JP2626982B2 - Polishing film - Google Patents
Polishing filmInfo
- Publication number
- JP2626982B2 JP2626982B2 JP62263221A JP26322187A JP2626982B2 JP 2626982 B2 JP2626982 B2 JP 2626982B2 JP 62263221 A JP62263221 A JP 62263221A JP 26322187 A JP26322187 A JP 26322187A JP 2626982 B2 JP2626982 B2 JP 2626982B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing layer
- film
- grinding
- binder resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 184
- 238000000227 grinding Methods 0.000 claims description 77
- 239000011347 resin Substances 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011230 binding agent Substances 0.000 claims description 39
- 239000006061 abrasive grain Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 95
- 230000003746 surface roughness Effects 0.000 description 38
- 239000000203 mixture Substances 0.000 description 37
- 230000001186 cumulative effect Effects 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 19
- 238000005259 measurement Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- -1 Polyethylene terephthalate Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 241001428397 Taito Species 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、ポリッシング、ラッピング加工、特に、精
密機器、精密部品の仕上げ加工に使用するのに適した研
磨フィルムに関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing film suitable for use in polishing and lapping, especially for finishing precision equipment and precision parts.
従来の技術 この種の研磨フィルムとしては、従来、プラスチック
フィルム上に、研磨材を分散させた塗料を塗布して、連
続あるいは不連続な研磨層を形成させたようなものがあ
り、この場合において、研磨層は１層にコーティングす
るのが普通であるが、特開昭61−65780号公報や実開昭6
1−178671号公報に開示されたような２層にコーティン
グすることも提案されている。Conventional technology As this type of polishing film, conventionally, there is a film in which a coating material in which an abrasive is dispersed is applied on a plastic film to form a continuous or discontinuous polishing layer. In this case, The polishing layer is usually coated as a single layer, but Japanese Patent Application Laid-Open No.
It has also been proposed to coat two layers as disclosed in JP 1-178671.
発明が解決しようとする問題点 このような従来の研磨層を１層にコーティングした研
磨フィルムでは、研削力の大きいものは高精密仕上げ性
に劣り、逆に、高精度仕上げ性に優れたものは研削力が
低くいのが普通であった。すなわち、同一の研磨フィル
ムで研削力が大きく高精密仕上げ性にも優れたものはな
いので、研削工程に合わせて適当な研削特性を有する研
磨フィルムに交換して、研削作業をしているのが現状で
あった。例えば、できるだけ短時間にて所定の研削量お
よび表面粗さの研削作業を行うためには、従来、最初は
研削力の大きな＃1000の研磨フィルムを用いて表面粗さ
は所定より大きくなるが短時間にて研削量の多い研削を
行い、中間工程においては、＃4000の研磨フィルムに交
換して研削量も表面粗さも中くらいの研削を行い、最後
に、＃8000の研磨フィルムに交換して研削量は小さいが
所定の高い精密仕上げ表面粗さの得られる研削を行うよ
うにしている。このように、１つの研削作業中において
何度も研磨フィルムを交換しなければならないのでは、
不便であり、研削作業時間もそれだけ長くなり、特に、
研削作業を自動化するような場合には問題となる。Problems to be Solved by the Invention In such a conventional polishing film coated with a single polishing layer, those having a large grinding force are inferior in high-precision finish, and conversely, those having excellent high-precision finish are not. The grinding power was usually low. In other words, there is no single polishing film with high grinding power and excellent high-precision finish.Therefore, it is necessary to replace the polishing film with one with appropriate grinding characteristics according to the grinding process, and then perform the grinding operation. It was the current situation. For example, in order to perform a grinding operation with a predetermined grinding amount and surface roughness in a short time as much as possible, conventionally, the surface roughness is initially larger than a predetermined value by using a # 1000 polishing film having a large grinding force. Grinding with a large amount of grinding in time, in the intermediate process, replace with a # 4000 polishing film, perform grinding with medium grinding amount and surface roughness, and finally, replace with a # 8000 polishing film Although the grinding amount is small, grinding is performed so as to obtain a predetermined high precision finish surface roughness. In this way, if you have to change the polishing film many times during one grinding operation,
It is inconvenient and the grinding time is longer, especially
This is a problem when the grinding operation is automated.
また、前述の特開昭61−65780号公報や実開昭61−178
671号公報に開示されたような２層コーティング研磨層
を有する研磨布も、特にこのような問題点の解決に向け
られたものではなかった。In addition, the above-mentioned Japanese Patent Application Laid-Open No.
A polishing cloth having a two-layer coating polishing layer as disclosed in Japanese Patent No. 671 is not particularly directed to solving such a problem.
本発明の目的は、このような従来の問題点を解消しう
る研磨フィルムを提供することである。An object of the present invention is to provide a polishing film which can solve such a conventional problem.
問題点を解決するための手段 本発明の第一の特徴によれば、研磨フィルムは、フィ
ルム基体上に、研削特性の異なる少なくとも２つの研磨
層を重ねて有し、前記研磨層の各々は、同一のバインダ
ー樹脂中に同一の砥粒を異なる濃度にて分散させてな
る。Means for Solving the Problems According to the first feature of the present invention, the polishing film has, on a film substrate, at least two polishing layers having different grinding characteristics stacked on each other, and each of the polishing layers is The same abrasive grains are dispersed at different concentrations in the same binder resin.
本発明の第二の特徴によれば、研磨フィルムは、フィ
ルム基体上に、研削特性の異なる少なくとも２つの研磨
層を重ねて有し、前記研磨層の各々は、異なるバインダ
ー樹脂中に、同一の砥粒を同一の砥粒濃度にて分散させ
てなる。According to the second aspect of the present invention, the polishing film has, on a film substrate, at least two polishing layers having different grinding characteristics stacked on each other, and each of the polishing layers is the same in a different binder resin. Abrasive grains are dispersed at the same abrasive grain concentration.
