JPH0760884B2 - Hybrid integrated circuit device - Google Patents

Description

The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit in which a writable and erasable ROM is built in the hybrid integrated circuit.

(B) Conventional technology Normally, in a hybrid integrated circuit, as shown in FIG. 3, a plurality of circuit elements (22) are fixed on a hybrid integrated circuit board (21) to hermetically seal the circuit element (22). Resin case material (2
3) is fixed and integrated with the hybrid integrated circuit board (21).

When a semiconductor element capable of writing and erasing predetermined data such as EPROM or a microcomputer is fixedly mounted on such a hybrid integrated circuit, a semiconductor chip (24) is die-bonded onto a substrate (21) as shown in FIG. Then, as shown in FIG. 5 or the structure in which the case material (23) is sealed, the semiconductor device (25) in which the semiconductor chip is resin-sealed is soldered onto the substrate (21) and the case material (23) is used. The structure of sealing was common.

(C) Problem to be Solved by the Invention In a hybrid integrated circuit including a semiconductor element capable of writing and erasing predetermined data such as EPROM or microcomputer, the case material is fixed and integrated. If the device data was changed, the hybrid integrated circuit itself was replaced. The reason is that it is very difficult to replace the semiconductor element itself having predetermined data. In addition, other elements may be damaged during replacement. Further, in the case of performing high-mix low-volume production with a conventional hybrid integrated circuit structure, different data for semiconductor elements such as EPROMs require different production lines or production equipment, and the production period becomes long and the production cost increases. There is a problem of getting higher.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and a sealing container for sealing the semiconductor element on an insulating metal substrate to which a plurality of semiconductor elements are fixed. A fixed integrated circuit, a window provided to expose the surface of the insulating metal substrate at a predetermined position of the sealing container, and a conductive sheet on the insulating metal substrate exposed by the window. A semiconductor device that is arranged as a unit, a mounting body that is in contact with the surface of the insulating metal substrate for mounting the hybrid integrated circuit, and a fixing plate that is integrated with the mounting body and press-fixes the semiconductor device. Prepare and solve.

(E) Action As described above, according to the present invention, by sandwiching the hybrid integrated circuit by the fixing plate and the heat radiating plate, the semiconductor device arranged on the window of the hybrid integrated circuit via the conductive sheet is pressed and fixed. Is
Connection is possible without soldering.

(F) Embodiment A hybrid integrated circuit device of the present invention will be described in detail below based on the embodiment shown in FIG.

As shown in FIG. 1, the hybrid integrated circuit device of the present invention is for sealing an insulating metal substrate (1), a semiconductor element (2) fixed on the substrate (1), and a semiconductor element (2). A sealed container (3), a window (4) provided to expose the substrate (1), and a conductive sheet (5) disposed on the substrate (1) exposed by the window (4) Semiconductor device (6) and fixing plate (7) for fixing the semiconductor device (6)
And an attachment body (8).

An aluminum substrate is used as the insulating metal substrate (1), and an aluminum oxide film is formed on the surface of the substrate for insulation treatment. The metal substrate (1) is not limited to the aluminum substrate, but iron, silicon steel plate, CIC
It is also possible to use a substrate such as a (copper, invar, copper) substrate. A copper foil is attached to one main surface of the substrate (1) via an insulating resin layer (not shown), and the copper foil is etched to form a conductive path (8) having a desired shape.

A plurality of semiconductor elements (2) such as ICs, LSIs and transistors, and a plurality of electronic components (2 ') such as chip capacitors and chip resistors are fixed on the conductive path (8).

The substrate (1) has a resin-made sealing container (3) for hermetically sealing the semiconductor element (2) and the electronic component (2 ').
Are fixed by an adhesive such as an adhesive sheet.

The sealed container (3) is provided with a window (4) of a predetermined shape for exposing the substrate surface of the substrate (1). Window (4)
A conductive path (8 ') extending from the conductive path (8) on the substrate (1) exposed by and connected to the semiconductor device (6).
Are formed.

A conductive sheet (5) having a certain elastic force is arranged on the substrate (1) exposed by the window (4). The conductive sheet (5) is an insulating sheet made of rubber or synthetic resin, and is formed in a plate shape as shown in FIG. A plurality of linear conductors (9) are projected from both sides of the sheet (5). Such a conductive sheet (5) is disclosed in JP-A-62-229714.
JP-A-59-58709.

The conductive sheet (5) is formed to be similar to or slightly smaller than the window (4), and the semiconductor device (6) which is resin-sealed in advance is placed on the sheet (5).
The semiconductor device (6) is a flip-chip type semiconductor device in which a writable and erasable ROM chip such as EPROM, EEPROM, microcomputer, etc. is resin-sealed, and a plurality of electrodes (10 ) Is provided and the electrode (10)
Will be connected to the conductive path (8 ') via the conductive sheet (5).

Since the hybrid integrated circuit and the semiconductor device (6) cannot be connected in this state, the semiconductor device (6) is simultaneously connected when the hybrid integrated circuit is mounted on the mounting body (11) such as a heat sink. It is a thing. That is, a resin fixing plate (7) is brought into contact with the sealing container (3) of the hybrid integrated circuit, and a screw () is provided so that the hybrid integrated circuit is sandwiched between the fixing plate (7) and the mounting body (11). The semiconductor device (6) is pressed by the fixing plate (7) by being attached by means of (12) and the like, and is pressed and connected to the conductive path (8 ') through the conductive sheet (5). It is effective that the fixing plate (7) with which the semiconductor device (6) is brought into contact is formed in a convex shape to increase the pressing force.

According to such an aspect of the invention, the semiconductor device is arranged in the window provided in the hybrid integrated circuit via the conductive sheet, and the fixed integrated circuit is held by the fixing plate and the mounting body. When mounting, the semiconductor devices can be connected at the same time, and the connection can be made without soldering.

(G) Effect of the Invention As described in detail above, by placing the semiconductor device in the window provided in the hybrid integrated circuit via the conductive sheet and holding the hybrid integrated circuit by the fixing plate and the mounting body. The semiconductor device and the hybrid integrated circuit can be connected without soldering, and the semiconductor device can be easily replaced due to rewriting of data or a defect.

Further, in the hybrid integrated circuit of the present invention, the inspection of the semiconductor device is different from the inspection of the hybrid integrated circuit before the semiconductor device is incorporated, which is particularly effective in the case of high-mix low-volume production.

[Brief description of drawings]

FIG. 1 is a sectional view showing a hybrid integrated circuit of the present invention, FIG. 2 is a perspective view showing a conductive sheet used in this embodiment, FIG.
4 and 5 are sectional views showing a conventional example. (1) ... Insulating metal substrate, (3) ... Sealing container, (4)
...... Window, (5) ...... conductive sheet, (6) ...... semiconductor device, (7) ...... fixing plate.

Claims (1)

[Claims] 1. A hybrid integrated circuit in which a sealing container for sealing the semiconductor element is fixed to an insulating metal substrate to which a plurality of semiconductor elements are fixed, and a surface of the insulating metal substrate of the sealing container is exposed. A window, a semiconductor device disposed on the insulating metal substrate exposed by the window via a conductive sheet, and a mounting body abutting on the back surface of the insulating metal substrate for mounting the hybrid integrated circuit. A fixing plate that has a convex portion at a position corresponding to the semiconductor device, and is screwed so as to sandwich the hybrid integrated circuit with the mounting body so that the convex portion presses and fixes the semiconductor element. A hybrid integrated circuit device characterized by being provided.