JP4786464B2 - Translucent cap member and manufacturing method thereof - Google Patents

Description

  The present invention relates to a translucent cap member for surface mounting and a method for manufacturing the same.

As a surface mounting cap member and a manufacturing method thereof, for example, one disclosed in Patent Document 1 is known. This document discloses a method of manufacturing a cap member in which a silicon plate is etched with a caustic potash aqueous solution to form a ring-shaped convex portion, and a tin cap solder bump is deposited and patterned on the surface of the convex portion. Has been.
Japanese Patent No. 3277646

  However, in the manufacturing method disclosed in the above patent document, since a silicon plate having excellent surface smoothness is used, the adhesion strength of the cap solder bump formed by vapor deposition to the silicon plate is low, and the cap solder bump It takes time to form and lacks mass productivity.

  The present invention has been made to solve the above problems, and an object thereof is to provide a translucent cap member having high adhesion strength and excellent mass productivity, and a method for producing the same.

  The translucent cap member according to the present invention comprises a transparent resin member having a recess formed on one surface, and a metal plate continuously provided so as to surround the entire circumference of the recess and sealed by the transparent resin member. The end face of the metal plate is exposed from the transparent resin member on one side.

  The translucent cap member configured as described above includes a transparent resin member and a metal plate, and is formed by sealing the metal plate with the transparent resin member, so that it can be easily manufactured. Excellent mass productivity can be obtained. Moreover, since the end surface of the metal plate is exposed from the transparent resin member on one surface of the transparent resin member and the other surface is sealed, the adhesion strength of the metal plate to the transparent resin member can be increased. . Further, since the end surface of the metal plate is exposed from the transparent resin member on one surface of the transparent resin member, the adhesion strength of the metal plate to the semiconductor element to which the translucent cap member is soldered can be increased. .

  The manufacturing method of the translucent cap member which concerns on this invention is a method of manufacturing the translucent cap member which concerns on said this invention, Comprising: (1) The said convex part of the board | substrate which is provided with a convex part and has electroconductivity A resist pattern forming process for forming a predetermined resist pattern on the main surface having a conductive pattern, and (2) conductive so as to surround the entire circumference of the convex portion on the main surface of the substrate excluding the resist pattern formed in the resist pattern forming process. A metal plate electrodeposition step of continuously electrodepositing a conductive metal to form a metal plate; (3) a resist pattern removal step of removing the resist pattern from the substrate after the metal plate electrodeposition step; and (4) After the resist pattern removing step, a resin sealing step of covering the metal plate with a resin using an upper mold having a shape corresponding to the shape of the main surface having the convex portion of the substrate, and (5) the substrate after the resin sealing step Group to remove A removal step, characterized in that it comprises a. In this case, the translucent cap member can be easily mass-produced.

  Moreover, the manufacturing method of the translucent cap member which concerns on this invention is a method of manufacturing the above-mentioned translucent cap member which concerns on this invention, Comprising: (1) The said board | substrate of a board | substrate which is provided with a convex part and has electroconductivity A resist pattern forming step of forming a predetermined resist pattern on the main surface having the convex portion, and (2) surrounding the entire circumference of the convex portion on the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step. A metal plate electrodeposition step of continuously electrodepositing a conductive metal to form a metal plate, and (3) a resist pattern removal step of removing the resist pattern from the substrate after the metal plate electrodeposition step; 4) After the resist pattern removing step, a resin sealing step of covering the metal plate with a resin using a flat upper mold, and (5) a substrate removing step of removing the substrate after the resin sealing step. Features . In this case, the translucent cap member can be easily mass-produced.

  According to the present invention, it is possible to provide a translucent cap member having high adhesion strength and excellent mass productivity, and a method for producing the same.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent components are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
First, 1st Embodiment of the translucent cap member which concerns on this invention, and its manufacturing method is described. FIG. 1 is a top view, a cross-sectional view, and a bottom view of the translucent cap member 1 according to the first embodiment. FIG. 1A shows a top view, FIG. 1B shows a cross-sectional view, and FIG. 1C shows a bottom view. The translucent cap member 1 shown in this figure includes a transparent resin member 30 in which a recess 12 is formed on one surface 30a, and a metal that is provided over the entire periphery of the recess 12 and sealed in the transparent resin member 30. Plate 26.

