JPH0321461B2 - - Google Patents
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- Publication number
- JPH0321461B2 JPH0321461B2 JP61120736A JP12073686A JPH0321461B2 JP H0321461 B2 JPH0321461 B2 JP H0321461B2 JP 61120736 A JP61120736 A JP 61120736A JP 12073686 A JP12073686 A JP 12073686A JP H0321461 B2 JPH0321461 B2 JP H0321461B2
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- JP
- Japan
- Prior art keywords
- thin plate
- laminated
- support
- laminated thin
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】
〔概 要〕
本発明は、IC用リードフレームの材料のよう
な薄板の複数枚が積層された積層薄板群の最下端
の一枚の薄板を、その対向する二辺を側面から圧
縮して変形させることにより、この積層薄板群か
ら確実に分離する積層薄板の分離装置である。[Detailed Description of the Invention] [Summary] The present invention provides a method for attaching one thin plate at the bottom of a laminated thin plate group in which a plurality of thin plates, such as materials for IC lead frames, are laminated to two opposite sides thereof. This is a laminated thin plate separation device that reliably separates the laminated thin plates from a group of laminated thin plates by compressing and deforming the laminated thin plates from the side.
本発明はIC(インテグレイテド・サーキツト)
用リードフレームのような薄板の複数枚が積層さ
れた積層薄板群から一枚の薄板を確実に分離する
自動化技術に係り、さらに詳しく言えば、この一
枚の薄板を弧状に変形させて分離する積層薄板の
分離装置に関するものである。
The present invention is an IC (integrated circuit)
It relates to automated technology that reliably separates a single thin plate from a group of laminated thin plates such as lead frames for industrial use, and more specifically, it deforms this single thin plate into an arc shape and separates it. This invention relates to a device for separating laminated thin plates.
ICの製造方法に用いるリードフレームのよう
な薄板を、その積層状態から一枚づつ確実に分離
して生産効率を向上させるために、この分離工程
の高速化と高信頼化及び薄板の品質維持を確実に
行える自動機が要望されている。 In order to improve production efficiency by reliably separating thin plates such as lead frames used in IC manufacturing methods one by one from their laminated state, it is necessary to increase the speed and reliability of this separation process and maintain the quality of the thin plates. There is a need for an automatic machine that can perform this process reliably.
従来の積層薄板の分離装置による薄板の分離方
法について第7図及び第8図により説明する。
A method of separating thin plates using a conventional laminated thin plate separating apparatus will be explained with reference to FIGS. 7 and 8.
第7図は真空チヤツクによる分離方法で、同図
において、1は積層された凹凸のある積層薄板
群、40は真空チヤツク、1−2は吸着されて分
離された薄板である。 FIG. 7 shows a separation method using a vacuum chuck. In the figure, 1 is a group of stacked laminated thin plates with irregularities, 40 is a vacuum chuck, and 1-2 is a thin plate that has been attracted and separated.
この真空チヤツク40は上下動作が可能で、積
層されている最上段の1−2を降下時に真空によ
り吸着し、その後上昇することにより、この薄板
1−2が積層薄板群1から分離される構造であ
る。 This vacuum chuck 40 can move up and down, and has a structure in which the thin plate 1-2 at the top of the stack is vacuum-adsorbed when descending, and then the thin plate 1-2 is separated from the laminated thin plate group 1 by rising. It is.
