JP2593728B2 - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JP2593728B2 JP2593728B2 JP2138436A JP13843690A JP2593728B2 JP 2593728 B2 JP2593728 B2 JP 2593728B2 JP 2138436 A JP2138436 A JP 2138436A JP 13843690 A JP13843690 A JP 13843690A JP 2593728 B2 JP2593728 B2 JP 2593728B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- fiber
- resin composition
- mol
- maleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 15
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 5
- 239000000178 monomer Substances 0.000 claims description 24
- 229920001577 copolymer Polymers 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 16
- 229920000412 polyarylene Polymers 0.000 claims description 14
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 8
- 229920002554 vinyl polymer Polymers 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 150000008064 anhydrides Chemical class 0.000 claims description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 13
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 239000004734 Polyphenylene sulfide Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229920000069 polyphenylene sulfide Polymers 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 methoxyethyl Chemical group 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000006358 imidation reaction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 229910052979 sodium sulfide Inorganic materials 0.000 description 2
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- SASYHUDIOGGZCN-ARJAWSKDSA-N (z)-2-ethylbut-2-enedioic acid Chemical compound CC\C(C(O)=O)=C\C(O)=O SASYHUDIOGGZCN-ARJAWSKDSA-N 0.000 description 1
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- QYOJZFBQEAZNEW-UHFFFAOYSA-N 1-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1N1C(=O)C=CC1=O QYOJZFBQEAZNEW-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- FBPVUBVZRPURIU-UHFFFAOYSA-N 1-hexylpyrrole-2,5-dione Chemical compound CCCCCCN1C(=O)C=CC1=O FBPVUBVZRPURIU-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- JSZMNEHRJUWKCF-UHFFFAOYSA-N 2-(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)acetic acid Chemical compound C1C(CC(O)=O)C(C)CC2OC21 JSZMNEHRJUWKCF-UHFFFAOYSA-N 0.000 description 1
- PWOBDMNCYMQTCE-UHFFFAOYSA-N 2-chlorobenzenethiol Chemical compound SC1=CC=CC=C1Cl PWOBDMNCYMQTCE-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- QZYCWJVSPFQUQC-UHFFFAOYSA-N 3-phenylfuran-2,5-dione Chemical compound O=C1OC(=O)C(C=2C=CC=CC=2)=C1 QZYCWJVSPFQUQC-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical group 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- PXJJSXABGXMUSU-UHFFFAOYSA-N disulfur dichloride Chemical compound ClSSCl PXJJSXABGXMUSU-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ZDHOYZBANMCKGV-UHFFFAOYSA-N n,n-dibromoaniline Chemical compound BrN(Br)C1=CC=CC=C1 ZDHOYZBANMCKGV-UHFFFAOYSA-N 0.000 description 1
- ILCQYORZHHFLNL-UHFFFAOYSA-N n-bromoaniline Chemical compound BrNC1=CC=CC=C1 ILCQYORZHHFLNL-UHFFFAOYSA-N 0.000 description 1
- KUDPGZONDFORKU-UHFFFAOYSA-N n-chloroaniline Chemical compound ClNC1=CC=CC=C1 KUDPGZONDFORKU-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は耐熱性、機械的特性及び成形性に優れた熱可
塑性樹脂組成物に関する。更に詳細にはマレイミド系共
重合体とポリアリーレンスルフィドとエポキシ樹脂とか
らなり、更には、必要に応じて充てん材を含む、マレイ
ミド系共重合体の耐熱性及びポリアリーレンスルフィド
の成形加工性が改良された熱可塑性樹脂組成物に関す
る。The present invention relates to a thermoplastic resin composition having excellent heat resistance, mechanical properties and moldability. More specifically, the heat resistance of the maleimide copolymer and the moldability of the polyarylene sulfide are improved, comprising a maleimide copolymer, polyarylene sulfide, and an epoxy resin. The present invention relates to a finished thermoplastic resin composition.
