JPH0630863B2 - Suction nozzle detent device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an up-and-down rotating detent device for a round shaft having an adsorption nozzle for adsorbing and carrying a minute object such as a semiconductor element.

2. Description of the Related Art For example, in pellet bonding work in a semiconductor device assembly process, semiconductor pellets arranged regularly are
Vacuum adsorption is performed on the adsorption nozzle of the pellet mounter, and pressure is applied to a predetermined position on the lead frame, that is, to the die attachment position, but the semiconductor pellet is attached to the predetermined position on the lead frame in order to obtain stable and quick adhesion. Generally, a method of rubbing it while being placed on and under pressure is used.

In order to perform such a work of rubbing the semiconductor pellet while applying pressure to a predetermined position of the lead frame,
The suction surface of the suction nozzle 1 for sucking the semiconductor pellets is not a flat surface but a concave pyramid shape, or as shown in FIG. 4 (a), the suction surface is opened at 90 to 120 degrees. , A shape having two opposing slopes 1a, 1b, FIG.
As shown in (b), a method is adopted in which the two slopes 1a and 1b of the suction nozzle 1 are in contact with the two edges of the semiconductor pellet 8 to adsorb, and the suction nozzle 1 whose tip is open is used. It is necessary that the opposing slopes 1a and 1b and the edges 8a and 8b of the semiconductor pellet 8 are adsorbed in parallel. However, if the semiconductor pellets 8 are rubbed while being pressed against a predetermined position of the lead frame in a state where they are not attracted in parallel, the semiconductor pellets 8 will be damaged or the assembled semiconductor device will be defective. Therefore, it is necessary to pay close attention to the angle adjustment of the suction nozzle 1 with respect to the semiconductor pellets 8. For this reason, a rotation stop is attached to the suction nozzle.

A conventional suction nozzle detent device has a structure as shown in FIG. In FIG. 3, a round shaft 2 having a suction nozzle 1 at its tip, a guide fixed to a moving arm 3 supporting the round shaft 2 up and down in parallel with the round shaft 2 by a guide pin set screw 4. The rotation stop plate 6 holding the pin 5 is fixed by a rotation stop plate set screw 7, and the rotation of the suction nozzle 1 is restricted by the rotation stop plate 6. In order to align the tip end slopes 1a and 1b of the suction nozzle 1 in parallel with the edges 8a and 8b of the semiconductor pellet 8, after loosening the retaining plate set screw 7, the round shaft 2 is rotated for positioning.

Problems to be Solved by the Invention According to the above conventional configuration, since the inclined surface of the suction nozzle tip is positioned parallel to the ridge of the semiconductor pellet, the round shaft having the suction nozzle at the tip is directly rotated. There is a problem that it is difficult to finely adjust the rotation angle, the yield of the assembled semiconductor device is reduced, and the operation rate of the pellet mounter is reduced.

The present invention solves the above problems, and an object of the present invention is to provide a detent device for a suction nozzle that can finely adjust the rotation of a shaft.

Means for Solving the Problems In order to solve the above problems, the present invention has a small object suction nozzle at the lower end, and a shaft supported by a moving arm so as to be vertically movable, and a shaft parallel to the shaft. A guide pin provided on the moving arm and fixed to the shaft, and slidably sandwiching the guide pin,
The guide pin is supported by the movable arm and a shaft center of a portion sandwiched by the rotation stopper plate. The rotation stopper plate is rotatably provided in a circumferential direction of the shaft. The shaft center of the part is eccentric.

Action With the above configuration, the rotation of the guide pin is reduced when it is transmitted to the rotation of the round shaft through the rotation stop plate, so that the rotation angle of the round shaft can be finely adjusted.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. First
FIG. 1 is a perspective view showing an outline of one embodiment, a round shaft 11
Is rotatably and vertically movable via a bearing 13 on a moving arm 12 that moves vertically and horizontally by a cam or the like, and a suction nozzle 14 for sucking semiconductor pellets is provided at the lower end.
Is fixed. On the upper part of the round shaft 11, a turning retaining plate 16 for inserting an eccentric guide pin 15 mounted in parallel with the round shaft 11 is fixed by a turning retaining plate set screw 17. The small-diameter portion 15a of the eccentric guide pin 15 is sandwiched in the cut portion of the rotation stopper plate 16 in a slidable state.

FIG. 2 is a cross-sectional view of the rotation stopping portion, showing the eccentric guide pin 15
The large diameter part 15b of the
It is fixed at.

The operation of accurately aligning the tip slope (1a, 1b in FIG. 4) of the suction nozzle with the ridge (8a, 8b in FIG. 4) of the semiconductor pellet to be sucked is as follows. Guide pin set screw 18
When the eccentric guide pin 15 is rotated by loosening the
Since a rotates about the shaft center of the large diameter portion 15b attached to the moving arm 12, the rotation stop plate 16 rotates only slightly together with the round shaft 11.

Now, the distance between the round shaft 11 and the eccentric guide pin 15 is 10 mm.
If the eccentricity amount of the eccentric guide pin 15 (S in FIG. 2) is 1 mm, the maximum rotation angle of the round shaft 11 when the eccentric guide pin 15 is rotated 180 degrees is And the magnification is That is, it is reduced by 0.06 times, and fine angle matching is possible.

If the parallelism between the semiconductor pellet and the suction nozzle 14 is greatly deviated, loosen the retaining plate set screw 17 and roughly adjust the mounting positions of the round shaft 11 and the retaining plate 16 and then adjust the fine angle as described above. I do.

EFFECTS OF THE INVENTION As described above, according to the rotation stopping device for a suction nozzle of the present invention, for example, fine angle alignment between a semiconductor pellet and a suction nozzle in a pellet mounting operation in a semiconductor device assembly process is facilitated, and pellet mounting workability is improved. It is possible to improve and improve the yield of the assembled semiconductor device.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of an embodiment of a detent device for a suction nozzle of the present invention, FIG. 2 is a configuration diagram of a detent portion of the device, and FIG. 3 is a detent device for a suction nozzle of the related art. FIG. 4 is a nozzle tip schematic diagram showing the positional relationship between the semiconductor pellet and the suction nozzle. 11 …… Round shaft, 12 …… Movement arm, 14 …… Suction nozzle, 15 …… Eccentric guide pin, 15a …… Small diameter part, 15b …… Large diameter part, 16 …… Rotating retaining plate, 17 …… Rotating Retaining plate setscrew,
18 …… Guide pin set screw

Claims (1)

[Claims] 1. A shaft having a minute object suction nozzle at a lower end thereof, the shaft being supported by a moving arm so as to be vertically movable, a guide pin provided on the moving arm in parallel with the shaft, and fixed to the shaft. , A guide plate that is slidably sandwiched between the guide pin and a rotation stopper plate that is rotatable in the circumferential direction of the shaft. The guide pin is sandwiched between the rotation stopper plate and the shaft. A rotation stopping device for a suction nozzle, wherein a center and an axial center of a portion supported by the moving arm are eccentric to each other.