JP2554345B2 - Semiconductor element pickup method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Overview] A method for preventing damage to a semiconductor element that occurs when a semiconductor element is picked up by a collet during vacuum suction is described. For the purpose of providing a method of picking up a semiconductor element capable of preventing damage to a corner chip, a semiconductor element adhered and arranged on an adhesive tape is pushed up by a push-up pin, and the semiconductor element is removed from this adhesive tape. In a semiconductor element pickup process in which the semiconductor element is peeled off and vacuum-adsorbed to the collet, the semiconductor element is completely peeled from the adhesive tape by the push-up by a plurality of push-up pins penetrating the adhesive tape. It is configured to supply a vacuum.

[Industrial applications]

The present invention relates to a method for picking up a semiconductor element, and more particularly to a method for preventing damage to a semiconductor element which is generated during vacuum adsorption by a collet.

In the semiconductor element pick-up process in which the semiconductor element adhered on the adhesive tape is pushed up by the push-up pin, the semiconductor element is peeled off from this adhesive tape, and the collet is vacuum-sucked, the semiconductor on the adhesive tape is pushed up by the push-up pin. In parallel with pushing up and peeling the element, a collet in a state in which a vacuum is supplied and capable of sucking the semiconductor element is brought close to above the semiconductor element, and the semiconductor element peeled from the adhesive tape is sucked by the collet.

For this reason, there is a failure in which a corner of the semiconductor element adjacent to the attracted semiconductor element is chipped.

Under the circumstances as described above, there is a demand for a semiconductor element pickup method capable of peeling a semiconductor element from an adhesive tape and adsorbing the semiconductor element onto a collet without causing any trouble.

[Conventional technology]

A conventional semiconductor element pickup method will be described with reference to FIG.

First, as shown in FIG. 4A, the adhesive tape 5 is moved and the semiconductor element 6 to be picked up next is stopped at a predetermined position on the push-up pin 1.

Next, a vacuum for fixing the adhesive tape is supplied to the adhesive tape 5.
Is sucked onto the tape suction surface 3, while a vacuum is also supplied to the collet 4.

Next, as shown in FIG. 4B, the pin holder 2 is raised to push up the semiconductor element 6 with the push-up pin 1, and at the same time, the collet 4 is lowered to adsorb the semiconductor element 6.

Finally, as shown in FIG. 4 (c), the collet 4 rises with the semiconductor element 6 adsorbed, the pin holder 2 descends and returns to its original position, and the adhesive tape 5 is adsorbed on the tape adsorption surface 3. Then, the vacuum is removed, and the pickup of the semiconductor element 6 to the collet 4 is completed.

[Problems to be solved by the invention]

A problem with the conventional semiconductor element pickup method described above is that chipping occurs at the corners around the element formation surface of the semiconductor element adjacent to the semiconductor element to be picked up.

That is, when the semiconductor element is not completely peeled off from the adhesive tape by the push-up pin, the collet to which the vacuum has already been supplied approaches the semiconductor element and a strong suction force acts on the semiconductor element, which causes the semiconductor element to move quickly. Since it is adsorbed from the part peeled off from the adhesive tape, the semiconductor element is adsorbed by the collet in a tilted state, and at that time, the corner of the semiconductor element adsorbed on the corner of the element formation surface of the adjacent semiconductor element has a strong corner. A chip occurs.

It is an object of the present invention to provide a semiconductor element pickup method capable of preventing an obstacle of a corner chip occurring in a semiconductor element by changing a vacuum supply time point to a collet, which can be easily implemented from the above situation. It is what

[Means for solving problems]

The semiconductor element pickup method of the present invention is a semiconductor element pickup step in which a semiconductor element adhered and arranged on an adhesive tape is pushed up by a push-up pin to separate the semiconductor element from the adhesive tape, and the collet is vacuum-adsorbed. In this case, a vacuum is supplied to the collet after the semiconductor element is completely peeled from the adhesive tape by the push-up by the plurality of push-up pins penetrating the adhesive tape.

[Action]

That is, in the present invention, by pushing up with a plurality of push-up pins, after the semiconductor element is completely peeled from the adhesive tape, since the vacuum is supplied to the collet for adsorbing the semiconductor element, the semiconductor element is completely removed from the adhesive tape. Since it is not peeled off and is strongly attracted by the collet in a state of hitting the corner of the adjacent semiconductor element while being inclined, the corner chipping failure does not occur in the adjacent semiconductor element.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2, and another embodiment will be described with reference to FIG.

