JP2676444B2 - Bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor component
The present invention relates to a bonding device for connecting a pad (electrode) on a C chip to a lead by a wire or mounting the IC chip on an island of a lead frame.

[0002]

2. Description of the Related Art Conventionally, a bonding apparatus of this type is shown in FIG. This device is, for example, I
In order to perform the bonding connection between the pad on the C chip and the lead arranged on the lead frame, the wire is held by the bonding tool, and the tip end of the wire melt-formed in a ball shape is the object to be connected. After thermocompression bonding to the pad, the leads to be the next bonding point are sequentially thermocompression bonded to perform bonding connection. At this time, ultrasonic vibration may be applied to the bonding tool to perform bonding connection.

As shown in FIG. 3, the ultrasonic transducer 50 is
The bracket 51a and the support shaft 5 on the frame 51
It is swingably supported via 2. A capillary 53 as a bonding tool is provided at the tip of one end of the ultrasonic oscillator 50, and a horn 54 as a means for amplifying and exciting the ultrasonic vibration together with the ultrasonic oscillator is attached. At the other end of the ultrasonic transducer 50, a lever 57 having a roller 56 at its tip is fixed. A cam 58 is provided corresponding to the roller 56, and the lever 57 is biased counterclockwise in the drawing by a coil spring 59 so that the roller 56 contacts the cam 58.

A reel 61 around which a wire 60 is wound is arranged above the ultrasonic transducer 50, and a clamper 62 for holding the wire supplied from the reel 61 is provided in the front. A torch 63 for melting the tip portion of the wire 60 to form a ball shape is provided near the capillary 53, and the vertical shaft 6 is provided.
It is configured to be rotatable around 4. Further, above the capillary 53, a position detection device 6 including a camera or the like is provided.
5 is provided, and by this position detection device 65,
The deviation amount from the reference position of the IC chip 67, which is the object to be bonded, is calculated to obtain a normal bonding point. Then, based on the obtained value, an XY table (not shown) as a positioning means is moved to perform bonding.

The ultrasonic transducer 50 and the horn 54
Constitutes a bonding arm together with the lever 57, and the capillary 53 is attached to the bonding stage 69 by the bonding arm, the roller 56, the cam 58, and torque applying means (not shown) for applying torque to the cam 58. A contacting / separating means for contacting / separating from each other is configured. Also,
The contacting / separating means and the XY table as the positioning means described above are collectively referred to as the contacting / separating positioning means.

When a bonding operation is performed by the device having the above-described structure, a torque is applied to the cam 58 by a pulse motor or the like (not shown) as torque applying means to drive the cam 58 in rotation, so that the capillary 53 is moved in accordance with the shape of the cam 58. Raise and lower to make bonding connection. At the time of bonding, ultrasonic vibration is applied to the capillary 53 and the bonding stage 69 is heated by a heat block (not shown). In addition, the formation of balls at the tip of the wire during the bonding operation,
Since various detailed operations such as cutting of wires are disclosed in, for example, Japanese Utility Model Publication No. 63-48123, the description thereof will be omitted here.

While the lead frame 68 is positioned and fixed on the bonding stage 69 during the above bonding work, the structure for this positioning and fixing is shown in FIGS. 4 and 5. Note that FIG. 5 shows a cross section taken along the line BB in FIG.

As shown in FIGS. 4 and 5, one suction hole 69a is formed in the center of the carrying surface of the bonding stage 69, and the other four suction holes are centered around this suction hole 69a. 69b are formed dispersedly.

The lead frame 68 has a large number of leads 68.
a and a substantially rectangular island 68b which is located so as to be surrounded by each lead and to which the IC chip 67 is mounted. The four suction holes 69b are provided corresponding to the four corners of the island. Has been done. As is clear from FIG. 5, the suction holes 69a and 69b are communicated with each other inside the bonding stage 69 and are integrated into a single hole, which is opened on the lower surface. Vacuum suction is performed by suction means (not shown) through the opening on the lower surface, and the lead frame 68 is suctioned and fixed. As shown in FIGS. 4 and 5, a large number of pads 67a to be connected to the leads 68a of the lead frame 68 and the wires 60 are arranged on the peripheral portion of the IC chip 67. Further, among the five suction holes provided on the bonding stage 69 as described above, the suction hole 69a located at the center is
Used when adsorbing a lead frame on which an IC chip with an outer diameter of about 2 mm is mounted.
When adsorbing the lead frame on which the chip is mounted, in addition to the suction holes 69a, the other four suction holes 69b are used together.