実施例 次に、添付図面に基づいて、本発明の実施例につい
て、本発明をより詳細に説明する。Next, the present invention will be described in more detail with reference to the accompanying drawings.
第１図は、本発明の一実施例として研磨フィルムの一
部を示す断面図であり、この実施例の研磨フィルムは、
プラスチックフィルム１の上に、バインダー樹脂３中に
砥粒３を分散させてなる第１の研磨層と、バインダー樹
脂５中に砥粒４を分散させてなる第２の研磨層とを重ね
て連続的にコーティングしたものである。第２図は、本
発明の別の実施例の研磨フィルムの一部を示す断面図で
あり、この実施例の研磨フィルムは、第１の研磨層と第
２の研磨層とを不連続または島状に形成した以外は、第
１図の実施例のものと同一である。第３図は、本発明の
さらに別の実施例の研磨フィルムの一部を示す断面図で
あり、この実施例の研磨フィルムは、第１の研磨層を不
連続または島状に形成した以外は、第１図の実施例の研
磨フィルムと同じである。FIG. 1 is a sectional view showing a part of a polishing film as one embodiment of the present invention.
A first polishing layer formed by dispersing the abrasive grains 3 in the binder resin 3 and a second polishing layer formed by dispersing the abrasive grains 4 in the binder resin 5 are stacked on the plastic film 1 and continuously formed. It is the one that was coated. FIG. 2 is a cross-sectional view showing a part of a polishing film according to another embodiment of the present invention. The polishing film according to this embodiment has a structure in which the first polishing layer and the second polishing layer are discontinuous or island-shaped. It is the same as that of the embodiment of FIG. FIG. 3 is a cross-sectional view showing a part of a polishing film according to still another embodiment of the present invention. The polishing film of this embodiment has a structure in which the first polishing layer is formed in a discontinuous or island shape. 1 is the same as the polishing film of the embodiment shown in FIG.
さらにまた、第４図、第５図および第６図は、それぞ
れ、本発明の別の実施例の研磨フィルムの一部を示す断
面図であり、プラスチックフィルム１の裏面に粘着層６
および離型紙７を設けた以外は、第１図、第２図および
第３図の実施例の研磨フィルムとそれぞれ同様の構造を
有するものである。また、これら研磨フィルムは、テー
プシート、ディスク状等任意の形に加工して使用できる
ものである。4, 5 and 6 are cross-sectional views each showing a part of a polishing film according to another embodiment of the present invention.
It has the same structure as the polishing film of the embodiment of FIGS. 1, 2 and 3, except that the release paper 7 is provided. These polishing films can be used after being processed into an arbitrary shape such as a tape sheet or a disk.
第１図から第６図にその構造を示した各実施例におい
て、第１の研磨層は、ワークの仕上り表面粗さは大きい
が、研削力が高いものとされており、第２の研磨層は、
研削力は低いがワークの仕上げ表面粗さは小さくなるよ
うなものとされている。すなわち、第１の研磨層では、
高い研削量が得られ、第２の研磨層では、精密研磨仕上
げが行えるようなものとされている。In each of the embodiments whose structures are shown in FIGS. 1 to 6, the first polishing layer has a large finished surface roughness of the work but a high grinding force. Is
The grinding force is low, but the finished surface roughness of the work is reduced. That is, in the first polishing layer,
A high grinding amount can be obtained, and the second polishing layer can be subjected to precision polishing finish.
第１の研磨層および第２の研磨層に前述したような研
削特性を与えるためには、本発明によれば、次のような
方法を採りうる。According to the present invention, the following method can be employed to impart the above-described grinding characteristics to the first polishing layer and the second polishing layer.
先ず、第１の研磨層と第２の研磨層とに同一の砥粒を
用いるとして、次の２つの組合せがある。First, assuming that the same abrasive grains are used for the first polishing layer and the second polishing layer, there are the following two combinations.
（Ａ）バインダー樹脂を第１の研磨層と第２の研磨層と
で同じとする場合 第１の研磨層の砥粒濃度と第２の研磨層の砥粒濃度と
を異ならせ、例えば、第１の研磨層の砥粒濃度を臨界砥
粒濃度（Critical Grain Volume Concentration:CGVC）
とし、第２の研磨層の砥粒濃度をその臨界砥粒濃度以下
または以上とする。(A) In the case where the binder resin is the same for the first polishing layer and the second polishing layer, the abrasive concentration of the first polishing layer and the abrasive concentration of the second polishing layer are made different. Critical Grain Volume Concentration (CGVC)
The abrasive concentration of the second polishing layer is equal to or less than the critical abrasive concentration.
（Ｂ）砥粒濃度を第１の研磨層と第２の研磨層とで同じ
とする場合 第１の研磨層のバインダー樹脂と第２の研磨層のバイ
ンダー樹脂とを異ならせ、例えば、第１の研磨層のバイ
ンダー樹脂は、第２の研磨層のバインダー樹脂より抗張
力が高く、破断伸びの低いものとする。主として、第１
の研磨層のバインダー樹脂は、熱硬化性樹脂とし、第２
の研磨層のバインダー樹脂は、熱可塑性樹脂とする。(B) When the Abrasive Grain Concentration is the Same for the First Polishing Layer and the Second Polishing Layer The binder resin of the first polishing layer and the binder resin of the second polishing layer are different from each other. The binder resin of the polishing layer of (1) has higher tensile strength and lower elongation at break than the binder resin of the second polishing layer. Mainly the first
The binder resin of the polishing layer is a thermosetting resin,
The binder resin of the polishing layer is a thermoplastic resin.