  Specifically, the translucent cap member 1 includes a disk-shaped window portion 10 disposed at the center position of the translucent cap member 1 and a frame that is provided around the window portion 10 and supports the window portion 10. It is formed integrally with the part 20. Further, the frame portion 20 is configured in a stepped manner from a flat portion 24 parallel to the window portion 10 and a connecting portion 22 that connects the flat portion 24 and the window portion 10. The connecting portion 22 has a truncated cone shape in which the upper end is connected to the end portion of the window portion 10 and the lower end is connected to the end portion of the flat portion 24, and extends from the upper end to the lower end. It is formed continuously so as to surround it. Thus, the window part 10 is supported by the frame part 20, and the truncated cone-shaped recessed part 12 is formed in the lower part of the window part 10. FIG. Further, the bottom surface 24 a of the flat portion 24 forms one surface 30 a of the transparent resin member 30.

  An annular metal plate 26 is continuously provided inside the flat portion 24 so as to surround the entire circumference of the recess 12, and is sealed with a transparent resin member 30. The lower surface 26a of the metal plate 26 is exposed from the transparent resin member 30 on one surface 30a of the transparent resin member 30, and is formed on the same plane as the bottom surface 24a of the flat portion 24. The other plane of the metal plate 26 is transparent. Covered by the resin member 30.

  As the transparent resin member 30 that forms the window portion 10 and the frame portion 20 (that is, the connecting portion 22 and the flat portion 24), a transparent resin used for resin sealing is used. And thermosetting epoxy transparent resin and silicone transparent resin which are transparent to the light emission wavelength of the light emitting element connected to the light receiving wavelength or the light receiving wavelength of the light receiving element.

  Since the translucent cap member 1 configured in this way is formed by resin-sealing the metal plate 26 using the transparent resin member 30, it is easily manufactured and excellent mass productivity is obtained. Since the metal plate 26 is continuously provided so as to surround the entire circumference of the recess 12, the lower surface 26a of the metal plate 26 exposed from the transparent resin member 30 is continuously soldered onto, for example, the light receiving element. The translucent cap member 1 can be mounted on the light receiving element, and the sealing property of the recess 12 can be easily secured.

  Since such a translucent cap member 1 remains in a resin-sealed form without being put into a package, it can be reduced in size and thickness, and the surface on other components such as a light receiving element Mounting density can be improved.

  Further, since the metal plate 26 is sealed by the transparent resin member 30 and the lower surface 26a is exposed from the transparent resin member 30, the adhesion strength of the metal plate 26 to the transparent resin member 30 can be obtained, and the metal plate 26 Reference numeral 26 functions as an alignment means, and when the translucent cap member 1 is mounted on another component, the alignment operation with the other component can be easily performed. For example, when the translucent cap member 1 is mounted on the light receiving element, the position of the metal plate 26 is set in accordance with the position of the electrode pad of the light receiving element in the design stage, and the metal plate 26 of the translucent cap member 1 is received. The position of the translucent cap member 1 can be easily determined by mounting directly on the electrode pad of the element with solder or the like and reflowing, and can be mounted with a high yield. In addition, since the translucent cap member 1 can be connected to other components by self-alignment when mounting by solder, highly accurate positioning can be easily performed.

  Further, the translucent cap member 1 is formed by resin-sealing the metal plate 26 with the transparent resin member 30, and the metal plate 26 is taken in by the transparent resin member 30 except for the lower surface 26 a. For this reason, the thickness of the translucent cap member 1 can be reduced, and the translucent cap member 1 can be thinned.

  Next, a method for manufacturing the translucent cap member 1 according to the first embodiment will be described. FIG. 2 is a flowchart for explaining a method of manufacturing the translucent cap member 1 according to the first embodiment. 3 and 4 are process diagrams illustrating a method for manufacturing the translucent cap member 1 according to the first embodiment. In these drawings, a case where a plurality of (four in the drawing) translucent cap members 1 are manufactured simultaneously is shown.

  First, in the substrate processing step (step S1), the convex portion 40a is formed on one surface of the conductive substrate 40 (FIGS. 3A and 3B). The board | substrate 40 used here is a metal plate with flat both surfaces, and thickness is 0.1 mm, for example, for example, consists of stainless steel, aluminum, copper, etc. Processing is performed so that a convex portion 40 a corresponding to the concave portion 12 of the translucent cap member 1 manufactured on one side of the substrate 40 is formed.

  In a resist pattern forming step (step S2) subsequent to the substrate processing step (step S1), a predetermined resist pattern 42 is formed on the main surface having the convex portions 40a of the substrate 40 provided with the convex portions 40a. A resist 42 is applied to the main surface of the substrate 40 along the concavo-convex shape of the main surface, and a resist 44 is applied to the other flat surface (FIG. 3C). The resist applied here is, for example, an alkali type photosensitive film resist having a thickness of 50 μm. A mask having a predetermined pattern is arranged on the main surface of the substrate 40 coated with the resist, and in this state, double-sided exposure is performed by ultraviolet irradiation, and development processing is performed. As a result, the resist on the main surface of the substrate 40 is cured, and a predetermined resist pattern 42 is formed (FIG. 3D).

