JP2680556B2 - Probe unit - Google Patents
Probe unitInfo
- Publication number
- JP2680556B2 JP2680556B2 JP7068767A JP6876795A JP2680556B2 JP 2680556 B2 JP2680556 B2 JP 2680556B2 JP 7068767 A JP7068767 A JP 7068767A JP 6876795 A JP6876795 A JP 6876795A JP 2680556 B2 JP2680556 B2 JP 2680556B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insulating film
- pressure contact
- contact piece
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 23
- 238000007747 plating Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000011295 pitch Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
- Liquid Crystal (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は液晶パネルの検査等に
使用されるプローブユニットの如き、リードを微小ピッ
チで並列配置し、このリードに弾性加圧接触片を付有せ
ねばならない場合に適したプローブユニットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is suitable for a case where leads are arranged in parallel at a fine pitch and an elastic pressure contact piece must be attached to the leads, such as a probe unit used for inspection of liquid crystal panels. Regarding the probe unit.
【０００２】[0002]
【従来の技術】液晶パネルを形成するガラス板端縁に並
列配置される電極層は益々微小ピッチ化する傾向にあ
り、これら液晶パネルの検査においては、検査装置側に
おいて、これら微小ピッチの電極層に対応するピッチの
プローブユニットの提供が必要となる。現状では上記電
極層のピッチは０．１ｍｍ以下であり、これら液晶パネ
ルの電極層に接触する検査側のリードをフープ材から機
械的に打抜き加工して形成することは困難となってきて
いる。2. Description of the Related Art There is a tendency that electrode layers arranged in parallel with the edge of a glass plate forming a liquid crystal panel have an increasingly smaller pitch. It is necessary to provide a probe unit having a pitch corresponding to the above. At present, the pitch of the electrode layers is 0.1 mm or less, and it is becoming difficult to mechanically punch and form the leads on the inspection side that come into contact with the electrode layers of the liquid crystal panel from the hoop material.
【０００３】このため、エッチング法やマスクを通して
光照射して形成された蝕刻溝に金属をメッキ成長させる
アディティブ法等を使用して微小ピッチのリードユニッ
トを形成する方法が採られている。この方法を使用した
最新の技術が特願平４−２９７５７８号及び特願平４−
３８２８９号である。For this reason, there is adopted a method of forming a fine pitch lead unit by using an etching method or an additive method in which a metal is plated and grown in an etching groove formed by irradiating light through a mask. The latest technology using this method is Japanese Patent Application No. 4-297578 and Japanese Patent Application No. 4-297578.
No. 38289.
【０００４】現在はエッチング法によって形成されたリ
−ドユニットをガラス板等の絶縁基板の表面に全巾に亘
り接着し、各リードの先端側を絶縁ベースの表面縁部か
ら延出しこの延出部先端を上記液晶パネルの電極層との
接触に供すると共に、絶縁ベースの表面に接着された各
リードの基端側表面に検査装置側のＩＣ等のリードを重
ねてハンダ付け等する構成のものが広く実用されてい
る。At present, a lead unit formed by an etching method is adhered to the surface of an insulating substrate such as a glass plate over the entire width, and the tip end side of each lead is extended from the surface edge of the insulating base. The tip of the part is brought into contact with the electrode layer of the liquid crystal panel, and leads such as ICs on the inspection device side are stacked and soldered on the base end side surface of each lead adhered to the surface of the insulating base. Is widely used.
【０００５】[0005]
【発明が解決しようとする問題点】上記先行発明は絶縁
基板の縁部から突出したリード部分をバネとして機能さ
せているが、リードの微細化に伴いバネ機能が減殺さ
れ、所要の接触圧が確保し難くなって来ている。又リー
ド突出部分に捩れや上下の不揃い（接触レベルの不均一
化）が生じ、これが接触の信頼性を損なう問題を有して
いる。又加圧接触の繰り返しによりリード突出部分の基
部に疲労や、永久変形や折損を生ずる問題を内在してい
る。In the above-mentioned prior invention, the lead portion protruding from the edge of the insulating substrate functions as a spring, but the spring function is diminished with the miniaturization of the lead, and the required contact pressure is reduced. It is becoming difficult to secure it. Further, there is a problem that twisting or unevenness in the upper and lower portions (uneven contact level) occurs in the protruding portion of the lead, which impairs reliability of contact. Further, there is an inherent problem that fatigue, permanent deformation and breakage occur at the base of the lead protruding portion due to repeated pressure contact.
