JP2760342B2 - Cap for electronic component package, mold for manufacturing electronic component package, and method of manufacturing these - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package cap for sealing a high frequency chip, a mold for manufacturing an electronic component package, a method for manufacturing an electronic component package cap, and an electronic component package manufacturing method. The present invention relates to a method for manufacturing a mold.

[0002]

2. Description of the Related Art Ultra-high frequency devices include transistors, ICs, optical elements, surface acoustic wave elements, and resonators. These devices are used in commercial communication equipment and satellites, and even if they are somewhat expensive, they must have high reliability and long life. I have.

[0003] In recent years, many ultra-high frequency devices have been used in consumer appliances used in ordinary households, such as satellite broadcast receivers and mobile phones. Although devices used in consumer devices do not need to be formed to have higher reliability and longer life than commercial communication devices, how to make them at low cost is a major issue. For this reason, the cost is reduced by incorporating the super-high frequency chip sealed in the hollow package made of ceramic into the hollow package made of synthetic resin.

[0004] This kind of hollow package made of synthetic resin is formed by bonding a cap to a case on which a semiconductor chip or the like is mounted. A conventional synthetic resin hollow package will be described with reference to FIGS. FIG.
FIG. 1A is a diagram showing an ultra-high frequency semiconductor device manufactured using a conventional synthetic resin hollow package, and FIG.
FIG. 2B is a sectional view taken along line XII-XII in FIG. FIG. 13 is a view showing a mold for molding a conventional cap. FIG. 13 (a) is a plan view of a second mold, and FIG. 13 (b) is a longitudinal sectional view. Note that the broken position in FIG. 2B is indicated by a line XIII-XIII in FIG.

FIG. 14 is a view for explaining a conventional method of manufacturing a hollow package. FIG. 14A is a plan view in an adhesive application step, and FIG. 14B is a view taken along the line XIV-XIV in FIG. FIG. 4C is a cross-sectional view showing a state after the adhesive is applied;
FIG. 4D is a cross-sectional view showing a state in which the cap has been transported above the case, and FIG. 4E is a cross-sectional view showing a state in the bonding step.

In these figures, reference numeral 1 designates a conventional ultra-high frequency semiconductor device. This semiconductor device 1 comprises an ultra-high frequency semiconductor chip 3 bonded to a lead frame 2 and wire-bonded to a case 4 and a cap. 5 is sealed by a hollow package. The case 4 of the hollow package is formed by loading the lead frame 2 before chip bonding into a mold (not shown), injecting an epoxy resin into the mold, and solidifying the resin. In this case 4
Is molded into a cylindrical shape with a bottom, and a lead frame 2
The die pad 2a and the inner lead 2b are exposed. The lead frame 2 is formed with a plurality of semiconductor device forming portions each having a die pad 2a, an inner lead 2b, and an outer lead 2c, and a case mold molds a case 4 at a time at each of the semiconductor device forming portions. It adopts a structure to do.

The cap 5 is formed by injecting an epoxy resin into a mold and solidifying it.
The cap 5 has a concave portion 5 a formed on the end surface on the case 4 side, and the outside of the concave portion 5 a is adhered to the end surface of the cylindrical portion of the case 4 with an adhesive 6. A molding die used for molding the cap 5 is denoted by reference numeral 7 in FIG.
Indicated by

The molding die 7 comprises a first die 8 and a second die 9, and the cavities 8a, 9a are formed in these dies 8, 9, respectively. A gate 10 is formed on the mold 8. The bottom wall of the cavity 9a of the second mold 9 has a central portion protruding toward the first mold 8 to form the recess 5a of the cap 5. In forming the projecting portion, the periphery of the portion to be the projecting portion is ground by a grinder or the like so as to be dented.

Further, the cavity 8a of the first mold 8 is provided.
A convex or concave portion (not shown) for forming an identification mark (hereinafter, referred to as an orientation) at a position corresponding to a reference lead (for example, the first pin) on the case 5 side on the upper surface of the cap 4. Has formed. In this molding die 7, the surfaces of the cavities 8a and 9a of the first die 8 and the second die 9 are plated to enhance wear resistance and releasability.

An adhesive 6 for bonding the cap 5 to the case 4
Is applied to the cap 5 by a screen printing method as shown in FIG. Reference numerals 11 in FIGS.
Is an adhesive application device, and the adhesive application device 1
Reference numeral 1 denotes a configuration in which a squeegee 13 spreads a viscous liquid adhesive 6 on the upper surface of the mask 12. The mask 12 has a plurality of mask openings 12 a and is positioned above the cap 5.

The cap 5 is held on the tray 14 with the end face 5b where the recess 5a is open facing upward. The tray 14 has a structure in which the cap 5 is held at a position corresponding to the mask opening 12a of the mask 12. The mask opening 12a is formed so that the hole diameter is substantially the same as the outer diameter of the cap 5.

In FIG. 14C, reference numeral 15 denotes a heating furnace, and in FIG. 14D, reference numeral 16 denotes a vacuum suction nozzle for transporting the cap 5. Further, a case 4 shown in the figure has a semiconductor chip 3 mounted on a lead frame 2 and subjected to wire bonding. FIG.
In (d) and (e), what is indicated by reference numeral 17 is a heater plate.

Next, a procedure for manufacturing the conventional ultrahigh frequency semiconductor device shown in FIG. 12 will be described. First, the case 4 and the cap 5 are manufactured. The case 4 is formed by loading the lead frame 2 into a mold (not shown) and injecting and solidifying an epoxy resin. afterwards,
The case 4 is completed by bonding the semiconductor chip 3 to the die pad 2a and performing wire bonding. The case 4 is transported onto the heater plate 17 together with the lead frame 2 after the completion of the bonding step.

The cap 5 is formed by injecting epoxy resin from the gate 10 into the cavities 8a and 9a of the mold 7 shown in FIG. 13 and solidifying the same.
After the epoxy resin is solidified, the cap 5 is released from the mold and stored in a transport container (not shown). Here, the reason why the caps 5 are stored in the transport container is to transport the individually molded caps 5 to the adhesive application device 11 collectively.

After the cap 5 is transported to the adhesive application device 11 by a transport container, the cap 5 is taken out of the transport container by a handling device (not shown) and mounted on a tray 14 of the adhesive application device 11. After the cap 5 is held on the tray 14, as shown in FIG.
1, the adhesive 6 is spread over the mask 12 with a squeegee 13. When the adhesive 6 is spread in this manner, the adhesive 6 is buried in the mask opening 12a of the mask 12 and adheres to the end face 5b of the cap 5 on the concave side.

Thereafter, the tray 14 is moved to the adhesive application device 11.
Away from At this time, the adhesive 6 adhering to the concave portion side end surface 5b of the cap 5 is separated from the adhesive 6 on the mask 12 side and remains on the cap 5. Next, FIG.
As shown in (c), the adhesive 5 is brought into a semi-cured state by supplying the cap 5 together with the tray 14 into the heating furnace 15 and heating the same. This is because when the caps 5 are transferred to a subsequent process, the caps 5 may adhere to each other,
Is to prevent adhesion to a transport container (not shown).