  In the metal plate electrodeposition step (step S3) subsequent to the resist pattern formation step (step S2), the conductive metal is formed so as to surround the entire periphery of the convex portion 40a on the exposed portion of the main surface of the substrate 40 excluding the resist pattern 42. The electrode plate is continuously electrodeposited to form a metal plate 26 on the main surface of the substrate 40 (FIG. 3E). Before this electrodeposition, surface activation treatment such as removal of the surface oxide film by chemical etching or chemical treatment with chemicals is performed as necessary. For example, nickel, nickel-cobalt alloy, copper and other various metals are used as electrodeposits, and a matte bath of nickel sulfamate is used. The thickness of the resist pattern 42 is about 40 to 50 μm. A metal plate 26 is formed. If necessary, it is preferable to perform gold plating or the like for improving the binding force on the surface of the metal plate 26 in a thickness of 0.3 to 0.4 μm.

  In the resist pattern removal step (step S4) subsequent to the metal plate electrodeposition step (step S3), the resists 42 and 44 are removed from the substrate 40 (FIG. 3 (f)). As a resist removal method, a swelling removal method using an alkaline solution or the like is possible.

  In the resin sealing step (step S5) subsequent to the resist pattern removing step (step S4), the metal plate 26 is covered and sealed with the transparent resin member 30. Specifically, at this time, a mold die (upper mold) 50 having a shape corresponding to the shape of the main surface of the substrate 40 having the convex portions 40a is mounted on the upper surface of the substrate 40 (FIG. 4A). The transparent resin member 30 is press-fitted into the cavity in the mold. As the transparent resin member 30, for example, a thermosetting epoxy resin that is transparent to light having a light emission wavelength or a light reception wavelength is preferably used. At this time, the substrate 40 functions as a lower mold during resin molding. As a result, the transparent resin member 30 flows between the mold 50 and the substrate 40, and a plurality of window portions 10 and the like are arranged on the substrate 40 and are integrally sealed by the transparent resin member 30. (FIG. 4B). If a plurality of substrates 40 are arranged in parallel at the time of molding, and the transparent resin member 30 is distributed and press-fitted between each substrate 40 and the mold 50 by a runner, a large number of resin seals can be efficiently used. Can be stopped. And after the transparent resin member 30 hardens | cures, the mold die 50 is removed and a resin sealing process is complete | finished (FIG.4 (c)).

  In the substrate removal step (step S6) subsequent to the resin sealing step (step S5), the resin sealing body in which the lower surface 26a of the metal plate 26 is exposed is obtained by removing the substrate 40 (FIG. 4D). ). As a method for removing the substrate 40, in addition to a method for forcibly peeling and removing the substrate 40 from the resin sealing body, the resin sealing body side may be used depending on the material constituting the substrate 40 or the like. A method of dissolving and removing the substrate 40 with a solvent or the like that does not affect the surface is also possible. The lower surface 26a of the metal plate 26 and the bottom surface 24a of the flat portion 24 are on the same plane. If necessary, a thin film of a conductive metal layer such as gold or silver is formed on the lower surface 26a of the metal plate 26 to a thickness of 0.3 to 0.5 μm by a method such as flash plating after the process. You may do it.

  In the cutting step (step S7) subsequent to the substrate removal step (step S6), the resin sealing body is cut along the cutting line indicated by the broken line in FIG. The optical cap member 1 (FIG. 1) is manufactured.

  Thus, since the translucent cap member 1 is formed by resin-sealing the metal plate 26 with the transparent resin member 30, the translucent cap member 1 can be easily mass-produced, and the manufacturing cost can be reduced. The effect to do.

  Next, a modification of the translucent cap member 1 will be described with reference to FIG. 5A, the metal plate 262 is formed such that its lower surface 262a protrudes from the bottom surface 24a of the flat portion 24 (one surface 30a of the transparent resin member 30) to the outside of the translucent cap member 1. Has been. In this case, similar to the above embodiment, the translucent cap member 1 can be easily manufactured, and excellent mass productivity can be obtained and the adhesion strength of the metal plate to the transparent resin member can be increased. it can. Furthermore, since the lower surface 262a of the metal plate 262 protrudes from the bottom surface 24a of the flat portion 24 to the outside of the translucent cap member 1, an effect of preventing a short circuit or the like due to a solder flow during mounting can be expected. In this case, in the method of manufacturing the translucent cap member 1, the substrate to be used has a region where the conductive metal is to be electrodeposited (that is, a region where the metal plate 262 is formed) and the bottom 24 a of the flat portion 24. It is necessary to process so that it may become depressed with respect to the area | region formed.