【０００６】[0006]
【問題点を解決するための手段】この発明は上記問題点
を有効に解決する構成を持ったプローブユニットを提供
するものである。The present invention provides a probe unit having a configuration that effectively solves the above problems.
【０００７】このプローブユニットは、上記リードを絶
縁フィルムの表面に並列して延在させると共に、補圧用
の弾性絶縁板でバックアップする。In this probe unit, the leads are extended in parallel with the surface of the insulating film and backed up by an elastic insulating plate for pressure compensation.
【０００８】上記リード補圧用弾性絶縁板は上記絶縁フ
ィルムのリードが延在する側と反対側の表面に接着す
る。換言すると上記絶縁フィルムのリード補圧用弾性絶
縁板を接着した側とは反対側の表面に上記リードを延在
せしめる。The elastic lead insulation plate is bonded to the surface of the insulating film opposite to the lead extending side. In other words, the leads are extended to the surface of the insulating film opposite to the side to which the elastic elastic plate for lead pressure compensation is attached.
【０００９】そして上記リードの一端を上記絶縁フィル
ムの表面に延在された状態でリード補圧用弾性絶縁板の
縁部から絶縁フィルムと共に突出し加圧接触に供する構
成とする。Then, one end of the lead is extended to the surface of the insulating film and protrudes from the edge of the elastic insulating plate for lead pressure compensation together with the insulating film for pressure contact.
【００１０】上記各プローブユニットにおけるリードは
メッキ成長等にて形成し、その並列間隔と尖った先端形
状等を与える。The leads in each of the probe units are formed by plating growth or the like, and are provided with a parallel interval and a sharp tip shape.
【００１１】詳述すると、可撓性を有する絶縁フィルム
の表面に多数のリードを並列して延在し、該絶縁フィル
ムの表面にリード補圧用弾性絶縁板を接着し、上記リー
ドを上記絶縁フィルムの上記リード補圧用弾性絶縁板を
接着した側とは反対側の表面に延在させる。More specifically, a large number of leads are arranged in parallel on the surface of a flexible insulating film, and an elastic insulating plate for lead pressure compensation is adhered to the surface of the insulating film. Of the lead compression elastic insulating plate is extended to the surface opposite to the side to which the elastic insulating plate is bonded.
【００１２】そして上記リードの一端を上記絶縁フィル
ムと一緒に上記リード補圧用弾性絶縁板の縁部から突出
して加圧接触片を形成し、該突出部によって形成された
加圧接触片の端末を加圧接触に供し、該端末の加圧接触
時にリードの上記突出部によって形成された加圧接触片
と絶縁フィルムの上記突出部とが一緒に上反りして上記
リード補圧用弾性絶縁板の縁部を圧縮する構成とした。Then, one end of the lead is projected together with the insulating film from the edge portion of the elastic insulating plate for pressure compensation of the lead to form a pressure contact piece, and the end of the pressure contact piece formed by the protruding portion is formed. When subjected to pressure contact, the pressure contact piece formed by the projecting portion of the lead and the projecting portion of the insulating film warp together at the time of the pressure contact of the end, and the edge of the elastic insulating plate for pressure compensation of the lead The part is configured to be compressed.
【００１３】上記絶縁フィルムはリードの全長に亘り全
表面を覆うように接着するか、上記リードの端末を上記
絶縁フィルムの上記突出部の縁部から露出する構成とす
る。The insulating film is adhered over the entire length of the lead so as to cover the entire surface, or the end of the lead is exposed from the edge of the protruding portion of the insulating film.