After taking out the cap 5 from the heating furnace 15, the cap 5 is put into the above-mentioned transfer container and transferred to the cap bonding apparatus shown in FIG. Then, the cap 5 is taken out of the transport container by a handling device (not shown) and aligned on a stage (not shown). In this handling apparatus, the cap 5 is positioned such that the bottom surface (the surface opposite to the concave end surface 5b to which the adhesive 6 is adhered) faces upward and the orientation corresponds to the first pin of the case 4. To be aligned. Next, after confirming whether or not the bottom surface of the cap 5 is positioned on the upper side and whether or not the orientation position corresponds to the first pin, the suction nozzle 16 sucks the bottom surface.

Thereafter, as shown in FIG. 14 (d), the cap 5 is transported above the case 4 by the suction nozzle 16, and is placed on the heater plate 17 as shown in FIG. 14 (e). To the top surface of the heated case 4. Then, the adhesive 6 is heated and melted by the heat of the case 4 and then hardened, so that the cap 5 is bonded to the case 4 via the adhesive 6. Case 4 and cap 5
In FIG. 12A, the area where the adhesive 6 is interposed is shown by hatching in FIG.

After the cap 5 is adhered to the case 4, the outer leads 2c of the lead frame 2 are cut off from the frame portion by a lead forming device (not shown), and the outer leads 2c are subjected to a bending process, as shown in FIG. By forming into the shape shown, the semiconductor device for ultrahigh frequency 1 is completed.

[0020]

However, in manufacturing an ultrahigh frequency semiconductor device using a hollow package made of synthetic resin, molding the cap 5 has been a problem. That is, recent ultrahigh frequency semiconductor devices have been miniaturized until the outer diameter of the package is about 2 mm, and the cap 5 used for such a small package is bonded to the mold 7 and released. This is because the property is extremely low. It is conceivable to use an eject pin at the time of releasing the mold. However, if the outer diameter of the cap 5 is about 2 mm, the eject pin becomes extremely small in diameter. The number of parts to be formed increases, and the cost increases.

Further, when the package is small as described above, there is a problem that the area of the bonding portion between the case 4 and the cap 5 cannot be made large. This is shown in FIG.
This is because the cavities 8a and 9a of the mold 7 shown in FIG. 3 are formed by grinding. That is,
Since there is a limit to making the cutter of the grinding machine small,
This is because the outer peripheral corner of the cavity 9a for molding the surface of the cap 5 to be bonded to the case 4 {indicated by R in FIG. 13B} is formed in an arc-shaped cross section.

When the corner R is formed in an arc-shaped cross section,
A flat portion, that is, a portion where the adhesive force of the adhesive 6 acts on the concave portion side end surface 5b of the cap 5 becomes relatively narrow. To prevent this, the diameter of the cap 5 may be increased to increase the bonding area. However, this not only increases the size of the package, but also causes the cap 5 to be attached to the case 4 when the cap 5 is bonded to the case 4. When it is displaced, it protrudes largely to the side.

In order to increase the bonding area, the cavity 9a of the mold 7 is not formed by grinding,
This can also be realized by forming the mold 9 with two molds. For example, the second mold 9 includes an outer mold having an opening that forms a peripheral wall portion of the cavity 9a, and an inner mold that forms a bottom wall of the cavity 9a by being inserted into the opening, It is conceivable to adopt a structure in which the corners R are substantially perpendicular.

However, if this structure is adopted, the mold resin permeates into the gap between the outer die and the inner die, and burrs are formed at the bottom of the cap 5. When the burrs are formed, the cap 5 is strongly adhered to the mold 7, so that it is extremely difficult to release the burrs, and a deburring step is required, resulting in an increase in cost. To prevent the generation of burrs, the outer mold and the inner mold should be formed so that the gap between these fitting parts is as small as possible. It becomes difficult and the manufacturing cost of the mold increases.

Further, conventionally, since the cap 5 formed by the mold 7 is transported to the adhesive coating device 11 or the cap bonding device using a transport container, the caps 5 in the transport container are transported during the transport. May collide with each other and the corner of the cap 5 may be chipped. Furthermore, the cap 5 is removed from the transport container and the adhesive application device 11 is removed.
In supplying the liquid to the cap and the cap bonding device, a handling device for aligning the orientation of the cap 5 in the vertical direction with the position of the orientation is required. Since such a multifunctional handling device is expensive, the manufacturing cost of the package also increases in this respect.

The present invention has been made in order to solve such a problem, and it is a first object of the present invention to provide a cap for an electronic component package which is small in size and easily released from a mold.
The purpose of. Further, it is an object of the present invention to provide a mold for manufacturing an electronic component package, which prevents a mold resin from penetrating deeply into a gap between an outer mold and an inner mold so as not to increase the cost and obtains high releasability. As a second object. It is a third object of the present invention to provide a mold capable of molding an electronic component package having a large bonding area. Still another object of the present invention is to provide a method for manufacturing a mold and a cap for an electronic component package that can prevent a cap after molding from being chipped during transportation and can easily align the direction of the cap. And

[0027]

According to a first aspect of the present invention, there is provided a cap for an electronic component package, wherein a mold resin portion molded by a first mold having a gate for injecting a sealing resin is loaded into the mold. It is formed so as to fit into the hole of the plate-shaped frame and to be narrower than the part formed by the second mold.

The cap according to the present invention, when molded, contacts the first mold having the gate with a larger contact area than the second mold, and furthermore, the end formed by the second mold. Engages the plate-like frame,
The mold is released together with the plate-shaped frame while being attached to the first mold.

According to a second aspect of the present invention, there is provided a mold for manufacturing an electronic component package, wherein one of the first mold and the second mold has an outer mold having an opening for forming a side wall of a cavity; An inner mold that is inserted into the opening to form a cavity bottom wall, and extends between the outer mold and the inner mold in the cavity from the outer mold to the inner mold without interruption. It is provided with a plating layer.

Therefore, since the plating layer intervenes in the gap between the outer mold and the inner mold, the sealing resin does not penetrate deep into this gap. Further, the corners of the cavities formed by the side walls of the cavity formed by the outer mold and the bottom wall of the cavity formed by the inner mold do not have rounded corners as compared with the case where the entire area of the cavity is formed by machining.

According to a third aspect of the present invention, there is provided a mold for manufacturing an electronic component package, wherein the cap of the electronic component package comprising an electronic component mounting case and a cap adhered to the case is connected to the first die and the second die. The two molds are configured such that the two molds hold the plate-shaped frame having the holes therebetween and that the holes are positioned in the cavity in a mold-clamped state. The cavity of one of the molds is formed such that the side wall has a configuration in which the inner peripheral surface of the hole is extended, and the other mold is formed to have a larger diameter than the hole to form the cavity side wall. It comprises an outer mold having an opening, and an inner mold that is fitted into the opening to form a cavity bottom wall, and a gate is formed in the one mold.

The mold for manufacturing an electronic component package according to the fourth invention is the mold for manufacturing an electronic component package according to the third invention, wherein the first mold and the plate-shaped frame are in contact with each other. The opening shape of the mold is similar to the hole of the plate frame, the opening shape of the first mold is smaller than or equal to the hole, and the opening shape of the second mold is larger than the hole. It is composed.

According to the third and fourth aspects of the present invention, the cap is formed in the hole of the plate-shaped frame, and the portion of the cap formed by the second mold is the first mold. This part becomes larger than the molded part and this part engages with the plate-like frame. Also, since the molded cap is formed integrally with the gate, the cap contacts the first mold on the gate side with a larger contact area than the second mold,
Adhesive force to the first mold is relatively large.