  5B, the metal plate 264 is formed such that its lower surface 264a is recessed from the bottom surface 24a of the flat portion 24 to the inside of the translucent cap member 1. In this case, similar to the above embodiment, the translucent cap member 1 can be easily manufactured, and excellent mass productivity can be obtained and the adhesion strength of the metal plate to the transparent resin member can be increased. it can. Furthermore, since the lower surface 264a of the metal plate 264 is recessed from the bottom surface 24a of the flat portion 24 to the inside of the translucent cap member 1, an effect of preventing a short circuit due to a solder flow during mounting can be expected. In this case, in the method of manufacturing the translucent cap member 1, the substrate to be used has a region where the conductive metal is to be electrodeposited (that is, a region where the metal plate 264 is formed) and the bottom 24 a of the flat portion 24. It is necessary to process so that it may protrude with respect to the area | region formed.

(Second Embodiment)
Next, a second embodiment of the translucent cap member according to the present invention will be described. FIG. 6 is a top view, a cross-sectional view, and a bottom view of the translucent cap member 2 according to the second embodiment. FIG. 1A shows a top view, FIG. 1B shows a cross-sectional view, and FIG. 1C shows a bottom view. The translucent cap member 2 shown in this figure has a substantially rectangular parallelepiped shape, and a transparent resin member 80 having a concave portion 12 formed on one surface 80a and a transparent resin provided over the entire circumference of the concave portion 12. And a metal plate 26 sealed with a resin member 80. Specifically, the translucent cap member 2 includes a disk-shaped window portion 60 disposed at the center of the translucent cap member 2 and a frame that is provided around the window portion 60 and supports the window portion 60. It is formed integrally with the part 70.

  The difference between the translucent cap member 2 according to the second embodiment shown in FIG. 6 and the first embodiment is that the translucent cap member 1 is not formed in a step shape and the frame portion 70 is different. That is, the upper surface 70a of the window and the upper surface 60a of the window 60 are formed in the same plane. About the other structure of the translucent cap member 2 which concerns on 2nd Embodiment, since it has the same structure as 1st Embodiment, description is abbreviate | omitted.

  With such a configuration, the translucent cap member 2 according to the second embodiment is excellent in that the adhesion strength of the metal plate 26 to the transparent resin member 80 is high as in the first embodiment. Mass production becomes possible. Further, when performing surface mounting, it is possible to easily perform alignment work with other components. Furthermore, since this embodiment has the characteristic that the upper surface 70a of the frame part 70 and the upper surface 60a of the window part 60 are formed in the same plane, the thickness of the frame part 70 can be thickened, and a translucent cap member The mechanical strength of 2 can be increased.

  Next, a method for manufacturing the translucent cap member 2 according to the second embodiment will be described. The flowchart explaining the method for manufacturing the translucent cap member 2 according to the second embodiment is the same as that of the first embodiment. In the manufacturing process, since the substrate processing process (step S1) to the resist pattern removal process (step S4) are the same as those in the first embodiment described above, description thereof is omitted. Hereinafter, the characteristics of the manufacturing method of the translucent cap member 2 according to the second embodiment will be described with reference to FIG. FIG. 7 shows a case where a plurality of (four in the drawing) translucent cap members 2 are manufactured simultaneously.

  In the resin sealing step (step S5) subsequent to the resist pattern removing step (step S4), the metal plate 26 is covered and sealed with the transparent resin member 80. Specifically, a flat mold die (upper die) 90 is mounted on the upper surface of the substrate 40 (FIG. 7A), and the transparent resin member 80 is press-fitted into the cavity in the mold die. . As the transparent resin member 80, for example, a thermosetting epoxy resin that is transparent to light having a light emission wavelength or a light reception wavelength is preferably used. At this time, the substrate 40 functions as a lower mold during resin molding. As a result, the transparent resin member 80 flows between the mold 90 and the substrate 40, and a plurality of window portions 60 and the like are arranged on the substrate 40 and integrally sealed with the transparent resin member 80. (FIG. 7B). If a plurality of substrates 40 are arranged in parallel at the time of molding and the transparent resin member 80 is distributed and press-fitted between each substrate 40 and the mold die 90 by a runner, a large number of resin seals can be efficiently used. Can be stopped. Then, after the transparent resin member 80 is cured, the mold die 90 is removed, and the resin sealing step is completed (FIG. 7C).