【００１４】[0014]
【作用】上記リード補圧用の弾性絶縁板の縁部から突出
してリードの加圧接触片をバックアップする絶縁フィル
ムは微細で脆弱なリードの加圧接触片の強度を補い適度
な剛性を付与すると共に、弾性絶縁板は絶縁板の縁部よ
り突出するリード部分（加圧接触片）の基部及び絶縁フ
ィルムの突出基部をバックアップしてリードの弾力不足
を補完し適正な接触圧を確保することができ、加圧接触
片と一緒に上反りしつつ撓む絶縁フィルムの突出部と、
該上反り時に該突出部の基部において端縁が圧縮される
弾性絶縁板の作用にてリードの接触レベルの不揃い（上
下の不揃い）と捩れを是正し、接触対象との相対位置を
保って均一に接触させることができ、又絶縁フィルムの
突出部は加圧接触片の整列の保持し左右へのピッチずれ
を防止し、リードの微細化、狭小ピッチ化に有効に対処
し得る。The insulating film, which projects from the edge of the elastic insulating plate for compensating the lead and backs up the pressure contact piece of the lead, supplements the strength of the pressure contact piece of the fine and fragile lead and imparts appropriate rigidity. , The elastic insulating plate backs up the base of the lead part (pressing contact piece) protruding from the edge of the insulating plate and the protruding base of the insulating film to supplement the lack of elasticity of the lead and ensure an appropriate contact pressure. , A protruding portion of the insulating film that bends while warping together with the pressure contact piece,
The edge of the protrusion is compressed at the time of the warp, and the edge of the protrusion is compressed to correct the uneven contact level of the leads (uneven upper and lower) and twist, and maintain the relative position with the contact target to maintain a uniform position. The protrusion of the insulating film can maintain the alignment of the pressure contact pieces and prevent the pitch deviation from side to side, and can effectively cope with the miniaturization of the leads and the narrowing of the pitch.
【００１５】又リード補圧用弾性絶縁板はリード一端の
加圧接触片を保護し変形防止に寄与する。即ち、リード
の上記弾性絶縁板の縁部から突出する弾性加圧接触片は
絶縁フィルムの上記突出部と共に上反りしつつ、上記弾
性絶縁板の端部を圧縮して上記上反りを招来するので、
リード突出部（加圧接触片）の繰り返し加圧接触と上反
りによるリード突出部の基部の疲労や永久変形、折損を
有効に防止する。Further, the elastic insulating plate for compressing the lead protects the pressure contact piece at one end of the lead and contributes to prevention of deformation. That is, since the elastic pressure contact piece protruding from the edge of the elastic insulating plate of the lead warps with the protruding portion of the insulating film, the end portion of the elastic insulating plate is compressed to cause the warp. ,
This effectively prevents fatigue, permanent deformation, and breakage of the base of the lead protrusion due to repeated pressure contact and upward warping of the lead protrusion (pressure contact piece).
【００１６】[0016]
【実施例】以下、この発明の実施例を図面に基いて詳述
する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１７】第１実施例（図１乃至図５） 図１乃至図５は本発明の実施例に係るプローブユニット
の製造法と構造を開示している。First Embodiment (FIGS. 1 to 5) FIGS. 1 to 5 disclose a manufacturing method and a structure of a probe unit according to an embodiment of the present invention.
【００１８】先ず、図２に示すように、導電性転写板１
の表面に並列して延在する多数のリード２をメッキ成長
により形成する。First, as shown in FIG. 2, the conductive transfer plate 1
A large number of leads 2 extending in parallel to the surface of is formed by plating growth.
【００１９】リード２の材質は弾性を富有し且つメッキ
特性に優れたニッケル合金、銅合金等の中から選択され
る。The material of the lead 2 is selected from nickel alloy, copper alloy and the like, which are highly elastic and have excellent plating characteristics.
【００２０】又転写板１はステンレス等の金属板、又は
合成樹脂板やセラミック板の表面に導電性を付写したも
のを用いる。そしてこの転写板１の表面に上記リード２
の剥離を助ける剥離層を形成し、この剥離層の表面に上
記リード２をメッキにより成長せしめる。図示しない
が、このメッキ成長によるリード２は既知のアディティ
ブ法を用い、リードパターンと同一パターンの絶縁隔壁
を転写板上に形成し、この絶縁隔壁間の溝内においてメ
ッキ金属を成長させ、次で上記絶縁隔壁を除去すること
によって形成できる。As the transfer plate 1, a metal plate such as stainless steel, or a synthetic resin plate or a ceramic plate having conductivity added thereto is used. Then, the lead 2 is formed on the surface of the transfer plate 1.