前述したような本発明の研磨フィルムにおいて、使用
できる砥粒としては、ダイヤモンド、アルミナ、シリコ
ンカーバイド、チッ化ホウ素、酸化クロム、酸化鉄、酸
化ケイ素、水酸化アルミニウム等がある。In the polishing film of the present invention as described above, usable abrasive grains include diamond, alumina, silicon carbide, boron nitride, chromium oxide, iron oxide, silicon oxide, aluminum hydroxide and the like.
また、バインダー樹脂としては、熱硬化性樹脂および
熱可塑性樹脂が使用でき、熱硬化性樹脂としては、２液
硬化型ウレタン、１液硬化型ウレタン樹脂、エポキシ・
ポリアミド樹脂、不飽和ポリエステル樹脂等、100℃以
下で反応（架橋＝硬化）するものが適している。熱可塑
性樹脂としては、各種アクリル樹脂、ビニル系樹脂、セ
ルロース系樹脂、エポキシ樹脂、エステル系樹脂等が使
用でき、また、ゴム系樹脂であるウレタンエラストマ
ー、ニトリルゴム、シリコーンゴム、アクリルゴム、エ
チレン酢ビゴム、フッ素ゴム等も使用できる。As the binder resin, a thermosetting resin and a thermoplastic resin can be used. As the thermosetting resin, a two-part curable urethane, a one-part curable urethane resin, an epoxy resin,
Those which react (crosslink = cure) at 100 ° C or lower, such as polyamide resin and unsaturated polyester resin, are suitable. As the thermoplastic resin, various acrylic resins, vinyl resins, cellulose resins, epoxy resins, ester resins, and the like can be used. In addition, rubber resins such as urethane elastomer, nitrile rubber, silicone rubber, acrylic rubber, and ethylene vinegar can be used. Birubber, fluorine rubber and the like can also be used.
フィルム基体であるプラスチックフィルムとしては、
ポリエチレンテレフタレート、ポリイミド、ポリカーボ
ネイトおよびそれらを表面処理したもの、その他合成
紙、不織布等を使用することができる。As a plastic film that is a film substrate,
Polyethylene terephthalate, polyimide, polycarbonate and their surface-treated ones, as well as synthetic paper, non-woven fabric and the like can be used.
次に、本発明の具体的実験例について説明する。 Next, specific experimental examples of the present invention will be described.
具体的実験例（１） この実験例は、本発明による研磨フィルムを試作実験
するため、各研磨層のバインダー樹脂を同じものとし、
各研磨層の砥粒濃度を異ならせた場合の例であり、先
ず、次の表１および２に示すような組成の塗工剤を準備
する。Specific Experimental Example (1) In this experimental example, the binder resin of each polishing layer was the same in order to test-produce a polishing film according to the present invention.
This is an example in which the abrasive concentration of each polishing layer is different. First, a coating material having a composition shown in the following Tables 1 and 2 is prepared.
但し、数値は、重量部を示し、IRM8−20は、ダイヤモン
ドパウダー（東名ダイヤモンド製粒径d50＝11.4μｍ）
であり、この場合の砥粒濃度は、表１の組成では、砥粒
／樹脂＝3.3/1であり、表２の組成では、砥粒／樹脂＝
2.0である。 However, numerical values indicate parts by weight, and IRM8-20 is diamond powder (Tomei Diamond particle size d 50 = 11.4 μm)
In this case, the abrasive grain concentration is 3.3 / 1 in the composition of Table 1, and the abrasive grain / resin is 3.3 / 1 in the composition of Table 2.
2.0.
表２の組成の塗工剤をメイヤーバーコーター、グラビ
ヤコーター、リバースロールコーター、ナイフコーター
等で、75μｍ厚さのポリエチレンテレフタレートフィル
ム上に、10μｍ〜100μｍの厚さに塗布し第２の研磨層
を形成し、その後、表１組成の塗工剤をその第２の研磨
層の上に同様の方法で10μｍ〜100μｍの厚さに塗布し
て第１の研磨層を形成して、研磨シートを製造した。こ
の場合において、第１の研磨層の厚さと、第２の研磨層
との厚さは、その研磨フィルムの使用目的に応じて適当
に選定する必要があり、特に、第１の研磨層は、その第
１の研磨層による目的の研削工程の完了時に丁度、摩滅
消滅したその下の第２の研磨層が表に表れるような厚さ
に選定する必要がある。その研磨シートを用いて、圧力
140g/cm2、回転数200rpm、ワーク回転数125rpmで、アル
ミを研磨し、一定時間毎に研磨されたアルミの表面粗さ
および体積を測定した。このときに測定された研磨特
性、すなわち、研磨時間対累積研削量の関係および研削
時間対表面粗さの関係を第７図に示している。この第７
図に示された関係から明らかなように、10分間の研削に
よる累積研削量は、160（×10-4cm3）であり、表面粗さ
は、0.20（μRa）であった。The coating composition having the composition shown in Table 2 was applied to a polyethylene terephthalate film having a thickness of 75 μm with a Meyer bar coater, a gravure coater, a reverse roll coater, a knife coater, or the like to a thickness of 10 μm to 100 μm to form a second polishing layer. Then, a coating material having the composition shown in Table 1 is applied on the second polishing layer to a thickness of 10 μm to 100 μm in the same manner to form a first polishing layer, thereby producing a polishing sheet. did. In this case, the thickness of the first polishing layer and the thickness of the second polishing layer need to be appropriately selected according to the purpose of use of the polishing film. In particular, the first polishing layer is It is necessary to select the thickness so that the second polishing layer underneath, which has been worn out, appears just when the target grinding step by the first polishing layer is completed. Using the abrasive sheet, pressure
The aluminum was polished at 140 g / cm 2 , 200 rpm, and 125 rpm of the workpiece, and the surface roughness and volume of the polished aluminum were measured at regular intervals. FIG. 7 shows the polishing characteristics measured at this time, that is, the relationship between the polishing time and the accumulated grinding amount and the relationship between the grinding time and the surface roughness. This seventh
As is clear from the relationship shown in the figure, the cumulative grinding amount by grinding for 10 minutes was 160 (× 10 −4 cm 3 ), and the surface roughness was 0.20 (μR a ).
