JP2642718B2 - Hybrid integrated circuit - Google Patents

Description

The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit in which a writable and erasable ROM is built in the hybrid integrated circuit.

(B) Conventional technology Generally, as shown in FIG. 3, in a hybrid integrated circuit, a plurality of circuit elements (22) are fixed on a hybrid integrated circuit board (21), and the circuit elements (22) are hermetically sealed. A resin case material (23) is fixed to and integrated with the hybrid integrated circuit board (21).

When a semiconductor element capable of writing and erasing predetermined data such as an EPROM or a microcomputer is fixedly mounted on such a hybrid integrated circuit, a semiconductor chip (24) is die-bonded onto a substrate (21) as shown in FIG. And case material (23)
In general, a semiconductor device (25) in which a semiconductor chip is resin-sealed is soldered onto a substrate (21) and sealed with a case material (23) as shown in FIG. Met.

(C) Problems to be Solved by the Invention In a hybrid integrated circuit in which a semiconductor element capable of writing and erasing predetermined data such as an EPROM or a microcomputer is incorporated, a case material is fixedly integrated. If the element data is changed, the hybrid integrated circuit itself is replaced. The reason is that it is very difficult to replace the semiconductor element itself. In addition, other elements may be damaged during replacement.

Furthermore, in the case of the conventional hybrid integrated circuit structure, in the case of high-mix low-volume production, the data of semiconductor devices such as EPROMs are different, so different types of production lines or production equipment are required, and the production deadline becomes longer and the production cost becomes higher. There was a problem.

(D) Means for Solving the Problems The present invention has been made in view of the problems described above,
Case material having two hybrid integrated circuit boards to which a plurality of circuit elements are fixed, and an insole plate fixedly spaced apart from the two hybrid integrated circuit boards and arranged in parallel with the two hybrid integrated circuit boards And a semiconductor device disposed between at least one of the hybrid integrated circuit substrate and the insole plate via a conductive sheet having elasticity.

(E) Function According to the present invention, the semiconductor device is provided between at least one of the two hybrid integrated circuit boards and the insulated board of the case material via the conductive sheet having elasticity. Is arranged, the semiconductor device is pressed by the hybrid integrated circuit board and the insole plate, so that connection without soldering can be performed.

(F) Embodiment Hereinafter, the hybrid integrated circuit of the present invention will be described in detail with reference to the embodiment shown in FIG.

As shown in FIG. 1, in the hybrid integrated circuit of the present invention, two hybrid integrated circuit boards (1) and (2) and two hybrid integrated circuit boards (1) and (2) are separately fixed to each other. 1) A case material (4) having an insole plate (3) for partitioning (2), and a conductive sheet disposed between at least one of the hybrid integrated circuit boards (1) and (2) and the insole plate (3). (5) and a semiconductor device (6).

As the two hybrid integrated circuit boards (1) and (2), a ceramic or metal substrate can be used. In this embodiment, a metal substrate, particularly, an aluminum substrate subjected to insulation treatment is used. Copper foil is adhered to one main surface of each of the substrates (1) and (2) via an insulating resin layer (not shown), and the copper foil is etched to form conductive paths (7) and (8) having desired shapes. Are formed.

Bare chip ICs and LSs are placed on the conductive paths (7) and (8).
I, a plurality of circuit elements (9) (10) such as a transistor, a chip capacitor, and a chip resistor are fixed by predetermined bonding, and are wire-bonded on nearby conductive paths (7) and (8).

Dedicated fixing pads (7 ') (8') for connecting the semiconductor device (6) are formed at predetermined positions where the respective conductive paths (7) and (8) are formed by elongation. The semiconductor device (6) is not directly mounted on the fixing pads (7 ') (8'), but is connected via a conductive sheet (5) so that the semiconductor device (6) can be easily replaced. Things.

The semiconductor device (6) is, for example, a flip-chip type in which a chip capable of writing and erasing predetermined data such as an EPROM, an EEPROM, and a microcomputer is resin-molded, for example, a flip-chip type. (11) is provided, and the electrode (11) is connected to the conductive paths (7 ') (8') via the conductive sheet (5).