A peeling layer for assisting peeling is formed, and the leads 2 are grown on the surface of the peeling layer by plating. Although not shown, the lead 2 formed by plating growth is formed on the transfer plate with an insulating partition having the same pattern as the lead pattern using a known additive method, and the plated metal is grown in the groove between the insulating partition. It can be formed by removing the insulating partition.
【００２１】次で図３に示すように上記転写板１の表面
に延在する全リード２の表面を可撓性を有する絶縁フィ
ルム８で覆い同表面に接着する。Next, as shown in FIG. 3, the surfaces of all the leads 2 extending on the surface of the transfer plate 1 are covered with a flexible insulating film 8 and adhered to the surface.
【００２２】この接着は接着剤によるか又は接着剤を使
用せずに熱圧着して上記絶縁フィルム８のリードと接す
る表面を溶融し接着する。This adhesion is carried out by an adhesive or by thermocompression bonding without using an adhesive so that the surface of the insulating film 8 in contact with the leads is melted and adhered.
【００２３】上記絶縁フィルム８は全リード２の全長に
亘り全表面を覆うように接着する。又はリード２の加圧
接触片２ａを形成する一端部の端末側を一部分だけフィ
ルム８の縁部から露出するようにリード表面を覆うよう
に重ね接着する。The insulating film 8 is adhered to cover the entire surface of the entire lead 2 over its entire length. Alternatively, the ends of one end of the lead 2 forming the pressure contact piece 2a are overlapped and bonded so as to cover the lead surface so that only a part of the end side is exposed from the edge of the film 8.
【００２４】このフィルム８の接着はシリコーン系接着
剤等の接着剤を用いるか、又は熱圧着による。The film 8 is adhered by using an adhesive such as a silicone adhesive or by thermocompression.
【００２５】この時リード２の他端部の端末側を絶縁フ
ィルムの対向する縁部から露出させることを妨げない。At this time, the other end of the lead 2 is not prevented from being exposed at the end side from the opposite edges of the insulating film.
【００２６】次に、図４に示すように上記絶縁フィルム
８の表面にリード補圧用弾性絶縁板３を重ねて接着し一
体とする。該リード補圧用弾性絶縁板３は絶縁フィルム
８のリード２を延在した側とは反対側の表面に接着す
る。換言すると上記リード２を上記絶縁フィルム８のリ
ード補圧用弾性絶縁板３を接着した側とは反対側の表面
に延在させる。このとき弾性絶縁板３は全リード２の中
間延在領域においてその表面を覆うように接着し、同絶
縁板３の対向する一方の縁部から、リード２の一端が絶
縁フィルム８と一緒に夫々所定寸法だけ突出し且つ同他
端が他方の縁部から絶縁フィルム８と共に夫々所定寸法
だけ突出するように接着する。Next, as shown in FIG. 4, an elastic insulating plate 3 for lead pressure compensation is superposed and adhered on the surface of the insulating film 8 to be integrated. The elastic lead insulation plate 3 is bonded to the surface of the insulating film 8 opposite to the side where the lead 2 extends. In other words, the lead 2 is extended to the surface of the insulating film 8 on the side opposite to the side to which the lead compression elastic insulating plate 3 is bonded. At this time, the elastic insulating plate 3 is adhered so as to cover its surface in the intermediate extending region of all the leads 2, and one end of the lead 2 is attached together with the insulating film 8 from one edge part of the insulating plate 3 facing each other. It is adhered so as to project by a predetermined dimension and the other end thereof projects by a predetermined dimension together with the insulating film 8 from the other edge portion.
【００２７】即ち、リード２の中間延在領域において上
記リード補圧用弾性絶縁板３がフィル８の表面に重ね付
けされ、リード両端はこの弾性絶縁板３の対向する縁部
から絶縁フィルム８と共に露出する。That is, in the intermediate extending region of the lead 2, the elastic lead insulation plate 3 is superposed on the surface of the fill 8, and both ends of the lead are exposed together with the insulating film 8 from the opposite edges of the elastic plate 3. To do.
【００２８】上記弾性絶縁板３としては、シリコーン樹
脂、ポリウレタン樹脂等を用いる。As the elastic insulating plate 3, silicone resin, polyurethane resin or the like is used.
【００２９】次に図５に示すように、上記リード２を絶
縁フィルム８及び弾性絶縁板３と一緒に転写板１から剥
離してプローブユニットを形成する。Next, as shown in FIG. 5, the lead 2 is separated from the transfer plate 1 together with the insulating film 8 and the elastic insulating plate 3 to form a probe unit.