The cap formed by the mold according to the present invention has one end fitted into the hole of the plate-shaped frame and the other end extended outside the hole, so that it is held by the frame. State. Further, the cap can be removed from the plate-like frame by pressing the one end formed by the first mold in a later step without changing the direction in the vertical direction or the rotation direction.

According to a fifth aspect of the present invention, there is provided a mold for manufacturing an electronic component package according to the third aspect of the present invention, wherein the first mold is disposed below the second mold. It was established. Therefore, the mold resin that has been solidified by the gate and adhered to the plate-shaped frame is positioned below the plate-shaped frame, and the mold resin drops downward from the plate-shaped frame only by applying an impact to the plate-shaped frame after release. I do.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a cap for an electronic component package, comprising the steps of: mounting the cap in an electronic component package comprising an electronic component mounting case and a cap adhered to the case; A plurality of frames are formed on a frame by a mold. Therefore, a plurality of caps can be formed so as to be held by the plate-shaped frame, and can be conveyed in this state.

A method for manufacturing an electronic component package cap according to a seventh aspect of the present invention is the method for manufacturing an electronic component package cap according to the sixth aspect of the present invention, wherein the mold is provided on a wall surface forming a cavity of a mold during molding. The identification mark is formed on the outer surface of the mold resin by the identification mark molding portion. Therefore, the plurality of caps can be conveyed in a state where the caps are held by the plate-shaped frame and the identification marks are aligned.

According to an eighth aspect of the present invention, there is provided a method of manufacturing a mold for manufacturing an electronic component package, comprising injecting a sealing resin into cavities formed in a first mold and a second mold. At least one of the molds is formed by combining an outer mold having an opening forming the side wall of the cavity, and an inner mold forming the bottom wall of the cavity by being inserted into the opening. Plating is performed on the wall surface of the cavity in a state where the inner mold is combined with the inner mold.

According to the present invention, the plating layer is formed continuously without interruption from the outer mold to the inner mold in the plating step, and the plating layer intervenes between these two molds. Therefore, when the production method of the present invention is adopted,
Even if the outer mold and the inner mold are formed to have dimensions that can be easily combined, the sealing resin does not penetrate deeply between the outer mold and the inner mold during molding. Also, in manufacturing a mold that forms a corner in a molded product with an outer mold and an inner mold, plating that has conventionally been performed is simply performed after the outer / inner mold combination process. In other words, it is only necessary to change the execution time of the plating step.

[0040]

BEST MODE FOR CARRYING OUT THE INVENTION

First Embodiment Hereinafter, a cap for an electronic component package according to a first invention, a mold for manufacturing an electronic component package according to the third to fifth inventions, and a cap for an electronic component package according to the sixth invention will be described. One embodiment of the manufacturing method will be described in detail with reference to FIGS. Here, an embodiment in which the present invention is applied to a hollow package type semiconductor device for ultra-high frequency will be described. A mold for manufacturing the hollow package cap and a method for manufacturing a hollow package cap using the mold will be described.

FIG. 1 is a longitudinal sectional view of an ultra-high frequency semiconductor device manufactured using the electronic component package cap according to the first invention, and FIG. 2 is an electronic component package cap according to the first invention. (A) is a longitudinal sectional view and (b) of FIG.
Is an enlarged sectional view showing a fitting portion between the outer die and the inner die, FIG. 4C is a plan view of the second die, and FIG. 4D is an outer die in FIG. It is a top view which expands and shows the fitting part with a metal mold. Note that the broken position in FIG.
Indicated by -II line.

FIG. 3 is a view showing a procedure for manufacturing a mold die for a cap. FIG. 3 (a) is a process diagram, and FIG. 3 (b) is a cross-sectional view showing a state where an inner die is plated. FIG. 3C is a cross-sectional view showing the configuration of the cap mold.
FIG. 4D is a sectional view showing an assembled state of the second mold.

FIGS. 4A and 4B are diagrams showing a procedure for manufacturing a hollow package of the semiconductor device for an ultrahigh frequency, wherein FIG. 4A is a plan view of a cap frame, and FIG. FIG. 1C is a cross-sectional view showing a state when the cap is molded, FIG. 2D is a cross-sectional view showing a state after the cap is released, and FIG. 1E is a state in a cap punching step. FIG. 7F is a cross-sectional view showing a state in which the cap is being sucked by the suction nozzle, and FIG. 7G is a cross-sectional view showing a state in the bonding step.

FIGS. 5A and 5B are cross-sectional views showing the procedure for releasing the mold. FIG. 5A shows a state in which the second mold is pulled up, and FIG. FIG. 3C shows a state in which the unnecessary resin portion is removed by a hammer. In these figures, the same or equivalent members as those shown in FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description is omitted.

The semiconductor device for ultrahigh frequency shown in FIG. 1 has the same configuration as that shown in FIG. 12B except that the structure of the cap is different. That is, after molding the case 4 on the lead frame 2, the semiconductor chip 3 for ultrahigh frequency is mounted, and after wire bonding, the lower end of a cap 21 described later is adhered to the case 4 with the adhesive 6.

The cap 21 is formed by a molding die 22 shown in FIG.
a and the small-diameter portion 21 at the upper end (the end opposite to the case 4)
b and a large diameter portion 21c at the lower end. The small diameter portion 21b is a lower portion (large diameter portion 21c) bonded to the case 4.
It is formed so as to have a smaller diameter.

The mold 22 for molding the cap 21 is composed of a first mold 23 and a second mold 24 as shown in FIG. These two molds 2
Reference numerals 3 and 24 adopt a structure for holding the metal plate frame 25 by clamping during mold clamping. The frame 25 has a hole 25a of a desired shape. In this embodiment,
The shape of the hole is circular, but is not limited to a circle. In the case of a rectangular cap, the shape of the hole may be rectangular or oval. The first mold 2
Reference numeral 3 denotes a cavity 23a having a circular opening shape and a gate 2
3b, and the second pressing device (not shown)
It is configured to move up and down with respect to the mold 24. Further, the cavity 23a is provided in the frame 2
The fifth circular hole 25a is formed such that the inner peripheral surface is extended. Further, the opening of the portion where the cavity 23a is in contact with the frame 25 and excluding the gate 23b is formed so as to be similar to the hole 25a of the frame 25, and the inner diameter of this opening is the same as the inner diameter of the hole 25a. They are formed to be the same or smaller by the alignment accuracy.

The second mold 24 has a cavity 24a.
And an inner mold 27 forming a bottom wall. The outer mold 26 has an opening 26a having a larger diameter than the cavity 23a of the first mold 23 and a circular opening shape. The inner mold 27,
The center portion of the upper surface (the portion to be the bottom wall of the cavity 24a) is formed so as to have a recess 21a formed in the cap 21 formed by the molding die 22. Project toward the mold 23 side. The outer peripheral portion of the upper surface of the inner mold 27 is formed flat to form the bonding surface of the cap 21.

The mold 22 has a plurality of cap molding portions each including the cavity 23a of the first mold 23 and the cavity 24a of the second mold 24. That is, a plurality of caps 21 are formed in one frame 25 by using a frame 25 in which a circular hole 25a is opened at a position corresponding to each cap forming portion.

