JP2583355B2 - Lead frame supply method for semiconductor manufacturing equipment - Google Patents
Lead frame supply method for semiconductor manufacturing equipmentInfo
- Publication number
- JP2583355B2 JP2583355B2 JP2309725A JP30972590A JP2583355B2 JP 2583355 B2 JP2583355 B2 JP 2583355B2 JP 2309725 A JP2309725 A JP 2309725A JP 30972590 A JP30972590 A JP 30972590A JP 2583355 B2 JP2583355 B2 JP 2583355B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor manufacturing
- supply method
- frame supply
- manufacturing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体ペレットをリードフレームにマウント
する際のリードフレームの供給方法に関する。The present invention relates to a method of supplying a lead frame when mounting a semiconductor pellet on a lead frame.
〔従来の技術〕 従来、この種のリードフレーム供給方法は、第３図
（ａ）〜（ｃ）の工程図に示す如く、コイルばね１で押
圧された吸着パッド２を、多数枚重ねたリードフレーム
３の上方に平行配置し（ａ）、一番上のリードフレーム
３を吸着パッド２を下げて吸着し（ｂ）、残りのリード
フレームと平行に上昇させることにより持ち上げて移動
し（ｃ）、レール５上に供給するようになっていた。[Prior Art] Conventionally, this type of lead frame supply method uses a lead in which a large number of suction pads 2 pressed by a coil spring 1 are stacked as shown in the process diagrams of FIGS. 3 (a) to 3 (c). It is arranged above the frame 3 in parallel (a), the uppermost lead frame 3 is sucked by lowering the suction pad 2 (b), and is lifted and moved by being raised in parallel with the remaining lead frames (c). , On the rail 5.
上述した従来のリードフレームの供給方法は、第３図
に示した如く、リードフレーム３を吸着パッド２で吸着
し、残りのリードフレームと平行に上昇させるので、リ
ードフレーム同志の密着力が強いと２枚重ねて持ち上げ
てしまう。そして、そのまま移動して供給したり、移動
途中で落下させてしまうという欠点がある。In the conventional lead frame supply method described above, as shown in FIG. 3, the lead frame 3 is sucked by the suction pad 2 and is raised in parallel with the remaining lead frames. I will lift up two sheets. Then, there is a drawback that they are supplied while being moved as they are, or are dropped during the movement.
このような従来のリードフレームの供給方法に対し、
本発明は偏芯カムを回転させることによって、リードフ
レームをその長手方向の一方の端から上方に持ち上げる
と、リードフレームは傾き且つ軽く反りながら持ち上げ
られる。この時同時に反発力も働くので、ある程度持ち
上げられると、反った状態から元のまっすぐな形になる
という連続した形状の変化が起る。これにより密着した
リードフレームを引き剥し、確実に１枚だけを持ち上げ
て供給することができるという相違点を有する。In contrast to such a conventional lead frame supply method,
According to the present invention, when the lead frame is lifted upward from one end in the longitudinal direction by rotating the eccentric cam, the lead frame is lifted while being tilted and slightly warped. At this time, a repulsive force is also exerted at the same time, so that when lifted to some extent, a continuous change in shape occurs such that the warped state returns to the original straight shape. Thus, there is a difference in that the adhered lead frame can be peeled off and only one sheet can be reliably lifted and supplied.
本発明の半導体製造装置のリードフレーム供給方法
は、多数枚が重ねられたリードフレームの一番上の１枚
を吸着パッドで吸着し、レール上に供給する半導体製造
装置のリードフレーム供給方法において、吸着パッドを
取り付けた支持板の一端を偏芯カムで持ち上げて前記一
番上のリードフレームを一方の端から持ち上げ、コイル
ばねにより支持板が水平に戻った後リードフレームをレ
ール上に移動し供給する方法である。A lead frame supply method for a semiconductor manufacturing apparatus according to the present invention is a lead frame supply method for a semiconductor manufacturing apparatus, wherein a top one of a plurality of stacked lead frames is sucked by a suction pad and supplied on a rail. One end of the support plate to which the suction pad is attached is lifted by an eccentric cam, and the top lead frame is lifted from one end. After the support plate is returned to a horizontal position by a coil spring, the lead frame is moved to a rail and supplied. How to
次に本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例に使用するリードフレーム
供給機構の概略図である。従来の供給機構に対し本供給
機構は、バキューム配管４につながった吸着パッド２と
コイルばね１との間に支持板７を設けてある。又、多数
枚のリードフレーム３を収納したカセットの端に支持板
７を上下させる偏芯カム６を設けてある。偏芯カム６は
180゜回転させた時偏芯量が最大となる。FIG. 1 is a schematic view of a lead frame supply mechanism used in one embodiment of the present invention. In contrast to the conventional supply mechanism, this supply mechanism has a support plate 7 provided between the suction pad 2 connected to the vacuum pipe 4 and the coil spring 1. Further, an eccentric cam 6 for raising and lowering the support plate 7 is provided at the end of the cassette in which a large number of lead frames 3 are stored. The eccentric cam 6
Maximum eccentricity when rotated 180 °.
