JP2654033B2 - Semiconductor IC device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor IC device used by being incorporated in an IC card or the like.

[Background Art] A semiconductor IC device to be used by being incorporated in an IC card or the like is required to be formed thin. Conventionally, for example, a printed wiring board 11 is used as a substrate as shown in FIG. 1 is provided and mounted by sealing with a sealing resin 12. However, in this case, the processing of the through hole 13 and the counterbore processing of the recess 14 for mounting the IC chip 1, the IC chip 1 and the through hole
There is a problem that many manufacturing steps are required, such as formation of a circuit 15 that conducts with the terminal 13, and a terminal exposed to the outside.
16 is formed by a copper foil laminated on the printed wiring board 11 and a slight plating layer on the surface thereof, and when the action frequency of the contact to the terminal 16 increases, the terminal 16 is easily worn and the reliability of the connection to the outside is increased. There is a possibility that a problem may occur in the property.

[Object of the Invention] The present invention has been made in view of the above points, can reduce the number of processing steps, and does not cause a problem in reliability of external connection due to terminal wear. It is another object of the present invention to provide a semiconductor IC device in which the heat dissipation of the IC chip is excellent and the protection strength of the IC chip is excellent.

[Disclosure of the Invention] In the semiconductor IC device according to the present invention, the chip mounting pieces 7 are respectively formed on the plurality of leads 3, 3. Is provided, and a resin chip receiver 21 is formed and provided on the chip mounting piece 7, and the reinforcing piece 6 is exposed on the upper surface of the chip receiver 21, and the IC chip is mounted on the chip receiver 21. 1, the reinforcing piece 6 is attached to the lower surface of the IC chip 1, and the IC chip 1 is connected to the lead 3 and the reinforcing piece 6.
Together with the molding resin 4, and the surface of the molding resin 4 on which the IC chip 1 of the chip mounting piece 7 is mounted is exposed as a terminal 5 on the surface of the molding resin 4. The present invention will be described in detail with reference to examples.

Lead frame 2 is 42 alloy (Ni42% Ni-Fe alloy)
It is formed by pressing a metal strip of aluminum, copper, or the like. As shown in FIG. 2, a pair of left and right frames 17, 17 are connected by connecting pieces 18 to form a long strip. It is. The portion between the adjacent connecting pieces 18, 18 is one unit for producing a semiconductor IC device, and a plurality of pieces from the frames 17, 17 are provided at the portions between the adjacent connecting pieces 18, 18, respectively. Leads 3,3 ... are extended. The leading end of each lead 3 is formed as a bent portion 19 and a wide chip mounting piece 7. In addition, a thin reinforcing piece 6 is provided integrally extending between the left and right frames 17, 17 between the leads 3, 3. This reinforcing piece 6 is provided so as to be located slightly above the chip mounting piece 7. In FIG. 2, reference numeral 23 denotes a feed hole formed in the frame 17 for automatically feeding the lead frame 2.

The semiconductor IC device A is manufactured using the lead frame 2, but first, primary molding is performed. A plate-shaped chip receiver 21 is integrally formed and provided between the tip portions of the chip mounting pieces 7, 7,. At this time, the reinforcing piece 6 is embedded in the chip receiver 21 with its upper surface being exposed on the upper surface of the chip receiver 21. The IC is mounted on the upper surface of the chip receiver 21
Chip 1 is mounted and IC chip 1 and each chip mounting piece
By bonding a wire 22 such as a gold wire between 7, 7,..., The IC chip 1 is electrically connected to the leads 3, 3,. Can be mounted. When the IC chip 1 is mounted in this manner, the reinforcing pieces 6 are arranged along the lower surface of the IC chip 1, and the reinforcing pieces 6 also support the IC chip 1. After mounting the IC chip 1 in this manner, secondary molding is performed, and the IC chip 1 is connected to each of the leads 3 and
3 and embedded in the molding resin 4 for sealing. These primary molding and secondary molding can be performed by continuously feeding the long lead frame 2 to a transfer molding device, a compression molding device, or the like. The resin used in the primary molding and the secondary molding is not particularly limited, but phenol, epoxy, silicone, thermosetting resin such as polyimide, polyphenylene sulfide,
Thermoplastic resins such as polysulfone, polyethersulfone, and polyarylsulfone can be used.

