JP2587011B2 - High frequency signal line forming member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a signal line exposed to the outside of a base for electronic components (hereinafter simply referred to as a base) such as a package and a substrate, as a signal line for transmitting a high-frequency signal. The present invention relates to a high-frequency signal line forming member to be formed (hereinafter, simply referred to as a forming member).

2. Description of the Related Art As a conventional signal line for transmitting a high-frequency signal provided on a base such as a ceramic package or a substrate for accommodating and mounting a high-frequency element, there is a signal line described below.

That is, a signal line for transmitting a high-frequency signal such as a tungsten metallized layer is provided inside or on the surface of an insulator such as a ceramic constituting the base, and is electrically connected to the ground inside or on the surface of the insulator around the signal line. And a conductor layer such as a tungsten metallized layer filled with a via hole filled with a conductor such as tungsten metallized.

In this signal line, via holes or conductor layers filled with conductors electrically conductive to the ground around the signal line transmitting the high-frequency signal form a metal wall or pseudo metal wall, and the high-frequency signal transmitted through the signal line is formed. Prevents signals from leaking out.

[Problems to be Solved by the Invention] By the way, the above-mentioned conventional signal line for transmitting a high-frequency signal provided inside the base body does not have its surface plated with gold or the like for reducing the surface resistance of the signal line. When a high-frequency signal is transmitted using the signal line, the conductor loss is large, and the high-frequency signal cannot be transmitted efficiently.

Heretofore, in some bases, a low-temperature sinterable ceramic has been used as an insulator constituting the base, and a signal line having a low conductor resistance value has been provided inside the insulator of the ceramic and a signal line provided on the surface thereof. There is a signal line using a noble metal and provided inside a base, which efficiently transmits a high-frequency signal with a small conductor loss.

However, in this base, it is not possible to connect electronic components such as leads and semiconductor elements with sufficient mechanical strength and electrical reliability to a signal line formed using a noble metal exposed outside the base. It is impossible with the current technology, and a highly reliable semiconductor device or the like cannot be formed using such a base.

Therefore, as a result of earnest research, the present inventor has formed a signal line provided inside an insulator constituting a base in a state where the signal line is exposed to the outside of the base, and provided a conductor resistance value of the signal line surface on the exposed line surface. After that, the line is covered with an insulator provided with a conductor layer electrically conductive to a ground for forming a metal wall or a pseudo metal wall, or a via hole filled with a conductor, or the like. Therefore, if the signal line is formed inside the insulator of the base, the signal line with reduced conductor loss can be easily formed inside the base. It has been conceived that it can be formed by a tungsten metallized layer or the like which can be connected with high mechanical strength and electrical reliability.

That is, an object of the present invention is to reduce the conductor loss of a signal line for transmitting a high-frequency signal provided inside an insulator, and to provide a signal line with sufficient mechanical strength and electrical reliability by providing leads and electronic components. It is an object of the present invention to provide a forming member for forming a signal line inside a base, which can use a tungsten metallized layer or the like that can be connected by being connected.

[Means for Solving the Problems] In order to achieve the above object, a first forming member of the present invention is mounted on a surface portion of a substrate for an electronic component where a signal line is exposed, and is mounted on a surface portion of the substrate. An insulator for covering the exposed signal line, and a conductor layer for forming a metal wall provided on the insulator, or a via hole filled with a conductor for forming a pseudo metal wall provided on the insulator; An insulator is mounted on the surface of the base where the signal line is exposed, and the signal line exposed on the surface of the base is covered with the insulator, and the side of the signal line exposed on the surface of the base is covered with the insulator. So that the conductor layer or the via hole can be surrounded by the conductor layer or the via hole at a predetermined interval from the signal line, and the conductor layer or the via hole can be electrically connected to the ground provided in the base. ,Before It is characterized in that the conductor layer or the via hole is provided in the insulator.