Hard chrome plating is applied to the wall surfaces of the cavities 23a and 24a so as to enhance corrosion resistance and abrasion resistance and maintain good releasability over a long period of time. This plating layer is denoted by reference numeral 28 in FIG.
Indicated by The plating layer 28 includes an outer mold 26 and an inner mold 27.
Each is formed so as to have a thickness of 2 μm. The outer and inner dies 26 and 27 are provided with a gap at the fitting part {FIG.
(D) cannot be combined unless｝ indicated by the symbol d is formed in the range of about 0 to 5 μm, so that the plating layer 28 is formed to have a size obtained by subtracting the thickness thereof. If the gap d is too large, the sealing resin will penetrate into the mold during molding, causing burrs. In this embodiment, the inner diameter of the opening of the outer mold 26 is about 4.5 μm larger than the designed value. In addition, the inner mold 27 is formed so that the outer diameter is smaller than the design value by about 4.5 μm, so that the intrusion of the sealing resin is suppressed as small as possible.

That is, when the plating layer 28 having a thickness of 2 μm is formed, the inner diameter of the opening is reduced by 4 μm and the outer diameter of the inner mold 26 is increased by 4 μm.
It becomes about μm. If the gap d is 1 μm, the sealing resin hardly penetrates without impairing the combination of the outer and inner molds 26 and 27.

Next, a method of manufacturing the second mold 24 will be described in more detail with reference to FIG. The second mold 24 is
As shown in FIG. 3A, after the outer mold 26 and the inner mold 27 are individually formed and subjected to plating treatment, both molds are adjusted while adjusting the height of the inner mold 27. Manufactured by combining. The plating process is performed as shown in FIG. That is, the plating solution 3 stored in the plating tank 29
0, the outer mold 26 and the inner mold 27 of the first mold 23 and the second mold 24 are individually immersed, and a DC voltage is applied between these molds and the electrode 31. . When the plating process is performed, a plating layer 28 is formed on the surface of each mold as shown in FIG.

After performing the plating process as described above, the first mold 23 is mounted on a press (not shown), and the second mold 24 is mounted on a base (not shown).
6 and the inner mold 27 are mounted in a combined state. In combining the outer mold 26 and the inner mold 27, FIG.
This is performed as shown in (d). That is, this is performed by fitting the circular flange 27a of the inner mold 27 into the large-diameter hole 26b of the outer mold 26 and screwing the fixing plate 32 to the lower end of the outer mold 26.

In combining the outer and inner dies 26 and 27, the lower end surface of the inner die 27 and the upper end surface of the circular flange 27a are cut to change the height of the inner die 27 so that the cavity 24a is formed. Adjust the position of the bottom wall.

The procedure for manufacturing the cap 21 with the thus-configured mold 22 will be described with reference to FIGS. First, the frame 25 shown in FIG. 4A is loaded into the mold 22 as shown in FIG. At this time, the frame 25 is positioned so that the circular hole 25a of the frame 25 coincides with the side wall of the cavity 23a. Next, as shown in FIG.
The molten sealing resin 33 is injected into the cavities 23a and 24a from the third gate 23b and solidified. In the resin injection step, the sealing resin 33 is injected into the cavities 23a and 24a provided at a plurality of locations of the mold 22. By solidifying the sealing resin 33, the cap 21 formed on the frame 25 is obtained. Reference numeral 33a indicates a sealing resin solidified by the gate 23b.

Thereafter, the frame 25 is released from the mold. The procedure for releasing the mold will be described with reference to FIG. In FIG. 4, in order to mainly explain the cap shape, the first mold 23 is positioned above and the second mold 24 is positioned below. However, the upper and lower relations of these molds are described below. The reverse is also acceptable. Here, in describing the procedure for releasing the frame 25 from the mold, the first mold 2 is used.
3 is positioned on the lower side and the second mold 24 is positioned on the upper side. That is, FIG. 5A is drawn in a state where FIG. 4C is inverted.

The cap 21 and the frame 25 are released from the second mold 24 by pulling the second mold 24 upward with respect to the first mold 23. This is because the area of the portion where the sealing resin 33a solidified by the gate 23b contacts the first mold 23 is larger than the area of the portion of the cap 21 that contacts the second mold 24. Is relatively large and the large diameter portion 21c of the cap 21 is engaged with the frame 25, so that the second mold 24
Is released before the first mold.

Next, as shown in FIG. 5B, the frame 25 is released from the first mold 23 by pushing up the frame 25 with the push-up pins 34, and the vacuum suction device 35 is released.
For example, it is transferred onto the frame base 36 shown in FIG. Thereafter, the sealing resin 33a solidified at the gate portion by the hammer 37 is hit from above the frame 25, thereby removing most of the unnecessary sealing resin 33a. When the gate 23b is formed on the lower side in this manner, the unnecessary sealing resin 33a can be naturally dropped by gravity and removed. At this time, a part of the sealing resin 33a remains on the cap 21 side as indicated by reference numeral 33b in FIG.

As described above, the cap 21 formed by the mold 22 is provided with the cavity 23 a of the first mold 23.
Is smaller in diameter than the cavity 24a of the second mold 24, the diameter of the end on the first mold 23 side is relatively small, and the shape has a small diameter portion 21b.
The portion corresponding to the diameter of the end on the second mold 24 side is the large diameter portion 2
1c.

For this reason, even if the first mold 23 is pulled down while the frame 25 is fixed to the second mold 24, the presence of the large diameter portion 21c causes the cap 2
The mold 1 does not come off from the frame 25 and remains attached to the first mold 23. Conversely, frame 25
Is fixed to the first mold 23, the second mold 24 is pulled upward, but the cap 21 is connected to the sealing resin 33a solidified by the gate 23b. The mold is not released while being attached to the mold 24. That is, the cap 21 is released in a state of being coupled to the frame 25.

The cap 2 released as shown in FIG.
As shown in FIG. 4 (d), the small-diameter portion 21b is fitted into the circular hole 25a of the frame 25 and the other end thereof is circular hole 25 as shown in FIG.
a, and is held by the frame 25. Thereafter, a plurality of caps 21 formed on the frame 25 are held by the frame 25 as shown in FIG.
It is conveyed to the punching device 338 shown in (e). The punching device 38 includes a receiving table 38a for supporting the frame 25 and a punch 38b for pressing the cap 21 from above.

When the frame 25 is supplied to the punching device 38 and the cap 21 is pressed from above by the punch 38b,
The small diameter portion 21b is punched downward from the circular hole 25a of the frame 25, and the cap 21 is transferred to the inside of the receiving stand 38a. At this time, the sealing resin 3 solidified in the gate 23b
3b is separated from the small diameter portion 21. Thus, cap 2
After being transferred to the receiving table 38a, the suction nozzle 16 is sucked on the upper surface of the small diameter portion 21b, as shown in FIG. When the cap 21 is transferred to the receiving table 38a or when the suction nozzle 16 sucks, the cap 21 does not turn upside down or rotate. Then, as in the conventional case, the cap 21 is conveyed to the adhesive applying device (not shown) by the suction nozzle 16 and the adhesive 6 is applied thereto and adhered to the case 4. The device can be manufactured.

