JP2706669B2 - Infrared detector - Google Patents
Infrared detectorInfo
- Publication number
- JP2706669B2 JP2706669B2 JP63217833A JP21783388A JP2706669B2 JP 2706669 B2 JP2706669 B2 JP 2706669B2 JP 63217833 A JP63217833 A JP 63217833A JP 21783388 A JP21783388 A JP 21783388A JP 2706669 B2 JP2706669 B2 JP 2706669B2
- Authority
- JP
- Japan
- Prior art keywords
- infrared
- vacuum chamber
- semiconductor
- detecting element
- cold shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 27
- 239000007788 liquid Substances 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 8
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- -1 for example Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は種々物体の放射する赤外線を検出するのに使
用される赤外線検出装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared detector used for detecting infrared rays emitted from various objects.
本発明は種々物体の放射する赤外線を検出するのに使
用される赤外線検出装置に関し、真空室により容器を形
成し、この容器内を冷却する機構とすると共にこの真空
室の内側壁の所定位置にコールドシールド室を設け、こ
のコールドシールド室のこの内側壁に接して半導体赤外
線検出素子を配し、この半導体赤外線検出素子の対向す
る真空室の外側壁に赤外線ウインドを設け、この赤外線
ウインドよりの赤外線の量をこの半導体赤外線検出素子
により検出する様にした赤外線検出装置に於いて、この
真空室内のコールドシールド室の赤外線ウインド側に集
光レンズを配したことにより、雑音の少ない良好な赤外
線検出ができるようにすると共に光学系を小さくできる
ように装置全体を小型化できるようにしたものである。The present invention relates to an infrared detecting device used to detect infrared rays emitted from various objects, a container formed by a vacuum chamber, a mechanism for cooling the inside of the container, and a predetermined position on an inner wall of the vacuum chamber. A cold shield chamber is provided, a semiconductor infrared detecting element is disposed in contact with the inner wall of the cold shield chamber, and an infrared window is provided on an outer wall of the vacuum chamber opposed to the semiconductor infrared detecting element, and infrared rays from the infrared window are provided. In the infrared detector, which detects the amount of light by the semiconductor infrared detector, a condenser lens is arranged on the infrared window side of the cold shield room in the vacuum chamber, so that good infrared detection with less noise can be achieved. The size of the entire apparatus can be reduced so that the optical system can be reduced in size.
〔従来の技術〕 従来種々の物体の放射する赤外線を検出する赤外線検
出装置として例えば第2図に示す如きものが提案されて
いる。この第2図に於いて、(1)は真空室を示し、こ
の真空室(1)により有底円筒形の容器(2)を形成す
る。この真空室(1)により形成された容器(2)はマ
ホービンと同様に構成されたものである。この真空室
(1)により形成された容器(2)内に冷却液例えば沸
点が−196℃の液体窒素(3)を注入する。この真空室
(1)の液体窒素(3)に接触している内側壁(1a)の
所定位置を囲む如く前方に絞りを構成する赤外線通過孔
(4a)を有する例えば銅板より成るコールドシールド室
(4)を設け、このコールドシールド室(4)内の液体
窒素(3)と接触する内側壁(1a)に例えばホトコンダ
クティブタイプの半導体赤外線検出素子(5)を接着固
定する。この場合この半導体赤外線検出素子(5)は液
体窒素(3)と接触する内側壁(1a)に接着されると共
にコールドシールド室(4)内に配されているので、こ
の半導体赤外線検出素子(5)の温度はこの液体窒素
(3)の沸点例えば−196℃と略同じ温度となり、この
半導体赤外線検出素子(5)自体及びその近辺より赤外
線は略んど放射されず、この半導体赤外線検出素子
(5)はその周辺よりの赤外線の照射はほとんどなくそ
れだけ雑音の影響が少なくなる。このホトコンダクティ
ブタイプのの半導体赤外線検出素子(5)は照射される
赤外線の量に応じて抵抗値が小さくなるもので、例えば
第3図に示す如く定電流回路(6)よりスイッチ(7)
を介してこの半導体赤外線検出素子(5)に一定電流を
流しておき、この半導体赤外線検出素子(5)の両端間
に得られて電圧を検出して、これにより赤外線の量即ち
温度を検出する様にする。この第3図に於いて(8)は
直流電圧が供給される電源端子、(9)は出力端子であ
る。このコールドシールド室(4)の赤外線通過孔(4
a)に対向するこの真空室(1)の外側壁(1b)に赤外
線ウインド(10)を設ける。この赤外線ウインド(10)
は略赤外線だけを通過するゲルマニウム板により構成す