A second forming member according to the present invention includes: an insulator that is fitted around a signal line protruding from the electronic component base to cover the signal line protruding from the base; and an insulator for forming a metal wall provided on the insulator. And a via hole filled with a conductor for forming a pseudo metal wall provided on the insulator, and the insulator was inserted around a signal line protruding from the base to protrude from the base. In a state where the signal line is covered with the insulator, the periphery of the side of the signal line protruding from the base can be surrounded by the conductor layer or via hole at a predetermined interval from the signal line, and the conductor The invention is characterized in that the conductor layer or the via hole is provided in the insulator so that the layer or the via hole can be electrically connected to the ground provided in the base.

[Operation] In the first forming member of the present invention, an insulator is mounted on the surface of the base where the signal line for transmitting a high-frequency signal is exposed, and the insulator covers the signal line exposed on the surface of the base. be able to. Then, a via hole filled with a conductor layer for forming a metal wall provided on the insulator or a conductor for forming a pseudo metal wall provided on the insulator is formed around the side of the signal line exposed on the surface portion of the base. Can be disposed so as to surround the signal line at a predetermined interval. At the same time, a via hole filled with a conductor layer for forming a metal wall provided on the insulator or a conductor for forming a pseudo metal wall provided on the insulator is electrically connected to a ground provided on the base. And can be grounded.

Then, around a side portion of the signal line exposed on the surface portion of the base, a metal wall made of a conductor layer provided on the insulator or a via filled with a conductor provided on the insulator at a predetermined interval from the signal line. A pseudo metal wall composed of holes can be formed. Then, by using the metal wall or the pseudo metal wall, it is possible to prevent a high frequency signal transmitted through the signal line exposed on the surface portion of the base from being mixed into another signal line provided on the base.

In addition, before mounting the insulator on the surface of the base where the signal line is exposed, the surface of the signal line exposed on the surface of the base can be plated with gold or the like having a low conductor resistivity. Then, by reducing the conductor resistance value of the signal line surface, the conductor loss of the high-frequency signal transmitted through the signal line exposed on the surface portion of the base can be reduced.

In the second forming member of the present invention, an insulator can be fitted around the signal line for transmitting a high-frequency signal protruding from the base, and the signal line protruding from the base can be covered with the insulator. Then, a via hole filled with a conductor layer for forming a metal wall provided on the insulator or a conductor for forming a pseudo metal wall provided on the insulator is formed around the side of the signal line protruding from the base. Can be arranged so as to surround them at a predetermined interval. At the same time, a via hole filled with a conductor layer for forming a metal wall provided on the insulator or a conductor for forming a pseudo metal wall provided on the insulator is electrically connected to a ground provided on the base. And can be grounded.

Around the side of the signal line protruding from the base, a metal wall made of a conductor layer provided on the insulator, or a via hole filled with a conductor provided on the insulator is provided at a predetermined interval from the signal line. A pseudo metal wall can be formed. Then, by using the metal wall or the pseudo metal wall, it is possible to prevent a high frequency signal transmitted through a signal line protruding from the base from being mixed into another signal line provided on the base.

Before the insulator is inserted around the signal line protruding from the base, the surface of the signal line protruding from the base may be plated with gold or the like having a low conductor resistivity. Then, the conductor resistance of the signal line surface can be reduced, and the conductor loss of the high-frequency signal transmitted through the signal line protruding from the base can be reduced.

Example Next, an example of the present invention will be described with reference to the drawings. 1 to 4 show a preferred embodiment of a first forming member for a ceramic package according to the present invention. FIG. 1 is a partial plan view showing a state where the forming member is mounted on the package. FIG. 3 is a sectional view taken along line AA of the package of FIG. 1, FIG. 3 is a sectional view taken along line BB of the package of FIG. 1, and FIG. 4 is a partially enlarged perspective view of a forming member used in the package. Hereinafter, an embodiment in the above-mentioned figure is explained.

FIG. 1 and the like show a high-frequency semiconductor in which a narrow ceramic frame 16 for forming a seal layer 15 for covering a cap 14 is integrally laminated on a top surface of a ceramic frame 13 for forming a cavity 12. A package containing the element 17 is shown.

