JP2556766B2 - Electronic component chip sorter - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an electronic component chip sorter.
This is related to the improvement of
Vibration transfer force and rolling properties of spherical granules, and selection magnetism
By making good use of the magnetic force of the stone,
There is no difference and it is difficult to select the sieve, and the difference in magnetic adhesion is a subtle angle.
Efficient and reliable separation of chip-shaped electronic component chips and spherical plated balls
Electronic component chip sorter that can separate and sort
It is something.

[0002]

2. Description of the Related Art As is well known, integration accompanying circuit technology advances
Due to the high integration of circuits, electricity such as resistors and capacitors
Sub-components are becoming smaller and smaller. For example, in chip resistors
In addition, it is about 0.5 to 1.5 mm, and it's a small piece of aluminum.
By applying barrel plating to the ceramic substrate
A silver electrode or the like is plated on the edge of the substrate.

Such a minute electronic component chip is barrel-mounted.
When working, it is common to share many workpieces in the rotating barrel.
A large number of plated balls with a particle size of about 0.3 mm were mixed in
Has been. During plating processing by mixing a large number of plating balls
It is possible to apply a negative potential evenly to each chip.
In addition, the stirring effect in the barrel is increased to achieve uniform plating.
This is because it becomes possible to obtain a film. And this
Vibrate mixed chip resistors and plated balls after cleaning
Transfer to the sieve of the sieving device and remove only the plated balls.
Thus, the chip resistor and the plated ball are selected.

However, in the screen selection by this vibrating screen device,
It is easy for the corners of the resistor to get caught in the mesh of the mesh.
The product may be peeled off or scratched, resulting in reduced product value.
There is a fear of inviting it, and the mesh of the mesh of the resistor is clogged.
Separates the chip resistor and the plating ball, which are processed in large numbers and in large quantities
However, it was time consuming and inefficient as a sorting method.

Therefore, the applicant of the present invention has previously used a vibration for mechanically selecting spherical particles and prismatic particles based on the difference in shape.
Opened the dynamic transfer type granular material sorting device (Kaikaihei 2-133484 )
Fired. However, this device does not operate on the slope of the sorting plate.
The vibration transfer force and the rolling property of spherical granules are exclusively
And use only the difference in the shape of the granular material as the selection criterion.
Therefore, the following is unique to the plating plating ball selection process described above.
We could not address the problem below.

That is, a plated ball used for barrel plating
Acts as an electrical passage in the plating solution, so
Yes, but it is charged with static electricity and magnetism.
Even after the drying process, several pieces will adhere to each other.
In some cases, these several plated balls stick together
Because the outer shape of the plated sphere aggregate that consists of
Rolls down the slope of the selection plate like a single plated ball
Without climbing a slope with a chip-shaped electronic component chip
I ended up doing it.

[0007] This cluster of plated balls climbs the selection plate
As a result, the efficiency of sorting electronic component chips and plated balls is improved.
It goes without saying that it will decrease, but in addition,
The plated plate itself can be used for a long time by using the plated plate.
Magnetized, this magnetized selection plate
I also magnetically stuck the plating ball of this and stopped it there,
Situation where you can not continue even the act of sorting because it interferes with the climbing
It also caused.

[0008]

SUMMARY OF THE INVENTION The present invention is a conventional vibration transfer type.
It was made in view of the above-mentioned drawbacks of the sorting machine, and it can efficiently sort electronic component chips and plating balls without causing sorting trouble due to static electricity , magnetism, or adhesion during the drying process.
It is a technical object to provide a sorter capable of surely separating and sorting .