る。2. Description of the Related Art Conventionally, as shown in FIG. 2, for example, an infrared detecting device for detecting infrared rays emitted from various objects has been proposed. In FIG. 2, (1) indicates a vacuum chamber, and the vacuum chamber (1) forms a bottomed cylindrical container (2). The container (2) formed by the vacuum chamber (1) has the same configuration as that of the mahobin. A cooling liquid, for example, liquid nitrogen (3) having a boiling point of -196 ° C. is injected into a container (2) formed by the vacuum chamber (1). A cold shield chamber (4) made of, for example, a copper plate having an infrared ray passing hole (4a) forming an aperture in the front so as to surround a predetermined position of the inner wall (1a) in contact with the liquid nitrogen (3) of the vacuum chamber (1). 4) is provided, and for example, a photoconductive semiconductor infrared detecting element (5) is adhesively fixed to the inner wall (1a) in contact with the liquid nitrogen (3) in the cold shield chamber (4). In this case, the semiconductor infrared detecting element (5) is adhered to the inner side wall (1a) in contact with the liquid nitrogen (3) and is disposed in the cold shield chamber (4). ) Is substantially the same as the boiling point of the liquid nitrogen (3), for example, -196 ° C., and almost no infrared light is emitted from the semiconductor infrared detecting element (5) itself and its vicinity, and the semiconductor infrared detecting element (5) In the case of 5), there is almost no infrared irradiation from the periphery, and the influence of noise is reduced accordingly. This photoconductive type semiconductor infrared detecting element (5) has a resistance value which decreases according to the amount of infrared rays to be irradiated. For example, as shown in FIG. 3, a switch (7) is provided by a constant current circuit (6).
A constant current is supplied to the semiconductor infrared detecting element (5) through the semiconductor device, and a voltage obtained between both ends of the semiconductor infrared detecting element (5) is detected to detect the amount of infrared rays, that is, the temperature. Like In FIG. 3, (8) is a power supply terminal to which a DC voltage is supplied, and (9) is an output terminal. This cold shield room (4)
An infrared window (10) is provided on the outer wall (1b) of the vacuum chamber (1) facing a). This infrared window (10)
Is composed of a germanium plate that transmits substantially only infrared rays.
斯る従来の赤外線検出装置を於いて測定物体(11)の
温度分布を検出するときは真空室(1)の外と測定物体
(11)との間に配された水平及び垂直走査用のミラーよ
り成る検出点走査系(12)及びレンズ系(13)を介して
得られる検出点の赤外線を赤外線ウインド(10),赤外
線通過孔(4a)を通して半導体赤外線検出素子(5)に
照射する如くして行っていた。When detecting the temperature distribution of the measuring object (11) in such a conventional infrared detecting device, a mirror for horizontal and vertical scanning arranged between the outside of the vacuum chamber (1) and the measuring object (11). An infrared ray at a detection point obtained through a detection point scanning system (12) and a lens system (13) is irradiated to a semiconductor infrared detection element (5) through an infrared window (10) and an infrared passage hole (4a). I was going.