比較実験例（１） 一方、前述した本発明による具体的実験例（１）の研
磨フィルムとの作用効果を確認するために、これと比較
しうる従来の如き研磨層が１層のみの研磨フィルムを作
製するため、表１の組成の塗工液を用いて１層の研磨層
のみを有する研磨フィルムと、表２の組成の塗工液を用
いて１層の研磨層のみを有する研磨フィルムとを製造
し、具体的実験例（１）と同様の実験測定を行った。こ
のときの、表１の組成の塗工液で研磨層を形成した研磨
フィルムの研削時間対累積研削量の関係および研削時間
対表面粗さの関係を、第８図に示し、表２の組成の塗工
液で研磨層を形成した研磨フィルムの研削時間対累積研
削量の関係および研削時間対表面粗さの関係を、第９図
に示している。これら第８図および第９図から明らかな
ように、表１の組成の塗工液で形成した研磨層のみを有
する研磨フィルムで10分間研磨した場合には、累積研削
量は、210（×10-4cm3）で、表面粗さは、0.25（μRa）
であった。これを、具体的実験例（１）のものと比較す
ると、累積研削量は、多いが、仕上り面の表面粗さは大
きくなってしまうことが分かる。一方、表２の組成の塗
工液で形成した研磨層のみを有する研磨フィルムで10分
間研磨した場合には、累積研削量は、140（×10-4cm3）
で、表面粗さは、0.10（μRa）であった。これを、具体
的実験例（１）のものと比較すると、仕上り表面粗さは
小さいが、累積研削量が少なくなってしまうことが分か
る。従って、具体的実験例（１）の研磨フィルムと同程
度の累積研削量を得るためには、第１の研磨層だけで
は、表面粗さが大きすぎてしまい、第２の研磨層のみで
は、研削時間が10分間以上かかってしまうことになる。Comparative Experimental Example (1) On the other hand, in order to confirm the effect of the polishing film of the specific experimental example (1) according to the present invention described above, a conventional polishing film having only one polishing layer comparable to this was used. And a polishing film having only one polishing layer using a coating liquid having a composition shown in Table 1 and a polishing film having only one polishing layer using a coating liquid having a composition shown in Table 2. Was manufactured, and an experimental measurement similar to that of the specific experimental example (1) was performed. FIG. 8 shows the relationship between the grinding time and the accumulated grinding amount and the relationship between the grinding time and the surface roughness of the polishing film on which the polishing layer was formed with the coating liquid having the composition shown in Table 1 and the composition shown in Table 2. FIG. 9 shows the relationship between the grinding time and the accumulated grinding amount and the relationship between the grinding time and the surface roughness of the polishing film on which the polishing layer was formed with the coating liquid. As is clear from FIGS. 8 and 9, when the polishing film having only the polishing layer formed of the coating liquid having the composition shown in Table 1 was polished for 10 minutes, the cumulative grinding amount was 210 (× 10 10 -4 cm 3 ) with a surface roughness of 0.25 (μR a )
Met. When this is compared with that of the specific experimental example (1), it can be seen that the cumulative grinding amount is large, but the surface roughness of the finished surface is large. On the other hand, when polished for 10 minutes with a polishing film having only a polishing layer formed with the coating liquid having the composition shown in Table 2, the cumulative grinding amount is 140 (× 10 −4 cm 3 ).
The surface roughness was 0.10 (μR a ). When this is compared with that of the specific experimental example (1), it is found that the finished surface roughness is small, but the accumulated grinding amount is small. Therefore, in order to obtain the same amount of cumulative grinding as that of the polishing film of the specific experimental example (1), the surface roughness is too large with only the first polishing layer, and only with the second polishing layer. The grinding time will take more than 10 minutes.
具体的実験例（２） この実験例は、本発明による研磨フィルムを試作実験
するため、各研磨層の砥粒濃度を同じものとし、各研磨
層のバインダー樹脂を異ならせた場合の例であり、先
ず、次の表３および４に示すような組成の塗工剤を準備
する。Specific Experimental Example (2) This experimental example is an example in which the abrasive concentration of each polishing layer is the same and the binder resin of each polishing layer is different in order to experimentally manufacture the polishing film according to the present invention. First, a coating agent having a composition as shown in the following Tables 3 and 4 is prepared.
但し、数値は、重量部を示し、IRM8−20は、ダイヤモン
ドパウダー（東名ダイヤモンド製粒径d50＝11.4μｍ）
であり、この場合の砥粒濃度は、表３および４の組成に
おいて共に、同じく、砥粒／樹脂＝2.0/1である。 However, numerical values indicate parts by weight, and IRM8-20 is diamond powder (Tomei Diamond particle size d 50 = 11.4 μm)
In this case, the abrasive concentration in the compositions shown in Tables 3 and 4 is also the same, that is, abrasive / resin = 2.0 / 1.
