JP2628481B2 - Chip forming die and chip forming method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding die for molding a chip molded product and a method for molding a chip molded product having a curved shape using the molding die.

[0002]

2. Description of the Related Art Conventionally, in order to mold a chip having a curved shape, a lower mold (2) having a convex surface (2A) and an upper mold having a concave surface (3A) as shown in FIG. (3) Using the chip mold (1) consisting of: and the chip mold material in the lower mold (2).
(5) and press-molding the chip molding material (5) between the lower mold convex surface (2A) and the upper mold concave surface (3A).

[0003]

However, in the above conventional method, when the chip molding material (5) is filled in the lower mold (2), the chip molding material (5) is filled with the convex surface of the lower mold (2). Near the top of the convex surface (2A) sliding down from (2A), the chip molding material (5)
The filling amount of the chip molding material (5) increases toward the bottom of the convex surface (2A), and as a result, a chip molding having a uniform density or a partially different density is obtained. However, there is a problem that it is difficult to obtain such a chip molded product.

[0004]

According to the present invention, as a means for solving the above-mentioned conventional problems, a lower mold (12) having a convex surface (12A) or a concave surface, a convex mold (12A) or A concave surface (13A) corresponding to the concave surface or an upper die (13) having a convex surface
And a lattice frame (1) inserted between the lower mold (12) and the upper mold (13).
The lattice frame (14) is composed of vertical and horizontal plate walls (14A, 14B), and the upper die (13) is composed of vertical and horizontal plate walls (14A, 14B) of the lattice frame (14).
Are formed, and a spacer (14D) corresponding to the thickness of the molded product is interposed between the lattice frame (14) and the lower mold (12). Chip mold (11), and further, a grid frame (14) is placed on the mold surface (12A) of the lower mold (12) of the chip mold (11) via a spacer (14D), and The lower mold (12) is filled with the chip molding material (15), and the upper mold (13)
Into the lower mold (12) to insert the vertical and horizontal plate walls (14) of the lattice frame (14).
A, 14B) into the fitting grooves (13B, 13C) of the upper mold (13) to form the mold surface (12A) of the lower mold (12) and the mold surface (13A) of the upper mold (13). The present invention provides a chip molding method for compression-molding the chip molding material (15).

[0005]

[Operation] A lattice frame (14) is placed on a convex surface (12A) or a concave surface of a lower mold (12) via a spacer (14D), and then the lower mold is formed.
(12) is filled with a chip molding material (15). The chip molding material (15) is filled in a gap (16) between the convex surface (12A) or the concave surface of the lower mold (12) and the lattice frame (14), and further the lattice frame (14)
Of the lattice frame (14).
(14C) is filled with the chip molding material (15).
The convex surface (1) of the lower mold (12) is formed by the vertical and horizontal plate walls (14A, 14B) of (4).
Sliding from 2A) or down to concave surfaces is prevented. Therefore, the chip molding material (15) is provided on the convex surface (12) of the lower mold (12).
A) or the desired shape can be filled on the concave mold surface, and when the upper mold (13) is lowered or raised in this state, the lattice frame is inserted into the fitting grooves (13B, 13C) of the upper mold (13). (14) is fitted, and the chip molding material (15) is a convex surface (12A) of the lower mold (12).
And the concave surface (13A) of the upper mold (13).

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to an embodiment shown in FIGS. 1 to 3. The chip forming die (11) comprises a lower die (12) having a convex surface (12A) and a concave die (13A). With upper mold (13) and lattice frame
(14), wherein the lower mold (12) is box-shaped,
The vertical plate wall (14A) is disposed with a predetermined gap (14C) along the convex surface (12A) of the lower die (12), and the horizontal wall connecting the vertical plate wall (14A) at the front and rear portions. The upper mold comprises a plate wall (14B) and pins (14D) as spacers hanging from four corners of the lower surface.
(13) is formed with fitting grooves (13B, 13C) into which the vertical and horizontal plate walls (14A, 14B) of the lattice frame (14) fit.

The lattice frame (14) is set on the convex surface (12A) of the lower mold (12) via pins (14D), and then the chip molding material (15) is placed in the lower mold (12). ) Is filled. The chip molding material (15) is a crushed material of waste plastic foam such as polyurethane foam, polyethylene foam, and polypropylene foam, a crushed material of plastic waste such as polyvinyl chloride, polyethylene, and polypropylene, a carpet, and the like.
It is composed of one or a mixture of two or more kinds of crushed waste materials of fiber materials such as fiber knitted fabrics and nonwoven fabrics, and usually contains urethane prepolymer or the like as a binder.

The above-mentioned chip molding material (15) is filled in the gap (16) between the convex surface (12A) of the lower mold (12) and the lattice frame (14), and then the vertical and horizontal plate walls (14) of the lattice frame (14) are formed. 14A, 14B) and the space (14C). The chip forming material (15) filled in the gap (14C) is prevented from sliding down the convex surface (12A) of the lower mold (12) by the vertical plate wall (14A). Therefore, the chip molding material (15) can be filled on the convex surface (12A) of the lower mold (12) with a uniform thickness. In this state the upper mold
(13) is lowered, and the vertical and horizontal plate walls (14A, 14B) of the lattice frame (14) are fitted into the fitting grooves (13B, 13C) of the upper mold (13). The tip molding material (15) is compression molded. At the same time, the urethane prepolymer is cured by contacting with steam.

In this way, a curved chip molded product (16A) as shown in FIG. 3 is manufactured. Contrary to the above embodiment, a concave surface is formed on the lower die and a convex surface is formed on the upper die. May be used.

[0010]

Thus, in the present invention, the chip molding material can be filled with a desired thickness on the lower convex surface, and molded products having a uniform density or molded products having partially different densities can be easily obtained. Can be obtained.

[Brief description of the drawings]

 1 to 3 show one embodiment of the present invention.

FIG. 1 is an exploded perspective view of a chip molding die.

FIG. 2 is an explanatory view of a state in which a chip molding material is filled;

FIG. 3 is an explanatory view of a molding state.

FIG. 4 is a perspective view of a molded product.

FIG. 5 is an explanatory view of a conventional example.

[Explanation of symbols]

 11 Chip mold 12 Lower mold 12A Convex face 13 Upper mold 13A Concave face 13B, 13C Fitting groove 14 Lattice frame 14A, 14B Vertical horizontal wall 14C Gap 14D pin (spacer) 15 Chip molding material 16 Gap

Claims (2)

(57) [Claims] 1. A lower mold having a convex surface or a concave surface, an upper mold having a concave surface or a convex surface corresponding to the convex surface or the concave surface, and being inserted between the lower mold and the upper mold. The upper frame is formed with an insertion groove into which the vertical and horizontal plate walls of the lattice frame are inserted, and the upper frame is formed between the lattice frame and the lower mold surface. A chip mold, characterized by the presence of a spacer for the thickness of the molded product 2. A chip frame is placed on a surface of a lower mold of the chip mold of claim 1 via a spacer, and the lower mold is filled with a chip molding material. And press-fitting the chip molding material between the lower mold surface and the upper mold surface by inserting the vertical and horizontal plate walls of the lattice frame into the fitting grooves of the upper mold. Characteristic chip forming method