JP2589358B2 - Double-sided mounting TAB tape carrier - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a double-sided mounting type TAB tape carrier used by incorporating electronic components on both sides.

[Related Art] In a conventional TAB tape carrier, a lead pattern is formed only on one side, and a semiconductor integrated circuit element (hereinafter, referred to as an IC element) is attached from below a device hole.
For example, FIG. 3 shows the structure of a conventional TAB tape carrier. Conventional single-sided mounting TAB tape carrier 4 shown in the figure
0 has the lead pattern shown in FIG.
The structure of the AB tape carrier is as follows: First, a device hole 20 for mounting an IC element is opened in a standard 35 mm wide polyimide film 12 or an organic insulating material tape such as glass epoxy, and a copper foil 14 having a thickness of 18 to 35 μm is formed on one surface thereof. In this structure, the patterns of the inner leads 22 and the outer leads 30 are formed by sticking and photo-etching.

As shown in FIG. 3, this conventional TAB tape carrier 40 has a structure in which the IC element 18 is mounted from below the device hole 20 and the inner lead 22 and the IC element electrode 24 are gang bonded. Was.

[Problems to be Solved by the Invention] By the way, a conventional TAB tape carrier in which a metal foil lead pattern such as a copper foil or a copper alloy foil is formed only on one side of an organic insulating material tape such as a polyimide film or a glass epoxy. Had the following problems.

1. Since the metal foil is applied only from one side, the coefficient of thermal expansion between the metal foil and an organic insulating material such as polyimide or glass epoxy differs due to temperature change. As shown in FIG. 3, the (+) side Or, the tape was warped to the (-) side. For this reason, if the tape is used in places where large temperature fluctuations are present after mounting the IC element, the tape will be repeatedly warped, the inner leads will be repeatedly bent, and the bonding between the IC element and the inner leads will come off, The lead breaks and causes a failure, which reduces the reliability of the mounted IC element.

2. Since it is a single-sided mounting type, only components such as IC elements could be mounted on the other hand, and the mounting density could not be increased.

3. Because it was a single-sided mounting type, the metal foil for mounting components was attached only to one side of the tape, and the tape could not be bent and held. This is only the rigidity of a metal foil such as a copper foil on one side, for example, usually an organic insulating material tape such as polyimide or glass epoxy having a thickness of 75 to 125 μm, which is usually thicker than a copper foil having a thickness of 18 to 35 μm. This is because the bending shape cannot be maintained.

SUMMARY OF THE INVENTION An object of the present invention is to provide a highly reliable TAB tape carrier which solves the above-mentioned problems of the prior art, is of a double-sided mounting type, can maintain a bent shape, and has a small warpage.

Means for Solving the Problems In order to achieve the above object, the present invention provides an organic insulating material tape having a device hole for incorporating a semiconductor integrated circuit element, and an adhesive tape attached to both sides of the tape via an adhesive layer. In a double-sided mounting TAB tape carrier comprising a metal foil layer, a wiring pattern having an inner lead and an outer lead for bonding the semiconductor integrated circuit element extending to the device hole on one surface of the metal foil layer. And a double-sided mounting TAB tape carrier, characterized in that a wiring pattern capable of mounting chip-type circuit components is formed on the other surface of the metal foil layer except for the device holes. To provide.

The metal foil layer is preferably a layer made of a copper foil or a copper alloy foil.

Preferably, the chip-type circuit component is a chip-type capacitor, resistor or coil.

 Hereinafter, the present invention will be described in more detail.

The organic insulating material tape used in the present invention is a long tape having a predetermined width in the form of a film, having good workability, having heat resistance, radiation resistance, moisture resistance, etc., and having excellent insulation properties. Any tape may be used as long as it is made of a polymer material, and examples of the organic insulating material typically include polyimide, glass epoxy, epoxy resin, epoxy polyimide, polyimide silicone, and photosensitive polyimide. The thickness of the tape is not particularly limited as long as it has a tape thickness used for a TAB tape carrier, and may be, for example, usually about 75 to 125 μm.