第8図はくさび状のつめによる分離方法で、同
図において、1は積層された凹凸のある積層薄板
群、41はくさび状のつめ、3は支持具、1−1
は分離された薄板である。積層された薄板群1は
支持具3により支持されており、この状態でくさ
び状のつめ41を最下段とその上の薄板との間に
強制的に挿入し、支持具を水平に移動してその間
隔を薄板の幅より広くすると、最下段の薄板1−
1が自重により落下して薄板1−1が積層された
凹凸のある積層薄板群1から分離され、その後支
持具3の間隔を元の間隔にした後、つめ41の間
隔を元の間隔にして積層薄板群1を支持部3で支
持する。 Fig. 8 shows a separation method using wedge-shaped claws, in which 1 is a group of stacked laminated thin plates with unevenness, 41 is a wedge-shaped claw, 3 is a support, and 1-1
is a separated lamina. The laminated thin plate group 1 is supported by a support 3, and in this state, a wedge-shaped pawl 41 is forcibly inserted between the bottom layer and the thin plate above it, and the support is moved horizontally. If the interval is wider than the width of the thin plate, the lowest thin plate 1-
1 falls due to its own weight, and the thin plate 1-1 is separated from the laminated thin plate group 1 with unevenness, and then the spacing between the supports 3 is returned to the original spacing, and then the spacing between the claws 41 is changed to the original spacing. The laminated thin plate group 1 is supported by a support portion 3.
真空チヤツクによる分離方法においては、積層
薄板群からその上部の一枚の薄板を吸着する際
に、特にその薄板に凹凸がある場合には、真空チ
ヤツク6を引き上げた時に2〜3枚が重なつた状
態で真空チヤツクに吸着されて分離される場合が
あるという問題点があり、また薄板の形状によつ
ては真空チヤツクにより薄板を吸着できない場合
もある。
In the separation method using a vacuum chuck, when picking up the upper thin plate from a stack of laminated thin plates, especially if the thin plate has unevenness, two or three sheets may overlap when the vacuum chuck 6 is pulled up. There is a problem in that the thin plate may be adsorbed to the vacuum chuck and separated in the same state, and depending on the shape of the thin plate, the thin plate may not be able to be adsorbed by the vacuum chuck.
くさび状のつめによる分離方法では、つめを強
制的に薄板の間に挿入するため、積層された薄板
に不均一な隙間があると、くさび状のつめと分離
する薄板の高さが合わないために薄板の表面を傷
つけるという品質上の問題が生じていた。 In the separation method using wedge-shaped claws, the claws are forcibly inserted between the thin plates, so if there are uneven gaps in the laminated thin plates, the heights of the wedge-shaped claws and the thin plates to be separated will not match. There was a quality problem in that the surface of the thin plate was damaged.
本発明はこのような点に鑑み発明されたもの
で、構成が簡単で、迅速、確実にかつ薄板を傷つ
けないで薄板を分離することが可能な積層薄板の
分離装置の提供を目的としたものである。 The present invention was invented in view of the above points, and aims to provide a laminated thin plate separating device that has a simple configuration and is capable of separating thin plates quickly, reliably, and without damaging the thin plates. It is.
本発明の積層薄板の分離装置は、第1のカムに
より支柱に沿つて垂直方向に移動可能な支持台
と、第2のカムによりこの支持台の間に設けた第
1の案内棒に沿つて水平方向に移動可能な、複数
枚の薄板を積層した積層薄板群を支持する支持具
と、固定台の間に設けた第2の案内棒に沿つて第
3のカムにより水平方向に移動可能な挟持具とを
具備するよう構成し、この複数枚の薄板を積層し
た積層薄板群の最下端の一枚の薄板を、この積層
薄板群から分離するよう構成する。
The device for separating laminated sheets of the present invention includes a support that is vertically movable along the column by a first cam, and a first guide rod that is provided between the supports by a second cam. Horizontally movable by a third cam along a second guide rod provided between a support for supporting a group of laminated thin plates made of a plurality of laminated thin plates and a fixed base. The present invention is configured to include a clamping tool, and to separate one thin plate at the lowest end of a laminated thin plate group in which a plurality of thin plates are laminated from this laminated thin plate group.
