JP2774840B2 - Component recognition method for image recognition component mounting device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a component mounting apparatus that automatically mounts components on a so-called printed circuit board (hereinafter, simply referred to as a substrate) in particular, and more particularly, grips a component by image recognition and attaches the component to the substrate. The present invention relates to a component recognition method for an image recognition component mounting apparatus to be mounted.

2. Description of the Related Art A component mounting apparatus that operates by such image recognition supplies random (non-aligned state) on a conveyor in order to correctly mount electronic components that are difficult to align and supply due to having soft terminals on a board. The mounted electronic components are imaged by a television camera, and the obtained image data is processed so that the shape, position and orientation of each component are known.

In the conventional image recognition component mounting apparatus, a program for image data processing is complicated, and when the component mounting speed is increased, a high-speed computer is required, the cost is increased, and there is a problem in practicality.

SUMMARY OF THE INVENTION [Object of the Invention] An object of the present invention is to provide a component recognition method in an image recognition component mounting apparatus formed by a low-speed computer and capable of detecting the position of the component at high speed.

[Configuration of the Invention] An image recognition method in an image recognition component mounting apparatus according to the present invention captures an electronic component randomly supplied on a component mounting surface, generates an image signal, and processes the image signal to generate an image signal. A component recognition method in an image recognition component mounting apparatus that generates pixel data constituting a three-dimensional screen and recognizes the presence of the electronic component on the component mounting surface based on the pixel data, the method including: A discrimination storage step of discriminating that the luminance level of the pixel data in the grid as a coordinate position of each pixel is at a black level indicating the presence of a component and storing a black level grid; and a window area based on the black level grid. A boundary determination step of determining that no black level grid exists on the boundary of the boundary and generating a determination output; A simple area discriminating step for discriminating that the number of black level grids stored by the storage means is equal to or greater than a predetermined number and generating a discrimination output; And an area detail determination step of determining that the number of black level pixels exceeds a predetermined number.

According to the component recognition method of the present invention as described above, instead of determining the levels of all the data of the image data obtained from the image signal, the coordinate positions of every predetermined number of pixels, that is, The level of pixel data in the grid is determined to determine the presence of coarse components.

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, an image recognition component mounting apparatus for executing the component recognition method according to the present invention will be described with reference to FIG.

In the present apparatus, the first control means 1 drives a motor 3 for operating the component supply device 2, and the component supply device 2
, Several electronic components 5 (in this case, light emitting elements) are dropped onto the conveyor 4 in a random (ie, non-aligned) state. Then, a motor 6 for operating the conveyor 4
Is driven, and the light emitting element 5 dropped on the conveyor 4 is brought to a component supply position 9 where an image can be picked up by a television camera 8 as an image pickup means. The image signal generated by the television camera 8 is converted to pixel data via the A / D converter 10 and sent to the first control means 1. The first control means 1 knows the shape, position and orientation of each light emitting element 5 at the component supply position 9 based on the pixel data, and
By driving the operation motor 13, the component transport chuck 14 is brought to a position where it is possible to grip the light emitting element which is determined to be transported first, and is gripped. And
Transfer the gripped light emitting element 5 to the front and back reversing device 15, and if the transferred light emitting element is upside down, activate the front and back reversing device 15 to correct the posture so that the light emitting element 5 is always turned upside down, It is delivered to the index chuck 18 on the index table 17. Index table 17
Is rotationally driven by a main motor 19 via a cam mechanism 20, and intermittently rotates by 36 ° by controlling the operation of the cam mechanism 20 by the first control means 1. The index chucks 18 are provided at 10 positions on the index table 17 at equal intervals (36 ° pitch). The index chuck 18 is provided with mechanical force by index chuck driving devices 23 and 24 which are controlled by a second control means 22 via a cam mechanism 20 at a component supply place and a component discharge place by the reversing device 15 described above. This causes the gripping claw to open. When the mechanical force is released, the gripping claws are closed.

As described above, the index table 17 is intermittently rotated at a pitch of 36 °, but the television camera 26, the terminal handling device 27, An apparatus 28, a television camera 29, and a component mounting chuck 30 are provided. The position where the component mounting chuck 30 is disposed is the above-described component discharge location, and the index chuck 18 holding the light emitting element 5 moves the index chuck driving device at this position.
A mechanical force is applied by 24 to release the gripping state of the light emitting element and deliver it to the component mounting chuck 30.

The above-described index chuck driving devices 23 and 24, the terminal handling device 27, the terminal bending device 28, and the component mounting chuck 30 are driven by the main motor 19 via the cam mechanism 20 and the clutch 21 whose operation is controlled by the second control means 22. Is done. The drive timing of the terminal handling device 27, the terminal bending device 28, and the component mounting chuck 30 is based on a signal from the encoder 31. First, the second control means 22 recognizes the state of the terminal of the light emitting element 5 held by the index chuck 18 based on the image signal from the television camera 26, and activates the terminal handling device 27 in response to the recognition. The terminal 5a of the light emitting element 5 which has been deformed as shown in FIG. 2 due to its presence is handled toward the tip thereof and molded in parallel to each other as shown in FIG. Next, the second control means 22 activates the terminal bending device 28 to bend the terminal 5a by about 90 ° as shown in FIG.

Thereafter, the second control means recognizes the state of the terminal 5a of the light emitting element 5 based on the image signal from the television camera 29, and
When it is determined that the molding state of 5a is good, the index chuck driving device 24 is operated to
Is released, and the component mounting chuck 30 is used to hold the light emitting element 5. Then, the motor 34 for operating the XY table 33 is driven, and the printed circuit board 35 is brought in so that the light emitting element 5 is mounted.

