JP2553393B2 - Bonder tool cleaning mechanism - Google Patents

Description

The present invention relates to a bonder tool cleaning mechanism used for an inner lead bonder, an outer lead bonder, a bump transfer bonder, a pellet bonder, and the like.

[Prior Art] Conventionally, as a tool cleaning mechanism for a bonder, for example, one disclosed in JP-A-63-16956 is known.
With this structure, air is blown onto the upper surface of a cleaning member such as a grindstone for cleaning the tool by a blower pipe, and the air is sucked by the duct means to prevent scattering of dust generated during cleaning.

[Problems to be Solved by the Invention] In the above-described conventional technology, since air is blown from one side to the other side with the tool in the middle during cleaning, the air hitting the tool flows in the lateral direction of the tool and dust is generated in the duct means. There was a problem that it was not completely sucked. There is also a problem that dust flowing in the bonding station direction adheres to the surface of the semiconductor and the bonded semiconductor component becomes defective.

An object of the present invention is to provide a bonder tool cleaning mechanism capable of effectively sucking dust generated during cleaning.

[Means for Solving the Problems] The above object is for a bonder provided with a cleaning member such as a grindstone for cleaning a tool for pressure-bonding leads and bumps of a film carrier, and duct means for sucking dust generated during cleaning. In the tool cleaning mechanism, the duct means includes a suction path that is disposed above the cleaning member and has a sealed periphery, and a duct that includes a tool insertion hole into which a tip of the tool is inserted. To be achieved.

[Operation] Since the duct surrounds the tool at the time of cleaning, dust can be sucked from around the tool. As a result, the dust does not scatter around and is effectively sucked into the duct.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. A support block 2 is fixed on an XY table 1 having a well-known structure that is driven in the XY direction by driving means (not shown). A vertically movable block 4 is attached to the support block 2 via a vertically arranged cross roller 3 so as to be vertically movable.
A vertically mounted stage support shaft 5 is rotatably supported on the vertical movement block 4 via a bearing 6, and a bond stage 7 is fixed to the upper surface of the stage support shaft 5.

Further, a shaft holder 10 is fixed to the vertical movement block 4, and an eccentric shaft 11, which is disposed horizontally and can be adjusted vertically, is rotatably supported on the shaft holder 10. An adjusting lever 12 is fixed to an end of the eccentric shaft 11, and the adjusting lever 12 is formed with a vertical groove 12a. The shaft of the lock screw 13 is inserted in the vertical groove 12a, and the screw of the lock screw 13 is
It is screwed to. The nut 14 is loosely fitted in a lateral groove 15a of a support plate 15 fixed to the vertically moving block 4. A cam follower 16 is fixed to the eccentric shaft 11.
The cam follower 16 is a linear cam 17 having a cam surface on the upper surface.
The linear cam 17 is horizontally moved by an air cylinder 18 fixed to the XY table 1. A guide block 19 for guiding the bottom surface of the linear cam 17 is fixed on the XY table 1 corresponding to the linear cam 17, and guide rollers 20 for guiding both side surfaces of the linear cam 17 are rotatably supported on the guide block 19. ing.

Therefore, when the lock screw 13 is loosened and the adjustment lever 12 is rotated, the eccentric shaft 11 rotates and the stage support shaft 5 and the bond stage 7 move up and down together with the up-and-down moving block 4, so that the vertical position of the bond stage 7 is adjusted. be able to. When the air cylinder 18 is operated, the vertical moving block 4 moves up and down together with the cam follower 16 according to the cam surface of the linear cam 17, and the bond stage 7 moves up and down.

The upper side of the stage support shaft 5 and the bond stage 7
Are formed with suction holes 5a and 7a for vacuum-sucking the pellet 25, and a pipe 26 which is evacuated by a vacuum source (not shown) is fixed to the suction hole 5a. The stage support shaft 5 has an adjusting lever for adjusting the rotation direction of the pellet 25.
A shaft 28 that extends vertically downward is fixed to the bottom surface of the adjustment lever 27 on the end side, and a roller 29 is rotatably supported at the lower end of the shaft 28.

On the other hand, a motor bracket 30 is fixed to the vertical movement block 4, and a motor 31 is fixed to the motor bracket 30. A block 32 is fixed to the output shaft of the motor 31. Two rollers 33 (only one is shown in FIG. 1) are rotatably supported on the block 32 so as to sandwich the roller 29. I have. A detection plate 34 having a slit 34a is fixed to the upper surface of the end portion of the adjusting lever 27. Further, in order to regulate the rotation range of the detection plate 34, that is, the rotation range of the adjustment lever 27, the motor bracket 30 has two photo sensors 35, 3 for detecting the slit 34a of the detection plate 34.
6 is fixed.

Accordingly, when the motor 31 is rotated, the roller 29, the shaft 28, and the adjustment lever 27 rotate about the axis of the stage support shaft 5 via the block 32 and the roller 33, and the stage support shaft 5 is rotated. The position of the pellet 25 in the rotation direction can be corrected.

Therefore, the bonding operation is performed by the pellet 25 on the bond stage 7.
Is placed by means not shown, the suction holes 7a are evacuated, and the pellets 25 are held on the bond stage 7. Then, the position of the pellet 25 is detected by a camera (not shown) and a lead 40 provided on a film carrier (not shown).
As described above, the position of the pellet 25 in the rotation direction is corrected by rotating the motor 31 as described above. In addition, the XY table 1 is driven in the XY direction, and the pellet 25 for the lead 40 is
The position in the XY direction is corrected. Next, the tool 41, which is moved up and down and moved in the XY direction by a driving means (not shown), is lowered, and the air cylinder 18 is operated to raise the bond stage 7 as described above so that the lead 40 becomes a bump of the pellet 25. Join. After that, the tool 41 moved up, bond stage 7
Goes down.

Next, a tool cleaning mechanism which is a feature of the present invention will be described. The vertically moving block 4 has a cleaning section 4a on the side of the stage support shaft 5, and a cleaning table 50 is fixed on the cleaning section 4a. On the cleaning table 50, a coarse grindstone 51 having a coarse particle size such as silicon carbide, a finishing grindstone 52 having a fine particle size such as ceramic, and a wire brush 53 are fixed. Also, corresponding to the lower surface of the cleaning section 4a,
A cylinder 54 is fixed on the XY table 1.

Above the coarse grindstone 51, the finishing grindstone 52, and the wire brush 53, a duct 60 having a suction path 60a whose periphery is sealed is provided. The duct 60 is formed with a tool insertion hole 60b that penetrates so that the tip side of the tool 41 is inserted, and an opening hole 60c that communicates with the suction path 60a. A hose connecting pipe 62 is fixed to the opening 60c via a connecting block 61, and the hose connecting pipe 62 is connected to a vacuum device via a drain hose (not shown). The duct 60 is fixed to a duct support plate 63, and the duct support plate
63 is provided on a fixed plate 65 via a cross roller 64 so as to be vertically movable. And the duct support plate 63 is a spring 66
Is biased upwards. The duct support plate 63 is fixed to the support block 2.

Next, the operation will be described. After the operation of bonding the film carrier lead 40 to the pellet 25 bumps is performed a certain number of times as described above, the tool 41 is positioned above the tool insertion hole 60b of the duct 60, and the XY table 1 is driven to roughly move the tool. The grindstone 51 is positioned below the tool insertion hole 60b. Next, the cylinder 54 is operated to slightly push up the cleaning portion 4a of the vertically moving block 4. Further, the tool 41 descends, and the lower end of the tool 41 comes into contact with the coarse grinding stone 51. This tool
When the tool 41 is lowered, the tool holder 42 holding the tool 41 pushes down the duct support plate 63, that is, the duct 60, and the lower surface of the duct 60 maintains a slight gap with the rough grindstone 51.
In this state, the XY table 1 is reciprocally driven in the XY direction for a certain period of time to prevent the oxide attached to the lower surface of the tool 41 from being clogged.

