer path. It contains a gas supply means for making a reducing gas atmosphere, a bonding tool for bonding through a bonding window provided so that the work transfer path communicates from above, and an organic component generated from the work by heating the heat block. A gas exhausting means for exhausting gas from the work transfer path, transferring the work to a bonding window while heating the work in the work transfer path, and performing a bonding process with a bonding tool. ,
It comprises a first gas supply means arranged in the vicinity of the inlet of the work transfer path and a second gas supply means arranged in front of the bonding window for bonding, wherein the gas exhaust means is the work transfer path. A bonding apparatus arranged between the first gas supply means and the second gas supply means therein.