The metal foil used in the present invention is not particularly limited as long as it is a metal foil having good conductivity and can form a lead pattern or a wiring pattern by a photo etching method or the like. Foil, copper alloy foil and the like.

Also, the thickness of this metal foil is not particularly limited.
The thickness required for the tape carrier for use may be appropriately selected depending on the wiring pattern, rigidity, and the like of the metal foil on both sides, and may be, for example, about 18 to 35 μm.

The chip-type circuit component used in the present invention is a chip type that can be mounted on the surface on the back side of the surface on which the IC element is mounted, and may be any circuit component that constitutes an electronic circuit.
Typically, a chip-type capacitor, a resistor, a coil, and a product obtained by integrating these can be given.

In the present invention, what is mounted on the surface on the back side of the surface on which the IC element is mounted is not limited to the above-described chip-type circuit component as long as it can be mounted, for example, the same IC element as the surface or another IC element And various other components, circuits, chip-type circuit components such as electronic devices, semiconductor devices, and optical devices.

In the present invention, the wiring pattern formed on the metal foil layer on one side or both sides is not limited to the lead pattern for the IC element shown in FIG. A necessary wiring pattern may be appropriately formed by a photoetching method or the like.

The most characteristic feature of the present invention resides in that a metal foil is attached to both sides of an organic insulating material tape via an adhesive, and a wiring pattern is formed on each metal foil.

The adhesive used in the present invention is not particularly limited as long as a metal foil can be suitably attached to an organic insulating material tape, and has an insulating property, and preferably has heat resistance and moisture resistance. Typically, an epoxy-based adhesive, a urethane-based adhesive, a silicone resin-based adhesive, and the like can be given.

EXAMPLES Hereinafter, the tape carrier for a double-sided mounting TAB according to the present invention will be described in more detail with reference to the preferred embodiments shown in the accompanying drawings, but the present invention is not limited thereto.

FIG. 1 is a sectional view of a double-sided mounting type TAB tape carrier of the present invention. In this embodiment, a tape-like polyimide film is used as the organic insulating material tape, and a copper foil is used as the metal foil.

As shown in the figure, a double-sided mounting TAB tape carrier 1
0 is a copper foil layer 14, 16 attached to both sides of the polyimide film 12 using an adhesive, the surface copper foil layer 14 is a polyimide film
A lead pattern having an inner lead 22 protruding into a device hole 20 for mounting an IC element 18 provided in an IC element 12, that is, a wiring pattern for an IC element is formed. The TAB tape carrier 10 is provided with an IC element electrode (for example, Au).
The bumps 24 and the inner leads 22 are gang-bonded at a time, and the area indicated by the dotted line is sealed with a sealing resin 26.

The wiring pattern on the surface of such a double-sided mounting TAB tape carrier 10 may be similar to the surface of a conventional TAB tape carrier, and has, for example, a configuration as shown in FIG. A device hole 20 for a mounted IC element is formed in the center of the long polyimide film 12, and pilot holes 28 are continuously provided at predetermined intervals on both sides. Around the device hole 20, a copper foil lead 32 composed of an inner lead 22 extending to the device hole 20 and an outer lead 30 attached to a polyimide film is formed in a predetermined lead pattern. These leads 32 form the surface copper foil layer 14.

On the other hand, a wiring pattern similar to that of the front surface is formed on the back surface copper foil layer 16 of the double-sided mounting TAB tape carrier 10 of the present invention.

Example 1 Double-sided mounting TA of the present invention having a cross-sectional shape shown in FIG.
As the tape carrier 10 for B, a tape carrier for 100 pins of inner leads was manufactured.

In the method of manufacturing the TAB tape carrier 10, first, a polyimide film 12 having a backside copper foil layer 16 (copper foil thickness 35 μm) is punched to form a device hole 20. The backside copper foil layer 16 except for the pilot hole 28
Affixed to the entire surface of the 35 mm-wide polyimide film 12 using an epoxy-based adhesive. After the device hole processing, the surface copper foil layer 14 was similarly adhered, and the inner leads 22 and the outer leads 30 were formed in a predetermined lead pattern by a photoresist method.