As described above, in the above bonding apparatus, when the pad 67a of the IC chip 67 and the lead 68a of the lead frame 68 are connected, the bonding stage 69 is heated and the horn 54 (see FIG. Ultrasonic vibrations are applied through (shown in FIG. 3). As indicated by the arrow in FIG. 6, this vibration energy is IC
It is applied to the ball at the tip of the wire 60 while transmitting or reflecting between the respective members of the chip 67, the island 68b and the bonding stage 69.

[0011]

However, in the conventional device, as shown in FIG. 6, at the time of connection work, the suction hole 69b is provided directly below the pad 67a which is the connection site of the IC chip 67 as the connection object. When (or the suction hole 69a) is located, the vibration energy applied from the capillary 53 is abnormally transmitted and reflected, and the ball pad 67 formed at the tip of the wire.
There is a drawback that a normal connection cannot be made, for example, the area to be crimped to a is too large or too small as compared with the pad 67a which is another connected portion.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide a bonding apparatus capable of always maintaining a stable connection state.

[0013]

SUMMARY OF THE INVENTION The present invention provides a bonding stage on which a frame is mounted, a bonding tool for holding a semiconductor component or wire and pressing it against an object to be connected, and the bonding tool. And a vibrating means for vibrating the bonding stage, and a suction hole for adsorbing the frame is formed on a frame carrying surface of the bonding stage, and the vibrating means is operated by placing the frame on the bonding stage in a suction state. While joining the semiconductor component to the island formed in the frame or the electrode on the semiconductor component mounted on the island and the island in the frame
In a bonding apparatus for connecting a lead to a wire by means of a wire, the suction holes are arranged only in a region corresponding to the island, except for a portion corresponding to the electrode of the semiconductor component, and the frame is sucked. It is configured to do .

[0014]

Embodiments of the wire bonding apparatus according to the present invention will be described below with reference to the drawings. The wire bonding apparatus has almost the same configuration and function as the conventional apparatus shown in FIGS. 3 to 6 except for the portions described below, and therefore the description of the entire apparatus will be omitted.

As shown in FIGS. 1 and 2, in the wire bonding apparatus according to the present invention, the lead frame 6 is formed on the frame carrying surface of the bonding stage 1.
The suction hole 1a for sucking 8 is formed by a substantially rectangular annular groove. The suction hole 1a is opened to the lower surface of the bonding stage 1 through the communication hole 1b, and vacuum suction is performed by a suction means (not shown) through the lower surface opening to suck the lead frame 68. The suction holes 1a are arranged on the frame-carrying surface of the bonding stage 1 on the connection target parts of the lead frame 68 and the IC chip 67, which are the connection objects, that is, the parts other than the parts corresponding to the pads 67a and the leads 68a. It is set up. In this case, the suction hole 1a is provided with a groove having a substantially square shape and a width of about 1 mm to 2 mm inside the portion corresponding to the pad 67a. The groove width of the suction holes may be appropriately changed. By arranging the suction holes 1a inside the pad 67a in this way, it is possible to effectively suck the suction holes. However, the external dimensions of the island 68b are set to the IC chip 6
When it is taken to be considerably larger than the outer dimension of No. 7, the suction holes 1a may be arranged outside the pad 67a.

By forming the suction hole 1a as a substantially rectangular annular groove as described above, the capillary 53 (see FIG. 3) is formed.
The state of transmission and reflection of vibration energy applied to each pad 6 is arranged so as to be along the annular groove.
7a is homogenized and transmitted.

As described above, since the suction hole 1a is not located immediately below the connected portion of the object to be connected, the vibration energy applied through the capillary is normally transmitted and reflected without being dispersed. It is possible to always maintain a stable connection state. In particular, the adsorption hole 1a
The island 68b formed on the lead frame 68.
Pad 67a of the IC chip 67 only within the range corresponding to
If it is arranged in a portion other than the portion corresponding to, the following effects can be obtained. That is, since the suction holes 1a and 1b are formed only within a relatively narrow range corresponding to the island 68b, the processing scale is small, and the suction holes 1a and 1b can be formed with high precision, at low cost, and easily. In addition, IC chip 67
For fixing the lead 68a connected to the pad 67a, the lead is integral with the island 68b, so that it is sufficient to adsorb and fix the island. Therefore before
The effects described above are more effectively achieved. Further, the suction holes are
It ’s closed by Iland, so do n’t take in the atmosphere.
Secure adsorption. Furthermore, the type of lead frame
Suction only for islands that are not affected by replacement
Since the holes are provided, it is possible to deal with any kind of product exchange.
it can.

In the wire bonding apparatus, the wire 60 is connected between the lead 68a provided on the lead frame 68 and the pad 67a on the IC chip 67 to connect the IC chip itself. Even if the suction structure with the suction holes is adopted at the stage side of the pellet bonding device (not shown) mounted on the island 68b of the lead frame 68 and at the position where the chip is removed, the same structure as that of the wire bonding device is obtained. The effect is played. However, the details of this pellet bonding apparatus will not be described here, for example, because the main part thereof is disclosed in Japanese Patent Publication No. 2-51258.

Further, in the present embodiment, the case where the suction hole 1a is a substantially rectangular annular groove is shown, but the suction hole 1a may be formed by one or a plurality of holes as shown in FIGS. 4 and 5, for example. It goes without saying that various other forms can be adopted as the adsorption holes, such as forming the adsorption holes.

[0020]

As described above, according to the present invention,
Since the suction hole is not located directly below the connected part of the connection object, the vibration energy applied through the bonding tool is transmitted and reflected normally without being dispersed, and a stable connection state can always be obtained. it can. Especially,
By disposing the suction holes only in the area corresponding to the island formed in the frame, in a portion other than the portion corresponding to the electrode of the semiconductor component, the following effects are achieved. That is,
Since the suction holes are formed only within a relatively narrow area corresponding to the island, the processing scale is small, and the suction holes can be formed with high precision, at low cost, and easily. Regarding the fixing of the lead connected to the electrode of the semiconductor component, since the lead is integral with the island, the island is attracted or absorbed.
It is enough to fix it. Therefore the above effects are more effective
Played by. Also, the adsorption holes are closed by islands.
Since it is exposed to the air
It is. Furthermore, there is almost no effect of changing the frame type.
Since the suction holes are provided only for the island, the product type can be changed.
You can deal with anything.

[Brief description of the drawings]

FIG. 1 is a plan view of a part of a bonding stage, which is a main part of a wire bonding apparatus according to the present invention, and a lead frame carried by the bonding stage.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a side view of a conventional bonding apparatus.

FIG. 4 is a plan view of a part of a bonding stage included in the bonding apparatus shown in FIG. 3 and a lead frame carried by the bonding stage.

5 is a sectional view taken along line BB in FIG.

FIG. 6 is a vertical cross-sectional view of a part of the bonding apparatus shown in FIGS. 3 to 5 in a connecting work state.

[Explanation of symbols]

 1 Bonding Stage 1a Suction Hole 50 Ultrasonic Transducer 54 Horn 57 Capillary (bonding tool) 60 Wire 67 IC Chip 67a Pad 68 Lead Frame 68a Lead

Claims (3)

(57) [Claims] 1. A bonding stage on which a frame is placed, a bonding tool for holding a semiconductor component or a wire and pressing it against an object to be connected, and a vibrating means for vibrating the bonding tool. An adsorption hole for adsorbing the frame is formed on a frame carrying surface of the bonding stage, and the frame is formed on the frame while operating the vibrating means with the frame being in an adsorption state on the bonding stage.
In bonding apparatus for performing connection by wires and the semiconductor component the island and integrally disposed a lead bonding or electrode and said frame on said semiconductor components mounted on the island of for the islands is the A bonding apparatus, wherein suction holes are provided only in a region corresponding to the islands, except for portions corresponding to the electrodes of the semiconductor component , and suck the frame . 2. The bonding apparatus according to claim 1, wherein the suction holes are provided inside or outside the electrodes of the semiconductor component. 3. The bonding apparatus according to claim 1, wherein the suction hole is formed of a substantially rectangular annular groove.