The cap 21 constituting the package of the semiconductor device for ultrahigh frequency is formed by molding a small-diameter portion 21b at one end with a first mold 23 having a gate 23b.
Since the other end is formed at step 4, when the mold 22 is opened after the molding, the small-diameter portion 21b remains on the first mold 22 with the small-diameter portion 21b adhered to the first mold 23, and the other end is the second mold. Release from the mold 24.

Further, since the frame 25 is clamped to the mold 22 and the cap 21 is formed in a state where the cavity 23a of the first mold 23 and the circular hole 25a are continuous, the cap 21 after the molding is The small-diameter portion 21b at one end is fitted into the circular hole 25a and the large-diameter portion 21c at the other end extends outside the circular hole 25a.
5 is reached. The cap 21 can be removed from the frame 25 by pressing the small-diameter portion 21b without changing the orientation in the vertical and rotational directions. Therefore, by removing the cap 21 from the frame 25 in a step after the molding step, the vertical and rotational directions of all the caps 21 become constant without using a handling device.

Further, after molding, a plurality of caps 21 are held by one frame 25, and all the caps 21 can be transported in this state.
Do not collide with each other during the transportation.

In this embodiment, since the corner of the cavity is formed by the side wall of the cavity 24a formed by the outer mold 26 and the bottom wall of the cavity 24a formed by the inner mold 27, the hollow is formed by machining. In comparison with the case, the corner 21d of the outer peripheral portion on the side of the bonding surface of the cap 21 (see FIG.
(D) Reference｝ does not become round. For this reason, the cap 21
Can be formed relatively large, so that the cap 21 can be firmly bonded to the case 4.

The gap d between the outer mold 26 and the inner mold 27
Is not 0, but since the diameter of the particles of the epoxy resin is small and about 10 μm, if the gap d is 5 μm or less, the epoxy resin hardly permeates here.
Since the phenolic resin has a particle diameter smaller than that of the epoxy resin, the sealing resin 33 may permeate into the gap d to generate burrs. This burr is denoted by reference numeral 3 in FIG.
9. However, in this embodiment, since the dimensions of the outer mold 26 and the inner mold 27 are set so that the gap d is minimized, the burrs 39 do not occur over the entire circumference of the cap 21, and are extremely small. small. For this reason,
For example, in the suction step shown in FIG. 4F, the suction nozzle 16 is easily crushed by pressing the cap against the cap 21 from above, and is buried in the adhesive layer at the time of bonding, so that deburring is not necessary.

Second Embodiment Hereinafter, one embodiment of a mold for manufacturing an electronic component package according to the second invention and a method for manufacturing a mold for manufacturing an electronic component package according to the eighth invention will be described. This will be described in detail with reference to FIGS. Here, a mold for manufacturing a cap of a semiconductor device for ultrahigh frequency and a method for manufacturing the same will be described.

FIG. 6 is a view showing a mold for a cap as a mold for an electronic component package according to the second invention. FIG. 6A is a longitudinal sectional view, and FIG. FIG. 2C is a plan view showing the fitting portion between the outer mold and the inner mold, and FIG. 2D is a sectional view showing the cap after molding. Note that the broken position in FIG. 7A is indicated by a VI-VI line in FIG. 7A and 7B are views for explaining a method of manufacturing a mold for an electronic component package according to the eighth invention, wherein FIG. 7A is a process diagram and FIG. 7B is a cross-section showing the structure of the mold. FIG. 3C is a cross-sectional view showing an assembled state of the second mold, and FIG. 4D is a cross-sectional view showing a state in a plating step. FIG. 8 is an enlarged sectional view showing a main part of the second mold. In these drawings, the same or equivalent members as those described in FIGS. 1 to 5 and FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description is omitted.

The mold 22 shown in FIGS. 6 to 8 is interrupted between the outer mold 26 and the inner mold 27 of the second mold 24 from the outer mold 26 to the inner mold 27. The plating layer 41 is formed so as to extend. That is, the plating layer 41 is formed so as to be interposed between the outer mold 26 and the inner mold 27. A portion of the plating layer 41 interposed in the gap is indicated by a reference numeral 41a in FIGS. 6B and 6C. Since the gap between the outer mold 26 and the inner mold 27 is narrowed to zero or close to zero by the intervening portion 41a, the cap 2 molded by the mold 22 is used.
In No. 1, as shown in FIG. 6D, no large burrs are formed at the corner 21d of the outer peripheral portion on the bonding surface side, and the mold is easily released after the molding.

Here, the second mold 24 has the plating layer 4
1 will be described in detail with reference to FIG. Second
7A, the outer mold 26 and the inner mold 27 are formed in a predetermined shape, respectively, and after combining these to adjust the position of the inner mold 27, as shown in FIG. It is manufactured by performing a plating process. In forming the outer and inner dies 26 and 27 into a predetermined shape, the outer and inner dies 26 and 27 are formed in such a size that they can be combined, that is, the tolerance is 0 to 5 μm.

For example, the opening 26a of the outer mold 26 is formed so that the inner diameter is about 2.5 μm larger than the designed value.
The inner mold 27 is formed such that the outer diameter is smaller than the design value by about 2.5 μm. Outer mold 26 and inner mold 2 after formation
7 is shown in FIG. The first mold 23 is also formed in a predetermined shape together with the second mold 24.

After forming each mold as described above, FIG.
As shown in (c), the inner mold 27 is combined with the outer mold 26, and both are fixed by the fixing plate 32. At this time, the circular flange 27a of the inner die 27 is fitted into the large-diameter hole 26b of the outer die 26, and the lower end surface of the inner die 27 and the upper end surface of the circular flange 27a are cut to obtain the height of the inner die 27. By changing the height, the position of the bottom wall of the cavity 24a is adjusted. In this combined state, the outer mold 26 and the inner mold 27
Is at most 5 μm.

Thereafter, as shown in FIG. 7D, the second mold 24 and the first mold 23 are subjected to hard chrome plating. The plating process is performed by immersing the second mold 24 or the first mold 23 in the plating solution 30 stored in the plating tank 29 and applying a DC voltage between these molds and the electrode 31. Do. When plating is performed in this way,
As shown in FIG. 8, a plating layer 41 is formed on the second mold 24 so as to extend from the outer mold 26 to the inner mold 27 without interruption.

That is, the substantial gap between the outer mold 26 and the inner mold 27 is narrowed by the interposed portion 41 a of the plating layer 41. In this embodiment, since the plating layer 41 is formed to have a thickness of 2 μm, a minute gap of 1 μm at the maximum is formed between the outer die 26 and the inner die 27 as shown in FIG. However, when epoxy resin is used as the sealing resin 33, the sealing resin 33 does not enter the gap of 1 μm, so that no burrs are generated. In addition,
The gap between the outer and inner dies can be made substantially zero by making the thickness of the plating layer 41 greater than in this embodiment.

Therefore, even if the second mold 24 manufactured as described above is formed to have a size that allows the outer mold 26 and the inner mold 25 to be easily combined, the distance between the two molds can be increased. Can be substantially filled with the plating layer 41 after the combination, the burrs do not occur at the corner 21d of the outer peripheral portion of the cap 21 on the bonding surface side. For this reason, the second mold 2 must be
Even in a configuration in which the outer mold 4 is formed by the outer mold 26 and the inner mold 27, both the assemblability of the second mold 24 and the releasability of the cap 21 can be improved.