表４の組成の塗工剤をメイヤーバーコーター、グラビ
ヤコーター、リバースロールコーター、ナイフコーター
等で、75μｍ厚さのポリエチレンテレフタレートフィル
ム上に、10μｍ〜100μｍの厚さに塗布し第２の研磨層
を形成し、その後、表３の組成の塗工剤をその第２の研
磨層の上に同様の方法で10μｍ〜100μｍの厚さに塗布
して第１の研磨層を形成して、研磨シートを製造した。
この場合形成された第１の研磨層の塗膜物性は、抗張力
が300kg/cm2、破断伸びが１％であり、第２の研磨層の
塗膜物性は、抗張力が10kg/cm2、破断伸びが300％であ
った。このような研磨シートを用いて、圧力140g/cm2、
回転数200rpm、ワーク回転数125rpmで、アルミを研磨
し、一定時間毎に研磨されたアルミの表面粗さおよび体
積を測定した。このときに測定された研磨特性、すなわ
ち、研削時間対累積研削量の関係および研削時間対表面
粗さの関係を第10図に示している。この第10図に示され
た関係から明らかなように、10分間の研削による累積研
削量は、100×（10-4cm3）であり、表面粗さは、0.03
（μRa）であった。The coating composition having the composition shown in Table 4 was applied to a polyethylene terephthalate film having a thickness of 75 μm by a Meyer bar coater, a gravure coater, a reverse roll coater, a knife coater, or the like to a thickness of 10 μm to 100 μm to form a second polishing layer. Then, a coating material having the composition shown in Table 3 is applied on the second polishing layer to a thickness of 10 μm to 100 μm in the same manner to form a first polishing layer, and a polishing sheet is formed. Manufactured.
In this case, the coating properties of the first polishing layer formed were such that the tensile strength was 300 kg / cm 2 and the elongation at break was 1%. The coating properties of the second polishing layer were that the tensile strength was 10 kg / cm 2 and the breaking strength. The elongation was 300%. Using such a polishing sheet, pressure 140 g / cm 2 ,
Aluminum was polished at a rotation speed of 200 rpm and a work rotation speed of 125 rpm, and the surface roughness and volume of the polished aluminum were measured at regular intervals. FIG. 10 shows the polishing characteristics measured at this time, that is, the relationship between the grinding time and the accumulated grinding amount and the relationship between the grinding time and the surface roughness. As is clear from the relationship shown in FIG. 10, the cumulative grinding amount by grinding for 10 minutes is 100 × (10 −4 cm 3 ), and the surface roughness is 0.03
(ΜR a ).
比較実験例（２） 一方、前述した本発明による具体的実験例（２）の研
磨フィルムとの作用効果を確認するために、これと比較
しうる従来の如き研磨層が１層のみの研磨フィルムを作
製するため、表３の組成の塗工液を用いて１層の研磨層
のみを有する研磨フィルムと、表４の組成の塗工液を用
いて１層の研磨層のみを有する研磨フィルムとを製造
し、具体的実験例（２）と同様の実験測定を行った。こ
のときの、表１の組成の塗工液で研磨層を形成した研磨
フィルムの研削時間対累積研削量の関係および研削時間
対表面粗さの関係を、第11図に示し、表４の組成の塗工
液で研磨層を形成した研磨フィルムの研削時間対累積研
削量の関係および研削時間対表面粗さの関係を、第12図
に示している。これら第11図および第12図から明らかな
ように、表３の組成の塗工液で形成した研磨層のみを有
する研磨フィルムで10分間研磨した場合には、累積研削
量は、150（×10-4cm3）で、表面粗さは、0.09（μRa）
であった。これを、具体的実験例（２）のものと比較す
ると、累積研削量は、多いが、仕上り面の表面粗さは大
きくなってしまうことが分かる。一方、表４の組成の塗
工液で形成した研磨層のみを有する研磨フィルムで10分
間研磨した場合には、累積研削量は、45（×10-4cm3）
で、表面粗さは、0.02（μRa）であった。これを、具体
的実験例（２）のものと比較すると、仕上り表面粗さは
小さいが、累積研削量が少なくなってしまうことが分か
る。従って、具体的実験例（１）の研磨フィルムと同程
度の累積研削量を得るためには、第１の研磨層だけで
は、表面粗さが大きすぎてしまい、第２の研磨層のみで
は、研削時間が10分間以上かかってしまうことになる。Comparative Experimental Example (2) On the other hand, in order to confirm the effects of the polishing film of the specific experimental example (2) according to the present invention described above, a conventional polishing film having only one polishing layer comparable to this was used. And a polishing film having only one polishing layer using the coating liquid having the composition shown in Table 3 and a polishing film having only one polishing layer using the coating liquid having the composition shown in Table 4. Was manufactured, and an experimental measurement similar to that of the specific experimental example (2) was performed. FIG. 11 shows the relationship between the grinding time and the cumulative grinding amount and the relationship between the grinding time and the surface roughness of the polishing film on which the polishing layer was formed with the coating liquid having the composition shown in Table 1 and the composition shown in Table 4. FIG. 12 shows the relationship between the grinding time and the accumulated grinding amount and the relationship between the grinding time and the surface roughness of the polishing film having the polishing layer formed with the coating liquid of Example 1. As is apparent from FIGS. 11 and 12, when the polishing film having only the polishing layer formed of the coating liquid having the composition shown in Table 3 was polished for 10 minutes, the cumulative grinding amount was 150 (× 10 -4 cm 3 ) with a surface roughness of 0.09 (μR a )
Met. When this is compared with that of the specific experimental example (2), it is found that the accumulated grinding amount is large, but the surface roughness of the finished surface becomes large. On the other hand, when polished for 10 minutes with a polishing film having only the polishing layer formed with the coating liquid having the composition shown in Table 4, the cumulative grinding amount is 45 (× 10 −4 cm 3 ).