A rectangular frame-shaped ceramic, which integrally covers the upper surface of the cavity forming frame 13 widely exposed inside the seal layer forming frame 16 of the package together with the plurality of signal lines 3 radially provided around the upper surface. Is provided.

A thin planar tungsten metallized layer that is a conductor layer 6 is radiated at predetermined intervals radially inside and outside of the rectangular frame-shaped insulator 4 and across the insulator 4. 6a. Further, a tungsten metallized layer inside the insulator 4 is formed on the upper surface of the insulator 4.
6a is provided with a tungsten metallized layer 6b, which is a conductor layer 6 continuous in series. Here, the tungsten metallized layer 6a radially provided inside the insulator 4 is provided by forming the rectangular frame-shaped insulator 4 inside the frame 16 for forming a seal layer, as shown in FIG. When mounted on the upper surface of the frame 13 for forming the cavity and covering the upper surface of the signal line 3 on the upper surface of the frame 13 for forming the cavity, which is exposed inside the frame 16 for forming the seal layer, Tungsten metallization layer
6a is provided inside the insulator 4 so as to be located between the adjacent signal lines 3 without contacting the signal lines 3 on the upper surface of the frame 13 for forming the cavity.

The first forming member shown in FIGS. 1 to 4 has the above configuration.

Next, an example of its use will be described. The surface of the signal line 3 on the upper surface of the cavity forming frame 13 exposed inside the sealing layer forming frame 16 before being covered with the forming member 1 is plated with gold or the like to reduce the conductor resistance of the line surface. Is applied. Then, as shown in FIG. 1 and the like, the rectangular frame-shaped forming member 1 is mounted on the upper surface of the cavity forming frame 13 inside the seal layer forming frame 16 of the package 2a. And
The surfaces of the plurality of signal lines 3 around the upper surface of the cavity forming frame 13 exposed inside the seal layer forming frame 16 are integrally covered with the forming member 1. Also, a cavity forming frame 13 located between adjacent signal lines immediately below the tungsten metallization layer 6a provided inside the insulator 4 of the forming member 1
In the portion, a via hole 11 filled with the conductor 10 is provided by penetrating the inside of the frame, and the lower end of the via hole 11 is
13 is electrically connected to the bottom plate 9 constituting the ground 5 integrally attached to the bottom surface via the metallization layer 18. Then, the conductor 10 which electrically connects the lower end of the tungsten metallized layer 6a inside the insulator 4 to the bottom plate 9 provided on the frame 13 for forming a cavity between the adjacent signal lines 3 immediately below the tungsten metallized layer 6a is filled. A connection is made to the upper end of the via hole 11 using a conductive adhesive or a low-temperature brazing material. At the same time, in some cases, the lower surface of the forming member 1 is fixed by using an adhesive or the like so that the forming member 1 is not separated from the upper surface of the cavity forming frame 13 on which the member is mounted. It is fixed to the upper surface of the body 13 or the like.

Then, the periphery of the signal line 3 on the upper surface of the frame 13 for forming the cavity of the package shown in FIG. 1 and the like, and the bottom plate constituting the ground 5 provided in the portion of the frame 13 for forming the cavity between the adjacent signal lines 3 9, a via hole 11 filled with a conductor 10 electrically conductive to the via hole 9, a tungsten metallized layer 6a inside the insulator 4 of the forming member electrically conductive to the via hole, and an insulator continuously connected to the tungsten metallized layer. 4, the tungsten metallization layer 6b on the upper surface surrounds the pseudo metal wall or metal wall composed of the via hole 11 and the tungsten metallization layers 6a, 6b.
To prevent crosstalk by mixing in

Further, plating such as gold plating applied to the surface of the signal line 3 on the upper surface of the cavity forming frame 13 covered with the forming member 1 suppresses the conductor loss of the high-frequency signal transmitted on the line surface to a small extent. Transmits high-frequency signals efficiently.