ポリフェニレンスルフィド樹脂に代表されるポリアリ
ーレンスルフィドは優れた耐熱性、耐薬品性、難燃性を
有するエンジニアリングプラスチックとして近年、注目
されているが樹脂単独ではぜい弱であり、しかも成形加
工性が悪く、実用性が著しく制限されてしまう。そのた
めガラス繊維等の補強材を添加するなどの複合化技術に
より各種特性を付与し実用に供している。Polyarylene sulfide represented by polyphenylene sulfide resin has attracted attention in recent years as an engineering plastic with excellent heat resistance, chemical resistance, and flame retardancy, but the resin alone is weak and has poor moldability and practical use. Sexability is severely restricted. For this reason, various properties are imparted by a compounding technique such as addition of a reinforcing material such as glass fiber or the like, and the material is put to practical use.
このようにして得られたポリフェニレンスルフィド樹
脂組成物はそれぞれの特性を生かし電気電子機器部品、
自動車機器部品、化学機器部品などとして使用されてい
るが、各分野ともに技術レベルの高度化に伴って精密
化、小型化が進んできている。このような背景から各分
野において、耐熱性、成形加工性、機械的強度のすべて
において優れた素材の出現が待たれている。The polyphenylene sulfide resin composition obtained in this manner makes use of the respective characteristics,
They are used as automotive equipment parts, chemical equipment parts, and the like, but in each field, precision and miniaturization have been progressing with the advancement of technical level. From such a background, in each field, appearance of a material excellent in all of heat resistance, molding workability, and mechanical strength is expected.
これらの要求に対して、ポリフェニレンスルフィド樹
脂に種々の高分子物質を混合あるいは反応させる試みが
なされてきた。例えば、ポリフェニレンスルフィド樹脂
の耐衝撃性を改善する方法として、グリシジル基含有オ
レフィン共重合体との組成物(特開昭58−154757号,同
59−152953号)が、ポリフェニレンスルフィド樹脂の成
形加工性を改善する方法としてはノボラック型エポキシ
樹脂を含有せしめた組成物(特開昭59−51945号)が知
られている。また、ポリフェニレンスルフィド樹脂の溶
融粘度を低下させる目的でビニル系芳香族単量体とマレ
イミド単量体の共重合体を混合した組成物(特開昭61−
9452号)が知られている。In response to these requirements, attempts have been made to mix or react various polymer substances with polyphenylene sulfide resin. For example, as a method for improving the impact resistance of a polyphenylene sulfide resin, a composition with a glycidyl group-containing olefin copolymer (Japanese Patent Application Laid-Open No.
As a method for improving the processability of polyphenylene sulfide resin, a composition containing a novolak type epoxy resin (Japanese Patent Application Laid-Open No. 59-51945) is known. Further, for the purpose of lowering the melt viscosity of the polyphenylene sulfide resin, a composition in which a copolymer of a vinyl aromatic monomer and a maleimide monomer is mixed (Japanese Patent Application Laid-Open No. 61-1986)
No. 9452) is known.
しかしながら、上記公知例においてビニル系芳香族単
量体とマレイミド単量体の共重合体とポリアリーレンス
ルフィド樹脂との組成物の特性をエポキシ樹脂の添加に
より改良した例はない。However, there is no example in the above-mentioned known examples in which the properties of a composition of a copolymer of a vinyl aromatic monomer and a maleimide monomer and a polyarylene sulfide resin are improved by adding an epoxy resin.
本発明の目的はポリアリーレンスルフィド樹脂の成形
加工性を改良することにある。An object of the present invention is to improve the moldability of polyarylene sulfide resin.
本発明を概説すれば、本発明は熱可塑性樹脂組成物に
関する発明であって、(a)芳香族ビニル単量体残基30
〜70モル%、マレイミド系単量体残基30〜50モル%、不
飽和ジカルボン酸無水物単量体残基1〜20モル%及びア
クリル系単量体残基0〜50モル%からなるマレイミド系
共重合体1〜99重量%、(b)ポリアリーレンスルフィ
ド99〜1重量%及び(c)熱可塑性エラストマー以外の
エポキシ樹脂0.1〜50重量%からなる樹脂組成物20〜100
重量%に対し充てん材0〜80重量%を混合してなること
を特徴とする。In general, the present invention relates to a thermoplastic resin composition, and comprises (a) an aromatic vinyl monomer residue 30
~ 70 mol%, maleimide monomer residue 30-50 mol%, unsaturated dicarboxylic anhydride monomer residue 1-20 mol% and acrylic monomer residue 0-50 mol% Resin composition comprising 1 to 99% by weight of a copolymer (b) 99 to 1% by weight of a polyarylene sulfide and (c) 0.1 to 50% by weight of an epoxy resin other than a thermoplastic elastomer
It is characterized in that a filler is mixed with 0 to 80% by weight with respect to% by weight.