【００３０】合成樹脂、ガラス、セラミック等から成る
絶縁基板の表面に上記フィルム８に担持されたリード群
を接着しプローブユニットを形成することができる。The lead group carried on the film 8 can be adhered to the surface of an insulating substrate made of synthetic resin, glass, ceramic or the like to form a probe unit.
【００３１】適例として上記絶縁フィルム８は透視可能
な透明若しくは半透明のフィルムを用いる。As a suitable example, the insulating film 8 is a transparent or translucent film which is transparent.
【００３２】リード２は液晶板５の電極層５ａの相対関
係を上部より検視する作業があり、上記絶縁フィルム８
を通してその検視を容易にし、フィルム８はリード引き
揃え手段となる。The lead 2 has a work of inspecting the relative relationship of the electrode layer 5a of the liquid crystal plate 5 from the upper side.
The inspection is facilitated through the film 8 and the film 8 serves as lead aligning means.
【００３３】斯くして形成された図５に示すプローブユ
ニットは図１に示すように、ホルダー６に取付け、例え
ば液晶板５の電極層５ａとの加圧接触に供する。The thus-formed probe unit shown in FIG. 5 is attached to a holder 6 as shown in FIG. 1, and is subjected to pressure contact with the electrode layer 5a of the liquid crystal plate 5, for example.
【００３４】プローブユニットは前下りの傾斜角度とな
るようにホルダー６に取付けリード２の加圧接触片の端
末を電極層５ａの表面に加圧接触せしめる。このリード
端末は図１、図５等に示すように、尖鋭にし、この尖鋭
部はメッキ成長により付形し、この尖鋭部を絶縁フィル
ム８の縁部表面に接着する。即ち尖鋭部を絶縁フィルム
８でバックアップする。The probe unit is attached to the holder 6 so as to be inclined forward and downward, and the end of the pressure contact piece of the lead 2 is brought into pressure contact with the surface of the electrode layer 5a. As shown in FIGS. 1 and 5, the lead terminal is sharpened, the sharpened portion is shaped by plating growth, and the sharpened portion is bonded to the edge surface of the insulating film 8. That is, the sharp portion is backed up by the insulating film 8.
【００３５】上記ホルダー６には上記リード補圧用の弾
性絶縁板３を嵌合する凹所７を形成し、絶縁フィルム８
をホルダー６の下面に添設すると共に、上記凹所７に弾
性絶縁板３を受け入れて凹所内面で位置規制し、ホルダ
ー６と一体構造とする。よって絶縁フィルム８を弾性絶
縁板３を重ね接着した側を以ってホルダー６の下面に添
設し、絶縁フィルム８の上記ホルダー６に添設した側と
は反対側の表面に上記リード２を延在せしめ、該リード
２の一端を上記ホルダー６及び弾性絶縁板３の縁部より
絶縁フィルム８と一緒に先方へ突出せしめて加圧接触片
２ａを形成する。A recess 7 into which the elastic insulating plate 3 for lead compression is fitted is formed in the holder 6, and an insulating film 8 is formed.
Is attached to the lower surface of the holder 6, and the elastic insulating plate 3 is received in the recess 7 to regulate the position on the inner surface of the recess to form an integral structure with the holder 6. Therefore, the insulating film 8 is attached to the lower surface of the holder 6 with the side to which the elastic insulating plate 3 is laminated and adhered, and the lead 2 is attached to the surface of the insulating film 8 opposite to the side attached to the holder 6. Then, one end of the lead 2 is projected forward together with the insulating film 8 from the edges of the holder 6 and the elastic insulating plate 3 to form the pressure contact piece 2a.
【００３６】上記ホルダー６を前傾することによってリ
ード２の加圧接触片２ａの端末が電極層５ａに押し付け
られ、この時加圧接触片２ａは自らの弾性で絶縁フィル
ム８の突出部と共に上反りする。この時上記リード補圧
用の弾性絶縁板３はホルダー６に支持されながら、その
縁部がリードの加圧接触片２ａによって圧縮され、その
反作用として加圧接触片２ａに補圧を与える。By tilting the holder 6 forward, the end of the pressure contact piece 2a of the lead 2 is pressed against the electrode layer 5a, and at this time, the pressure contact piece 2a moves upward together with the protrusion of the insulating film 8 due to its elasticity. Warp. At this time, the elastic insulating plate 3 for lead pressure compensation is supported by the holder 6 while the edge portion thereof is compressed by the pressure contact piece 2a of the lead, and as a reaction thereof, a supplementary pressure is applied to the pressure contact piece 2a.
