JP2595566B2 - Charged particle beam exposure system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to an improvement of a charged particle beam exposure apparatus that enables accurate drawing of a charged particle beam, and is capable of accurately measuring a charged particle beam without being affected by charges of the charged particles accumulated on a resist film. The purpose of the present invention is to provide a charged particle beam exposure apparatus capable of performing various patterning, a conductive thin film having an opening corresponding to an exposure area and a positioning hole, a moving mechanism of the conductive thin film, and a position detecting sensor of the conductive thin film. And a charge shield device.

[Industrial applications]

The present invention relates to a charged particle beam exposure apparatus, and more particularly to an improvement in a charged particle beam exposure apparatus that enables accurate drawing of a charged particle beam.

When a desired patterning is performed on a resist film by a charged particle beam exposure apparatus, charges of the charged particles are accumulated in the resist film made of an insulator, and a repulsive force due to charge-up generated thereby causes a desired trajectory of the charged particle beam. Problem has arisen.

Under the circumstances described above, there is a demand for a charged particle beam exposure apparatus that can prevent the trajectory of the charged particle beam from deviating from a desired position.

[Conventional technology]

As shown in FIG. 2, in a conventional charged particle beam exposure apparatus, for example, an electron beam exposure apparatus, an electron beam irradiated from an electron beam source is irradiated with a beam deflection coil 13 or a beam deflection coil 13 at a desired position on a resist film 12. The objective lens coil 14 scans within a certain area.

However, since the resist film 12 on which the electron beam draws a pattern is an insulator, charges of the irradiated electron beam are accumulated on the resist film 12.

The charge of the electron beam accumulated on the resist film 12 is transferred to a metal film below the resist film 12, for example, the light-shielding pattern 11.
Even if the charge is released through b, a certain amount of charge is accumulated in the resist film 12.

In particular, as shown in FIG. 2, when the size of the opening of the objective lens coil 14 is large, the electron beam is greatly affected by the electric charge of the electrons accumulated on the resist film 12 and May be shifted from the set position.

[Problems to be solved by the invention]

The problem with the conventional charged particle beam exposure apparatus described above is that the charged particle beam has the same polarity as the charged particle beam because the polarity of the charged particle beam and the charged particle beam accumulated on the resist film are the same. And the position of the charged particle beam irradiated on the resist film deviates from the set position.

An object of the present invention is to provide a charged particle beam exposure apparatus capable of performing accurate patterning without being affected by the charge of charged particles accumulated on a resist film.

[Means for solving the problem]

The above problem is caused by a charge shielding conductor thin film in which a plurality of openings corresponding to an exposure region and a plurality of positioning holes corresponding to the respective openings are continuously provided, and an opening of the charge shield conductor thin film. A movement mechanism for bringing a predetermined portion including the predetermined portion close to the sample surface, a position detection sensor for detecting the positioning hole in a state where the predetermined portion of the charge shield conductor thin film is close to the sample surface by the movement mechanism, and The problem is solved by a charged particle beam exposure apparatus provided with a mechanism for winding up the charge shield conductive thin film so that the plurality of openings of the charge shield conductive thin film are sequentially aligned with the exposure area.

[Operation] That is, in the present invention, a metal thin film having a deflection opening corresponding to a deflection region of a charged particle beam smaller than the size of an opening of an objective lens coil of a charged particle beam exposure apparatus, a metal thin film having a positioning hole, and A charge shield device having a mechanism for moving the metal thin film up and down between the position at the time of exposure and the position at the time of insertion of the dry plate, and a sensor for detecting the position of the metal thin film at the position at the time of exposure is provided. Since the influence of the electric charge accumulated thereon can be blocked by the above-mentioned metal thin film, a shift of the irradiation position of the charged particle beam due to the electric charge can be prevented, and accurate patterning on the resist film can be performed.

〔Example〕

FIG. 1 shows an embodiment of the present invention in the case of an electron beam exposure apparatus.

FIG. 1 schematically shows a column section including a beam deflection coil 3 and an objective lens coil 4 of an electron beam exposure apparatus, a charge shield apparatus, and a transparent substrate 1a having a light shielding pattern 1b.

In the side view shown in FIG. 1 (a), an electron beam irradiated through the beam deflection coil 3 is irradiated with a resist film formed on the light shielding pattern 1b by the beam deflection coil 3 and the objective lens coil 4. 2 is designed to draw a desired pattern on the surface.

The charge shield device is provided to prevent the influence of repulsion caused by the electric charge of the electrons accumulated in the resist film 2.
A movable shaft 6 for pushing down a metal thin film 5 made of copper having a thickness of 0.02 to 0.05 mm from a position above the illustrated pulley shaft 8 to a position close to the illustrated resist film 2, and a pulley to which the movable shaft 6 is coupled It comprises a shaft 8 and a pulley 7. The pulley 7 is rotated above and below the movable shaft 6 by a drive belt 9.

As shown in the plan view of FIG. 1 (b), the metal thin film 5 has a deflection opening 5a and a positioning hole 5b corresponding to a deflection region where an electron beam is drawn on the resist film 2, and the metal thin film 5 The displacement of the deflecting opening 5a caused when the movable shaft 6 is pressed down by the movable shaft 6 is used to detect the displacement of the sensor 10 by a tension mechanism (not shown) that applies tension to the metal thin film 5.
The position is corrected by matching the positioning hole 5b to the position.

In such a charge shield device, the metal thin film 5 is positioned on the pulley shaft 8 when the transparent substrate 1a having the light shielding pattern 1b is inserted or removed, and when the electron beam is irradiated, the metal thin film 5 is set by the charge shield device. 5 can be brought close to the resist film 2,
The metal thin film 5 can prevent the repulsive force due to the charge of the electrons accumulated in the resist film 2 by the irradiation of the electron beam.

The metal thin film 5 is provided with a plurality of deflecting openings 5a and positioning holes 5b, and is wound by one pitch by the above-mentioned tension mechanism for each use plural times, so that the electron beam irradiation is continuously performed. Is possible.

〔The invention's effect〕

As is clear from the above description, according to the present invention, by providing a charge shield device having a simple structure in the charged particle beam exposure device, the displacement of the irradiation position of the charged particle beam due to the electric charge accumulated on the resist film can be reduced. This has the advantage that it can be prevented and that accurate patterning on the resist film can be achieved. The effect of remarkable improvement in reliability can be expected, and this is extremely useful industrially.

[Brief description of the drawings]

 FIG. 1 is a view showing an embodiment according to the present invention, and FIG. 2 is a schematic side view showing a conventional electron beam exposure apparatus. In the figure, 1a is a transparent substrate, 1b is a light shielding pattern, 2 is a resist film, 3 is a beam deflection coil, 4 is an objective lens coil, 5 is a metal thin film, 5a is a deflection opening, 5b is a positioning hole, and 6 is movable. 7 denotes a pulley, 8 denotes a pulley shaft, 9 denotes a drive belt, and 10 denotes a sensor.

Claims (1)

(57) [Claims] 1. A charge shield conductive thin film (5) provided with a plurality of openings (5a) corresponding to an exposure area and a plurality of positioning holes (5b) corresponding to the respective openings. A moving mechanism (6 to 9) for bringing a predetermined portion including an opening of the charge shield conductive thin film close to the sample surface; A position detection sensor (10) for detecting the positioning hole, and a mechanism for winding up the charge shield conductor thin film so that the plurality of openings of the charge shield conductor thin film are sequentially aligned with the exposure area. A charged particle beam exposure apparatus, comprising: