JP2765350B2 - Package mounting abnormality detection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package mounting abnormality detecting device for detecting an abnormality in package mounting in a unit constituted by mounting a plurality of packages on a backboard in accordance with a product type.

[0002]

2. Description of the Related Art Conventionally, in this type of unit, a package mounting abnormality is detected by a method as shown in FIG.

In this system, n
The package 11 to 1n and the monitoring package 30 are mounted, and a signal line 40 indicating a product type is connected between one of the packages 11 to 1n, for example, the package 1n and the monitoring package 30. The monitoring package 30 receives a signal output from the package 1n through 40, and thereby recognizes the type of the package 1n.

[0004]

As described above, the conventional package mounting abnormality is detected by n packages 11.
Since the signal line 40 indicating the type of paper is connected to only one package 1n among the packages 11 to 1n and monitored, the other packages 11 to 1 (n-1) are not monitored. Therefore, these packages 11 to 1
When there is an abnormality in the mounting state of (n-1), there is a problem that this cannot be detected.

The present invention has been made in view of such a problem, and an object of the present invention is to reliably detect an abnormality in the mounting state of any one of a plurality of packages. It is an object of the present invention to provide a package mounting abnormality detecting device capable of performing the above.

[0006]

A package mounting abnormality detecting device according to the present invention has a plurality of package mounting sections on a back board, and a plurality of packages are mounted on each of these package mounting sections in accordance with a product type. And a plurality of first signal lines disposed between the plurality of package mounting portions on the backboard in accordance with the product type, and each of the plurality of packages corresponding to the product type. Signal line grounding means for grounding a second signal line of a package mounted on a package mounting portion on one end of the plurality of packages, and the backboard And monitoring the grounding state of the package at the end through the first signal line and the second signal line. Implementation determines that normal, in which a monitoring package mounting of at least one package is determined to be abnormal when it detects an open state.

In this package mounting abnormality detecting device, when an appropriate package according to the product type is mounted on each of the package mounting portions on the back board, the first signal line corresponding to the product type is monitored by the monitoring package. Second
The grounding state is detected through the signal line of FIG. On the other hand, when a different package is mounted on any one of the package mounting units, the monitoring package detects an open state and determines that the mounting is abnormal.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 4 show a specific configuration of a package mounting abnormality detecting apparatus according to an embodiment of the present invention. Here, FIG. 3 shows the configuration of the backboard 20, FIG.
Represents the configuration of the packages 11 to 1n. In this embodiment, the same components as those in FIG.

The back board 30 is formed with n package mounting portions 21 to 2n, and a monitoring package 30 is mounted adjacent to the package mounting portion 2n located at the right end in the drawing. M signal lines (first signal lines) 41 to 4m each indicating a product type are formed between each of the package mounting units 21 to 2n and between the package mounting unit 2n and the monitoring package 30. These signal lines 41 to 4m are connected to packages 11 to 1n, respectively.
Are formed corresponding to the product type determined by the combination of. The monitoring package 30 has these signal lines 41 to 4 m.
This is to detect whether the mounting state is normal or abnormal according to the output state.

The packages 11 to 1n are mounted corresponding to the package mounting portions 21 to 2n provided on the back hood 20, respectively. Each of the packages 11 to 1n has a signal line 51 according to a product type.
Are wired. In this embodiment, the backboard 20
Only the signal line corresponding to the product type corresponding to the signal line 41 on the side is wired. In addition, these packages 11 to 1
Of n, only the signal line 51 formed on the package 11 mounted on the package mounting section 21 is grounded in the package.

FIG. 1 shows a state where the packages 11 to 1n are properly mounted on the corresponding package mounting sections 21 to 2n, respectively. In this state, the monitoring package 30
Receives signals from m signal lines 41 to 4m. In this case, since the packages 11 to 1n are mounted in a normal combination and the signal lines 51 of the package 11 are grounded, the monitoring package 30 is mounted on the signal lines 51 of all the packages 11 to 1n and the back board 20. The grounding state is detected through the signal line 41 corresponding to the product type, and it is determined that the mounting of the packages 11 to 1n is normal.

Here, as shown in FIG. 2, for example, when a package 62 corresponding to a product type different from the above-described type is erroneously mounted on the package mounting section 22, the signal line 52 of the package 62 is provided. Is connected to the signal line 42 on the back board 20. In this case, since the other packages 11, 13 to 1n are connected to the signal lines 41, the monitoring package 30
It is detected that each of 1-4 m is open, and it is determined that mounting is abnormal. The same applies to a case where a package corresponding to a different product type is mounted on another package mounting unit.

As described above, the package mounting abnormality detecting device of this embodiment can reliably detect a mounting abnormality when any one or more packages are erroneously mounted.

[0015]

As described above, according to the package mounting abnormality detecting device of the present invention, a plurality of package mounting sections are provided on the back board, and each of these package mounting sections is provided with a plurality of package mounting sections in accordance with the type of product. In a unit configured by mounting a package, a plurality of first signal lines disposed according to a product type between each of a plurality of package mounting portions on the back board; A second signal line provided corresponding to the type; a second signal line grounding means for grounding a second signal line of a package mounted on a package mounting portion at one end of the plurality of packages; The package is disposed on the back board and monitors the grounding state of the package at the end through the first signal line and the second signal line. A monitoring package that determines that the package mounting is normal and determines that the mounting of at least one package is abnormal when an open state is detected. Therefore, mounting of any one of a plurality of packages is performed. There is an effect that even when there is an abnormality in the state, the abnormality can be reliably detected.

[Brief description of the drawings]

FIG. 1 is a front view illustrating a state in which a package is normally mounted in a unit according to an embodiment of the present invention.

FIG. 2 is a front view showing an abnormal mounting state in the unit shown in FIG. 1;

FIG. 3 is a front view illustrating a configuration on a back board side of the unit in FIG. 1;

FIG. 4 is a front view illustrating a configuration of each package of the unit in FIG. 1;

FIG. 5 is a front view for explaining a conventional package mounting method.

[Explanation of symbols]

 11 to 1n package 20 Back board 21 to 2n Package mounting unit 30 Monitoring package 41 to 4m Signal line (first signal line) 51, 52 Signal line (second signal line)

Claims (1)

(57) [Claims] 1. A unit having a plurality of package mounting portions on a backboard, and a plurality of packages mounted on each of these package mounting portions in accordance with a product type, wherein: A plurality of first signal lines provided in accordance with the product type between each of the package mounting portions; a second signal line provided corresponding to the product type in each of the plurality of packages; Second grounding the second signal line of the package mounted on the package mounting portion on one end side of the package
Signal line grounding means, disposed on the backboard, monitoring the grounding state of the package at the end through the first signal line and the second signal line, and detecting all when the grounding state is detected. A package mounting abnormality detecting device, comprising: a monitoring package that determines that the mounting of the package is normal and determines that the mounting of at least one package is abnormal when detecting an open state.