JP2630232B2 - Method for manufacturing multilayer wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board, and more particularly to a method for manufacturing a multilayer board based on a ceramic substrate used for a multi-chip module mounted on a super-large computer or the like.

[0002]

2. Description of the Related Art Conventionally, in such a multilayer wiring board, efforts have been made to increase the wiring speed and density in order to achieve a higher processing capability of the device. In order to increase the speed, an organic resin having a low dielectric constant is used as an insulating material, or a low-resistance conductive material such as copper is used. For higher density, finer wiring patterns,
Alternatively, the number of wiring layers has been increased.

However, there is a limit to the miniaturization of wiring patterns due to the problem of conductor resistance. To increase the number of layers, when an organic resin is used as an insulating material, wiring patterns and insulating films are alternately formed to increase the number of layers. However, there is a problem that the number of production days increases as the number of layers increases.

To solve this problem, Japanese Patent Application Laid-Open No.
There is a method for manufacturing a multilayer wiring board disclosed in Japanese Patent No. 50094. In this method, as shown in FIG. 5, a multilayer circuit board is formed of a first wiring board block 10 for a lower layer having a ceramic laminated wiring board 17 and a second wiring board for an upper layer having an aluminum plate 30 as a metal plate. Wiring board block 4
0.

In the first wiring board block 10,
A first wiring layer 18 is selectively formed on a ceramic substrate 17, a first polyimide resin insulating layer 19 covering the first wiring layer 18 is formed, and a second wiring 21 is formed thereon. Subsequently, a second polyimide resin insulating layer 22 is formed thereon, and further a third wiring layer 23 is formed. Subsequently, a third polyimide resin insulating layer 24 is formed thereon, and finally, a gold pad 25 and a fourth wiring layer 26 are formed.

Next, after a gold pad 31 is formed on the surface of the aluminum plate 30, a fourth polyimide resin insulating layer 3 is formed.
2, a fourth wiring layer 33, a fifth polyimide resin insulating layer 34, a fifth wiring layer 35, and a sixth polyimide resin insulating layer 36 are formed in this order. Finally, a gold pad 37 is formed thereon.

Next, the aluminum plate 30 is dissolved and removed with dilute hydrochloric acid to obtain a second wiring board block 40. In the next step, the gold pads 25 and 31 of the blocks 10 and 40 are adhered to each other using a gold-epoxy adhesive while being in contact with each other, so that the total from the first wiring layer 18 to the surface gold pad 37 is removed. A multilayer circuit board having seven wiring layers is obtained.

[0008]

In the manufacturing method shown in FIG. 5, after the metal plate (aluminum plate) 30 of the second wiring board block 40 is dissolved by dilute hydrochloric acid, the first
Is bonded to the wiring board block 10. After the metal plate 30 is dissolved and removed, the multilayer wiring film has a thickness of several tens to several hundreds μm.
Has a drawback that the work of bonding with the first wiring board block 10 becomes very difficult.

Therefore, the bonding with the first wiring board block 10 is performed with the metal plate 30 remaining. In this bonding, the coefficient of thermal expansion between the ceramic substrate 17 and the metal plate 30 is significantly different, so that a large stress is generated when bonding by heating, and there is a danger that the ceramic substrate will not be able to withstand the stress and break. is there.

If a ceramic substrate is used instead of a metal plate, the thermal expansion coefficients become equal, and the above-described substrate destruction during bonding does not occur. However, it is extremely difficult to dissolve and remove the ceramic substrate thereafter. Mechanical removal may be considered, but removal without affecting the multilayer wiring portion is impossible in terms of precision.

An object of the present invention is to provide a method of manufacturing a multilayer wiring board in which when a wiring board is divided into a plurality of blocks and these blocks are bonded to obtain a multilayer wiring board, the workability of bonding between the blocks is improved. It is to provide.

[0012]

According to the present invention, there is provided a means for solving], an organic resin as the interlayer insulating layer, a method for manufacturing a multilayer wiring substrate forming a plurality of wiring layers on a ceramic substrate, wherein the cell <br/> At least the wiring layer is formed on ceramic substrate, using the conductive connection on the one of the top surface of the lamination direction of the wiring layer
Are connecting member and said insulating adhesive layer at a portion connecting member is not formed are respectively formed a first wiring block
A first step of click is generated, at least the wiring layer is form <br/> formed on the ceramic substrate than size larger photosensitive glass plate, on what the uppermost surface of the stacking direction of said wiring layer <br/> A connecting member used for conductor connection and the connecting member is formed
A second step in which an insulating adhesive layer is formed in a portion that is not formed, and a second wiring supported by a photosensitive glass frame by removing the photosensitive glass plate while leaving the outer periphery thereof A third step of generating a block , a fourth step of abutting and temporarily bonding the connecting member of the first wiring block and the connecting member of the second wiring block to each other, and a fifth step of removing the frame of the photosensitive glass cutting the second wiring block along the substrate, the first wiring Bed
The second wiring block temporarily bonded on the lock is evacuated.
And a sixth step of thermocompression bonding with a hot press.

[0013]

Next, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, in one embodiment of the present invention, first, a first wiring board block 100 is formed. A wiring layer 2 is selectively formed on a ceramic substrate 1 by gold plating, and a first polyimide resin insulating layer 3 covering the wiring layer 2 is formed.
Is selectively formed, and the second wiring layer 4 is selectively formed thereon by gold plating. Furthermore, a polyimide-based adhesive layer 5 for bonding the blocks is formed thereon,
Solder bumps 6 for conductor connection are selectively formed at predetermined positions of second wiring layer 4 to obtain first block 100.