The surface roughness was 0.02 (μR a ). When this is compared with that of the specific experimental example (2), it is found that the finished surface roughness is small, but the accumulated grinding amount is small. Therefore, in order to obtain the same amount of cumulative grinding as that of the polishing film of the specific experimental example (1), the surface roughness is too large with only the first polishing layer, and only with the second polishing layer. The grinding time will take more than 10 minutes.
その他の具体的実験例およびその比較実験例を次に列
挙する。なお、これらの実験条件は、実験例（１）と同
じである。Other specific experimental examples and comparative experimental examples are listed below. Note that these experimental conditions are the same as in Experimental Example (1).
具体的実験例（３） ワークの種類：チッ化ケイ素 砥粒の種類:IRM8−20 第１の研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:50vol％ 第２の研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:10vol％ 測定結果： 10分間の累積研削量:80×10-4cm3 表面粗さ:0.09μRa 比較実験例（３） （Ａ） ワークの種類：チッ化ケイ素 砥粒の種類:IRM8−20 単一研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:50vol％ 測定結果： 10分間の累積研削量:100×10-4cm3 表面粗さ:0.28μRa （Ｂ） ワークの種類：チッ化ケイ素 砥粒の種類:IRM8−20 単一研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:10vol％ 測定結果： 10分間の累積研削量:50×10-4cm3 表面粗さ:0.08μRa 具体的実験例（４） ワークの種類：ポリメチルメタクリレート 砥粒の種類:WA1500（昭和電工製） 第１の研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:50vol％ 第２の研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:10vol％ 測定結果： 10分間の累積研削量:180×10-4cm3 表面粗さ:0.20μRa 比較実験例（４） （Ａ） ワークの種類：ポリメチルメタクリレート 砥粒の種類:WA1500 単一研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:50vol％ 測定結果： 10分間の累積研削量:210×10-4cm3 表面粗さ:0.25μRa （Ｂ） ワークの種類：ポリメチルメタクリレート 砥粒の種類:WA1500 単一研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:10vol％ 測定結果： 10分間の累積研削量:90×10-4cm3 表面粗さ:0.18μRa 具体的実験例（５） ワークの種類：チッ化ケイ素 砥粒の種類:IRM8−20 第１の研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:50vol％ 第２の研磨層の組成： バインダー樹脂の種類:N2304 砥粒濃度:50vol％ 測定結果： 10分間の累積研削量:70×10-4cm3 表面粗さ:0.08μRa 比較実験例（５） （Ａ） ワークの種類：チッ化ケイ素 砥粒の種類:IRM8−20 単一研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:50vol％ 測定結果： 10分間の累積研削量:100×10-4cm3 表面粗さ:0.28μRa （Ｂ） ワークの種類：チッ化ケイ素 砥粒の種類:IRM8−20 単一研磨層の組成： バインダー樹脂の種類:N2304 砥粒濃度:50vol％ 測定結果： 10分間の累積研削量:20×10-4cm3 表面粗さ:0.06μRa 具体的実験例（６） ワークの種類：ポリメチルメタクリレート 砥粒の種類:WA1500（昭和電工製） 第１の研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:30vol％ 第２の研磨層の組成： バインダー樹脂の種類:N2304 砥粒濃度:30vol％ 測定結果： 10分間の累積研削量:100×10-4cm3 表面粗さ:0.19μRa 比較実験例（６） （Ａ） ワークの種類：ポリメチルメタクリレート 砥粒の種類:WA1500 単一研磨層の組成： バインダー樹脂の種類:VAGH＝100 Ｃ−Ｌ＝10 砥粒濃度:30vol％ 測定結果： 10分間の累積研削量:180×10-4cm3 表面粗さ:0.22μRa （Ｂ） ワークの種類：ポリメチルメタクリレート 砥粒の種類:WA1500 単一研磨層の組成： バインダー樹脂の種類:N2304 砥粒濃度:30vol％ 測定結果： 10分間の累積研削量:70×10-4cm3 表面粗さ:0.10μRa 発明の効果 前述の説明から明らかなように、本発明による研磨フ
ィルムは、研削作業の目的に合わせて研削特性の異なる
研磨層を設けるようにすることにより、１つの研磨フィ
ルムにて所望の研削作業を短時間にて完了させることが
できる。例えば、本発明の研磨フィルムは、第１の研磨
層を研削力の高いものとし、第２の研磨層を仕上げ精度
の優れたものとしておくことにより、同一の研磨フィル
ムにて高研削と高精密仕上げを行うことができ、作業性
を著しく向上させることができる。つまり、研磨フィル
ムを交換することなく、初期に第１の研磨層にて所定の
高い研削量を達成し、丁度、第１の研磨層の摩滅消滅後
に表面に出てくる第２の研磨層にて精密仕上げ研磨を達
成することができる。Specific experimental example (3) Type of work: silicon nitride Type of abrasive: IRM8-20 Composition of first polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive concentration: 50 vol% Composition of polishing layer 2: Kind of binder resin: VAGH = 100 CL = 10 Abrasive grain concentration: 10 vol% Measurement result: Cumulative grinding amount for 10 minutes: 80 × 10 -4 cm 3 Surface roughness: 0.09 μR a Comparative Experiment Example (3) (A) Type of work: silicon nitride Type of abrasive: IRM8-20 Composition of single polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive concentration: 50 vol% Measurement result: Cumulative grinding amount for 10 minutes: 100 × 10 -4 cm 3 Surface roughness: 0.28 μR a (B) Work type: silicon nitride Abrasive type: IRM8-20 Composition of single polishing layer: binder Type of resin: VAGH = 100 CL = 10 Abrasive grain concentration: 10 vol% Measurement result: Cumulative grinding amount for 10 minutes: 50 × 10 -4 cm 3 Surface roughness: 0.08 μR a Specific experimental example (4) Work Type: Poly Chill methacrylate Type of abrasive: WA1500 (manufactured by Showa Denko) Composition of first polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive concentration: 50 vol% Composition of second polishing layer: Binder resin Type: VAGH = 100 CL = 10 Abrasive grain concentration: 10 vol% Measurement result: Cumulative grinding amount for 10 minutes: 180 × 10 -4 cm 3 Surface roughness: 0.20 μR a Comparative experimental example (4) (A) Type of work: Polymethyl methacrylate Type of abrasive: WA1500 Composition of single polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive concentration: 50 vol% Measurement result: Cumulative grinding amount for 10 minutes: 210 × 10 -4 cm 3 Surface roughness: 0.25μR a (B) Type of work: polymethyl methacrylate Type of abrasive: WA1500 Composition of single polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive grain concentration: 10 vol% measurement: 10 min cumulative grinding amount: 90 × 10 -4 cm 3 surface roughness: 0.18Myuaru a specific experimental examples (5) of the workpiece species : Type of silicon nitride Abrasive: IRM8-20 Composition of first polishing layer: Kind of binder resin: VAGH = 100 CL = 10 Abrasive concentration: 50 vol% Composition of second polishing layer: Binder resin Type: N2304 Abrasive grain concentration: 50 vol% Measurement result: Cumulative grinding amount for 10 minutes: 70 × 10 -4 cm 3 Surface roughness: 0.08 μR a Comparative experimental example (5) (A) Work type: silicon nitride abrasive Type of grain: IRM8-20 Composition of single polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive grain concentration: 50 vol% Measurement result: Cumulative grinding amount for 10 minutes: 100 × 10 −4 cm 3 Surface roughness: 0.28μR a (B) Type of work: silicon nitride Type of abrasive: IRM8-20 Composition of single polishing layer: Type of binder resin: N2304 Abrasive concentration: 50 vol% Measurement result: 10 minutes cumulative amount of grinding: 20 × 10 -4 cm 3 surface roughness: 0.06Myuaru a specific experimental examples (6) work type: polymethylmethacrylate grains type: WA1500 (produced by Showa Denko) first Composition of polishing layer: Type of binder resin: VAGH = 100 CL = 10 Abrasive particle concentration: 30 vol% Composition of second polishing layer: Type of binder resin: N2304 Abrasive particle concentration: 30 vol% Measurement result: 10 minutes Cumulative grinding amount: 100 × 10 -4 cm 3 Surface roughness: 0.19 μR a Comparative experimental example (6) (A) Work type: polymethyl methacrylate Abrasive type: WA1500 Composition of single polishing layer: binder resin Type: VAGH = 100 CL = 10 Abrasive grain concentration: 30 vol% Measurement result: Cumulative grinding amount for 10 minutes: 180 × 10 -4 cm 3 Surface roughness: 0.22 μR a (B) Work type: polymethyl methacrylate Type of abrasive: WA1500 Composition of single polishing layer: Type of binder resin: N2304 Abrasive concentration: 30 vol% Measurement result: Cumulative grinding amount for 10 minutes: 70 × 10 -4 cm 3 Surface roughness: 0.10 μR a invention As is clear from the above description, the polishing film according to the present invention has different polishing characteristics depending on the purpose of the grinding operation. By so providing the, it can be completed desired grinding work in a short time at a single abrasive film. For example, in the polishing film of the present invention, the first polishing layer has a high grinding force and the second polishing layer has a high finishing accuracy, so that the same polishing film can be used for high grinding and high precision. Finishing can be performed, and workability can be significantly improved. In other words, the first polishing layer achieves a predetermined high grinding amount at the initial stage without changing the polishing film, and the second polishing layer that appears on the surface just after the first polishing layer has been worn away. Precision finish polishing can be achieved.
また、本発明の実施例の如く、研磨特性の異なる研磨
層を同一の砥粒を用いて形成するようにすれば、研磨フ
ィルムの製造工程、研磨工程（使用時）で、異なる粒径
の砥粒が不所望に混入することがなく、非常に良質の研
磨フィルムを作製することができる。また、本発明によ
って、同一の砥粒、同一のバインダー樹脂を使用する場
合には、研磨フィルムの製造工程において、第１の研磨
層、第２の研磨層の各々の塗工剤の砥粒濃度を調整する
だけで形成できるので、材料の損失量を少なくすること
ができ経済的であり、結局は安価な研磨フィルムを製造
することができる。Further, if the polishing layers having different polishing characteristics are formed by using the same abrasive grains as in the embodiment of the present invention, the abrasive layers having different particle diameters can be formed in the polishing film manufacturing process and the polishing process (when used). A very good quality polishing film can be produced without undesired mixing of grains. Further, when the same abrasive grains and the same binder resin are used according to the present invention, the abrasive grain concentration of each coating agent of the first polishing layer and the second polishing layer in the production process of the polishing film. Can be formed only by adjusting the thickness of the material, so that the amount of material loss can be reduced, which is economical, and in the end, an inexpensive polishing film can be manufactured.