  In the substrate removal process (step S6) subsequent to the resin sealing process (step S5), the resin sealing body in which the lower surface 26a of the metal plate 26 is exposed is obtained by removing the substrate 40 (FIG. 7D). ). As a method for removing the substrate 40, in addition to a method for forcibly peeling and removing the substrate 40 from the resin sealing body, the resin sealing body side may be used depending on the material constituting the substrate 40 or the like. A method of dissolving and removing the substrate 40 with a solvent or the like that does not affect the surface is also possible. The lower surface 26a of the metal plate 26 and the bottom surface 24a of the flat portion 24 are on the same plane. If necessary, a thin film of a conductive metal layer such as gold or silver is formed on the lower surface 26a of the metal plate 26 to a thickness of 0.3 to 0.5 μm by a method such as flash plating after the process. You may do it.

  In the cutting step (step S7) subsequent to the substrate removing step (step S6), the resin sealing body is cut along the cutting line indicated by the broken line in FIG. The optical cap member 2 (FIG. 6) is manufactured.

  Thus, since the translucent cap member 2 is formed by resin-sealing the metal plate 26 with the transparent resin member 80, the translucent cap member 2 can be easily mass-produced and the manufacturing cost can be reduced. The effect to do.

  It should be noted that a similar modification (FIG. 5) to the translucent cap member 2 according to the first embodiment can be employed for the translucent cap member 2 according to the second embodiment. The description is omitted.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the end face of the metal plate is exposed from the transparent resin member on one side of the translucent cap member, but both end faces may be exposed from the transparent resin member so as to penetrate the transparent resin member. Good. Moreover, the shape of a window part and a frame part is not restricted to said embodiment, A various change in the range which does not deviate from the technical idea of this invention is possible.

It is the top view, sectional drawing, and bottom view of the translucent cap member which concerns on 1st Embodiment. It is a flowchart explaining the method to manufacture the translucent cap member which concerns on 1st Embodiment. It is process drawing explaining the method to manufacture the translucent cap member which concerns on 1st Embodiment. It is process drawing explaining the method to manufacture the translucent cap member which concerns on 1st Embodiment. It is a figure which shows the modification of the translucent cap member which concerns on 1st Embodiment. It is the upper side figure, sectional drawing, and bottom view of the translucent cap member which concerns on 2nd Embodiment. It is process drawing explaining the method to manufacture the translucent cap member which concerns on 2nd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 2 ... Translucent cap member 10, 60 ... Window part, 12 ... Recessed part, 20, 70 ... Frame part, 26, 262, 264 ... Metal plate, 30, 80 ... Transparent resin member, 40 ... Substrate, 40a ... convex portions, 42, 44 ... resist, 50, 90 ... mold (upper die).

Claims (3)

A transparent resin member having a recess formed on one surface;
A metal plate continuously provided so as to surround the entire circumference of the recess and sealed with the transparent resin member;
With
The metal plate has an end surface exposed from the transparent resin member on the one surface,
The translucent cap member characterized by the above-mentioned. A method for producing the translucent cap member according to claim 1,
A resist pattern forming step of forming a predetermined resist pattern on the main surface having the convex portions of the conductive substrate provided with the convex portions;
A metal plate electrode is formed by continuously electrodepositing a conductive metal on the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step so as to surround the entire circumference of the convex portion. Wearing process,
After the metal plate electrodeposition step, a resist pattern removal step of removing the resist pattern from the substrate,
After the resist pattern removing step, a resin sealing step of covering the metal plate with a resin using an upper mold having a shape corresponding to the shape of the main surface having the convex portion of the substrate,
A substrate removal step of removing the substrate after the resin sealing step;
The translucent cap member manufacturing method characterized by comprising. A method for producing the translucent cap member according to claim 1,
A resist pattern forming step of forming a predetermined resist pattern on the main surface having the convex portions of the conductive substrate provided with the convex portions;
A metal plate electrode is formed by continuously electrodepositing a conductive metal on the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step so as to surround the entire circumference of the convex portion. Wearing process,
After the metal plate electrodeposition step, a resist pattern removal step of removing the resist pattern from the substrate,
After the resist pattern removing step, a resin sealing step of covering the metal plate with a resin using a flat upper mold,
A substrate removal step of removing the substrate after the resin sealing step;
The translucent cap member manufacturing method characterized by comprising.

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