斯る従来の赤外線検出装置に於いてはレンズ系(13)
を構成する対物レンズ,中継レンズ,集光レンズは真空
室(1)の外側に配されるのでこの半導体赤外線検出素
子(5)とこのレンズ系(13)との距離が比較的長くな
り、この為このレンズ系(13)のレンズの径が比較的大
きなものを必要としていた。この為このレンズ系(13)
を通過する測定物体(11)よりの赤外線の他にこのレン
ズ系(13)により反射されたノイズ源となる比較的多量
の赤外線がこの測定物体(11)よりの赤外線と共にこの
半導体赤外線検出素子(5)に照射され、比較的S/Nが
悪くなる不都合があった。またレンズ系(13)を含む光
学系が比較的大きくなるので装置全体も比較的大きくな
る不都合があると共にこの光学系のレンズは赤外線用の
ゲルマニウムにより構成されているのでこのレンズの径
が大きくなるとこの価格がより高価となる不都合があっ
た。In such a conventional infrared detecting apparatus, a lens system (13)
Are arranged outside the vacuum chamber (1), the distance between the semiconductor infrared detecting element (5) and the lens system (13) becomes relatively long. Therefore, the lens of the lens system (13) needs to have a relatively large diameter. Therefore this lens system (13)
In addition to the infrared light from the measurement object (11) passing through the lens system, a relatively large amount of infrared light which is a source of noise reflected by the lens system (13), together with the infrared light from the measurement object (11), is used as the semiconductor infrared detection element ( Irradiated in 5), there was a disadvantage that the S / N was relatively poor. In addition, since the optical system including the lens system (13) is relatively large, there is a disadvantage that the entire device is relatively large, and the lens of this optical system is made of germanium for infrared rays. There was the disadvantage that this price was more expensive.
本発明は斯る点に鑑みS/Nの良好な赤外線検出ができ
るようにすると共に光学系を小さくできる様にすること
を目的とする。In view of the above, an object of the present invention is to enable infrared detection with good S / N and to reduce the size of an optical system.
本発明赤外線検出装置は例えば第1図に示す如く真空
室(1)により容器(2)を形成し、この容器(2)内
を冷却する機構(3)とすると共にこの真空室(1)の
内側壁(1a)の所定位置にコールドシールド室(4)を
設け、このコールドシールド室(4)の内側壁(1a)に
接して半導体赤外線検出素子(5)を配し、この半導体
赤外線検出素子(5)の対向する真空室(1)の外側壁
(1b)に赤外線ウインド(10)を設け、この赤外線ウイ
ンド(10)よりの赤外線の量をこの半導体赤外線検出素
子(5)により検出する様にした赤外線検出装置に於い
て、この真空室(1)内のコールドシールド室(4)の
赤外線ウインド(10)側に集光レンズ(14)を配したも
のである。In the infrared detector of the present invention, for example, as shown in FIG. 1, a container (2) is formed by a vacuum chamber (1), and a mechanism (3) for cooling the inside of the container (2) is provided. A cold shield chamber (4) is provided at a predetermined position on the inner wall (1a), and a semiconductor infrared detector (5) is arranged in contact with the inner wall (1a) of the cold shield chamber (4). An infrared window (10) is provided on the outer wall (1b) of the vacuum chamber (1) facing (5), and the amount of infrared light from the infrared window (10) is detected by the semiconductor infrared detecting element (5). In the infrared detector described above, a condenser lens (14) is disposed on the side of the infrared window (10) of the cold shield chamber (4) in the vacuum chamber (1).
本発明に依れば真空室(1)内のコールドシールド室
(4)の赤外線ウインド(10)側に集光レンズ(14)を
配したので測定物体(11)よりのこの赤外線の光線束を
小さくでき、この光学系を小さくできると共にこの集光
レンズ(14)は低温例えば−196℃であるコールドシー
ルド室(4)に配されているのでこの半導体赤外線検出
素子(5)には集光レンズ(14)よりのノイズ源となる
放射赤外線,反射赤外線は無視できるほど小さくなりS/
Nの良好な赤外線検出ができる。According to the present invention, since the condenser lens (14) is arranged on the side of the infrared window (10) of the cold shield chamber (4) in the vacuum chamber (1), this infrared ray flux from the measurement object (11) is transmitted. Since the size of the optical system can be reduced and the condenser lens (14) is disposed in the cold shield chamber (4) at a low temperature, for example, -196 ° C., the semiconductor infrared detecting element (5) has a condenser lens. (14) The radiated infrared rays and reflected infrared rays, which are the noise sources, become so small that they can be ignored.
Good infrared detection of N is possible.
以下第1図を参照しながら本発明赤外線検出装置の一
実施例につき説明しよう。この第1図に於いて第2図に
対応する部分には同一符号を付し、その詳細説明図は省
略する。An embodiment of the infrared detecting apparatus according to the present invention will be described below with reference to FIG. In FIG. 1, portions corresponding to FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
本例に於いても第2図と同様に真空室(1)により有
底円筒形の容器(2)を形成する。この場合容器(2)
はマホービンと同様に構成されたものである。この真空
室(1)により形成された容器(2)内に冷却液例えば
沸点が−196℃の液体窒素(3)を注入する。この真空
室(1)の液体窒素(3)に接触している内側壁(1a)
の所定位置本例では内側壁(1a)の下方に前方に絞りを
構成する赤外線通過孔(4a)を有する例えば銅板より成
るコールドシールド室(4)を設け、このコールドシー
ルド室(4)内の液体窒素(3)と接触する内側壁(1
a)に例えばホトコンダクティブタイプの半導体赤外線
検出素子(5)を接着固定する。この場合この半導体赤
外線検出素子(5)は液体窒素(3)と接触している内
側壁(1a)に接着されると共にコールドシールド室
(4)内に配されているので、この半導体赤外線検出素
子(5)の温度はこの液体窒素(3)の沸点例えば−19
6℃と略同じ温度となり、この半導体赤外線検出素子
(5)自体及びその近辺より赤外線は略んど放射され
ず、この半導体赤外線検出素子(5)はその周辺よりの
赤外線の照射はほとんどなくそれだけ雑音の影響が少な
くなる。Also in this example, a cylindrical container (2) with a bottom is formed by a vacuum chamber (1) as in FIG. In this case the container (2)
Is constructed in the same manner as Mahobon. A cooling liquid, for example, liquid nitrogen (3) having a boiling point of -196 ° C. is injected into a container (2) formed by the vacuum chamber (1). The inner wall (1a) of the vacuum chamber (1) in contact with the liquid nitrogen (3)
In this example, a cold shield chamber (4) made of, for example, a copper plate having an infrared ray passing hole (4a) forming a diaphragm is provided below the inner side wall (1a). Inner side wall (1) in contact with liquid nitrogen (3)
In (a), for example, a semiconductor infrared detecting element (5) of a photoconductive type is adhesively fixed. In this case, the semiconductor infrared detecting element (5) is adhered to the inner wall (1a) in contact with the liquid nitrogen (3) and is disposed in the cold shield chamber (4). The temperature of (5) is the boiling point of this liquid nitrogen (3), for example, -19.
The temperature is substantially the same as 6 ° C., and almost no infrared light is emitted from the semiconductor infrared detecting element (5) itself and its vicinity, and the semiconductor infrared detecting element (5) hardly irradiates infrared light from its surroundings. The effect of noise is reduced.
このコールドシールド室(4)の赤外線通過孔(4a)
に対向するこの真空室(1)の外側壁(1b)に略赤外線
だけを通過するゲルマニウム板により構成した赤外線ウ
インド(10)を設ける。Infrared hole (4a) of this cold shield room (4)
An infrared window (10) made of a germanium plate that transmits substantially only infrared light is provided on the outer wall (1b) of the vacuum chamber (1) facing the vacuum chamber (1).
本例に於いてこの真空室(1)のコールドシールド
(4)の赤外線通過孔(4a)をふさぐ如く集光レンズ
(14)を配する。この場合本例に於いてはこの集光レン
ズ(14)の焦点距離fとこの集光レンズ(14)及び半導
体赤外線検出素子(5)の間の距離とを等しくすると共
にこの集光レンズ(14)の集光点が半導体赤外線検出素
子(5)上になる如くする。またこの集光レンズ(14)
は略赤外線のみを通過するゲルスニウムにより構成す
る。In this embodiment, a condenser lens (14) is arranged so as to cover the infrared ray passage hole (4a) of the cold shield (4) of the vacuum chamber (1). In this case, in this embodiment, the focal length f of the condenser lens (14) is made equal to the distance between the condenser lens (14) and the semiconductor infrared detecting element (5), and the condenser lens (14) is made. ) Is focused on the semiconductor infrared detecting element (5). Also this condenser lens (14)
Is made of germanium, which passes only substantially infrared rays.
またこのホトコンダクティブタイプの半導体赤外線検
出素子(5)は照射される赤外線の量に応じて抵抗値が
小さくなるもので本例に於いても第3図に示す如く定電
流回路(6)よりこの半導体赤外線検出素子(5)に一
定電流を流しておき、この半導体赤外線検出素子(5)
の両端間に得られる電圧を検出して、これにより赤外線
の量(高温になるほど赤外線の量を多く放射することが
知られている。)即ち温度を検出する様にする。In addition, the resistance of the photoconductive semiconductor infrared detecting element (5) becomes smaller in accordance with the amount of infrared rays to be irradiated. In the present embodiment, the constant current circuit (6) as shown in FIG. A constant current is passed through the semiconductor infrared detecting element (5), and the semiconductor infrared detecting element (5)
Is detected, thereby detecting the amount of infrared rays (it is known that the higher the temperature, the more the amount of infrared rays is emitted), that is, the temperature.
かかる本例に依る赤外線検出装置に於いて測定物体
(11)の温度分布を検出するときは真空室(1)の外と
測定物体(11)との間に配された水平及び垂直走査用の
ミラーより成る検出点走査系(12)及び対物レンズ,中
継レンズ等のレンズ系(13a)を介して得られる検出点
の赤外線を赤外線ウインド(10)及び集光レンズ(14)
を介して半導体赤外線検出素子(5)に照射する如くす
る。When detecting the temperature distribution of the measuring object (11) in the infrared detecting apparatus according to the present embodiment, horizontal and vertical scanning arranged between the outside of the vacuum chamber (1) and the measuring object (11) are performed. A detection point scanning system (12) composed of a mirror and an infrared window at a detection point obtained through a lens system (13a) such as an objective lens and a relay lens (13a) and a condenser lens (14)
Irradiates the semiconductor infrared detecting element (5) through the.
この場合本例に於いては真空室(1)内のコールドシ
ールド室(4)の赤外線ウインド(10)側に集光レンズ
(14)を配したので、この赤外線ウインド(10)に垂直
に入射される平行光がこの半導体赤外線検出素子(5)
に照射されることになり、測定物体(11)よりのこの赤
外線の光線束を小さくでき、この光学系を小さくでき、
それだけこの装置全体を小さくでき且つ安価となる。因
みに赤外線の光学系はゲルマニウム等より構成するので
レンズ等の径が大きくなるにつれ多次関数的に高価とな
る。またこの集光レンズ(14)は低温例えば−196℃で
あるコールドシールド室(4)に配されているので、こ
の半導体赤外線検出素子(5)には集光レンズ(14)よ
りのノイズ源となる放射赤外線,反射赤外線は無視でき
るほど小さくなりS/Nの良好(従来に比しノイズ源は例
えば1/5となる。)な温度分布を測定できる。In this case, in this example, since the condenser lens (14) is arranged on the side of the infrared window (10) of the cold shield chamber (4) in the vacuum chamber (1), the light enters the infrared window (10) perpendicularly. The parallel light to be emitted is the semiconductor infrared detecting element (5).
And the infrared ray flux from the measurement object (11) can be reduced, and the optical system can be reduced.
As a result, the entire device can be made smaller and less expensive. Incidentally, since the infrared optical system is made of germanium or the like, as the diameter of the lens or the like increases, the cost increases in terms of a multi-order function. Since the condenser lens (14) is disposed in the cold shield chamber (4) at a low temperature of, for example, -196 ° C., the semiconductor infrared detecting element (5) has a noise source from the condenser lens (14). The radiated infrared rays and reflected infrared rays are so small that they can be ignored, and a temperature distribution with a good S / N ratio (for example, the noise source is 1/5 as compared with the conventional one) can be measured.
尚本発明は上述実施例に限らず本発明の要旨を逸脱す
ることなく、その種々の構成が取り得ることは勿論であ
る。It is to be noted that the present invention is not limited to the above-described embodiment, but may adopt various configurations without departing from the gist of the present invention.
本発明に依ればS/Nの改善された良好な温度分布測定
ができる利益があると共に赤外線の光学系を小さくでき
装置全体が小型化でき且つそれだけ安価となる利益があ
る。According to the present invention, there is an advantage that a good temperature distribution measurement with an improved S / N can be obtained, and further, there is an advantage that an infrared optical system can be made smaller, the entire apparatus can be made smaller, and the cost can be reduced accordingly.
第1図は本発明赤外線検出装置の一実施例を示す要部の
断面図、第2図は従来の赤外線検出装置の例を示す断面
図、第3図は赤外線検出装置の説明に供する接続図であ
る。 (1)は真空室、(1a)は内側壁、(1b)は外側壁、
(2)は容器、(3)は冷却液、(4)はコールドシー
ルド室、(5)は半導体赤外線検出素子、(10)は赤外
線ウインド、(14)は集光レンズである。FIG. 1 is a sectional view of an essential part showing an embodiment of the infrared detecting device of the present invention, FIG. 2 is a sectional view showing an example of a conventional infrared detecting device, and FIG. 3 is a connection diagram for explaining the infrared detecting device. It is. (1) is a vacuum chamber, (1a) is an inner wall, (1b) is an outer wall,
(2) is a container, (3) is a cooling liquid, (4) is a cold shield chamber, (5) is a semiconductor infrared detecting element, (10) is an infrared window, and (14) is a condenser lens.
Claims (1)
却する機構とすると共に上記真空室の内側壁の所定位置
にコールドシールド室を設け、該コールドシールド室の
上記内側壁に接して半導体赤外線検出素子を配し、該半
導体赤外線検出素子の対向する真空室の外側壁に赤外線
ウインドを設け、該赤外線ウインドよりの赤外線の量を
上記半導体赤外線検出素子により検出する様にした赤外
線検出装置に於いて、上記真空室内のコールドシールド
室の赤外線ウインド側に集光レンズを配したことを特徴
とする赤外線検出装置。A vacuum chamber forms a container, a mechanism for cooling the inside of the container is provided, and a cold shield chamber is provided at a predetermined position on an inner wall of the vacuum chamber, and a cold shield chamber is provided in contact with the inner wall of the cold shield chamber. An infrared detecting device in which a semiconductor infrared detecting element is provided, an infrared window is provided on an outer wall of a vacuum chamber opposed to the semiconductor infrared detecting element, and an amount of infrared light from the infrared window is detected by the semiconductor infrared detecting element. 3. An infrared detecting apparatus according to claim 1, wherein a condenser lens is arranged on an infrared window side of the cold shield chamber in the vacuum chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63217833A JP2706669B2 (en) | 1988-08-31 | 1988-08-31 | Infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63217833A JP2706669B2 (en) | 1988-08-31 | 1988-08-31 | Infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266415A JPH0266415A (en) | 1990-03-06 |
| JP2706669B2 true JP2706669B2 (en) | 1998-01-28 |
Family
ID=16710463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63217833A Expired - Lifetime JP2706669B2 (en) | 1988-08-31 | 1988-08-31 | Infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2706669B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2061605B1 (en) | 2006-08-28 | 2014-05-14 | Air Products and Chemicals, Inc. | Apparatus and method for controlling the flow rate of a cryogenic liquid |
| CN101842629A (en) * | 2007-08-28 | 2010-09-22 | 气体产品与化学公司 | Apparatus and method for providing condensation-and frost-free surfaces on cryogenic components |
| JP6193553B2 (en) * | 2012-11-02 | 2017-09-06 | 日本信号株式会社 | Terahertz wave detection sensor |
| JP7441621B2 (en) * | 2019-09-12 | 2024-03-01 | セイコーNpc株式会社 | infrared measurement system |
-
1988
- 1988-08-31 JP JP63217833A patent/JP2706669B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0266415A (en) | 1990-03-06 |
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