【００３７】詳述すると、上記リード２を上記絶縁フィ
ルム８の上記リード補圧用弾性絶縁板３を接着した側と
は反対側の表面に延在させると共に、上記リード２の一
端を上記絶縁フィルム８と一緒に上記リード補圧用弾性
絶縁板３の縁部から突出して加圧接触片２ａを形成し、
該突出部によって形成された加圧接触片２ａの端末を加
圧接触に供し、該端末の加圧接触時にリード２の上記突
出部によって形成された加圧接触片２ａと絶縁フィルム
８の上記突出部とが上記リード補圧用弾性絶縁板３の縁
部を圧縮しつつ一緒に上反りする構成とした。More specifically, the lead 2 is extended to the surface of the insulating film 8 opposite to the side to which the elastic lead insulating pressure insulating plate 3 is adhered, and one end of the lead 2 is connected to the insulating film 8. Together with the above, the pressure contact piece 2a is formed by projecting from the edge portion of the lead pressure resilient insulating plate 3.
The end of the pressure contact piece 2a formed by the protrusion is subjected to pressure contact, and the pressure contact piece 2a formed by the protrusion of the lead 2 and the protrusion of the insulating film 8 at the time of pressure contact of the terminal. The portion compresses the edge portion of the lead pressure-compliant elastic insulating plate 3 and warps together.
【００３８】第２実施例（図６乃至図１０） 第１実施例においては転写板１の表面においてメッキ成
長させたリード２を可撓性を有する絶縁フィルム８の表
面に転写（接着）する方法を採ったが、第２実施例にお
いては、上記リード２を絶縁フィルム８の表面において
直接メッキ成長させ並列状態に延在せしめる構成として
いる。Second Embodiment (FIGS. 6 to 10) In the first embodiment, a method of transferring (adhering) the leads 2 plated and grown on the surface of the transfer plate 1 to the surface of the insulating film 8 having flexibility. However, in the second embodiment, the leads 2 are directly grown on the surface of the insulating film 8 by plating to extend in parallel.
【００３９】詳述すると図６に示すように、絶縁フィル
ム８の表面に金属層９を蒸着して導電性を付与し、この
絶縁フィルム８の蒸着金属層９をリード下地とし、その
表面に前記リード２をメッキ成長させる。More specifically, as shown in FIG. 6, a metal layer 9 is vapor-deposited on the surface of the insulating film 8 to impart conductivity, and the vapor-deposited metal layer 9 of the insulating film 8 is used as a lead base, and the surface of the metal layer 9 is formed as described above. The lead 2 is grown by plating.
【００４０】リード２を等ピッチで並列状態にメッキ成
長させる方法として、図２に基いて説明した既知のアデ
ィティブ法等が適切である。A known additive method described with reference to FIG. 2 is suitable as a method for growing the leads 2 in parallel at equal pitches.
【００４１】図７、図８に示すように、上記リード２を
形成した後、リード２間の蒸着金属層をエッチングで除
去し、図９に示すように、前記リード補圧用の弾性絶縁
板３を絶縁フィルム８の表面に重ね接着することにより
プローブユニットを形成する。弾性絶縁板３はリード２
を接着した側と反対側のフィルム表面に被着しフィルム
８と一体とする。After forming the leads 2 as shown in FIGS. 7 and 8, the vapor-deposited metal layer between the leads 2 is removed by etching, and as shown in FIG. On the surface of the insulating film 8 to form a probe unit. The elastic insulating plate 3 is the lead 2
Is adhered to the film surface on the side opposite to the side where the is adhered, and is integrated with the film 8.
【００４２】上記弾性絶縁板３の接着領域やリードとの
関係配置は図４に基いて詳細に説明した通りである。The arrangement of the elastic insulating plate 3 in relation to the bonding area and the leads is as described in detail with reference to FIG.