本発明においては、複数枚の薄板を積層した積
層薄板群を支持具により支持させ、この支持具の
水平方向の移動を案内する案内棒を支持する支持
台を、第1のカムにより支柱に沿つて下降させ、
この積層薄板群の最下端の薄板を、挟持具の水平
な平坦部に当接し、第2のカムによつてこの積層
薄板群を支持している支持具の間隔を広げ、、第
3のカムによつてこの挟持具を固定台の間に設け
た案内棒に沿つて水平方向に移動させてこの積層
薄板群の最下端の一枚の薄板の両側面をこの挟持
具の垂直なつめ部分で挟持し、このつめ部分の間
隔を支持具のつめ部分よりも狭くすると、この最
下端の薄板を積層薄板群から分離することができ
る。
In the present invention, a group of laminated thin plates made by laminating a plurality of thin plates is supported by a support, and a support base that supports a guide rod that guides the horizontal movement of the support is moved along the column by a first cam. and lower it,
The lowermost thin plate of this group of laminated thin plates is brought into contact with the horizontal flat part of the holding tool, the interval between the supports supporting this group of laminated thin plates is widened by the second cam, and the third cam The clamping tool is moved horizontally along the guide rod provided between the fixing bases, and both sides of the lowest sheet of the laminated thin board group are clamped with the vertical claws of the clamping tool. However, by making the spacing between the claws narrower than the claws of the support, the lowermost thin plate can be separated from the group of laminated thin plates.
この後、支持具の間隔を元通りに戻して狭く
し、挟持具の間隔も元通りにして広くし、第1の
カムによつて支持台を上昇させると、積層薄板群
を支持する支持具が、挟持具の位置の上方に上昇
するので、薄板の分離を一層確実にすることが可
能となる。 After that, the spacing between the supports is restored to its original size and narrowed, and the spacing between the clamping devices is also restored and widened. When the support base is raised by the first cam, the support that supports the group of laminated thin plates is raised above the position of the clamping tool, making it possible to separate the thin plates even more reliably.
以下第1図により本発明の原理を、第2図〜第
6図により本発明による一実施例を詳細に説明す
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The principle of the present invention will be explained below in detail with reference to FIG. 1, and an embodiment according to the present invention will be explained with reference to FIGS. 2 to 6.
第2図は支持具3と挟持具4と積層薄板群1と
の要部の関係を示す平面図、第3図は第2図の側
面図、第4図は第2図のA−A矢視図、第5図は
第2図のB−B矢視図、第6図は透視図である。 FIG. 2 is a plan view showing the relationship between the main parts of the support 3, the clamping tool 4, and the laminated thin plate group 1, FIG. 3 is a side view of FIG. 2, and FIG. A perspective view, FIG. 5 is a view taken along the line B--B in FIG. 2, and FIG. 6 is a perspective view.
支持具3と挟持具4は第2図に示すように、平
面的には交互に櫛状に配設されており、支持具3
は4個所において対向しており合計8個所、挟持
具4は3個所において対向しており合計6個所で
積層薄板群1にそれぞれ接している。 As shown in FIG.
are opposed to each other at four locations, for a total of eight locations, and the clamping tool 4 is opposed to each other at three locations, and is in contact with the laminated thin plate group 1 at six locations in total.
第2図及び第3図は支持具3の間隔が積層薄板
群1を支持する間隔であり、かつ支持具3が最上
の位置にある状態を示している。(第1図aの状
態)
この状態で積層薄板群1を上から支持具3のつ
め部分3−1に載せて装填する。ここで後述する
第1のカム15により、支持具3は挟持具4の平
坦部4−1に積層薄板群1が当接する位置まで下
降し、ついで支持具3のつめ部3−1の先端の間
隔を薄板の幅よりも広くする。(第1図bの状態)
つぎに挟持具4の間隔を狭くし、その垂直なつ
め部分4−2で積層薄板群1の最下端の一枚の薄
板、即ち挟持具4の平坦部4−1に当接している
一枚の薄板1−1をその両側面から第5図の矢印
の方向に挟持し、更にその薄板の幅よりも狭く圧
縮する。即ち、薄板幅40mmに対し更に0.2mm程度
狭くなるまで圧縮する。この際支持具3の間隔を
元の状態に戻して支持具3で積層薄板群1を支持
する。 FIGS. 2 and 3 show a state in which the spacing between the supports 3 is such that the group of laminated thin plates 1 is supported, and the supports 3 are in the uppermost position. (The state shown in FIG. 1a) In this state, the laminated thin plate group 1 is loaded by placing it on the claw portion 3-1 of the support 3 from above. Here, by the first cam 15 which will be described later, the support 3 is lowered to a position where the laminated thin plate group 1 comes into contact with the flat part 4-1 of the clamping tool 4, and then the tip of the claw part 3-1 of the support 3 is lowered. Make the spacing wider than the width of the thin plate. (The state shown in FIG. 1b) Next, the interval between the clamping tools 4 is narrowed, and the vertical claw portion 4-2 is used to connect the lowestmost thin plate of the laminated thin plate group 1, that is, the flat part 4-1 of the clamping tool 4. A thin plate 1-1 that is in contact with is held between both sides thereof in the direction of the arrow in FIG. 5, and further compressed to a width narrower than the width of the thin plate. In other words, the thin plate width of 40 mm is compressed until it becomes narrower by about 0.2 mm. At this time, the spacing between the supports 3 is returned to the original state, and the laminated thin plate group 1 is supported by the supports 3.