5 and 6 show a preferred embodiment of the first forming member used for the ceramic substrate of the present invention.
FIG. 6 is a plan view showing the state where the forming member is mounted on the substrate, and FIG. 6 is a cross-sectional view taken along line XX of the substrate shown in FIG. Hereinafter, an embodiment in the above-mentioned figure is explained.

FIG. 5 and the like show a ceramic substrate 2b provided with a signal line 3 made of a tungsten metallized layer 6a for transmitting a high-frequency signal on its upper surface.

A rectangular block-shaped ceramic insulator 4 is provided to cover the upper surface of the signal line 3 for transmitting the high-frequency signal of the substrate 2b.

A tungsten metallized layer 6b, which is a conductor layer 6, is integrally provided on the upper surface of the insulator 4, and the tungsten 4 on the upper surface of the insulator 4 is arranged at small intervals before and after the insulator 4 in the thickness direction thereof. A plurality of via holes 8 in which a metallized layer 6b is filled with a series of continuous tungsten metallized conductors 7 are provided integrally through the inside of the insulator 4. Here, the plurality of via holes 8 filled with the conductors 7 provided before and after the insulator 4 of the forming member cover the surface of the signal line 3 for transmitting a high-frequency signal on the upper surface of the substrate 2b, as shown in FIG. When the surface of the line is covered, the lower ends of the plurality of via holes 8 filled with the conductors 7 provided before and after the insulator 4 of the forming member do not contact the signal line 3 for transmitting a high-frequency signal on the upper surface of the substrate 2b. In addition, it is provided at predetermined intervals before and after the insulator 4 of the forming member so as to be located on both sides of the signal line 3.

The first forming member shown in FIGS. 5 and 6 has the above configuration.

Next, an example of its use will be described. The surface of the signal line 3 on the upper surface of the substrate 2b before being integrally covered with the forming member 1 is plated with gold or the like to reduce the surface resistance of the signal line 3.
Then, the forming member 1 is put on the upper surface of the upper surface of the substrate 2b provided with the signal line 3 for transmitting the high-frequency signal, and the plurality of via holes 8 filled with the conductors 7 provided before and after the insulator 4 of the forming member are formed on the substrate 2b. The signal line 3 on the upper surface of the substrate 2b is placed on both sides of the signal line 3 on the upper surface
Cover all together. A portion of the substrate 2b located immediately below the plurality of via holes 8 filled with the conductors 7 provided before and after the insulator 4 of the forming member that covers the surface of the signal line 3 on the upper surface of the substrate 2b, 2b
Are provided, and the lower end of the via hole 11 is electrically connected to the bottom plate 9 constituting the ground 5 integrally provided on the lower surface of the substrate 2b via the metallized layer 18 in advance. The lower end of the plurality of via holes 8 filled with the conductors 7 before and after the insulator 4 of the forming member is placed on the upper end of the plurality of via holes 11 filled with the conductor 10 by a conductive adhesive or a low-temperature brazing material. And are connected together. At the same time, in some cases, the lower surface of the insulator 4 of the forming member is fixed to the upper surface of the substrate 2b using an adhesive or the like so that the forming member 1 mounted on the upper surface of the substrate 2b does not separate from the upper surface.

Then, the ground around the upper surface of the signal line 3 for transmitting high-frequency signals provided on the upper surface of the substrate 2b is formed before and after the insulator 4 of a forming member that integrally covers the upper surface of the line and the lower surface of the substrate 2b provided on the substrate 2b. A plurality of via holes (8, 11) filled with conductors (7, 10) electrically conductive to the bottom plate (9);
The tungsten metallized layer 6b on the upper surface of the insulator 4 that is electrically connected to the via holes 8, 11 surrounds the via holes 8,
The metal wall or the pseudo metal wall including the metal layer 11 and the tungsten metallization layer 6b prevents a high-frequency signal transmitted through the signal line 3 from being mixed into another signal line 3 to cause crosstalk.