本発明の組成物は耐熱性が高く、成形加工性に優れて
いることを見出した。It has been found that the composition of the present invention has high heat resistance and excellent moldability.
本発明で用いるマレイミド系共重合体の製造方法につ
いて特に制限はなく、例えば芳香族ビニル単量体、マレ
イミド系単量体、不飽和ジカルボン酸無水物単量体及び
アクリル系単量体のラジカル共重合により製造すること
ができる。The method for producing the maleimide-based copolymer used in the present invention is not particularly limited. For example, a radical copolymer of an aromatic vinyl monomer, a maleimide-based monomer, an unsaturated dicarboxylic anhydride monomer, and an acrylic monomer may be used. It can be produced by polymerization.
芳香族ビニル単量体の具体例としてはスチレン、α−
メチルスチレン、ビニルトルエン、t−ブチルスチレン
等があり、マレイミド系単量体の具体例としてはマレイ
ミド、N−メチルマレイミド、N−エチルマレイミド、
N−プロピルマレイミド、N−ヘキシルマレイミド、N
−シクロヘキシルマレイミド、N−フェニルマレイミ
ド、N−トリルマレイミド等があり、不飽和ジカルボン
酸無水物単量体の具体例としては無水マレイン酸、無水
メチルマレイン酸、無水1,2−ジメチルマレイン酸、無
水エチルマレイン酸、無水フェニルマレイン酸等があ
り、アクリル系単量体の具体例としてはメチル(メタ)
アクリレート、エチル(メタ)アクリレート、ブチル
(メタ)アクリレート、ヘキシル(メタ)アクリレー
ト、シクロヘキシル(メタ)アクリレート、、デシル
(メタ)アクリレート、オクタデシル(メタ)アクリレ
ート、ヒドロキシエチル(メタ)アクリレート、メトキ
シエチル(メタ)アクリレート、グリシジル(メタ)ア
クリレート等があり、これらを単独で、あるいは併用し
て用いることができる。ただし、ここでメチル(メタ)
アクリレートとはメチルアクリレートあるいはメチルメ
タクリレートを示すものとする。これらの単量体のラジ
カル共重合方法については特に制限はなく、ラジカル共
重合の公知の方法を任意に適用できる。Specific examples of the aromatic vinyl monomer include styrene and α-
There are methylstyrene, vinyltoluene, t-butylstyrene and the like, and specific examples of the maleimide monomer include maleimide, N-methylmaleimide, N-ethylmaleimide,
N-propylmaleimide, N-hexylmaleimide, N
-Cyclohexylmaleimide, N-phenylmaleimide, N-tolylmaleimide and the like. Specific examples of unsaturated dicarboxylic anhydride monomers include maleic anhydride, methylmaleic anhydride, 1,2-dimethylmaleic anhydride, Ethyl maleic acid, phenylmaleic anhydride and the like, specific examples of acrylic monomers include methyl (meth)
Acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, decyl (meth) acrylate, octadecyl (meth) acrylate, hydroxyethyl (meth) acrylate, methoxyethyl (meth) ) Acrylate, glycidyl (meth) acrylate and the like, and these can be used alone or in combination. However, here methyl (meth)
Acrylate means methyl acrylate or methyl methacrylate. The method for radical copolymerization of these monomers is not particularly limited, and any known radical copolymerization method can be applied.
本発明で用いるマレイミド系共重合体を製造する他の
方法として芳香族ビニル単量体、不飽和ジカルボン酸無
水物単量体及びアクリル系単量体の共重合体をアンモニ
アあるいは第一級アミンと反応させて酸無水物残基をイ
ミド化する方法を例示することができる。イミド化に用
いられる第一級アミンを例示すると、メチルアミン、エ
チルアミン、プロピルアミン、ブチルアミン、ヘキシル
アミン、シクロヘキシルアミン、デシルアミン、アニリ
ン、トルイジン、ナフチルアミン、クロロフェニルアミ
ン、ブロモフェニルアミン、ジブロモフェニルアミン等
がある。As another method for producing a maleimide-based copolymer used in the present invention, a copolymer of an aromatic vinyl monomer, an unsaturated dicarboxylic acid anhydride monomer and an acrylic monomer with ammonia or a primary amine is used. A method of imidizing an acid anhydride residue by reacting can be exemplified. Examples of primary amines used for imidization include methylamine, ethylamine, propylamine, butylamine, hexylamine, cyclohexylamine, decylamine, aniline, toluidine, naphthylamine, chlorophenylamine, bromophenylamine, dibromophenylamine and the like. .