第１図から第６図は、本発明の種々な実施例の研磨フィ
ルムの一部分をそれぞれ示す断面図、第７図は、本発明
の一実施例の研磨フィルムの研磨特性の一例を示す図、
第８図および第９図は、第７図に示した研磨特性を有す
る研磨フィルムと比較対象となるような研磨フィルムの
研磨特性を示す図、第10図は、本発明の別の実施例の研
磨フィルムの研磨特性の一例を示す図、第11図および第
12図は、第10図に示した研磨特性を有する研磨フィルム
と比較対象となる研磨フィルムの研磨特性を示す図であ
る。 １……プラスチックフィルム、 ２、４……砥粒、３、５……バインダー樹脂。1 to 6 are cross-sectional views each showing a part of a polishing film of various embodiments of the present invention. FIG. 7 is a diagram showing an example of polishing characteristics of the polishing film of one embodiment of the present invention.
8 and 9 are diagrams showing polishing characteristics of a polishing film as compared with a polishing film having the polishing characteristics shown in FIG. 7, and FIG. 10 is a diagram showing another embodiment of the present invention. Figures showing an example of the polishing characteristics of the polishing film, FIG. 11 and FIG.
FIG. 12 is a view showing polishing characteristics of a polishing film having the polishing characteristics shown in FIG. 10 and a polishing film to be compared. 1 ... Plastic film, 2,4 ... Abrasive grains, 3,5 ... Binder resin.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 酒井 茂 東京都台東区台東１―５―１ 東京磁気 印刷株式会社内 (56)参考文献 特開 昭61−65780（ＪＰ，Ａ) 特開 昭62−218072（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Shigeru Sakai 1-5-1, Taito, Taito-ku, Tokyo Tokyo Magnetic Printing Co., Ltd. (56) References JP-A-61-65780 (JP, A) JP-A-62 −218072 (JP, A)
Claims (5)
くとも２つの研磨層を重ねて有し、前記研磨層の各々
は、同一のバインダー樹脂中に同一の砥粒を異なる濃度
にて分散させてなることを特徴とする研磨フィルム。1. A film substrate comprising at least two polishing layers having different grinding characteristics superposed on each other, wherein each of the polishing layers is formed by dispersing the same abrasive grains in the same binder resin at different concentrations. A polishing film, characterized in that:
求の範囲第（１）項記載の研磨フィルム。2. The polishing film according to claim 1, wherein the abrasive concentration is higher in the upper layer.
くとも２つの研磨層を重ねて有し、前記研磨層の各々
は、異なるバインダー樹脂中に、同一の砥粒を同一の砥
粒濃度にて分散させてなることを特徴とする研磨フィル
ム。3. At least two polishing layers having different grinding characteristics are superposed on a film substrate, and each of the polishing layers includes the same abrasive grains in different binder resins at the same abrasive grain concentration. A polishing film characterized by being dispersed.
ンダー樹脂は、下層の研磨層の前記バインダー樹脂よ
り、抗張力が高く破断伸びが低いものである特許請求の
範囲第（３）項記載の研磨フィルム。4. The binder resin according to claim 3, wherein the binder resin of the upper polishing layer of the polishing layer has higher tensile strength and lower elongation at break than the binder resin of the lower polishing layer. Polishing film.
ンダー樹脂は、熱硬化性樹脂であり、下層の研磨層の前
記バインダー樹脂は、熱可塑性樹脂である特許請求の範
囲第（４）項記載の研磨フィルム。5. The method according to claim 4, wherein the binder resin of the upper polishing layer of the polishing layer is a thermosetting resin, and the binder resin of the lower polishing layer is a thermoplastic resin. The polishing film according to the above item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62263221A JP2626982B2 (en) | 1987-10-19 | 1987-10-19 | Polishing film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62263221A JP2626982B2 (en) | 1987-10-19 | 1987-10-19 | Polishing film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01109084A JPH01109084A (en) | 1989-04-26 |
| JP2626982B2 true JP2626982B2 (en) | 1997-07-02 |
Family
ID=17386463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62263221A Expired - Lifetime JP2626982B2 (en) | 1987-10-19 | 1987-10-19 | Polishing film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2626982B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006346853A (en) * | 2005-06-13 | 2006-12-28 | Kwh Mirka Ab Oy | Flexible polishing member and its method of manufacture |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5011513A (en) * | 1989-05-31 | 1991-04-30 | Norton Company | Single step, radiation curable ophthalmic fining pad |
| JP3012261B2 (en) * | 1989-12-20 | 2000-02-21 | 住友スリーエム株式会社 | Polishing tape |
| JP2980682B2 (en) * | 1993-06-02 | 1999-11-22 | 大日本印刷株式会社 | Polishing tape and method of manufacturing the same |
| US7867302B2 (en) * | 2005-02-22 | 2011-01-11 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
| US7875091B2 (en) * | 2005-02-22 | 2011-01-25 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
| US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
| JP2007326175A (en) * | 2006-06-07 | 2007-12-20 | Nihon Micro Coating Co Ltd | Cleaning tape and method |
| CN104369118A (en) * | 2014-09-15 | 2015-02-25 | 苏州群力防滑材料有限公司 | Composite abrasive cloth |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6165780A (en) * | 1984-09-06 | 1986-04-04 | Kouyoushiya:Kk | Grinding belt |
| US4644703A (en) * | 1986-03-13 | 1987-02-24 | Norton Company | Plural layered coated abrasive |
-
1987
- 1987-10-19 JP JP62263221A patent/JP2626982B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006346853A (en) * | 2005-06-13 | 2006-12-28 | Kwh Mirka Ab Oy | Flexible polishing member and its method of manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01109084A (en) | 1989-04-26 |
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