Further, plating such as gold plating applied to the surface of the signal line 3 for transmitting the high-frequency signal suppresses conductor loss of the high-frequency signal transmitted on the surface of the line, and the signal line 3 efficiently transmits the high-frequency signal.

FIGS. 7 (a), (b) and 8 show a preferred embodiment of the second forming member for a metal package of the present invention, and FIGS. 7 (a) and (b) show the second embodiment. FIG. 8 is a partial structural explanatory view showing a state where the forming member of FIG. 7 is mounted on a metal package. Hereinafter, an embodiment in the above-mentioned figure is explained.

In FIG. 8, a glass 21 is interposed between the package body 20 and the package body 20 through the inside of the side wall of the package body 20 made of a metal member.
A metal package 2c having a bar-shaped lead 3b constituting the signal line 3 is shown.

A ceramic insulator 4 having a rectangular block-like shape constituting the forming member 1 and having a through hole 23 through which the lead 3b is inserted in a lateral direction, covering the periphery of the lead 3b protruding into the package body inner space 22 of the metal package 2c. Is provided. The through-hole is formed inside the insulator 4 or on a side surface around the insulator 4.
Package body 20 that constitutes ground 5 surrounding the periphery of 23
And a conductor layer 6 such as a tungsten metallized layer that is electrically connected to the conductive layer.

The second forming member for the metal package shown in FIGS. 7A, 7B and 8 has the above-described structure.

Next, an example of its use will be described. The surface of the lead 3b projecting into the space 22 inside the package body before being covered with the forming member 1 is plated with gold or the like to reduce the surface resistance of the lead. Then, the lead 3b protruding into the body internal space 22 is penetrated and inserted into the inside of the through hole 23 of the insulator 4 of the forming member 1, and the periphery of the lead 3b is integrally covered with the forming member 1. At the same time, a part of the conductor layer 6 on the insulator side surface of the forming member 1 is connected to a part of the package body 20 constituting the ground 5 using a conductive adhesive or the like. The conductive layer 6 provided on the insulator is electrically connected to the ground 5.

Then, the conductor layer 6 electrically connected to the ground 5 provided around the through hole 23 in the insulator 4 of the forming member 1 is formed around the through hole 23 through which the lead 3b of the insulator 4 is inserted. Is formed to prevent a high-frequency signal transmitted through the lead 3b from being mixed into another lead 3b to cause crosstalk.

Also, plating such as gold plating applied to the lead 3b surface
The conductor loss of the lead 3b is suppressed to be small, and the lead 3b transmits a high-frequency signal efficiently.

In each of the above-described embodiments, resin or the like may be used for the insulator 4 forming the forming member 1.

Also, a ground 5 provided inside or on the surface of the forming member 1
A rod-shaped or thin metal member may be used for the conductor 7 and the conductor layer 6 that fill the inside of the via hole 8 that is electrically connected to the via hole 8.

Further, a protrusion (not shown) is provided on either the lower surface of the forming member 1 or the upper surface of the one base 2 on which the member is mounted, and the protrusion is fitted into the upper surface of the other base 2 or the lower surface of the forming member 1. An insertion hole (not shown) may be provided, and the projection may be inserted into the insertion hole to position and fix the forming member 1 at a predetermined position on the upper surface of the base 2.

Also, a via hole 8 filled with a conductor 7 inside the insulator 4 of the forming member, a conductor layer 6 and a bottom plate 9 forming the ground 5
Etc. are provided on the upper surface of the base 2 as a circuit pattern (not shown).
The connection may be made using a conductor layer such as.

Further, as the forming member 1 similar to the above-described embodiment used for the package 2a shown in FIG. 1 and the like, the upper surface of the cavity forming frame 13 exposed outside the sealing layer forming frame 16 is formed around the upper surface. Covering together with a plurality of signal lines 3,
The signal line 3 on the upper surface of the frame is formed as the signal line 2 for transmitting a high-frequency signal, and has a structure similar to the formation member 1 of the above-described embodiment used for the package 2a. A forming member having a large rectangular frame shape is conceivable.