イミド化反応の方法は任意であり、オートクレーブを
用いて溶液状態、塊状溶融状態あるいは懸濁状態で反応
を行うことができる。また、スクリュー押出機等の溶融
混練装置を用いて、溶融状態で反応を行うことも可能で
ある。The method of the imidation reaction is arbitrary, and the reaction can be carried out in a solution state, a bulk molten state, or a suspension state using an autoclave. It is also possible to carry out the reaction in a molten state using a melt kneading device such as a screw extruder.
溶液反応に用いられる溶媒は任意であり、例えばアセ
トン、メチルエチルケトン、メチルイソブチルケトン、
シクロヘキサノン等のケトン類、テトラヒドロフラン、
1,4−ジオキサン等のエーテル類、トルエン、キシレン
等の芳香族炭化水素、ジメチルホルムアミド、ジメチル
スルホキシド、N−メチル−2−ピロリドン等が例示さ
れる。イミド化反応温度は50〜350℃の範囲で好まし
く、100〜300℃の範囲で特に好ましい。The solvent used for the solution reaction is arbitrary, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone,
Ketones such as cyclohexanone, tetrahydrofuran,
Examples thereof include ethers such as 1,4-dioxane, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylsulfoxide, and N-methyl-2-pyrrolidone. The imidization reaction temperature is preferably in the range of 50 to 350 ° C, particularly preferably in the range of 100 to 300 ° C.
イミド化は触媒の存在を必ずしも必要としないが、用
いるならば、トリメチルアミン、トリエチルアミン、ト
リブチルアミン、N,N−ジエチルアニリン等の第三級ア
ミンが好適である。Imidation does not necessarily require the presence of a catalyst, but if used, tertiary amines such as trimethylamine, triethylamine, tributylamine, N, N-diethylaniline are preferred.
本発明に使用するポリアリーレンスルフィド樹脂は、
構造式(−Ar−S−)(ただしArはp−又はm−フェニ
レン、ビフェニレン、ナフタレン等)で示される繰返し
単位を70モル%以上含有する重合体で、その代表的物質
は構造式 で示される構造単位を70モル%以上有するポリフェニル
フィドである。また、その量が70モル%未満では、優れ
た特性の組成物は得難い。この樹脂の合成法としては、
例えばp−ジクロロベンゼンを硫黄と炭酸ソーダの存在
下で重合させる方法、極性溶媒中で硫化ナトリウムある
いは水硫化ナトリウムと水酸化ナトリウム又は硫化水素
と水酸化ナトリウムの存在下で重合させる方法及びp−
クロロチオフェノールの自己縮合などが挙げられるが、
N−メチルピロリドン、ジメチルアセトアミドなどのア
ミド系溶媒やスルホランなどのスルホン系溶媒中で硫化
ナトリウムとp−ジクロロベンゼンを反応させる方法が
ある。また、この際に重合度を調節するためにカルボン
酸やスルホン酸のアルカリ金属塩を添加したり、水酸化
アリカリを添加するのは好ましい方法である。更に共重
合成分として好ましい例としては、30モル%未満であれ
ば、メタ結合 オルト結合 エーテル結合 スルホン結合 ビフェニル結合 置換フェニルスルフィド結合 ここでRはアルキル基、ニトロ基、フェニル基、アルコ
キシ基、カルボン酸基の金属塩基を示す)及び三官能結
合 などを含有していても樹脂の結晶性に大きく影響しない
範囲であるならばかまわないが好まくは共重合成分は10
モル%以下が好ましい。Polyarylene sulfide resin used in the present invention,
A polymer containing at least 70 mol% of a repeating unit represented by the structural formula (-Ar-S-) (where Ar is p- or m-phenylene, biphenylene, naphthalene, or the like). Is a polyphenyl sulfide having at least 70 mol% of a structural unit represented by If the amount is less than 70 mol%, it is difficult to obtain a composition having excellent characteristics. As a method of synthesizing this resin,
For example, a method of polymerizing p-dichlorobenzene in the presence of sulfur and sodium carbonate, a method of polymerizing in the presence of sodium sulfide or sodium hydrosulfide and sodium hydroxide or hydrogen sulfide and sodium hydroxide in a polar solvent, and
Self-condensation of chlorothiophenol, etc.