Next, the tool 41 is raised, and the XY table 1 is driven to position the finishing grindstone 52 below the tool insertion hole 60b. Then, the tool 41 is lowered again, and the XY table 1 is reciprocally driven in the XY direction for a predetermined time in the same manner as described above.
Finish cleaning is performed on the lower surface of the tool 41. Thereafter, the tool 41 is raised again, the XY table 1 is driven, the wire brush 53 is positioned below the tool insertion hole 60b, and the tool 41 is lowered. And XY table 1
It is reciprocally driven for a fixed time in the XY directions, and the oxide adhered to the side surface of the tool 41 is removed by cleaning the rough grindstone 51 and the finishing grindstone 52 described above. Then, the tool 41 is raised and driven in the XY directions to be positioned above the bonding station. Further, the operating rod of the cylinder 54 is retracted, the vertically moving block 4 is lowered, and the XY table 1 is driven to position the bond stage 7 at the bonding station.

By the way, the dust of the foreign matter removed by the coarse grindstone 51, the finishing grindstone 52, and the wire brush 53 as described above is sucked by the duct 60, so that the scattering of the dust is prevented. In this case, since the duct 60 surrounds the tool 41, dust is effectively sucked by the duct 60.

Although the cleaning unit 4a is provided in the vertical moving block 4 in the above embodiment, the cleaning unit 4a is formed separately from the vertical moving block 4 and is driven by an XY table different from the XY table 1. Good. Although the above embodiment has been described with respect to the case where the present invention is applied to internal lead bonding, it is needless to say that the present invention can be similarly applied to external lead bonding and transfer bump bonding.

In the above embodiment, two grindstones 51 and 52 and a wire brush are used.
Although 53 and 53 are provided, they can be applied to the case of any one or two or more.

[Advantages of the Invention] As is clear from the above description, according to the present invention, since the duct surrounds the tool during cleaning, dust can be sucked from the periphery of the tool.
As a result, the dust does not scatter to the surroundings, is effectively sucked into the duct, and the semiconductor component does not become defective.

[Brief description of drawings]

FIG. 1 is a partially sectional front view showing an embodiment of the present invention, and FIG.
1 is a plan view of FIG. 1, and FIG. 3 is a sectional view taken along the line AA of FIG. 4: Vertical movement block, 4a: Cleaning part, 5: Stage support shaft, 7: Bond stage, 25: Pellet, 40: Lead, 41: Tool, 50: Cleaning stand, 51: Coarse whetstone, 52: Finishing whetstone, 53 : Wire brush, 60: Duct, 60a: Suction path, 60b: Tool insertion hole, 61: Connection block, 62: Hose connection pipe.

Front page continuation (72) Inventor Koji Sato 1 51-51 Inahira 2-chome, Musashimurayama City, Tokyo Shinkawauchi Co., Ltd. (72) Inventor Michio Okamoto 5-20 1 Kamimizumotocho, Kodaira-shi, Tokyo Hitachi, Ltd. Musashi Plant (72) Inventor Masaki Nakanishi 5-20-1, Kamisuihonmachi, Kodaira-shi, Tokyo Hitachi Ltd. Musashi Plant (56) Reference JP-A-1-144638 (JP, A) 61-97934 (JP, A) JP-A 1-144639 (JP, A) JP-A 63-250829 (JP, A) JP-B 4-55532 (JP, B2)

Claims (1)

(57) [Claims] 1. A tool cleaning mechanism for a bonder, comprising: a cleaning member such as a grindstone for cleaning a tool for crimping a lead and a bump of a film carrier; and a duct means for sucking dust generated during cleaning. Has a suction passage disposed above the cleaning member and having a sealed periphery, and a duct including a tool insertion hole into which a tip of the tool is inserted, and a tool cleaning mechanism for a bonder. .