JP2553566B2 - Movable electronic component manufacturing method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a movable electronic component used in electronic equipment such as video / television / audio equipment.

2. Description of the Related Art In recent years, electronic devices have become smaller and more densely mounted, and electronic parts such as switches used for them are also required to be smaller and thinner. Therefore, components such as these switches are also small and thin. Things have come to be used.

The configuration of a conventional general small switch will be described below.

FIG. 4 is an assembled sectional view showing the structure of a conventional small switch, in which FIG. 1 has an opening on the upper surface and is electrically connected to the fixed contacts 3 and 4 exposed on the bottom surface of the opening. A case 5 in which the terminal 2 is insert-molded is included in the lower portion of the opening of the case 1, a movable mounting point which is in continuous contact with the fixed contact 3 and performs a reversing operation, and 6 is included in the upper portion of the opening of the case 1, and externally. A drive member having an operation portion 7 operated from 8 is a cover plate fixed to the upper surface of the opening of the case 1 and holding the movable contact 5 and the drive member 6.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the above-described conventional manufacturing method, the moving contact 5, the driving body 6, and the cover plate 8 included in the opening of the case 1 are Since it is a separate body, the same number of components must be prepared individually for assembling even if it is miniaturized, and there is a problem that workability deteriorates as miniaturization progresses.

The present invention solves the above-mentioned conventional problems, and provides a method of manufacturing a movable electronic component that can reduce the number of components to be assembled and can easily mechanize the assembly.

Means for Solving the Problems In order to achieve this object, a method of manufacturing a movable electronic component according to the present invention is directed to a peripheral edge of a central hole of a cover plate through a holding recess provided on a side surface of an operating portion of a driving body. Part of this driving body is connected and held by outsert molding and supplied to the assembly line, and at the time of assembly, this driving body is separated from the cover plate by moving toward the center of the hole of the cover plate, This is a manufacturing method in which the drive body is included in a box-shaped housing formed of a case and a cover plate.

By using this method, the driving body and the cover plate can be integrated and supplied as one component to the assembly line, and the number of assembled components can be reduced.

Example A method of manufacturing a movable electronic component according to an example of the present invention will be described below with reference to FIGS. 1 to 3.

FIG. 1 is an exploded perspective view showing the structure of a small switch manufactured according to an embodiment of the present invention, FIG. 2 is an assembled sectional view of the switch, and FIG. 3 is outsert-molded on a cover plate immediately before the assembly. FIG. 3 is a sectional view of the driven body.

In the present embodiment, the same components as those described in the above-mentioned conventional example are designated by the same reference numerals and the description thereof will be omitted.

In FIG. 1 to FIG. 3, reference numeral 9 is a holding concave portion provided on the side surface of the operating portion 7 of the driving body 6, and the driving body 6 passes through the holding concave portion 9 and one of the peripheral edges of the central hole of the cover plate 8. The parts are connected and held by the outsert molding to be integrally supplied to the assembly line.

Here, the assembling process of the small switch will be described. First, the movable contact 5 is mounted in the case 1 in which the fixed contacts 3 and 4 and the terminal 2 are insert-molded, and then the cover plate 8 shown in FIG. The case 1 in which the movable contact 5 includes the driving body 6 which is continuously maintained and held by the salt molding to be integrated.
Then, immediately before the assembly, the driver 6 is pushed leftward in FIG. 3 to remove it from the cover plate 8, and the driver 6 is mounted on the movable contact 5 included in the case 1. After that, the cover plate 8 is fixed to the case 1 for assembly.

The small switch of the present embodiment assembled as described above holds the driving body 6 which is connected and held by the cover plate 8 by outsert molding and is integrated as shown in FIG. 3 immediately before the assembling. Since it is configured to be separated into two parts and assembled by releasing the state, in the state of the finished product as shown in FIG.
The driving body 6 and the driving body 6 operate as independent parts, as in the configuration shown in the conventional example.

That is, as shown in FIG. 2, the driving body 6 moves vertically due to the maximum outer diameter portion thereof being guided by the inner peripheral wall of the case 1, so that when the operating portion 7 of the driving body 6 is pressed to perform the switching operation. In addition, the holding recess 9 used for holding during the outsert molding can be operated without being caught in the central hole of the cover plate 8.

As described above, according to the present embodiment, the driving body 6 is integrated with the cover plate 8 by outsert molding until just before assembly, so that the number of parts to be supplied to the assembly line can be reduced by one. As a result, it is possible to reduce the number of parts supply facilities and also to supply the parts in a hoop shape.

EFFECTS OF THE INVENTION The present invention, as is apparent from the above embodiment, outserts the driving body and the cover plate to a part of the peripheral edge of the central hole of the covering plate via the holding recess provided on the side surface of the driving body. The integrated structure makes it easy to supply parts to the assembly line. By making the integrated state into a hoop shape, for example, more efficient parts supply is possible and the parts supply facility is reduced. It is possible to obtain a great effect especially in a miniaturized electronic component.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a structure of a small switch manufactured by a method for manufacturing a movable electronic component according to an embodiment of the present invention, FIG. 2 is an assembled sectional view of the switch, and FIG. FIG. 4 is a cross-sectional view of a drive body outsert-molded on the cover plate in FIG. 4, and FIG. 4 is an assembled cross-sectional view showing the configuration of a conventional small switch. 1 ... Case, 2 ... Terminal, 3, 4 ... Fixed contact, 5 ...
Movable contact, 6 ... Driver, 7 ... Operation part, 8 ... Cover plate,
9 ... Retaining recess.

Front page continued (72) Inventor Matsuo Nishioka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kazuo Mitani 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56 ) References JP-A-59-37615 (JP, A) JP-A-59-42729 (JP, A) Actually developed JP-A-59-159829 (JP, U)

Claims (1)

(57) [Claims] 1. A movable contact is mounted inside a case provided with a fixed contact having an opening on the upper surface and an integrated terminal so as to be exposed at the bottom surface of the opening, and then the upper surface of the case is covered. A drive member in which a part of the peripheral edge of the hole provided in the center of the cover plate formed as described above and the holding recess provided on the side surface of the operating portion are connected and held by outsert molding By moving the center in the direction of the center of the hole of the cover plate, the holding state by the cover plate is released, and the separated state is mounted on the movable contact housed in the case, and then the operation part of the drive body is moved upward. A method of manufacturing a movable electronic component, wherein the cover plate is fixed to the upper surface of the case so as to project to the front side and assembled.