【００４３】[0043]
【発明の効果】上記のとおり絶縁フィルムの突出部は加
圧接触片端末の加圧接触時に同加圧接触片と一緒に上反
りしつつ個々の加圧接触片において撓むことができ、他
方上記弾性絶縁板は上記上反りによってその縁部が圧縮
される。As described above, the protruding portion of the insulating film can bend in the individual pressure contact pieces while warping together with the pressure contact pieces at the time of the pressure contact of the end of the pressure contact piece, while The edge of the elastic insulating plate is compressed by the warp.
【００４４】この絶縁フィルムと弾性絶縁板の作用が相
補して微細で脆弱な加圧接触片のバネ定数を適切に補
い、充分な接触圧を確保できると共に、加圧接触片の上
下のレベル、捩れ等を有効に是正して適正なる接触を確
保し信頼性を向上できる。又絶縁フィルムの突出部は加
圧接触片の左右のピッチずれを防止し整列を保持する。The functions of the insulating film and the elastic insulating plate complement each other to appropriately supplement the spring constant of the minute and fragile pressure contact piece to ensure a sufficient contact pressure, and the upper and lower levels of the pressure contact piece. Twisting can be effectively corrected to ensure proper contact and improve reliability. Further, the protruding portion of the insulating film prevents the pressure contact pieces from shifting in the left and right pitches and maintains the alignment.
【００４５】又弾性絶縁基板の縁部に加わる加圧接触片
（リードの突出基部）の曲げ負荷を弾性絶縁板の縁部の
圧縮により吸収して変形や折損を有効に防止することが
できる。Further, the bending load of the pressure contact piece (protruding base of the lead) applied to the edge portion of the elastic insulating substrate can be absorbed by the compression of the edge portion of the elastic insulating plate to effectively prevent deformation and breakage.
【００４６】加えてリード突出部と絶縁フィルムの突出
部とが一緒に上反りしつつ、リード突出部の端末を接触
対象に加圧せしめる時に良好なワイピング作用が期待で
き、これが接触の信頼性を一層向上せしめる。In addition, when the lead protrusion and the protrusion of the insulating film are warped together, a good wiping action can be expected when the end of the lead protrusion is pressed against the contact object, which improves the reliability of contact. Further improve.
【図１】この発明に係るプローブユニットによって検査
ユニットを形成した一例を示す断面図である。FIG. 1 is a sectional view showing an example in which an inspection unit is formed by a probe unit according to the present invention.
【図２】図２乃至図５はこの発明に係るプローブユニッ
ト（第１実施例）の製造工程を示し、図２は転写板表面
にメッキ成長により形成されたリード群の斜視図であ
る。2 to 5 show a manufacturing process of a probe unit (first embodiment) according to the present invention, and FIG. 2 is a perspective view of a lead group formed by plating growth on a transfer plate surface.
【図３】図２のリード群に絶縁フィルムを付設した状態
を一部切欠して示す転写板斜視図である。FIG. 3 is a perspective view of a transfer plate showing a state in which an insulating film is attached to the lead group of FIG.
【図４】上記絶縁フィルムにリード補圧用の弾性絶縁板
を付設した状態を一部切欠して示す転写板斜視図であ
る。FIG. 4 is a perspective view of a transfer plate showing a partially cutaway state in which an elastic insulating plate for lead compression is attached to the insulating film.
【図５】上記転写板から剥離したプローブユニットを一
部切欠して示す斜視図である。FIG. 5 is a perspective view showing a part of the probe unit separated from the transfer plate by cutting away.
【図６】図６乃至図１０はこの発明に係るプローブユニ
ット（第２実施例）の製造工程を示し、図６は絶縁フィ
ルムに金属層を蒸着した状態を示す断面図である。6 to 10 show a manufacturing process of a probe unit (second embodiment) according to the present invention, and FIG. 6 is a sectional view showing a state in which a metal layer is deposited on an insulating film.
【図７】図６の絶縁フィルム上にリード群をメッキ成長
により形成した状態を示す斜視図である。7 is a perspective view showing a state in which a lead group is formed on the insulating film of FIG. 6 by plating growth.
【図８】図７のリードを施した絶縁フィルムの断面図で
ある。8 is a cross-sectional view of the leaded insulating film of FIG.