In parallel with this manufacturing operation, a second wiring board block 200 as shown in FIG. 2 is formed. A fourth wiring layer 12 is selectively formed by gold plating on a photosensitive glass plate 11 which is slightly larger than the ceramic substrate 1, and a polyimide resin insulating layer 13 serving as a fourth insulating layer covering this is selectively formed. Is done. Further, a wiring layer 14 serving as a third wiring layer is selectively formed thereon by gold plating.

A polyimide adhesive layer 15 for bonding the blocks is formed thereon. Then, at a predetermined position on the third wiring layer 14, a Sata bump 16 for connecting a conductor is provided.
Are selectively formed.

Next, the photosensitive glass plate 11 is removed by the size of the ceramic substrate 1 except for the outer periphery. This removal method utilizes the property that the characteristics of the photosensitive glass change when exposed to ultraviolet light, and the photosensitive glass is easily dissolved in an acid. That is, the outer periphery of the photosensitive glass plate 11 is masked, and the area corresponding to the ceramic substrate 1 is irradiated with ultraviolet rays, and then subjected to an acid treatment. Glass plate 11
Can be dissolved and removed while leaving its outer periphery, and the second block 200 can be obtained.

The two blocks 100 and 200 obtained as described above are positioned so that the solder bumps 6 and the solder bumps 16 are in contact with each other as shown in FIG. This temporary bonding is performed by applying an industrial adhesive to the outer periphery of the ceramic substrate 1. At the time of this bonding, the second wiring board block 200 is in a state where the multilayer wiring film is supported by the photosensitive glass frame. And the bonding operation can be easily performed.

Next, referring to FIG.
The wiring board block 200 is cut along, and the adhesive layers 5 and 15 are bonded together by performing a vacuum hot pressing process, and the solder bumps 6 and 16 are soldered.

Although the above description has been made of an example in the case of manufacturing by dividing into two blocks, it may be manufactured by dividing into three or more blocks. In this case, a plurality of blocks in FIG. 2 are formed in parallel with the formation of the first blocks in FIG. Then, the first block and the second block are temporarily bonded, and after the second block is cut along the ceramic substrate, the third block is further temporarily bonded. Then, after cutting the third block, the fourth block is temporarily bonded. The above process is repeated, and after performing the temporary bonding of all the blocks, a vacuum hot press process is performed, so that the multilayer wiring board can be easily manufactured and the number of days of manufacture can be reduced.

[0020]

According to the present invention, the wiring board block to be bonded to the multilayer wiring film formed on the ceramic substrate is formed as a multilayer wiring film supported by a photosensitive glass frame which is slightly larger than the ceramic substrate. By doing
There is an effect that workability at the time of bonding becomes easy.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for forming a first wiring board block in one step of an embodiment of the present invention.

FIG. 2 is a diagram illustrating a method for forming a second wiring board block in one step of the embodiment of the present invention.

FIG. 3 is a diagram illustrating temporary bonding of first and second blocks in one step of the embodiment of the present invention.

FIG. 4 is a diagram showing a cross-sectional structure of a multilayer wiring board obtained according to an example of the present invention.

FIG. 5 is a view for explaining the structure of a conventional multilayer wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic substrate 2 1st wiring layer 3 1st insulating layer 4 2nd wiring layer 5 Adhesive layer as 2nd insulating layer 6 Solder bump 11 Photosensitive glass plate 12 4th wiring layer 13 4th Insulating layer 14 Third wiring layer 15 Adhesive layer as third insulating layer 16 Solder bump 100 First wiring board block 200 Second wiring board block

Claims (3)

(57) [Claims] 1. A method for manufacturing a multilayer wiring board, comprising forming a plurality of wiring layers on a ceramic substrate using an organic resin as an interlayer insulating layer, wherein at least a wiring layer is formed on the ceramic substrate,
A connection member used for conductor connection and an insulating adhesive layer are formed on a portion where the connection member is not formed on the uppermost one of the wiring layers in the stacking direction, and a first wiring block is formed. A connecting member used for conductor connection on at least a wiring layer formed on a photosensitive glass plate slightly larger than the ceramic substrate, and a wiring member on the uppermost one of the wiring layers in the laminating direction; A second step in which an insulating adhesive layer is formed in a portion where no is formed, and a step of removing the photosensitive glass plate except for the outer periphery, and removing the second wiring block supported by the photosensitive glass frame. 3rd to generate
And bonding the connecting member of the first wiring block and the connecting member of the second wiring block to each other and temporarily bonding them.
A step of cutting the second wiring block along the ceramic substrate to remove the photosensitive glass frame; and a step of temporarily bonding the first wiring block on the first wiring block. And a sixth step of thermocompression-bonding the wiring block by a vacuum hot press. 2. The method according to claim 3, wherein in the third step, the outer periphery of the photosensitive glass is masked and irradiated with ultraviolet rays, and thereafter, the ultraviolet irradiated portion of the photosensitive glass is dissolved and removed with an acid. The method for manufacturing a multilayer wiring board according to claim 1, wherein 3. A process according to claim 1 or, wherein the interlayer insulating layer and adhesive layer are both intended polyimide
3. The method for manufacturing a multilayer wiring board according to item 2 .