この時積層薄板群1は自重によりその中央部が
僅かに下方に垂下しているので、両側から圧縮さ
れた薄板1−1は下方に膨れるような形で容易に
湾曲し、下から2枚目の薄板から分離する。(第
1図cの状態)
挟持具4のつめ部分4−2の高さは薄板の厚さ
より低く設定されているので、この場合に下端か
ら二枚目の薄板はそのままの状態であり、挟持具
4の上面によつて傷つけられることもない。 At this time, the central part of the laminated thin plate group 1 is slightly hanging downward due to its own weight, so the thin plate 1-1, which is compressed from both sides, easily curves in a shape that swells downward, and the second plate from the bottom Separate from the thin plate. (Condition shown in Figure 1c) Since the height of the claw portion 4-2 of the clamping tool 4 is set lower than the thickness of the thin plate, in this case, the second thin plate from the bottom remains in the same state and is not clamped. It will not be damaged by the upper surface of the tool 4.
ついで、積層薄板群1を支持する支持具3は第
1のカム15により支柱16に沿つて上昇し、同
時に挟持具4の間隔を元通りに広げると、分離さ
れた一枚の薄板1−1はその弾性により平坦な形
状に復帰し、分離する薄板と積層薄板群1とは確
実に分離される。(第1図dの状態)
この圧縮による変形は、充分に弾性限度内であ
るので、この薄板1−1には何ら後遺症的な変形
が残留することはない。 Next, the supporting tool 3 supporting the laminated thin plate group 1 is raised along the support column 16 by the first cam 15, and at the same time, when the gap between the clamping tools 4 is widened to the original state, the separated single thin plate 1-1 returns to its flat shape due to its elasticity, and the thin plates to be separated and the laminated thin plate group 1 are reliably separated. (The state shown in FIG. 1d) Since the deformation caused by this compression is sufficiently within the elastic limit, no residual deformation remains in the thin plate 1-1.
ここで第4図及び第5図により上記の支持具3
と挟持具4の開閉と昇降を行うカム機構について
詳細に説明する。 Here, according to FIGS. 4 and 5, the above-mentioned support 3
The cam mechanism for opening/closing and raising/lowering the clamping tool 4 will be explained in detail.
第4図に示すように、支持具3はそれを貫通す
る2本の案内棒17により案内されて水平に移動
可能である。そして支点21を中心として回動可
能な一対のレバー20が、スプリング22により
ローラを介してカム14に圧着され、このカム2
2の回転に応じてレバー20が支点21を中心と
して回動し、支持具3に設けた切り込み部分3−
2に、このレバー20の上部の先端に取り付けら
れたローラー23が嵌入されているので、支持具
3を案内棒17に沿つて水平に移動することが可
能である。 As shown in FIG. 4, the support 3 is guided by two guide rods 17 passing through it and is movable horizontally. A pair of levers 20, which are rotatable about a fulcrum 21, are pressed against the cam 14 via a roller by a spring 22.