There is a method of reacting sodium sulfide with p-dichlorobenzene in an amide solvent such as N-methylpyrrolidone or dimethylacetamide or a sulfone solvent such as sulfolane. At this time, it is preferable to add an alkali metal salt of carboxylic acid or sulfonic acid or to add alkali hydroxide to adjust the degree of polymerization. Further, as a preferable example of the copolymer component, if it is less than 30 mol%, a meta bond Ortho coupling Ether bond Sulfone bond Biphenyl bond Substituted phenyl sulfide bond R represents an alkyl group, a nitro group, a phenyl group, an alkoxy group, a metal base such as a carboxylic acid group) and a trifunctional bond It does not matter if it is in a range that does not greatly affect the crystallinity of the resin even if it contains etc., but preferably the copolymer component is 10
It is preferably at most mol%.
かかるポリアリーレンスルフィド樹脂の具体的な製造
方法としては、例えば(1)ハロゲン置換芳香族化合物
と硫化アルカリとの反応(米国特許第2513188号明細
書、特公昭44−27671号、同45−3368号各公報参照)、
(2)チオフェノール類のアルカリ触媒又は銅塩等の共
存下における縮合反応(米国特許第3274165号明細書、
英国特許第1160660号明細書参照)、(3)芳香族化合
物を塩化硫黄とのルイス酸触媒共存下における縮合反応
(特公昭46−27255号公報、ベルギー特許第29437号明細
書)等が挙げられる。As a specific method for producing such a polyarylene sulfide resin, for example, (1) the reaction of a halogen-substituted aromatic compound with an alkali sulfide (US Pat. No. 2513188, JP-B-44-27671 and JP-B-45-3368) Refer to each publication),
(2) Condensation reaction of thiophenols in the presence of an alkali catalyst or a copper salt (US Pat. No. 3,274,165,
(See British Patent No. 1160660), (3) Condensation reaction of an aromatic compound with sulfur chloride in the presence of a Lewis acid catalyst (JP-B-46-27255, Belgian Patent No. 29439) and the like. .
次に本発明に使用するエポキシ樹脂は、熱可塑性エラ
ストマー以外のエポキシ樹脂である。好適に用いられる
エポキシ樹脂を例示するならば、ビスフェノールAジグ
リシジルエーテル型、ノボラックグリシジルエーテル型
等のグリシジルエーテル型エポキシ樹脂、ヘキサヒドロ
フタル酸グリシジルエステル、ダイマー酸グリシジルエ
ステル等のグリシジルエステル型エポキシ樹脂、トリグ
リシジルイソシアヌレート、テトラグリシジルジアミノ
ジフェニルメタン等のグリシジルメタン型のエポキシ樹
脂、エポキシ化ポリブタジエン、エポキシ化大豆油等の
線状脂肪族エポキシ樹脂、3,4−エポキシ−6−メチル
シクロヘキシルメチルカルボキシレート等の脂肪族エポ
キシ樹脂等がある。Next, the epoxy resin used in the present invention is an epoxy resin other than the thermoplastic elastomer. Examples of suitably used epoxy resins include glycidyl ether epoxy resins such as bisphenol A diglycidyl ether type, novolac glycidyl ether type, glycidyl ester epoxy resins such as glycidyl ester hexahydrophthalate and glycidyl dimer, Triglycidyl isocyanurate, glycidyl methane type epoxy resin such as tetraglycidyl diaminodiphenylmethane, epoxidized polybutadiene, linear aliphatic epoxy resin such as epoxidized soybean oil, 3,4-epoxy-6-methylcyclohexylmethyl carboxylate and the like There are aliphatic epoxy resins and the like.