First, as shown in FIG. 1 (a), the adhesive tape 5 is moved and the semiconductor element 6 to be picked up next is stopped at a predetermined position on the plurality of push-up pins 1, and a vacuum for fixing the adhesive tape is supplied. Then, the adhesive tape 5 is sucked onto the tape suction surface 3.

Next, as shown in FIG. 1B, the pin holder 2 is raised to push up the semiconductor element 6 with the plurality of push-up pins 1, and at the same time, the collet 4 is lowered. No vacuum is supplied to the collet 4 at this point.

Next, as shown in FIG. 1C, a vacuum is supplied to the collet 4 in a state where the semiconductor element 6 is completely peeled off from the adhesive tape 5 to adsorb the semiconductor element 6.

Thereafter, as shown in FIG. 1 (d), the collet 4 ascends with the semiconductor element 6 adsorbed, returns to the original position where the pin holder 2 has descended, and adsorbs the adhesive tape 5 on the tape adsorbing surface 3. The vacuum is cut off, and the pickup of the semiconductor element 6 to the collet 4 is completed.

When the timing of these operations is set as shown in the timing chart of FIG. 2 and a vacuum is supplied to the collet 4 when the collet 4 descends to the lowest point, the element of the adjacent semiconductor element by the adsorbed semiconductor element It is possible to prevent chipping around the formation surface.

The effect of this example is verified by the following experimental results.

The numerator is the number of occurrences, and the denominator is the semiconductor device 6 on which the experiment was conducted.
Is the number of.

From the above experimental results, it is only necessary to push up with a plurality of push-up pins to separate the semiconductor element 6 from the adhesive tape 5,
If it is not adsorbed by the collet, there will be no chipping. In the conventional technology, 9 out of 42 cases where the corner chip crosses the scribe line occur. In this example, 1 of 186 cases where the corner chip did not reach the scribe line
It can be seen that only cases have occurred.

In another embodiment shown in FIG. 3, FIG. 1 (b) is further divided into two steps, and as shown in FIG. 3 (a), first, only the plurality of push-up pins 1 are raised, Next, as shown in FIG. 3 (b), when the collet 4 is subsequently lowered, the semiconductor element 6 is more reliably peeled off from the adhesive tape 5, and the semiconductor element 6 can be picked up more stably. Becomes

[Effects of the Invention] As is clear from the above description, according to the present invention, the corners around the element formation surface of the semiconductor element adjacent to the semiconductor element to be picked up can be changed by the extremely simple change of the vacuum supply timing to the collet. There is an advantage that a semiconductor element can be picked up without causing chipping, and the remarkable effect of improving reliability can be miraculously achieved, which is extremely useful industrially.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention in the order of steps, FIG. 2 is a timing chart of the embodiment according to the present invention, and FIG. 3 is a side cross section of another embodiment of the present invention in the order of steps. 4 and 5 are side sectional views showing a conventional method of picking up a semiconductor element in the order of steps. In the figure, 1 is a push-up pin, 2 is a pin holder, 3 is a tape suction surface, 4 is a collet, 5 is an adhesive tape, and 6 is a semiconductor element.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yoshiro Furuya 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Toshimitsu Kosaka 1 Nishigaoka, Murata, Shibata-gun, Miyagi Prefecture No. 1 Fujitsu Miyagi Electronics Co., Ltd. (72) Teruyuki Iwata Inventor Teruyuki Iwata 5950 Soeda Iruki-cho, Satsuma-gun, Kagoshima Prefecture Kyushu Fujitsu Electronics Co., Ltd. (56) References 63-70153 (JP, U)

Claims (1)

(57) [Claims] 1. A semiconductor element picked up in a step of picking up a semiconductor element adhered and arranged on an adhesive tape by a push-up pin to separate the semiconductor element from the adhesive tape and vacuum-sucking it to a collet. A method for picking up a semiconductor element, characterized in that a vacuum is supplied to the collet after the semiconductor element is completely peeled from the adhesive tape by the push-up by a plurality of push-up pins penetrating therethrough.