JP2803801B2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for forming projecting electrodes (bumps) on a surface of a semiconductor substrate or the like by a ball bonding method.

[0002]

2. Description of the Related Art A conventional semiconductor manufacturing apparatus for forming bump electrodes will be described with reference to FIG.

The stage portion of this semiconductor manufacturing apparatus comprises a wafer stage 1, a heater 2, a bearing 3, a belt 4, and a pneumatic actuator 5, and a bonding head portion has a capillary 6 and an ultrasonic horn 7 at its tip. Torch 8
It is constituted by.

[0004] The operation of the semiconductor manufacturing apparatus for forming a protruding electrode configured as described above will be described below.

That is, the semiconductor wafer 9 is placed on the wafer stage 1, and the bonding head is operated to form only half of the semiconductor wafer 9 on the semiconductor wafer 9. When the process is completed, the wafer stage 1 is rotated by the bearing 3, the belt 4, and the pneumatic actuator 5, and the remaining portion is bonded.

[0006]

However, in the above-described conventional configuration, since the entire stage rotates, a connection line to the heater 2 for increasing the temperature of the semiconductor wafer 9, a connection line to the thermocouple, and a vacuum pressure supply are provided. Tubes are twisted,
Since the entire stage is rotated, the rigidity of the wafer stage 1 is reduced, and the shape of the protruding electrode 10 may become unstable during high-speed bonding.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and fixes a wafer stage, rotates only a semiconductor wafer by one revolution, eliminates twisting of a heater wire and the like, and provides a stable semiconductor manufacturing device having a high rigidity of a wafer stage portion. It is intended to provide a device.

[0008]

In order to achieve this object, the present invention provides a suction hole, wherein the suction hole is an air ejection hole which also serves as a suction hole.
The air ejection hole, which also serves as the suction hole,
By the configuration are found provided on the substrate table in a direction which forms a predetermined angle θ Te.

[0009]

With this configuration, when air is ejected from the suction holes, the semiconductor wafer floats and rotates. As a result, there is no need to rotate the wafer stage.

[0010]

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, the same parts as those in FIG. 3 of the prior art are denoted by the same reference numerals, and description thereof will be omitted. That is, a feature of the present invention is that an air ejection hole 11 which also serves as a suction hole and has a predetermined angle θ with respect to the upper surface of the wafer stage 1 is provided.
Reference numeral 12 denotes a wafer stopper. The operation will be described below.

A semiconductor wafer 9 is placed on the wafer stage 1, and first, a projection electrode 10 is formed on a half of the semiconductor wafer 9 by a bonding head. When it is finished,
High pressure air of about 5 kg / cm ² is ejected from the four air ejection holes 11 to float the semiconductor wafer 9. As shown in FIG. 2, the air ejection holes 11 are fixed at a certain angle θ with respect to the upper surface of the wafer stage 1 in order to rotate the semiconductor wafer 9 in one direction.
The semiconductor wafer 9 can be rotated by ejecting high-pressure air therefrom. Then, when rotated to a predetermined position, the ejection of air is stopped, and the air ejection port 11 is used as a vacuum hole for suction to suck the semiconductor wafer 9 onto the wafer stage 1 and perform bonding of the remaining half.

[0013]

As described above, according to the present invention, since the suction holes are formed in the direction inclined from the vertical direction on the surface of the substrate mounting table, the semiconductor wafer can be rotated on the fixed stage, and the wires such as heaters can be used. A semiconductor manufacturing apparatus capable of preventing torsion and further increasing the rigidity to stably form a protruding electrode can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view for explaining an air ejection hole portion of FIG. 1;

FIG. 3 is a perspective view of a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer stage 2 Heater 6 Capillary 7 Ultrasonic horn 8 Toe 9 Semiconductor wafer 10 Projection electrode 11 Air ejection hole (suction hole) 12 Wafer stopper

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60

Claims (1)

(57) [Claims] A substrate stage having a 1. A adsorbs the semiconductor substrate fixed to the suction hole, in a semiconductor manufacturing apparatus and a bonding head for bonding by the ball bonding method on a surface of the semiconductor substrate, wherein the suction hole is adsorbed Hole
Air ejection hole, and the air ejection hole also serving as the suction hole,
In a direction making a certain angle θ with respect to the upper surface of the substrate table.
The semiconductor manufacturing apparatus characterized by being provided et the substrate table.