[0009]

SUMMARY OF THE INVENTION The present invention is directed to a rectangular strip-shaped electrode.
Sub-component chip M and electronic component chip M are plated
Electronic component chip that selects the plated ball B that is mixed when
In the sorting machine, it is installed in an inclined state with a predetermined slope,
Anodized aluminum film was formed on the surface
Sorting plate 1; this sorting plate 1
Vibrator 3 that vibrates the slope of the door 1 upward;
Electronic component chip in mixed state near Sakashita of sorting plate 1
A dropping device 4 for spreading the plating M and the plating ball B;
Upward near the slope of rate 1 and in the plate width direction
Are installed in a row, and the distance from the sorting plate 1 is on the plate slope.
A plurality of selection magnets 5 arranged so as to become smaller
.5 and mixed ; sprinkled from the dropper 4
The electronic component chip M and the plated ball B in the state are
The electronic component chip M is pushed by the vibration operation of rate 1.
While for climbing the rate slope upward direction, plating balls B are plates
While rolling down in the downward direction, multiple plating balls B
The non-rolling plated ball agglomerates collected are the plurality of selection magnets.
Adopting the technical means of removing the magnetic attachment by 5.5.
The above-mentioned problem was solved by using this.

[0010]

EXAMPLE An electronic component chip sorter according to the present invention will be described below.
A description will be given based on the embodiment shown in FIGS. Incidentally, FIG.
Is a perspective view showing the whole of the electronic component chip sorter of the present embodiment, and FIG. 2 shows the configuration near the sorting plate 1 of the sorter.
Partial cross-sectional view, FIG. 3 shows the configuration of the dropper 4 of the same sorter .
Fig. 4 shows the structure of the passage 41 of the dropper 4 in the sorting machine.
Fig. 5 is a plan view showing the configuration of the sorting magnet 5 of the sorting machine.
FIG.

In the figure, what is designated by reference numeral 1 is a support base 2.
750mm with the long side inclined by about 5 °
Sorting play consisting of 280 mm x 10 mm aluminum material
The surface of the sorting plate 1 is anodized.
An aluminum oxide film is formed by reason. Real
Anodizing施例are those oxalic acid is carried out in mixed acid electrolytic solution such as sulfuric acid, after setting the aluminum plate electrode is performed by applying a predetermined voltage while maintaining the electrolyte at a relatively low temperature A porous aluminum oxide film having a thickness of 30μ is formed on the surface of this aluminum plate. Form holes in the coating, when the oxygen atoms react with the aluminum atoms, while destroying the coating layer already formed
In this embodiment, about 130 × 10 ⁸ fine holes are formed per 1 cm 2.

In the figure, reference numeral 3 indicates the support.
A conventionally known vibration conveyor bar disposed between the legs of the base 2.
This vibrator is made by Shinko Denki Co., Ltd.
3 is the plate 1 above the selection plate 1 via the support base 2.
Vibrate in the opposite direction. The vibration generated by this vibrator 3
Square pieces existing on the selection plate 1 due to rate vibration
-Shaped electronic component chip M (intermediate product of ceramic fixed resistors
Goods: 0.5mm × 0.5mm × 0.3mm) should be climbed uphill.
The electronic component chip M is released.
Spherical plating ball B (diameter mixed during plating process)
Approx. 0.3 mm) down the slope of the inclined selection plate 1.
Rolling down. In this way, the device of this embodiment
Rollable single plating ball B and square piece electronic component chip M
And separate and sort.

As described above, the apparatus according to the present embodiment uses the sorting play.
Formed by a weak magnetic material aluminum plate material,
The surface is anodized, which has excellent corrosion resistance and wear resistance.
Since an aluminum oxide film is provided on the
This prevents the selection plate 1 from being magnetized by the gold balls.
Of the electronic component chip M mainly made of ceramic.
Wear of the sorting plate 1 due to climbing can be significantly suppressed.
it can. Furthermore, the selection plate 1 is made of a weak magnetic material.
Because of the vibration, the vibration type sorting mechanism by the vibrator 3 is used.
In addition, the magnetic sorting mechanism described below that utilizes the subtle difference in magnetism.
I was able to combine (selection magnets 5 ・ 5 ...)
is there.