更に本発明においては組成物の特性を低下させない範
囲において各形状の有機、無機及び金属の充てん材例え
ばガラス繊維、チタン酸カリウム繊維、アラミド繊維、
シリカ繊維、アルミナ繊維、シリカ・アルミナ繊維、ジ
ルコニア繊維、窒化ホウ素繊維、窒化ケイ素繊維、ホウ
素繊維、ステンレス繊維、アルミニウム繊維、チタン繊
維、銅繊維、真ちゅう繊維、マグネシウム繊維、ポリア
ミド繊維、ポリエステル繊維、ポリエチレン繊維、ポリ
アクリル繊維、フッ素繊維等の繊維状強化材、又はワラ
ステナイト、セリサイト、カオリン、マイカ、クレー、
ベントナイト、アスベスト、タルク、アルミナシリケー
ト等のケイ酸塩、アルミナ、塩化ケイ素、酸化マグネシ
ウム、酸化ジルコニア、酸化チタン等の金属酸化物、炭
酸カルシウム、炭酸マグネシウム、ドロマイト等の炭酸
塩、硫酸カルシウム、硫酸バリウム等の硫酸塩、ガラス
ビーズ、窒化ホウ素、炭化ケイ素、シリカ等の粒状の充
てん材が使用できる。これらの充てん材は2種以上を併
用することが可能であり、必要によりシラン系あるいは
チタン系等のカップリング剤で予備処理して使用するこ
とができる。Furthermore, in the present invention, organic, inorganic and metal fillers such as glass fiber, potassium titanate fiber, aramid fiber, etc.
Silica fiber, alumina fiber, silica / alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, stainless steel fiber, aluminum fiber, titanium fiber, copper fiber, brass fiber, magnesium fiber, polyamide fiber, polyester fiber, polyethylene Fiber, polyacrylic fiber, fibrous reinforcing material such as fluorine fiber, or wollastenite, sericite, kaolin, mica, clay,
Silicates such as bentonite, asbestos, talc, alumina silicate, etc., metal oxides such as alumina, silicon chloride, magnesium oxide, zirconia, titanium oxide, carbonates such as calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate Granular fillers such as sulfate, glass beads, boron nitride, silicon carbide, and silica can be used. Two or more of these fillers can be used in combination, and if necessary, can be used after being pretreated with a silane-based or titanium-based coupling agent.
本発明ではマレイミド系共重合体1〜99重量%とポリ
アリーレンスルフィド99〜1重量%及びエポキシ樹脂0.
1〜50重量%からなる樹脂組成物20〜100重量%に対し充
てん材80〜0重量%とを混合して組成物とするが、エポ
キシ樹脂の添加量は0.1重量%未満では改質効果は少な
く50重量%を越えると剛性などのポリアリーレンスルフ
ィドの特性が失われる。成形加工性を改質した樹脂組成
物として好ましくはマレイミド系共重合体1〜50重量%
とポリアリーレンスルフィド99〜50重量%及びエポキシ
樹脂0.1〜50重量%からなる樹脂組成物20〜100重量%に
対し充てん材80〜0重量%からなる脂肪組成物である。
更に好ましくは、マレイミド系共重合体5〜45重量%と
ポリアリーレンスルフィド95〜45重量%及びエポキシ樹
脂0.5〜30重量%からなる樹脂組成物20〜100重量%に対
し充てん材80〜0重量%からなる樹脂組成物である。In the present invention, 1 to 99% by weight of a maleimide copolymer, 99 to 1% by weight of a polyarylene sulfide, and 0.1% of an epoxy resin are used.
A composition is prepared by mixing 80 to 0% by weight of a filler with 20 to 100% by weight of a resin composition consisting of 1 to 50% by weight. If it exceeds 50% by weight, properties of polyarylene sulfide such as rigidity are lost. As a resin composition having improved moldability, preferably 1 to 50% by weight of a maleimide copolymer
And a resin composition comprising 99 to 50% by weight of a polyarylene sulfide and 0.1 to 50% by weight of an epoxy resin, and a fat composition comprising a filler of 80 to 0% by weight with respect to a resin composition of 20 to 100% by weight.