【図９】図７のリード群にリード補圧用弾性絶縁板を付
設したプローブユニットの斜視図である。9 is a perspective view of a probe unit in which a lead pressure elastic insulating plate is attached to the lead group of FIG. 7. FIG.
【図１０】図９のプローブユニットの断面図である。10 is a cross-sectional view of the probe unit of FIG.
２ リード ２ａ 加圧接触片 ３ リード補圧用の弾性絶縁板 ８ フィルム 2 lead 2a pressure contact piece 3 elastic insulating plate for lead pressure 8 film
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−138166（ＪＰ，Ａ) 特開 平６−334005（ＪＰ，Ａ) 特開 平６−109762（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-138166 (JP, A) JP-A-6-334005 (JP, A) JP-A-6-109762 (JP, A)
Claims (4)
のリードを並列して延在し、該絶縁フィルムの表面にリ
ード補圧用弾性絶縁板を接着し、上記リードを上記絶縁
フィルムの上記リード補圧用弾性絶縁板を接着した側と
は反対側の表面に延在させると共に、上記リードの一端
を上記絶縁フィルムと一緒に上記リード補圧用弾性絶縁
板の縁部から突出して加圧接触片を形成し、該突出部に
よって形成された加圧接触片の端末を加圧接触に供し、
該加圧接触片の端末の加圧接触時に該加圧接触片と上記
絶縁フィルムの突出部とが上記リード補圧用弾性絶縁板
の縁部を圧縮しつつ一緒に上反りし接触圧を得る構成と
したことを特徴とするプローブユニット。1. A flexible insulating film having a large number of leads extending in parallel on the surface thereof, and an elastic insulating plate for lead pressure compensation bonded to the surface of the insulating film. A pressure contact piece is formed by extending an elastic insulating plate for lead pressure compensation on the surface opposite to the side where it is bonded and projecting one end of the lead together with the insulating film from the edge of the elastic insulating plate for lead pressure compensation. And subjecting the end of the pressure contact piece formed by the protrusion to pressure contact,
A structure in which the pressure contact piece and the protruding portion of the insulating film are warped together while compressing the edge portion of the lead pressure-compressing elastic insulating plate at the time of pressure contact of the end of the pressure contact piece to obtain a contact pressure. A probe unit characterized in that
表面を覆うように接着したことを特徴とする請求項１記
載のプローブユニット。2. The probe unit according to claim 1, wherein the insulating film is bonded so as to cover the entire surface of the lead over its entire length.
の上記突出部の縁部から露出する構成としたことを特徴
とする請求項１記載のプローブユニット。3. The probe unit according to claim 1, wherein an end of the pressure contact piece is exposed from an edge of the protruding portion of the insulating film.
特徴とする請求項１記載のプローブユニット。4. The probe unit according to claim 1, wherein the end of the pressure contact piece is sharpened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7068767A JP2680556B2 (en) | 1995-03-02 | 1995-03-02 | Probe unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7068767A JP2680556B2 (en) | 1995-03-02 | 1995-03-02 | Probe unit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4677596A Division JPH08254546A (en) | 1996-02-08 | 1996-02-08 | Probe unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08240631A JPH08240631A (en) | 1996-09-17 |
| JP2680556B2 true JP2680556B2 (en) | 1997-11-19 |
Family
ID=13383223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7068767A Expired - Fee Related JP2680556B2 (en) | 1995-03-02 | 1995-03-02 | Probe unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2680556B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4382593B2 (en) * | 2004-06-29 | 2009-12-16 | 山一電機株式会社 | Probe unit and manufacturing method thereof |
| KR101255097B1 (en) * | 2011-06-14 | 2013-04-16 | 주식회사 프로이천 | Film unit for testing panel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06138166A (en) * | 1992-09-10 | 1994-05-20 | Tokyo Electron Yamanashi Kk | Liquid crystal inspection device |
| JPH0756493B2 (en) * | 1992-09-25 | 1995-06-14 | 日東精工株式会社 | Method for manufacturing conductive contact terminal |
| JP2571516B2 (en) * | 1993-05-20 | 1997-01-16 | フレッシュクエストコーポレーション | Probe card |
-
1995
- 1995-03-02 JP JP7068767A patent/JP2680556B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08240631A (en) | 1996-09-17 |
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