2, the lever 20 rotates around the fulcrum 21, and the notch 3- provided in the support 3
2 is fitted with a roller 23 attached to the top end of the lever 20, so that the support 3 can be moved horizontally along the guide rod 17.
支持具3は、この案内棒17を支持している支
持台13が4本の垂直な支柱16に沿つて垂直方
向に移動できるので、上昇或いは下降することが
可能であり、支柱16上の固定具24により支持
されたスプリング25は常に支持台13を持ち上
げているが、支持台13から出ているレバー26
の先端部に取り付けられたローラ27がカム15
によつて押し下げられることにより、支持台13
はカム15の回転に応じて上下動する。 The support 3 can move up or down because the support stand 13 supporting the guide rod 17 can move vertically along the four vertical columns 16, and can be fixed on the columns 16. The spring 25 supported by the tool 24 always lifts the support base 13, but the lever 26 protruding from the support base 13
The roller 27 attached to the tip of the cam 15
By being pushed down by the support stand 13
moves up and down according to the rotation of the cam 15.
第5図に示すように、挟持具4はこれを貫通す
る一対の案内棒19により案内されて水平方向に
移動可能である。この案内棒19は、上記の4本
の垂直な支柱16により固定された固定台11
に、その両端が固定されている。支点31を中心
として回動可能な一対のレバー30が、スプリン
グ32によりローラを介してカム18に圧着さ
れ、このカム18の回転に応じてレバー30が支
点31を中心として回動し、挟持具4に設けた切
り込み部分4−2に、このレバー30の上部の先
端に取り付けられたローラー33が嵌入されてい
るので、挟持具4を案内棒19に沿つて水平に移
動することが可能である。 As shown in FIG. 5, the clamping tool 4 is guided by a pair of guide rods 19 passing through it, and is movable in the horizontal direction. This guide rod 19 is attached to a fixed base 11 fixed by the four vertical supports 16 mentioned above.
is fixed at both ends. A pair of levers 30 that are rotatable around a fulcrum 31 are pressed against the cam 18 via a roller by a spring 32, and in response to the rotation of the cam 18, the levers 30 rotate around the fulcrum 31, and the gripping tool Since the roller 33 attached to the top end of the lever 30 is fitted into the notch 4-2 provided in the lever 4, the clamping tool 4 can be moved horizontally along the guide rod 19. .
上記のカム14,15,18は一体化して共通
の軸によつて同時に駆動され、上記の支持具3及
び挟持具4の水平移動及び垂直移動の順序及び変
位量はこれらのカムの形状と軸への取り付け角度
により設定することが可能である。 The cams 14, 15, and 18 are integrated and driven simultaneously by a common shaft, and the order and amount of displacement of the horizontal and vertical movements of the support 3 and clamping tool 4 are determined by the shape and shaft of these cams. It is possible to set it by the installation angle.
第6図の透視図は単純化のため省略されている
部分があるが、案内棒17と19はそれぞれ一対
で2本、カム14と15はそれぞれ一対で2個、
カム18は挟持具4の中央に1個設けられてい
る。 Although some parts of the perspective view in FIG. 6 are omitted for simplicity, there are two guide rods 17 and 19 in each pair, two cams 14 and 15 in each pair,
One cam 18 is provided at the center of the clamping tool 4.
分離する薄板の形状は単純な平板だけでなく、
図示のようにICチツプ取り付け用の凹部を有す
る場合には、その凸部を変形湾曲方向に持つてく
ることにより、挟持具4による圧縮変形を容易に
行うことができる。 The shape of the thin plate to be separated is not limited to a simple flat plate.
In the case where a concave portion for attaching an IC chip is provided as shown in the figure, compressive deformation by the holding tool 4 can be easily performed by bringing the convex portion in the direction of deformation and curvature.