More preferably, the filler is 80 to 0% by weight based on 20 to 100% by weight of a resin composition comprising 5 to 45% by weight of a maleimide copolymer, 95 to 45% by weight of a polyarylene sulfide and 0.5 to 30% by weight of an epoxy resin. And a resin composition comprising:
本発明からなる組成物の調製は種々の公知の方法で可
能である。例えば、原料を予めタンブラー又はヘンシェ
ルミキサーのような混合機で均一に混合した後、一軸又
は二軸の押出機などに供給して溶融混練した後、ペレッ
トとして調製する方法がある。The preparation of the composition according to the invention is possible by various known methods. For example, there is a method in which raw materials are uniformly mixed in advance with a mixer such as a tumbler or a Henschel mixer, then supplied to a single-screw or twin-screw extruder, melt-kneaded, and then prepared as pellets.
本発明素生物は射出成形、圧縮成形だけでなく、押出
成形、中空成形、発泡成形が可能であるフィルム、シー
ト、繊維などに加工することができる。特に射出成形に
好適に使用できる。The substrate of the present invention can be processed into films, sheets, fibers, and the like, which can be extruded, hollow and foamed, as well as injection molded and compressed. In particular, it can be suitably used for injection molding.
以下に本発明を更に詳細に説明するために実施例及び
比較例を挙げるが、本発明はこれらの実施例のみに限定
されるものではない。EXAMPLES Examples and comparative examples will be described below in order to explain the present invention in more detail, but the present invention is not limited to these examples.
<マレイミド系共重合体の製造法> かくはん機を備えたオートクレーブ中にスチレン60
部、メチルイソブチルケトン50部を仕込み、系内を窒素
ガスで置換した後、内温を85℃に昇温した。別に無水マ
レイン酸40部とベンゾイルパーオキシド0.15部をメチル
イソブチルケトン250部に溶解した溶液を作製し、これ
を8時間かけて系内に連続添加した。添加終了後、更に
85℃で3時間反応を継続した。反応液の一部を採取して
ガスクロマトグラフィーにより重合率を定量したとこ
ろ、スチレン、無水マレイン酸ともに99%以上であっ
た。<Method for producing maleimide copolymer> Styrene 60 was placed in an autoclave equipped with a stirrer.
And 50 parts of methyl isobutyl ketone, and the inside of the system was purged with nitrogen gas, and then the internal temperature was raised to 85 ° C. Separately, a solution was prepared by dissolving 40 parts of maleic anhydride and 0.15 part of benzoyl peroxide in 250 parts of methyl isobutyl ketone, and this was continuously added to the system over 8 hours. After the addition is complete,
The reaction was continued at 85 ° C. for 3 hours. A part of the reaction solution was sampled, and the polymerization rate was determined by gas chromatography. As a result, both styrene and maleic anhydride were 99% or more.
次いで、系内にアニリン30部、トリエチルアミン0.3
部を加え、140℃で7時間かくはんを継続した。Then, aniline 30 parts, triethylamine 0.3
And stirring was continued at 140 ° C. for 7 hours.
冷却後、内容物を脱液機能を有した真空ベント付きの
同方向回転二軸押出機に供給し、脱液、脱揮してペレッ
ト化し、このポリマーをマレイミド系共重合体とし使用
した。After cooling, the content was supplied to a co-rotating twin-screw extruder equipped with a vacuum vent and having a dewatering function, dewatered, devolatilized and pelletized, and this polymer was used as a maleimide-based copolymer.
ポリフェニレンスルフィドは、(株)トープレン製、
商品名「T−4」を使用した。Polyphenylene sulfide is manufactured by Topren Co., Ltd.
The trade name "T-4" was used.
エポキシ樹脂は東都化成(株)社製アミン型エポキシ
樹脂、商品名「YH 434」及びダウ・ケミカル日本(株)
社製ノボラック型エポキシ樹脂、商品名「DER−662UH」
を使用した。Epoxy resin is amine type epoxy resin manufactured by Toto Kasei Co., Ltd., trade name "YH434" and Dow Chemical Japan Co., Ltd.
Novolak epoxy resin, trade name "DER-662UH"
It was used.
ガラス繊維は日本電気硝子(株)社製、商品名「チョ
ップドストランドECS03T−717P」を使用した。The glass fiber used was Nippon Electric Glass Co., Ltd., trade name “Chopped Strand ECS03T-717P”.