In the figure, what is designated by reference numeral 4 is the selection
A large number of objects to be sorted near Plate Sakashita on Plate 1.
(= Spray mixed electronic component chip M and plating ball B)
It is a dropper. The dropping device 4 of this embodiment is a sorting plate.
1 It is located near the slope on the slope about 15 cm from the bottom edge.
As shown in 3, storage hoppers that store a large number of objects to be sorted
-42 and a motor (not shown)
A target that gradually sends the objects to be sorted in the par 42 to the passage described below.
The table 44 and the turntable 44 from below.
Cantilever type with a slight downward slope in the upper width direction of the sorting plate 1.
The passage 41 that is taken out and extends and vibrates this passage 41.
The vibration generator 43 that conveys the objects to be sorted on the
It is composed of

The passage 41 of the dropper 4 is shown in FIG.
, A plurality of drop holes 41a, 41a ...
Transferring the vibration generator 43, which is formed into a V-shape
Sorting objects traveling on path 41 by vibration, to fall from the plurality of dropping holes 41a · 41a ... in the order from those in the vicinity of the center in the width direction of the passage 41 to those in the width direction on both sides Yu
Ku. In this way, the selection target over the entire width of the sorting plate 1
Things are dropped all over the place .

In the figure, the reference numeral 5 indicates the selection
On the sorting plate 1 near the slope of plate 1
Square rod-shaped pluses, which are arranged in a row in a widthwise direction in a cage shape
These are selection magnets composed of tic magnets, and these selection magnets 5
・ For 5 ..., the distance from the selection plate 1 goes to the plate slope.
It is arranged on the support base 2 so that it becomes smaller
(See Figure 5).

Magnetic sorting consisting of these sorting magnets 5 ...
Depending on the mechanism, static electricity or magnetism was given during the plating process.
Or, they adhere to each other in the drying process and become non-spherical.
The plating ball aggregate that climbs another plate 1 is selected.
The magnetic adhesion is removed from above rate 1. Meanwhile, electronic components
The chip M is not magnetically attached to the sorting magnets 5 ...
Pass under it. Thus, with the electronic component chip M
It is possible to reliably select a non-rolling plated ball aggregate.
It is.

The selection magnets 5, 5 ...
The distance from rate 1 decreases as the plate slope goes up.
Since it is arranged like this,
The selection magnet 5 with a wide gap is more effective than the other clusters of plated balls.
A large number of plated balls or a larger-sized plated ball
A large aggregate of plated spheres, such as
It will be magnetically attached.
In the sorting magnet 5 with the narrowest distance,
Magnetically attach a plated agglomerate of small magnetic particles that could not be magnetically attached
Will be. That is, in the device of this embodiment, various
An aggregate of plated balls is magnetically attached to seven selection magnets 5 ...
It will be done.

Distance between the selection plate 1 and the selection magnet
If there is no such ingenuity in 5, most of the selection magnets in Sakashita
The aggregate of plated balls is magnetically attached, and immediately the selection magnet in Sakashita is plated.
Filled with sphere aggregates and climbing electronic chip M
Since the road will be blocked and it will interfere with climbing, selection magnets
It is necessary to frequently collect aggregates of plated balls from
It becomes very complicated.

Further , in this embodiment, it is assumed that
The sorting plate 1 is made of an aluminum plate that is a weak magnetic material.
Since it is formed, it is sorted by the magnetic force of this sorting magnet 5.
Plate 1 does not become magnetized and
It does not adversely affect the magnetic selection. This way
And the subtle magnetic adhesion between the electronic component chip M and the plated ball aggregate
Reliable magnetic selection by the selection magnets 5 ...
Different is possible.

The present embodiment is constructed as described above, but the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the claims. In particular, the drop device 4
It is naturally included in the scope of the present invention to change the method of dropping the sorting target on the sorting plate 1 by changing the above.