上記の実施例は、積層薄板群の最下端の一枚の
薄板を分離する装置の場合について説明たが、積
層薄板群の最上端の一枚の薄板を、或いは横方向
に積層した積層薄板群の最端部の一枚の薄板を分
離する場合においても、本発明を適用することが
可能である。 The above embodiment describes the case of an apparatus that separates one thin plate at the bottom of a group of laminated thin plates. The present invention can also be applied to the case where a single thin plate at the end of a wafer is separated.
以上述べたように本発明によれば、構成が簡単
で、迅速、確実にかつ薄板を傷つけないで、積層
薄板の分離を行うことが可能となる積層薄板の分
離装置を提供をすることが可能であり、その工業
的効果は極めて大きい。
As described above, according to the present invention, it is possible to provide a laminated thin plate separation device that has a simple configuration and is capable of separating laminated thin plates quickly, reliably, and without damaging the thin plates. The industrial effect is extremely large.
第1図は本発明の原理説明図、第2図は本発明
の一実施例の要部平面図、第3図は第2図の側面
図、第4図は第2図のA−A矢視図、第5図は第
2図のB−B矢視図、第6図は本発明の一実施例
の透視図、第7図は従来の方法の説明図、第8図
は従来の他の方法の説明図、である。
図において、1は積層薄板群、1−1は分離さ
れた一枚の薄板、3は支持具、4は挟持具、であ
る。
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is a plan view of essential parts of an embodiment of the present invention, Fig. 3 is a side view of Fig. 2, and Fig. 4 is an arrow shown along the line A-A in Fig. 2. 5 is a view taken along the line B-B in FIG. 2, FIG. 6 is a perspective view of an embodiment of the present invention, FIG. 7 is an explanatory diagram of a conventional method, and FIG. This is an explanatory diagram of the method. In the figure, 1 is a group of laminated thin plates, 1-1 is a separated thin plate, 3 is a support, and 4 is a clamp.
Claims (1)
方向に移動可能な支持台13と、 第2のカム14により前記支持台13の間に設
けた第1の案内棒17に沿つて水平方向に移動可
能な、複数枚の薄板を積層した積層薄板群1を支
持する支持具3と、 固定台11の間に設けた第2の案内棒19に沿
つて第3のカム18により水平方向に移動可能な
挟持具4と、 を具備し、複数枚の薄板を積層した前記積層薄板
群1の最下端の一枚の薄板1−1を、前記積層薄
板群1から分離することを特徴とする積層薄板の
分離装置。[Claims] 1. A support base 13 movable in the vertical direction along a column 16 by a first cam 15, and a first guide rod 17 provided between the support base 13 by a second cam 14. A third cam is moved along a second guide rod 19 provided between a support 3 that supports a laminated thin plate group 1 made of a plurality of laminated thin plates, and a fixed base 11, which is movable in the horizontal direction along a fixed base 11. a clamping tool 4 movable in the horizontal direction by 18, which separates the lowest one thin plate 1-1 of the laminated thin plate group 1 in which a plurality of thin plates are laminated from the laminated thin plate group 1; A laminated thin plate separation device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12073686A JPS62280135A (en) | 1986-05-26 | 1986-05-26 | Laminated thin plate separation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12073686A JPS62280135A (en) | 1986-05-26 | 1986-05-26 | Laminated thin plate separation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62280135A JPS62280135A (en) | 1987-12-05 |
| JPH0321461B2 true JPH0321461B2 (en) | 1991-03-22 |
Family
ID=14793710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12073686A Granted JPS62280135A (en) | 1986-05-26 | 1986-05-26 | Laminated thin plate separation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62280135A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06333959A (en) * | 1993-05-26 | 1994-12-02 | Nec Corp | Lead frame supplying device |
| JP5562604B2 (en) * | 2009-09-29 | 2014-07-30 | エムテックスマツムラ株式会社 | Method and device for preventing two frames from being taken out by a frame take-out device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59108639A (en) * | 1982-12-14 | 1984-06-23 | Sumitomo Metal Mining Co Ltd | Feeder for platelike material with resilience |
-
1986
- 1986-05-26 JP JP12073686A patent/JPS62280135A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62280135A (en) | 1987-12-05 |
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