実施例1、比較例1 マレイミド系共重合体、ポリフェニレンスルフィド、
エポキシ樹脂及びガラス繊維を表1に示した割合で配合
した。次いで二軸押出機を用いてシリンダー温度300℃
で押出混練した後、ストランドを空冷、切断してペレッ
トを得た。このペレットを130℃で2時間乾燥した後、
射出成形機(シリンダー温度280℃、金型温度170℃)で
形成し、試験片を作成して曲げ強度、衝撃強度、熱変形
温度及びヒケ率を測定した。曲げ強度、衝撃強度、熱変
形温度の測定はそれぞれ、JIS K−7203,JIS K−7110,JI
S K−7207に従って測定した。なお、ヒケ率の測定は試
験片中央部における最大厚みL、最小厚みIにより次の
ような定義に従い算出した。Example 1, Comparative Example 1 Maleimide-based copolymer, polyphenylene sulfide,
Epoxy resin and glass fiber were blended in the proportions shown in Table 1. Then, using a twin screw extruder, the cylinder temperature was 300 ° C.
After extruding and kneading, the strand was air-cooled and cut to obtain pellets. After drying the pellets at 130 ° C for 2 hours,
A test piece was prepared using an injection molding machine (cylinder temperature 280 ° C., mold temperature 170 ° C.), and the bending strength, impact strength, heat deformation temperature and sink rate were measured. Measurements of bending strength, impact strength, and heat distortion temperature are JIS K-7203, JIS K-7110, and JI, respectively.
It was measured according to SK-7207. The sink mark was measured according to the following definition based on the maximum thickness L and the minimum thickness I at the center of the test piece.
ヒケ率(%)=(L−1)*100/L それらの結果を表1にまとめて示す。Sinking rate (%) = (L-1) * 100 / L The results are shown in Table 1.
実施例1、比較例1よりポリフェニレンスルフィド、
マレイン酸共重合体にエポキシ樹脂を添加することによ
り強度、耐熱製、成形加工性(ヒケ)が向上することが
分かる。 Example 1, polyphenylene sulfide from Comparative Example 1,
It can be seen that the addition of an epoxy resin to the maleic acid copolymer improves strength, heat resistance, and moldability (sinking).
本発明では、マレイミド系共重合体、及び熱可塑性エ
ラストマー以外のエポキシ樹脂を配合することにより成
形加工性が極めて優れたポリアリーレンスルフィド樹脂
組成物が得られるようになった。In the present invention, a polyarylene sulfide resin composition having extremely excellent moldability can be obtained by blending an epoxy resin other than a maleimide copolymer and a thermoplastic elastomer.
Claims (1)
%、マレイミド系単量体残基30〜50モル%、不飽和ジカ
ルボン酸無水物単量体残基1〜20モル%及びアクリル系
単量体残基0〜50モル%からなるマレイミド系共重合体
1〜99重量%、(b)ポリアリーレンスルフィド99〜1
重量%及び(c)熱可塑性エラストマー以外のエポキシ
樹脂0.1〜50重量%からなる樹脂組成物20〜100重量%に
対し充てん材0〜80重量%を混合してなる熱可塑性樹脂
組成物。(1) (a) 30 to 70 mol% of an aromatic vinyl monomer residue, 30 to 50 mol% of a maleimide monomer residue, 1 to 20 mol of an unsaturated dicarboxylic anhydride monomer residue % And a maleimide copolymer comprising 0 to 50 mol% of acrylic monomer residues, and (b) polyarylene sulfide 99 to 1
A thermoplastic resin composition obtained by mixing 0 to 80% by weight of a filler with 20 to 100% by weight of a resin composition comprising 0.1 to 50% by weight of an epoxy resin other than a thermoplastic elastomer (c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2138436A JP2593728B2 (en) | 1990-05-30 | 1990-05-30 | Thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2138436A JP2593728B2 (en) | 1990-05-30 | 1990-05-30 | Thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0433956A JPH0433956A (en) | 1992-02-05 |
| JP2593728B2 true JP2593728B2 (en) | 1997-03-26 |
Family
ID=15221940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2138436A Expired - Fee Related JP2593728B2 (en) | 1990-05-30 | 1990-05-30 | Thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2593728B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6819052B2 (en) * | 2015-03-04 | 2021-01-27 | 住友化学株式会社 | Curable resin composition |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2932605B2 (en) * | 1990-05-14 | 1999-08-09 | 東レ株式会社 | Polyphenylene sulfide resin composition |
-
1990
- 1990-05-30 JP JP2138436A patent/JP2593728B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0433956A (en) | 1992-02-05 |
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