The same 100-pin lead pattern as the front surface was experimentally formed on the back copper foil layer of the double-sided mounting TAB tape carrier thus obtained. However, no inner lead extending to the device hole was formed.

(Comparative Example 1) A conventional TAB tape carrier for 100 pins was manufactured in exactly the same manner as in Example 1 except that the back copper foil layer 16 was not adhered.

Here, the thickness of the polyimide film was 125 μm in both the example and the comparative example 1.

The IC element 18 was bonded to both TAB tape carriers, and the area indicated by the dotted line was sealed with a potting range (epoxy type) 26.

After sealing, a temperature cycle test was performed as a reliability test of both.

Further, the change in the amount of warpage of the film was examined on both sides of the temperature cycle of -50 ° C and 150 ° C. Table 1 shows the survey results.

As is clear from the results in Table 1, the conventional type of Comparative Example 1
As shown in Fig. 3, the TAB tape was repeatedly warped on the (+) side and the (-) side because the coefficient of thermal expansion of the copper foil and that of the polyimide were different at high and low temperature changes. I understand. On the other hand, it can be seen that in the case of the present invention, the warpage does not fluctuate due to the temperature change. In the conventional single-sided copper foil type structure, all of the 11 test ICs failed in 300 cycles due to breakage of the inner lead. This is considered to be due to the addition of repetition of warpage in addition to the thermal fatigue caused by the difference in thermal expansion between the copper foil and the sealing range due to the temperature cycle. As is evident from Table 1, in Example 1, the heat resistance cycle test of 600 hours was cleared.

[Effects of the Invention] As described above in detail, according to the present invention, since the metal foil layers are provided on both sides of the organic insulating material film, the organic insulating material film and the metal foil are not affected by a temperature change. The warp of the inner lead and the recoil thereof due to the difference in thermal expansion coefficient can be reduced, and the junction between the IC element and the inner lead and the breakage of the inner lead itself can be prevented. .

Further, according to the present invention, since a wiring pattern on which a chip-type circuit component can be mounted is provided on the back surface, chip-type capacitors, resistors, coils, and the like are mounted on the back-surface wiring pattern together with the integrated circuit elements in the device holes. In addition, the mounting density can be greatly improved, and the manufacture of a hybrid IC can be facilitated.

Also, according to the present invention, metal foil is stuck on both sides,
Due to the rigidity, the shape can be maintained by bending. This is very advantageous when housed in a camera, a liquid crystal device or the like.

[Brief description of the drawings]

FIG. 1 is a sectional view of an embodiment of a tape carrier for a double-sided TAB according to the present invention. FIG. 2 is a plan view of the surface of the TAB tape carrier. FIG. 3 is a sectional view of a conventional TAB tape carrier. Description of symbols 10: Double-sided mounting TAB tape carrier, 12: Polyimide film 14: Top copper foil layer, 16: Back copper foil layer, 18: IC element, 20: Device hole 22: Inner Lead, 24 ... IC element electrode, 26 ... Sealed resin, 28 ... Pilot hole, 30 ... Outer lead, 32 ... Lead, 40 ... Conventional single-sided mounting TAB tape carrier

Claims (3)

(57) [Claims] 1. A tape carrier for a double-sided mounting TAB, comprising: an organic insulating material tape having a device hole for incorporating a semiconductor integrated circuit element; and a metal foil layer attached to both sides of the tape via an adhesive layer. A wiring pattern having an inner lead and an outer lead for bonding the semiconductor integrated circuit element extending to the device hole on one surface of the metal foil layer, and the other surface of the metal foil layer A wiring pattern on which chip-type circuit components can be mounted except for the device holes. 2. The double-sided mounting TAB tape carrier according to claim 1, wherein the metal foil layer is a layer made of a copper foil or a copper alloy foil. 3. The tape carrier for a double-sided mounting TAB according to claim 1, wherein the chip-type circuit component is a chip-type capacitor, a resistor or a coil.