On the other hand, the conductive sheet (5) is an insulating sheet made of rubber or synthetic resin having a certain elasticity and is formed in a plate shape as shown in FIG. A plurality of linear conductors (12) are embedded and protrude from both sides of the conductive sheet (5). Such a conductive sheet (5) is disclosed in JP-A-62-229714 and JP-A-59-229714.
No. 58709.

The semiconductor elements (6) connected via the conductive sheet (5) are connected by being clamped when the case material (4) and the substrates (1) and (2) are fixed.

A case member (6) for fixing the two substrates (1) and (2) apart from each other is formed in a frame shape, and the substrate (1) is provided at a substantially intermediate portion thereof.
An insole plate (3) parallel to (2) is provided.
That is, the semiconductor device (6) is sandwiched between the insole plate (3) and the substrates (1) and (2) via the conductive sheet (5). Further, the insole plate (3) is provided with a frame (13) for regulating the position of the semiconductor device (6) or the semiconductor device (6) and the conductive sheet (5). ) And the substrates (1) and (2) are not displaced even when they are integrated. Naturally, the frame portion (13) provided on the insole plate (3) is a fixing pad (7 ') to which the conductive sheet (5) is abutted.
It is set in advance so as to be located directly above (or below) (8 ').

The two substrates (1) and (2) and the case material (4) are screwed with screws (14) as shown in FIG. 1 so that the semiconductor device (6) can be easily replaced. At this time, the tip of the conductive sheet (5) that is not in contact with the semiconductor device (6) is slightly protruded from the step (15) of the case material (4). As a result, when the substrates (1) and (2) are screwed to the case member (4), the semiconductor device (6) is pressed via the conductive sheet (5), and the connection of the semiconductor device (6) is established. Is performed.

According to the present invention, the insole plate (3) is provided in the case material (4) to which the two substrates (1) and (2) are fixed, and the insole plate (3) is provided. Each substrate (1) (2)
By arranging the resin-molded semiconductor device (6) with the conductive sheet (5) therebetween, the semiconductor device (6) can be connected without using soldering, and the semiconductor device (6) is replaced. Can be easily performed.

(G) Effects of the Invention As described in detail above, according to the present invention, an insole plate is provided on a case material to which two substrates are fixed, and a semiconductor device is interposed between the insole plate and the substrate via a conductive sheet. By placing
Since connection of a semiconductor device molded with resin without soldering can be performed, rewriting of data or replacement of the semiconductor device due to a defect or the like can be easily performed.

In addition, the present invention has an advantage that a large variety of small-quantity production can be performed because the inspection process of the semiconductor device itself and the inspection process of the substrate before the semiconductor device is incorporated are different.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view showing a conductive sheet used in this embodiment, and FIGS.
The figure is a sectional view showing a conventional example. (1) (2) ... hybrid integrated circuit board, (3) ... insole board, (4) ... case material, (5) ... conductive sheet,
(6) Semiconductor device.

Claims (7)

(57) [Claims] 1. A semiconductor device comprising: two hybrid integrated circuit boards having a plurality of circuit elements fixed thereto; and fixing the two hybrid integrated circuit boards apart from each other and being arranged in parallel with the two hybrid integrated circuit boards. A hybrid integrated circuit, comprising: a case member having an underlay plate; and a semiconductor device disposed between at least one of the hybrid integrated circuit substrate and the insole plate via a conductive sheet having elasticity. . 2. The semiconductor device according to claim 1, wherein a storage portion is provided in the insole plate toward the hybrid integrated circuit board, and the semiconductor device and the conductive sheet are stored and arranged in the storage portion. Hybrid integrated circuit. 3. The hybrid integrated circuit according to claim 1, wherein said conductive sheet is formed of an insulating sheet, and a plurality of linear conductors project from both surfaces thereof. 4. The semiconductor device according to claim 1, wherein the semiconductor device is molded by resin sealing, and is pressed onto the hybrid integrated circuit board when fixing the hybrid integrated circuit board and the case material. The hybrid integrated circuit according to claim 1. 5. The hybrid integrated circuit according to claim 1, wherein said hybrid integrated circuit board to which said semiconductor device is connected is screwed to said case material. 6. The hybrid integrated circuit according to claim 1, wherein a frame for regulating the position of said semiconductor device is provided on said insole plate of said case material. 7. The hybrid integrated circuit according to claim 1, wherein said hybrid integrated circuit board is a metal substrate subjected to an insulation treatment.