[0022]

As described above with reference to the embodiments,
In the electronic component chip sorter of the present invention,
Utilizing the vibration transfer force of the blade and the rolling property of the spherical plated ball
A slope sorting tool that separates and sorts electronic component chips and plated balls.
An oxide film was provided on the surface by anodizing treatment.
The barrel is made of a weak magnetic aluminum plate.
Selection by plating ball that has been magnetized during plating
It can prevent the plate from being magnetized and mainly
Significant wear on the surface of the sorting plate due to climbing of component chips
It is possible to suppress the electronic component chip and plating ball
It becomes possible to perform the sorting process stably for a long period of time.

Further, in the sorting machine of the present invention, the sorting plate is weak.
Since it is made of magnetic aluminum plate material, it can be used as an electronic component.
For a vibrator that utilizes the difference in shape between the tip and the plated ball
The vibration type sorting mechanism by
It is possible to combine a magnetic sorting mechanism for sorting.
It was. In other words, the pre-selection by the magnetic force of this magnetic selection mechanism.
Electronic component chip
And play with this electronic component chip without rolling
Subtle magnetic attraction with a cluster of plated spheres that climbs the slope
It is possible to reliably select both due to the difference in
Highly accurate sorting processing of electronic component chips becomes possible.

Further, in the device of the present invention, this magnetic
The sorting mechanism consists of a plurality of rod-shaped sorting magnets arranged in a cage.
And the distance between the selection magnet and the selection plate
Is made smaller as it goes to the plate slope, so magnetic sticking is removed.
The plated lumps to be plated should be distributed evenly to these multiple selection magnets.
Can be magnetically attached. Therefore, a specific sorting magnet
Only the aggregate of the plated balls is magnetically concentrated,
The block blocks the climbing path of electronic component chips and obstructs the climbing
And collecting the plated ball aggregates from the selection magnet.
Avoid the complexity of having to do it often
It is possible to increase the number of electronic component chips and plating balls that can be processed in large quantities.
It is possible to efficiently separate and sort.

[Brief description of drawings]

FIG. 1 shows the entire electronic component chip sorter of this embodiment .
Ru be perspective view der.

FIG. 2 shows a configuration near a sorting plate 1 of the sorting machine .
FIG .

FIG. 3 is a side view showing a configuration of a dropper 4 of the sorting machine.
It

FIG. 4 shows the structure of the passage 41 of the dropper 4 in the sorting machine .
It is a top view shown .

FIG. 5 is a partial side view showing a configuration of a sorting magnet 5 of the sorting machine .
FIG.

[Explanation of symbols]

1 Selection Plate 2 Support Stand 3 Vibrator 4 Dropper 5 Selection Magnet M Electronic Component Chip B Plating Ball

Claims (1)

(57) [Claims] 1. A rectangular piece-shaped electronic component chip M and the electron
Plating ball B mixed when the component chip M is plated
In the electronic component chips sorting machine for sorting bets are placed in an inclined state at a predetermined gradient, on the surface of aluminum
A sorting plate 1 on which a anodic oxide coating of nickel is formed; and this sorting plate 1 in the upward slope direction of the sorting plate 1.
A vibrator 3 for vibrating; electronic parts in a mixed state near the slope of the sorting plate 1
A dropper 4 for sprinkling the top M and the plating ball B; and a plate width direction above the sorting plate 1 near the slope.
Are arranged in the shape of a cage in the opposite direction, and the space between the sorting plate 1 and
A number of smaller units are arranged so that
.. and the selection magnets, and the electronic component chips in a mixed state spread from the dropper 4
M and the plating ball B are used for the vibration operation of the sorting plate 1.
Therefore, the electronic component chip M climbs up the plate.
On the other hand, the plated ball B rolls down the plate slope.
Non-rolling plating with multiple plating balls B gathered together
The gold ball aggregate is magnetically removed by the plurality of selection magnets 5 ...
Electronic component chip characterized by being able to be removed
Sorting machine.