In order to manufacture the mold 22 excellent in the assembling property and the releasability as described above, the plating treatment which has been conventionally performed is simply performed after the step of combining the outer and inner molds. In other words, it is only necessary to change the execution time of the plating step, so that the number of manufacturing steps and the number of parts do not increase.

Third Embodiment Another embodiment of a mold for manufacturing an electronic component package according to the second invention will be described in detail with reference to FIG. FIG. 9 is a view showing a mold for a case as a mold for an electronic component package according to the second invention. FIG. 9A is a longitudinal sectional view, and FIG. 9B is a bottom view of the first mold. FIG. The broken position in FIG. 9A is indicated by IX-IX in FIG. 9B.
Indicated by lines. In these figures, the same or equivalent members as those described in FIGS. 1 to 8 and FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the mold 22 shown in FIG. 9, the lead frame 2 is clamped and held by the first mold 23 and the second mold 24, and the second mold 24 forms the bottom of the case 4. And the first
Has a structure for forming a cylindrical portion of the case 4 projecting upward from the lead frame 2 in the case 4. In this embodiment, the cavity 24a of the second mold 24
Is formed by a concave portion formed in one mold block (second mold 24), and the cavity 23 of the first mold 23
“a” includes an outer mold 51, a first inner mold 52, and a second inner mold 53. The gate is formed on the second mold 24 in this embodiment. The gate is indicated by reference numeral 24b in FIG.

The outer die 51 has an opening 51 a forming the outer peripheral wall of the cavity 23 a of the first die 23, and the lower end thereof holds the lead frame 2 together with the second die 24. ing. The first inner mold 52 is formed in a cylindrical shape that fits into the opening 51a, and the second inner mold 53 is fitted into the inner peripheral part of the first inner mold 52. It is formed in a cylindrical shape. The first cylindrical inner mold 52 is formed so that the thickness is equal to the thickness of the cylindrical portion of the case 4 and is unevenly distributed upward by the height of the cylindrical portion. It is fixed to the outer mold 51. The second inner mold 53 has a lower end in contact with the upper surface of the lead frame 2, and a lower end of the outer peripheral surface forms an inner peripheral wall of the cavity 23a. Further, the outer mold 51, the first inner mold 5
The second and second inner molds 53 are fixed to each other so as to maintain the illustrated state by connecting upper ends (not shown) to each other with a fixing plate (not shown).

In the first mold 23 formed by combining three dies as described above, the surface of the cavity is subjected to hard plating in the combined state. The plating layer is indicated by reference numeral 54 in FIG. When plating is performed in a state where the three dies are combined, the gap between the adjacent dies is filled with the interposed portion 54a of the plating layer 54 as in the case of the second embodiment. It is.

Therefore, the case 4 formed by the mold 22 has corners formed on the outer periphery and the inner periphery of the bonding surface, so that the bonding area can be increased and the burrs are formed on the corners. Since it does not occur, it has high releasability.
In order to prevent burrs, the first mold 23
Since the above-mentioned three dies 51 to 53 are combined with each other and subjected to a plating process, the three dies can be formed into dimensions that can be easily combined, and the assemblability is high. .

Fourth Embodiment Still another embodiment of a mold for manufacturing an electronic component package according to the second invention will be described in detail with reference to FIG. FIG. 10 is a view showing a state in which the second invention is applied to a mold for manufacturing a mold resin package. FIG. 10 (a) is a longitudinal sectional view of the mold, and FIG. 10 (b) is the first mold. FIG. 4C is a bottom view of the mold, FIG. 5C is an enlarged perspective view showing a main part of the first mold, and FIG. 5D is a process diagram for manufacturing the mold. Note that, in the figure (b), the broken position in the figure (a) is shown by XX line. In these drawings, the same or equivalent members as those described in FIGS. 1 to 9 and FIGS. 12 to 14 are denoted by the same reference numerals, and detailed description thereof will be omitted.

A mold 22 shown in FIG. 10 is for molding a mold resin package. The second invention is applied to a first mold 23 for forming a recess on the upper surface of the package. ing. This mold 22 is
The first die 23 and the second die 24 use the lead frame 2
, The lower part of the package is molded by the second mold 24, and the upper part of the package is molded by the first mold 22. In this embodiment, the second mold 24
The cavity 24a of the first mold 23 is formed by a concave portion formed in one mold block (second mold 24), and the cavity 23a of the first mold 23 is fixed to the outer mold 61 and the inner mold. And a pin 62. Note that the lead frame 2 is drawn with the semiconductor chip, bonding wires, and the like omitted.

The outer die 61 has a recess 61a forming a part of the side wall and the upper wall of the cavity 23, and a rectangular hole 61 having a rectangular opening at a portion to be the upper wall.
b is formed. The fixing pin 62 is
The upper end (not shown) is fixed to the outer mold 61 with its lower end facing the cavity 23.

The first mold 22 has an outer mold 61
Hard chrome plating is performed in a state where the fixing pins 62 are combined. The plating layer is indicated by reference numeral 63 in FIG. The second mold 24 is similarly subjected to hard plating. When plating is performed on the first mold 22 as described above, the gap between the outer mold 61 and the fixing pin 62 is increased in the same manner as in the case of employing the second embodiment or the third embodiment. Is filled with the interposed portion 63a of the plating layer 63.

Therefore, the mold resin package formed by the mold 22 has high releasability since no burrs are formed at the opening edge of the recess formed by the first mold 23. In order to prevent burrs from occurring, plating is performed in a state where the fixing pin 62 is combined with the outer mold 61 of the first mold 23. 61b and the fixing pin 62 can be formed in dimensions that are easy to combine with each other, and the assemblability is high. For example, the square hole 61b and the fixing pin 62 are set to have a dimensional tolerance of 0 to 5 μm and the gap between them is 5 μm at the maximum.
m, the plating layer 63 has a thickness of 5 to 5 m.
By forming the gap to 8 μm, the gap is filled with the plating layer 63, so that generation of burrs can be prevented.

Fifth Embodiment A method for manufacturing an electronic component package cap according to a seventh invention will be described in detail with reference to FIG. 11A and 11B are views for explaining a method of manufacturing a cap having an identification mark. FIG. 11A is a longitudinal sectional view of a cap mold.
FIG. 2B is a bottom view of the first mold, and FIG. 2C is a cross-sectional view showing the cap after the mold is released. In addition, in the figure (b), the breaking position of the figure (a) is shown by the XI-XI line. In these figures, the same or equivalent members as those described in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description is omitted.

The mold 22 shown in FIG. 11 has a structure in which the cap 21 is formed so that the shape of the cap 21 when viewed from above is rectangular, and the portion of the first mold 23 which becomes the upper wall of the cavity 23a. Are formed with orientation (identification mark) forming projections 71. The orientation is an engraving indicating the position of the first pin of a case (not shown) to which the cap 21 is bonded.

The mold 22 has a first mold 23 and a second mold 24 provided with a plurality of cap molding portions each having a cavity 23a, 24a.
And a plurality of caps 21 are formed at one time. The frame 25 has a square hole 25b corresponding to the shape of the cap 21 at a position corresponding to the cap forming portion.