[Effects of the Invention] As described above, the first or second forming member of the present invention is placed on a signal line for transmitting a high-frequency signal that is exposed or protrudes to the outside of a base such as a package or a board, and the forming member is formed. If the conductor layer surrounding the inside of the insulator and the signal line provided on the surface thereof and the via hole filled with the conductor are electrically connected to the ground of the base and the signal line of the base is covered with the forming member, By using the first or second forming member of the present invention, a signal line that is exposed or protruded outside the base is converted into a signal in which a high-frequency signal transmitted through the line is not mixed into another signal line to cause crosstalk. Can be formed on railway tracks.

Also, the surface of the signal line exposed or protruded outside the base such as the package and the substrate before being covered with the first or second forming member of the present invention is plated with gold plating or the like having a small conductor resistance value, By suppressing the conductor loss of the high-frequency signal transmitted on the signal line surface to a small value, a signal line for efficiently transmitting the high-frequency signal inside the base can be easily formed.

Further, as the base using the first or second forming member of the present invention, a ceramic or a tungsten metallized layer which is usually fired at a high temperature for the insulator or the signal line can be used. Therefore, according to the present invention, a tungsten metallized layer or the like that can be accurately connected to a signal line of the base body by using a normal brazing material or the like with external lead or the like having mechanical strength and electrical reliability is used. A highly reliable substrate such as a package or a substrate for a semiconductor device can be formed.

[Brief description of the drawings]

FIG. 1 is a partial plan view showing a state in which a first high-frequency signal line forming member of the present invention is mounted on a package, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 4 is a partially enlarged perspective view of the first high-frequency signal line forming member, and FIG. 5 is a diagram illustrating the first high-frequency signal line forming member of the present invention mounted on a substrate. FIG. 6 is a cross-sectional view taken along line XX of the substrate of FIG. 5, and FIGS. 7A and 7B are front views of a second high-frequency signal line forming member for a metal package. FIG. 8 is a side view, and FIG. 8 is a partial structural explanatory view showing a state where the second high-frequency signal line forming member of FIG. 7 is mounted on a metal package. DESCRIPTION OF SYMBOLS 1 ... High frequency signal line forming member, 2 ... Electronic component base, 2a ... Package, 2b ... Substrate, 2c ... Metal package, 3 ... Signal line, 4 ... Insulator, 5 ... Ground , 6 ... conductor layer, 6a, 6b, 6c ... tungsten metallization layer, 7,10 ... conductor, 8, 11 ... via hole, 9 ... bottom plate.

Claims (2)

(57) [Claims] An insulator mounted on a surface portion of a substrate for an electronic component where a signal line is exposed to cover the signal line exposed on a surface portion of the substrate, and an insulator provided on the insulator for forming a metal wall. A conductor layer, or a via hole filled with a conductor for forming a pseudo metal wall provided in the insulator; and mounting the insulator on a surface portion of the base where the signal line is exposed, thereby forming a surface portion of the base. In a state where the exposed signal line is covered with the insulator, the periphery of the side of the signal line exposed on the surface portion of the base can be surrounded by the conductor layer or via hole at a predetermined interval from the signal line. The conductor layer or the via hole is provided in the insulator so that the conductor layer or the via hole can be electrically connected to a ground provided in the base. Week Use signal line forming member. 2. An insulator which is fitted around a signal line protruding from the base for an electronic component to cover the signal line protruding from the base, a conductor layer for forming a metal wall provided on the insulator, or A via hole filled with a conductor for forming a pseudo metal wall provided in the insulator, and the insulator is fitted around a signal line protruding from the base,
In a state where the signal line protruding from the base is covered with the insulator, the periphery of the side of the signal line protruding from the base can be surrounded by the conductor layer or via hole at a predetermined interval from the signal line. And the conductor layer or the via hole is provided in the insulator so that the conductor layer or the via hole can be electrically connected to a ground provided in the base. Signal line forming member.