第２図（ａ）〜（ｆ）は本実施例のリードフレーム供
給方法を示す工程図である。まず重ねられたリードフレ
ーム３はレール（図示せず）と平行に配置する（ａ）。
次いで傾斜用のコイルばね１を支持板７を介して取り付
けた６個の吸着パッド２により、リードフレーム３を吸
着させる（ｂ）。次に偏芯カム６を徐々に回転させて支
持板７の端を上昇させる（ｃ）。これによりリードフレ
ーム３は傾き軽く反りながら持ち上げられる。（ｄ）。
この時同時に反発力も働くので、偏芯カム６が180゜付
近になると元のまっすぐな形になろうとする連続した形
状の変化が起き、密着したリードフレーム３を引き剥す
（ｅ）。よって必ず１枚だけ吸着パッドで持ち上げ、レ
ール（図示せず）に移動して供給される（ｆ）。2 (a) to 2 (f) are process diagrams showing a lead frame supply method of the present embodiment. First, the superposed lead frames 3 are arranged in parallel with a rail (not shown) (a).
Next, the lead frame 3 is sucked by the six suction pads 2 to which the coil spring 1 for inclination is attached via the support plate 7 (b). Next, the end of the support plate 7 is raised by gradually rotating the eccentric cam 6 (c). As a result, the lead frame 3 is lifted while slightly tilting and warping. (D).
At this time, a repulsive force acts simultaneously, so that when the eccentric cam 6 approaches 180 °, a continuous change in shape that tends to return to the original straight shape occurs, and the closely attached lead frame 3 is peeled off (e). Therefore, only one sheet is always lifted by the suction pad and moved to a rail (not shown) to be supplied (f).
以上説明したように本発明は、偏芯カムを回転させて
リードフレームを一方の端から持ち上げることにより２
枚重ねという現象はなくなり、半導体製造装置としての
生産性の向上を図れるという効果がある。As described above, according to the present invention, the eccentric cam is rotated to lift the lead frame from one end.
The phenomenon of stacking is eliminated, and there is an effect that productivity as a semiconductor manufacturing apparatus can be improved.
第１図は本発明の一実施例に使用するリードフレーム供
給機構の概略図、第２図（ａ）〜（ｆ）は本発明の一実
施例を説明する工程図、第３図（ａ）〜（ｃ）は従来の
リードフレーム供給方法を説明する工程図である。 １……コイルばね、２……吸着パッド、３……リードフ
レーム、４……バキューム配管、５……レール、６……
偏芯カム、７……支持板。FIG. 1 is a schematic view of a lead frame supply mechanism used in one embodiment of the present invention, FIGS. 2 (a) to (f) are process diagrams for explaining one embodiment of the present invention, and FIG. 3 (a). (C) is a process drawing explaining a conventional lead frame supply method. 1 ... Coil spring, 2 ... Suction pad, 3 ... Lead frame, 4 ... Vacuum piping, 5 ... Rail, 6 ...
Eccentric cam, 7 ... Support plate.
Claims (1)
上の１枚を吸着パッドで吸着し、レール上に供給する半
導体製造装置のリードフレーム供給方法において、吸着
パッドを取り付けた支持板の一端を偏芯カムで持ち上
げ、吸着したリードフレームの一端を上方に反らせて密
着したリードフレームを引き剥し、コイルばねにより支
持板が水平に戻った後リードフレームをレール上に移動
し供給することを特徴とする半導体製造装置のリードフ
レーム供給方法。1. A lead frame supply method for a semiconductor manufacturing apparatus, wherein the uppermost one of a plurality of stacked lead frames is sucked by a suction pad and supplied on a rail. One end is lifted by an eccentric cam, and one end of the adsorbed lead frame is warped upward to peel off the adhered lead frame. A method for supplying a lead frame of a semiconductor manufacturing apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309725A JP2583355B2 (en) | 1990-11-15 | 1990-11-15 | Lead frame supply method for semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309725A JP2583355B2 (en) | 1990-11-15 | 1990-11-15 | Lead frame supply method for semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04180635A JPH04180635A (en) | 1992-06-26 |
| JP2583355B2 true JP2583355B2 (en) | 1997-02-19 |
Family
ID=17996548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2309725A Expired - Fee Related JP2583355B2 (en) | 1990-11-15 | 1990-11-15 | Lead frame supply method for semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2583355B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100850454B1 (en) * | 2002-02-27 | 2008-08-07 | 삼성테크윈 주식회사 | Block head part for dicing and sorting equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368973A (en) * | 1976-12-02 | 1978-06-19 | Toshiba Corp | Lead frame feeder |
| JPH01310884A (en) * | 1988-06-09 | 1989-12-14 | Mitsubishi Electric Corp | Frame transporting device |
-
1990
- 1990-11-15 JP JP2309725A patent/JP2583355B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04180635A (en) | 1992-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |