JP2737264B2 - Semiconductor device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor device, and more particularly to a semiconductor device having at least one of a logic circuit and a memory circuit.

[Conventional technology]

Conventionally, in a semiconductor device having at least one of a logic circuit and a memory circuit, as shown in the plan view of FIG. 2A, a power supply input section 22, a signal input section 23, and an output section 24 of each cell 21 are formed by wiring. It is pulled out to the electrode pad provided at the end of the chip 25, and for connection of the substrate on which the semiconductor device is mounted,
For example, mechanical processes such as wire bonding and bump connection have been performed. A pair of an input unit and an output unit in a system including a plurality of the semiconductor devices are connected by metal wiring, and a power supply input unit, a signal input unit, and an output unit as the system are configured as shown in FIG. As shown in the plan view of (2), the wiring is led out to the electrode pads 27 arranged on each side of the substrate 26 on which the plurality of semiconductor devices are mounted.

[Problems to be solved by the invention]

In the semiconductor device having at least one of the above-described conventional logic circuit and memory circuit, since the input portion and the output portion are extended to the electrode pads by wiring, the signal propagation delay time attributed to the resistance and capacitance of the wiring system. There is a disadvantage that the operating speed of the logic circuit or the memory circuit is reduced while the signal propagates through the wiring system.

In addition, a mechanical process such as aluminum wire bonding or bump connection is applied to the connection between the semiconductor device and the substrate on which the semiconductor device is mounted, which causes a reduction in yield.

Further, some substrates on which the semiconductor device is mounted are provided with multilayer wiring in order to meet the demand for high density. However, the wiring life is shortened due to a rise in temperature due to Joule heat when current flows through the multilayer wiring. There is a disadvantage that. Further, for the purpose of improving heat dissipation, a ceramic substrate or the like provided with gold wiring is used, but the use of such a ceramic substrate has a disadvantage that the cost is high.

Further, a metal wiring is provided between a pair of an input unit and an output unit in a system having a plurality of semiconductor devices and having one function as a whole, and is attributed to the resistance and capacitance of the wiring system. There is a disadvantage that the signal propagation delay time increases and the operation speed of the system decreases.

[Means for solving the problem]

According to the present invention, in a semiconductor device having at least one of a logic circuit and a memory circuit, one of a plurality of the semiconductor devices having a microwave receiving function at an input portion and a microwave transmitting function at an output portion is arranged on a substrate. A plurality of pairs of the input unit and the output unit defined by the same microwave frequency are provided, and different microwave frequencies are assigned to each of the plurality of pairs. A semiconductor device that transmits signals and forms a system having one signal transmission function on the entire substrate.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) show an embodiment of the present invention, and are a plan view of a semiconductor device and a plan view of a system including a plurality of the semiconductor devices and having one function as a whole.

As shown in FIG. 1 (a), a cell 2 is provided on a chip 1,
A power supply electrode pad 3 and a power supply wiring 4 are arranged. Each cell 2 has a power input 5, a signal input 6, and a signal output 7. Power is supplied to each cell 2 through an electrode input section 5 through a power supply wiring 4 connected to a power supply electrode pad 3 on the chip 1. Each signal input unit 6 is connected to a microwave receiving circuit, and has a function of receiving a microwave transmitted from another cell or an output unit of a chip in the same system and converting it to an input signal. .
Each signal output unit 7 is connected to a microwave transmission circuit, and has a function of converting an output signal into a microwave and transmitting the microwave to another cell or an input unit of another chip in the same system. Have.

In FIG. 1 (b), a plurality of semiconductor devices, such as chips 1, 1a, etc., a system power supply electrode pad 9, a system input electrode pad 10, and a system output electrode pad are provided on a substrate 8. 11 is installed. The system power is supplied from the outside of the system to the system power supply electrode pad 9 by the system power supply line 12, and the power is supplied to each chip through the system power supply wiring 13 laid vertically and horizontally in the system.
1, 1a etc. Signal transmission between chips in the system or between cells in the same chip is performed by microwave propagation between a pair of signal input units 6a and signal output units 7a defined at the same frequency, as described above. Different microwave frequencies are assigned to the signal input unit 6a and the signal output unit 7a. Signal input section 6a, 6b, signal output section 7
a and 7b can be arranged at any position in the system.

An input signal from the outside of the system to the inside of the system enters through the external wiring 14 into the input electrode pad 10 of the system arranged around the substrate 8, and the input micro pad of the system similarly provided on each side of the substrate 8. The signal is transmitted to the wave transmitting circuit 15 on the wiring, is converted into a microwave, and is transmitted to cells in the system. An output signal from the inside of the system to the outside is transmitted by microwaves from the cells in the system, transmitted to the microwave receiving circuit 16 for the system provided on each side of the substrate 8, where the electric signal is transmitted. Is transmitted to the output electrode pad 11 of the system provided on each side of the substrate 8 on the wiring, and is transmitted to the outside of the system through the external wiring 14a.

The input microwave transmission circuit 15 of the paired system and the signal input unit 6c on the chip in the system are defined at the same frequency, and the input microwave transmission circuit 15 of each system and the Different microwave frequencies are assigned to pairs of the signal input sections 6c. Similarly, the output microwave receiving circuit 16 of the paired system and the signal output unit on the chip in the system
7c are defined by the same frequency, and different microwave frequencies are assigned to the pair of the output microwave receiving circuit 16 of each system and the signal output unit 7c on the chip in the system.

The chips 1, 1a, etc. need only be adhered to the substrate. Further, since the calorific value is small, it is not necessary to use an expensive material such as ceramic as a substrate material.

As microwave receiving circuit and microwave transmitting circuit,
Use a circuit that uses IMPATT or Gunn diode. Also, shield the entire system with metal so that microwaves do not leak out of the system.

〔The invention's effect〕

As described above, the present invention relates to a semiconductor device having at least one of a logic circuit and a memory circuit,
The input unit has a microwave receiving function, the output unit has a microwave transmitting function, and a pair of input units and outputs defined by the same frequency in a system including a plurality of semiconductor devices and having one function as a whole. By assigning different microwave frequencies to each of the units, an input signal can be applied to any position on the chip and an output signal can be extracted from any position on the chip. There is an effect that the signal propagation delay in the wiring between the electrode pad and the input / output unit is eliminated.

In addition, the connection between the semiconductor device and the substrate on which the semiconductor device is mounted only needs to be a power supply line, which has the effect of simplifying the process and improving the yield.

Further, a reduction in the wiring life due to Joule heat when a current flows through the wiring system is reduced, and a ceramic substrate or the like for dissipating heat does not need to be used, so that the cost is reduced.

Further, in a system including a plurality of semiconductor devices and having one function as a whole, there is an effect that a signal propagation delay between a paired input unit and output unit is eliminated.

[Brief description of the drawings]

1 (a) and 1 (b) are plan views of an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are plan views of a conventional semiconductor device. 1,1a chip, 2 cells, 3 electrode pads for power, 4 power wiring, 5 power input, 6, 6a, 6b, 6c
... Signal input part, 7,7a, 7b, 7c ... Signal output part, 8 ... Substrate, 9 ... System power electrode pad, 10 ... System input electrode pad, 11 ... System output Electrode pad, 12 ... Power line for system 13, Power line for system 13, 14, 14a External wiring, 15
... System input microwave transmission circuit, 16 ... System output microwave reception circuit, 21 ... Cell, 22 ... Power input section, 23
…… Signal input section, 24 …… Output section, 25, 25a …… Chip, 26
... board, 27 ... electrode pads.

Claims (1)

(57) [Claims] In a semiconductor device having at least one of a logic circuit and a memory circuit, a plurality of semiconductor devices having a microwave receiving function at an input portion and a microwave transmitting function at an output portion are arranged on one substrate. A plurality of pairs of the input unit and the output unit defined by the same microwave frequency are provided, and different microwave frequencies are assigned to each of the plurality of pairs. A semiconductor device having a single signal transmission function for the entire substrate.