When the secondary molding is performed and the leads 3, 3... Of the IC chip 1 and the molding resin 4 are sealed in the molding resin 4, the lead 3 on the back side of the chip mounting piece 7, which is the part on which the IC chip 1 is mounted, is formed. The surface is exposed from the surface of the molding resin 4 as shown in FIG. 1, and the exposed surface of the chip mounting piece 7 becomes the connection terminal 5 to the outside. And each lead
By separating 3, 3,... From the frame 17, the semiconductor IC device A formed as shown in FIG. In this semiconductor IC device A,
Since the IC chip 1 is connected to the leads 3 of the lead frame 2, the third using the printed wiring board 11 as a substrate
It is not necessary to perform through-hole processing or circuit processing as in the conventional example shown in the figure, and the number of processing steps in manufacturing can be reduced. Further, since the substrate can be formed by the molded resin 4 formed by molding, the substrate can be formed with a higher dimensional accuracy in thickness than when the substrate is formed by the printed wiring board 11 obtained by lamination molding, and is incorporated into an IC card. In addition to being suitable as a package requiring thinness, for example, the IC chip 1 is molded and sealed in a molding resin 4 having a high material density.
The moisture resistance of the sealing can be enhanced, and the IC chip 1 can be effectively protected from external force. Further, the reinforcing piece 6 provided on the lead frame 2 is the IC chip 1
, The external force can be received by the reinforcing piece 6 even when an external force is applied to the location of the IC chip 1, and the IC chip 1 is deformed in the molding resin 4. It can prevent destruction.

The semiconductor IC device A thus formed is used, for example, for an IC card, and the semiconductor IC device A is connected to the IC 5 with the terminals 5 formed on the exposed surfaces of the leads 3 exposed from the surface of the IC card. It can be embedded and used in a card. Here, since the terminal 5 is formed on the exposed surface of the chip mounting piece 7 which is a part of the lead 3, the frequency of contact with a contact or the like is high, and even if there is abrasion, the lead 3 is thicker than a metal foil. Is hardly worn out, and the reliability of the connection to the outside is not reduced. The portion exposed as the terminal 5 is the chip mounting piece 7 on which the IC chip 1 is mounted, and the heat of the IC chip 1 can be efficiently radiated to the outside from this portion. In particular, by forming the chip mounting pieces 7 widely as in the embodiment of FIG. 2, the heat radiation can be enhanced. In the embodiment shown in FIG.
The outer end 3a of the lead 3 also protrudes from the molding resin 4. However, when the semiconductor IC device A is incorporated into an IC card, the protruding end 3a of the lead 3 is used for positioning, or for discharging static electricity. It can be used as a ground terminal. Both ends of the support piece 6 may or may not project from the side ends of the molding resin 4.

[Effects of the Invention] As described above, in the present invention, an IC chip is mounted on a chip mounting piece formed on each of a plurality of leads of a metal lead frame, and the IC chip is sealed in a molding resin together with the leads. Since the IC chip is mounted with the molded resin as the substrate and connected to the lead of the lead frame, the through-hole processing and circuit processing are performed as in the conventional example using the printed wiring board as the substrate. There is no need to perform this, and the number of processing steps in manufacturing can be reduced. In addition, since the back surface of the part where the IC chip of the chip mounting piece is mounted on the surface of the molding resin is exposed as a terminal, the terminals formed on the exposed surface of the chip mounting piece which is a part of the lead are worn out. Even if there is, there is almost no risk that the lead that is thicker than the metal foil will wear out, and the reliability of the connection to the outside will not decrease, and the part exposed as this terminal is mounted with an IC chip It is a chip mounting piece that can efficiently radiate heat generated from the IC chip to the outside from this exposed portion. Further, a reinforcing piece is provided on the lead frame so as to be located above the chip mounting piece, and a resin chip receiver is formed and provided on the chip mounting piece, and the reinforcing piece is exposed on the upper surface of the chip receiver, and the chip receiving section is formed. The IC chip is mounted on top of the IC chip and the reinforcing piece is attached to the lower surface of the IC chip, so the IC chip mounted on the chip receiver can be directly supported by the reinforcing piece,
The reinforcing effect by the reinforcing piece can be obtained high, and even if external force is applied to the IC chip, the external force is received by the reinforcing piece and IC
The chip can be protected, and the heat of the IC chip can be dissipated through the reinforcing piece, so that a high heat dissipating effect can be obtained.

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of the present invention. FIG. 1 (a) is a cross-sectional view taken along the line YY of FIG. 2, and FIG. 1 (b) is an X-axis of FIG. FIG. 2 is a perspective view of a part of the lead frame used in the same as above, and FIG. 3 is a sectional view of a conventional example. 1 is an IC chip, 2 is a lead frame, 3 is a lead, 4 is a molding resin, 5 is a terminal, 6 is a reinforcing piece, 7 is a chip mounting piece,
21 is a chip receiver.

Claims (1)

(57) [Claims] A chip mounting piece is formed on each of a plurality of leads of a metal lead frame, and a reinforcing piece is provided on the lead frame so as to be positioned above the chip mounting piece, and a resin chip is provided on the chip mounting piece. Forming and mounting the receiver, exposing the reinforcing piece on the upper surface of the chip receiver, mounting the IC chip on the chip receiver, attaching the reinforcing piece to the lower surface of the IC chip, and molding the IC chip together with the lead and reinforcing piece A semiconductor IC device characterized by being enclosed in a package and exposing a surface on a back side of a portion where the IC chip of the chip mounting piece is mounted on a surface of a molding resin as a terminal.