JP2674756B2 - Semiconductor manufacturing equipment - Google Patents

Description

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a photoresist coating apparatus and a photoresist developing apparatus. [Prior Art] Conventionally, management of the exhaust amount in this type of semiconductor manufacturing apparatus is performed by periodically confirming static pressure or wind speed by a person or by monitoring with a static pressure gauge with a dot, and an alarm is issued when an abnormality occurs. It was structured. [Problems to be Solved by the Invention] In the conventional displacement control described above, it is difficult to control the displacement within a certain range due to variations in the displacement in the duct, etc., and the displacement becomes a large factor in terms of quality. In the coating apparatus, the fluctuation of the exhaust gas amount in the processing chamber is a big problem. In particular, when the resist adheres to and accumulates on a part of the exhaust pipe and the cross-sectional area of that part becomes small, the monitoring pressure varies depending on whether the generation point is on the upstream side or the downstream side of the pressure monitoring point. There is a problem that it is difficult to constantly manage the exhaust gas amount in the processing chamber by monitoring the static pressure because the difference between the exhaust gas amount in the processing chamber and the actual exhaust gas amount in the processing chamber. An object of the present invention is to provide a semiconductor manufacturing apparatus that solves the above problems. [Differences from the Prior Art of the Invention] The present invention has a difference from the above-described conventional semiconductor manufacturing apparatus in that the exhaust amount in the processing chamber is controlled in real time. [Means for Solving the Problems] In order to achieve the above object, the semiconductor manufacturing apparatus according to the present invention has a wind speed measuring device, a damper, and a controller, and forcibly exhausts air inside the processing chamber through an exhaust pipe. A semiconductor manufacturing device that performs chemical treatment while rotating a semiconductor substrate in a processing chamber.The wind speed measuring device detects the wind speed in the exhaust pipe during forced exhaust and outputs it to the controller. It adjusts the effective opening area of the pipe, and the controller receives the detection signal of the wind velocity measuring device as an input,
A control signal is output to the damper to control the effective opening area of the damper so that the wind speed at the measurement point by the wind speed measuring device becomes constant. Embodiment An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 2 is a processing chamber, and 3 is a chuck that applies a centrifugal force to a semiconductor substrate (hereinafter referred to as a wafer) 1 in the processing chamber 2. The present invention provides a wind speed measuring device (sensor) 5 provided in the middle of the exhaust pipe 4 of the processing chamber 2, a damper 7 for adjusting the effective opening area of the exhaust pipe 4, and a damper driving motor 8 for driving the damper 7. , And a controller 6 that processes the output of the wind velocity measuring device 5 and issues a drive command to the motor 8. The exhaust volume in the processing chamber 2 is the wind velocity measured by the wind velocity measuring device 5 and the exhaust pipe 4.
Calculated based on the cross-sectional area, etc. The wafer 1 is vacuum-adsorbed by the chuck 3 in the processing chamber 2,
The required chemical treatment is performed. The atmosphere in the processing chamber 2 is drawn in the direction a from the exhaust pipe 4 attached to a part of the processing chamber 2. The wind speed in the exhaust pipe 4 is constantly monitored by the wind speed measuring device 5, and this information is transmitted to the controller 6 in real time. According to the calculation result of the controller 6, when the displacement is smaller than the desired value, the damper 7 is moved in the b'direction so as to open. When the exhaust amount is large, the above operation is reversed to move the damper 7 in the b direction so that the exhaust amount inside the processing chamber 2 is always constant. [Advantages of the Invention] As described above, according to the present invention, the wind velocity of the exhaust gas from the processing chamber is captured as a parameter, and the opening amount of the damper is controlled so as to keep it constant, while the exhaust amount of the processing chamber It has the effects of stabilizing the air flow rate), improving the uniformity of the film, and effectively removing mist while improving the product yield.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram showing an embodiment of a semiconductor manufacturing apparatus of the present invention. 1 ... Wafer, 2 ... Processing chamber 3 ... Chuck, 4 ... Exhaust pipe 5 ... Wind speed measuring device, 6 ... Controller 7 ... Damper, 8 ... Damper drive motor

Claims (1)

(57) [Claims] A semiconductor manufacturing apparatus that has a wind speed measuring device, a damper, and a controller, and performs chemical liquid processing while rotating a semiconductor substrate in the processing chamber while forcibly exhausting air inside the processing chamber through an exhaust pipe. It detects the wind speed in the exhaust pipe during forced exhaust and outputs it to the controller.The damper adjusts the effective opening area of the exhaust pipe.The controller receives the detection signal of the wind speed measuring device as input and A semiconductor manufacturing apparatus, wherein a control signal is output to the device to control the effective opening area of the damper so that the wind speed at the measurement point by the wind speed measuring device becomes constant.