Further, in the second mold 24 of the mold 22, the opening 26 a of the outer mold 26 is formed so as to have a rectangular opening, and the inner metal having a rectangular cross section is formed in the opening 26 a. The mold 27 is fitted. Also, the second mold 2
4 also performs hard chrome plating in a state where the outer mold 26 and the inner mold 27 are combined, fills the gap between the outer and inner molds 26 and 27 with the plating layer 41, and adheres to the adhesive surface side of the cap 21. No burrs are formed at the corner 21d.

When the cap 21 is formed by using the thus-configured mold 22, as shown in FIG. 11C, the cap 21 is formed while being held by the frame 25, and the cap 21 is formed on the upper surface. Projection 71 of one mold 23
Thus, an orientation 72 is formed. Therefore, by forming the projections 71 at the same position in each cap forming portion of the mold 22, the orientation 72 can be provided at the same position on all the caps 21 formed on the frame 25.

Thus, the plurality of caps 21 can be conveyed to the bonding step with the identification marks 72 aligned with the frame 25 held in the frame 25. In the bonding step, the orientation of the caps 21 corresponds to the case in the bonding step. This eliminates the need for a step of aligning.

[0094]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In adopting the first embodiment and the second embodiment, the mold 22 is made of SK steel, SKD.
Made of steel, stainless steel, etc. The frame 25 used for molding the cap 21 is made of copper,
2 alloy, stainless steel, etc.
125 mm.

Further, as the sealing resin 33, which is a material of the cap 21, a bisphenol transparent resin was used in addition to the epoxy resin. As for the dimensions of the cap 21, the outer diameter of the small-diameter portion 21b indicated by the symbol d1 in FIG. 4D is 1.6φ, and the outer diameter of the lower portion indicated by the symbol d2 in the same drawing is 1.9φ. The outer diameter of the concave portion 21a of the cap 21 was 1.4φ, the depth was 0.2 mm, and the total height of the cap 21 was 0.5 mm. When the cap 21 was formed to have the above-mentioned dimensions by the mold 22 described in the first or second embodiment, the radius of curvature of the corner 21d on the adhesive surface side was 0.03 mm at the maximum, and the corner 21d. The bonding area was significantly increased as compared with the conventional cap 5 (see FIG. 12) in which the radius of curvature of R was 0.15 mm. The cap 21 of the present invention
Has an adhesion area of 1.12 mm ² , and the conventional cap 5 has an adhesion area of 0.47 mm ² when the outer dimensions are the same as the cap 21 of the present invention. Therefore, the bonding area of the cap 21 of the present invention is 2.4 times that of the conventional cap 5, and the bonding strength is twice or more.

In each of the above-described embodiments, the semiconductor device for ultra-high frequency has been described as an electronic component. However, the present invention can be applied to a device for high frequency, such as an optical element, a surface acoustic wave element, and a resonator. it can.

[0097]

As described above, in the electronic component package cap according to the first aspect of the invention, the mold resin portion formed by the first mold having the gate for injecting the sealing resin is formed into the mold mold. Since the cap is formed so as to fit into the hole of the loaded plate-shaped frame and to be narrower than the portion molded by the second mold, this cap is used in a first mold having a gate in a molded state. A contact area larger than that of the second mold, and
Since the end formed by the mold engages with the plate-shaped frame, the mold is released together with the plate-shaped frame while being attached to the first mold.

Therefore, the cap can be removed from the first mold by urging the plate-shaped frame, so that the mold can be easily released. The cap can be easily removed from the plate-like frame by pushing the molded resin portion molded by the first mold into the plate-like frame.

The mold for manufacturing an electronic component package according to the second invention is characterized in that one of the first mold and the second mold has an outer mold having an opening forming a side wall of a cavity; An inner mold that is inserted into the opening to form a cavity bottom wall, and extends between the outer mold and the inner mold in the cavity from the outer mold to the inner mold without interruption. Since the plating layer is provided, the plating layer is interposed in the gap between the outer mold and the inner mold, so that the sealing resin does not penetrate deep into this gap.

Therefore, the bonding area of the resin portion does not increase, so that the mold can be easily released even if the external dimensions of the package are extremely small. In addition, since the electronic component package formed by the mold does not generate a large flash at a portion corresponding to the gap, a deburring step is not required, and the flash may hit another component during transport, thereby causing a transport failure. Absent.

Further, the corner of the cavity formed by the side wall of the cavity formed by the outer mold and the bottom wall of the cavity formed by the inner mold has a corner as compared with the case where the whole area of the cavity is formed by machining. Because it doesn't get round
The bonding area of the electronic component package formed by the mold is relatively large when the surface formed by the inner die is used as the bonding surface. For this reason, according to the mold according to the present invention, it is possible to manufacture an electronic component package which is excellent in releasability even though it is small, and which is firmly adhered to the adherend.

According to a third aspect of the present invention, there is provided a mold for manufacturing an electronic component package, wherein the cap of the electronic component package including an electronic component mounting case and a cap adhered to the case is connected to the first die and the second die. The two molds are configured such that the two molds hold the plate-shaped frame having the holes therebetween and that the holes are positioned in the cavity in a mold-clamped state. The cavity of one of the molds is formed such that the side wall has a configuration in which the inner peripheral surface of the hole is extended, and the other mold is formed to have a larger diameter than the hole to form the cavity side wall. According to a fourth aspect of the present invention, there is provided an outer mold having an opening, and an inner mold which is inserted into the opening to form a cavity bottom wall, wherein a gate is formed in the one mold. Electronic component package manufacturing mode In the mold for manufacturing an electronic component package according to the third invention, the opening shape of the mold at a portion where the first mold contacts the plate-shaped frame is similar to the hole of the plate-shaped frame. None, the opening shape of the first mold is smaller than or equal to the hole, and the opening shape of the second mold is larger than the hole.

According to the third and fourth aspects of the present invention, the cap is formed in the hole of the plate-like frame, and the portion of the cap formed by the second mold is the first mold. This part becomes larger than the molded part and this part engages with the plate-like frame. Also, since the molded cap is formed integrally with the gate, the cap contacts the first mold on the gate side with a larger contact area than the second mold,
Adhesive force to the first mold is relatively large.

Therefore, when the first mold and the second mold are opened, the cap adheres to the first mold, and the plate-like frame is engaged with the first mold together with the cap because the cap is engaged. It remains on the mold side. Thereafter, the cap can be released from the first mold together with the plate frame by urging the plate frame. After the mold is released, the cap can be removed from the plate-shaped frame by pressing the portion of the cap formed by the first mold into the hole of the plate-shaped frame with a punch or the like.

Therefore, the cap can be easily released even if the external dimensions of the package are extremely small, and the cap can be transported while being held by the plate-shaped frame. And the work of the next step becomes easy.

The mold for manufacturing an electronic component package according to the fifth invention is the mold for manufacturing an electronic component package according to the third invention, wherein the first mold is arranged below the second mold. Since the mold resin solidified by the gate and adhered to the plate-shaped frame is positioned below the plate-shaped frame, the mold resin falls naturally only by applying an impact to the plate-shaped frame after release.

Therefore, the mold resin solidified by the gate can be easily removed from the plate frame.

According to a sixth aspect of the present invention, there is provided a method of manufacturing an electronic component package cap, comprising the steps of: mounting the electronic component package in a case of an electronic component mounting case; Since a plurality of caps are formed by a mold, a plurality of caps can be formed so as to be held in a plate-like frame, and can be conveyed in this state. Therefore, the caps do not collide with each other during the conveyance, and it is possible to prevent the corners of the cap from being chipped during the conveyance.

A method for manufacturing an electronic component package cap according to a seventh aspect of the present invention is the method for manufacturing an electronic component package cap according to the sixth aspect of the present invention, wherein the electronic component package cap is provided on a wall surface for forming a mold cavity during molding. Since the identification mark is formed on the outer surface of the mold resin by the identification mark forming portion, the conveyance can be performed with the plurality of caps held on the frame and the identification marks aligned.

Therefore, a handling device for aligning the cap so that the identification mark corresponds to the case in the bonding step becomes unnecessary, and a step of adjusting the position of the identification mark by the handling device becomes unnecessary. In addition, the number of steps can be reduced.

An eighth invention is a method of manufacturing a mold for manufacturing an electronic component package, which comprises injecting a sealing resin into a cavity formed in a first mold and a second mold. One of the molds is formed by combining an outer mold having an opening forming the side wall of the cavity and an inner mold forming the bottom wall of the cavity by being inserted into the opening. In order to apply plating to the wall surface of the cavity in combination with the mold, the plating layer is formed continuously without interruption from the outer mold to the inner mold in the plating process, and the plating layer is formed between these two molds. Will intervene.

Therefore, when the production method of the present invention is adopted,
Even if the outer mold and the inner mold are formed to a size that can be easily combined, the gap between the two is narrowed by the plating layer. The sealing resin does not penetrate deeply. For this reason, a mold for manufacturing an electronic component package having both excellent assemblability and releasability can be obtained.

Further, in manufacturing a mold for forming a corner in a molded product by using an outer mold and an inner mold, a plating treatment which has been conventionally performed is performed after a step of combining the outer and inner molds. In other words, it is only necessary to change the timing of performing the plating step. Therefore, since the number of manufacturing steps and the number of parts do not increase, it is possible to manufacture a mold having excellent assembling and releasing properties of the outer and inner dies without increasing the cost.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of an ultrahigh frequency semiconductor device manufactured using an electronic component package cap according to a first invention.

FIG. 2 is a view showing a cap mold used for manufacturing the electronic component package cap according to the first invention.

FIG. 3 is a diagram showing a procedure for manufacturing a cap mold.

FIG. 4 is a view showing a procedure for manufacturing a hollow package of the semiconductor device for ultra-high frequency.

FIG. 5 is a cross-sectional view showing a procedure for releasing the mold.

FIG. 6 is a view showing a cap mold as a mold for an electronic component package according to a second invention.

FIG. 7 is a diagram for explaining a method of manufacturing a mold for an electronic component package according to an eighth invention.

FIG. 8 is an enlarged cross-sectional view showing a main part of a second mold.

FIG. 9 is a view showing a case mold as a mold for an electronic component package according to the second invention.

FIG. 10 is a diagram showing a state where the second invention is applied to a mold for manufacturing a mold resin package.

FIG. 11 is a diagram for explaining a method of manufacturing a cap having an identification mark.

FIG. 12 is a view showing an ultra-high frequency semiconductor device manufactured using a conventional synthetic resin hollow package.

FIG. 13 is a view showing a mold for molding a conventional cap.

FIG. 14 is a view for explaining a conventional method of manufacturing a hollow package.

[Explanation of symbols]

2 ... lead frame, 3 ... semiconductor chip for ultra-high frequency, 4
... Case, 6 ... Adhesive, 21 ... Cap, 21b ... Small diameter part, 21c ... Large diameter part, 21d ... Corner part, 22 ... Mold mold, 23 ... First mold, 23a, 24a ... Cavity,
24 ... second mold, 25 ... frame, 25a ... circular hole,
25b: square hole, 26: outer mold, 26a: opening, 27:
Inner die, 29 plating bath, 33 sealing resin, 41 plating layer, 51 outer die, 52 first inner die, 53 second
Inner mold, 54 ... plating layer, 61 ... outer mold, 62 ... fixing pin, 63 ... plating layer, 71 ... protrusion, 72 ... orientation.

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Satoshi Murata 5-7-1 Shiba, Minato-ku, Tokyo NEC Inside (72) Inventor Kaoru Kubota 5-7-1 Shiba, Minato-ku, Tokyo NEC (72) Inventor Seiji Ichikawa 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (72) Inventor Tomoaki Hirokawa 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (72) Inventor Tomoaki Kimura 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (72) Inventor Taku Sato 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (72) Inventor Junichi Tanaka 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (56) References JP-A-5-226495 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB Name) H01L 23/00-23/10 H01L 21/56

Claims (8)

(57) [Claims] An electronic component package cap formed by molding a sealing resin with a mold including a first mold and a second mold has a gate for injecting the sealing resin. The mold resin portion molded by the first mold is formed so as to fit into the hole of the plate-shaped frame loaded in the mold and to be narrower than the region molded by the second mold. An electronic component package cap characterized by the following. 2. A mold for manufacturing an electronic component package in which a sealing resin is injected into a cavity formed in a first mold and a second mold, wherein one of the two molds is a side wall of the cavity. And an inner mold that forms one bottom wall of the cavity by being inserted into the opening, and the outer mold and the inner mold in the cavity are formed. A mold for manufacturing an electronic component package, comprising a plating layer extending between the outer mold and the inner mold without interruption. 3. An electronic component package comprising a case for mounting an electronic component and a cap adhered to the case, wherein the cap is sealed in a cavity formed in a first mold and a second mold. What is claimed is: 1. A mold for manufacturing an electronic component package, which is formed by injecting a sealing resin, wherein said mold holds said plate-shaped frame in which a hole is formed, and said hole is in a cavity in a mold-clamped state. And the cavity of the first mold of the two molds is formed such that the side wall extends the inner peripheral surface of the hole, and the second mold is formed by: An outer mold having an opening formed to be larger in diameter than the hole and forming a side wall of the cavity, and an inner mold forming one bottom wall of the cavity by being inserted into the opening, Game into the first mold A mold for manufacturing an electronic component package, wherein a mold is formed. 4. The mold for manufacturing an electronic component package according to claim 3, wherein an opening shape of the mold at a portion where the first mold and the plate-shaped frame are in contact is similar to a hole of the plate-shaped frame. Wherein the opening shape of the first mold is smaller than or equal to the hole, and the opening shape of the second mold is larger than the hole. 5. The mold according to claim 3, wherein the first mold is disposed below the second mold. . 6. An electronic component package comprising a case for mounting an electronic component and a cap bonded to the case, wherein a plurality of the caps are formed on a single plate-like frame by a mold. Manufacturing method for electronic component package caps. 7. A method for manufacturing a cap for an electronic component package according to claim 6, wherein an identification mark is formed on an outer surface of the molding resin by an identification mark forming portion provided on a wall surface forming a cavity of a mold during molding. A method for manufacturing a cap for an electronic component package. 8. A method for manufacturing a mold for manufacturing an electronic component package, comprising injecting a sealing resin into cavities formed in a first mold and a second mold, wherein one of the two molds is used. An outer mold having an opening forming the side wall of the cavity, and an inner mold forming the bottom wall of the cavity by being inserted into the opening are formed by combining these outer mold and the inner mold. A method of manufacturing a mold for manufacturing an electronic component package, wherein plating is performed on a wall surface of a cavity in a state where the mold is combined with the mold.