Thereafter, the second control means 22 rotates the component mounting chuck rotating motor 37 to rotate the component mounting chuck 30 to an appropriate angular position, and determines the angular position of the light emitting element 5 with respect to the printed circuit board 35. Then, the component mounting chuck 30 is lowered, and the light emitting element 5 is mounted on the printed circuit board 35 as shown in FIG. At this time, the terminal 5a of the light emitting element 5 is inserted into the terminal insertion hole 35a formed in the printed board 35, and the tip portion protrudes to the lower surface side of the printed board 35. Second
The control means 22 inspects the continuity of the terminal 5a with a continuity check / terminal cutting device 39. If the continuity is good, the control unit 22 cuts the tip of the terminal 5a with the continuity chuck / terminal cutting device.
Cut by 39 and trim to a predetermined length.

On the other hand, when the second control means 22 recognizes that the terminal continuity inspection result by the continuity chuck / terminal cutting device 39 is defective, the component mounting chuck 30 is used to remove the light emitting element 5 from the printed circuit board 35 and to perform the operation. This is stored in the defective component storage unit 40 for collection, and the subsequent light emitting element is immediately mounted.

Hereinafter, the above-described series of operations is performed for each light-emitting element to be mounted on the printed circuit board 35.

Next, the component recognition operation in the first control means 1 will be described with reference to FIG.

The means for performing the component recognition operation by the first control means includes a CPU,
It is formed by a so-called microcomputer including RAM and ROM. FIG. 6 is a flowchart showing a program executed by the microcomputer.
An interrupt is executed at a desired timing with respect to a program for controlling the motor 13 and the component transport chuck 14 by the first means.

In this program, first, it is determined whether or not the flag F is equal to 1 (step S1). When F is equal to 0, the pixel data sequentially supplied from the A / D converter 10 is collected for one frame. To a predetermined area in the RAM (step S2). When it is determined that F = 1, the process proceeds to step S18 described later. FIG. 7 shows an example of an image of one frame represented by pixel data, in which the electronic components d1, d2, and d3 are placed on the conveyor 4 in a non-aligned state. ing. As shown in FIG. 8, according to the present invention, a grid Gi (i = 1,..., 196) is set at predetermined pixels (for example, 100 pixels) in the vertical and horizontal directions in an image of one frame. Then, in the area outside the existing window, checking is performed in numerical order starting from the youngest Gi (step S3). When a black level grid is found, an area of a predetermined size, that is, a window W is set based on the detected black level grid. (See FIG. 9) (step S4). Then, this window W
Is determined as soon as a black level grid exists on the boundary of (step S5). When a black level grid exists on the window boundary, for example, as shown in FIG. 10, the components are close to each other, and it is determined that the components are not suitable for component suction. Step to perform black level grid detection operation in the number direction
Return to S3. On the other hand, when the black level grid does not exist on the window boundary, it is determined whether or not the number of black level grids in the window is within a predetermined value range (step S7). If the number of black level grids in the window is not within the predetermined value range, the size of the target component is out of the specified range, or the component is placed inclined with respect to the placement surface, and the Return to step S3 as not suitable. On the other hand, when it is determined that the number of black level grids in the window is within the predetermined value range, it is determined that the area of the target component to be satisfied from the television camera 8 is within a tentative specification as shown in FIG. The determination operation of step S8 is started. Step S8
In the above, it is determined whether the maximum distance X between the black level pixels in the horizontal direction and the maximum distance Y between the black level pixels in the vertical direction in the window are smaller than predetermined maximum values X _MX and Y _MX. I do. As shown in FIG. 12, X <X
If both _MX and Y <Y _MX are satisfied, the size of the target part is determined to be within the specified range, and the next area check step S9
to go into. In step S9, the black level pixel numbers in the window, to determine certain As soon as during the predetermined minimum value N _MN and the predetermined maximum value N _MX. The number of black level pixels in the window is
Because of no and parts area between the N _MN and N _MX is outside the prescribed range, either as part of the orientation profile of the component is abnormal is not correct, the flow returns to step S3. On the other hand, if it is determined that the number of black level pixels in the window is between _NMN and _NMX , the coordinates of the center of gravity of the target component are calculated as preparation for calculating the component suction or grip position (step S10). The method of calculating the coordinates of the position of the center of gravity is well known and will not be described in detail here. Next, in step S11, it is determined whether a flag F indicating that the operation up to the suction position calculation has already been performed for one component has been set for the captured one frame image. When it is determined that the flag F is 1, since the suction position calculation has already been completed for one component, the center-of-gravity position coordinate data for the component in the current setting window is stored (step S1).
S12), and return to the main routine. On the other hand, when it is determined that F = 0, the equivalent ellipse of the target part d1 and the black level data on the principal axis of inertia are calculated as shown in FIG.
S13). This calculation is also well known and will not be described in detail here.
Next, in step S14, as shown in FIG. 14, obtains the longitudinal axis l ₁ and Tanjikusen l ₂ connecting the farthest point and the nearest point and the center of gravity on the contour from the center of gravity of the part. Then, this l ₁ and
The counterclockwise angle with respect to the horizontal right direction reference line γ of l ₂ theta
As ₁ and theta _2, seeking _{Δθ = θ 1 -θ 2, Δθ} > 18
When 0 °, Δθ = Δθ−360 °, and when Δθ <−180 °, Δθ = Δθ + 360 °. In this case -180 ゜ <
Δθ <180 °, and the front / back discrimination is performed based on the sign of Δθ (step S15). Next, in step S17, a position at which the target component is to be sucked by the suction means for picking up the target component from the mounting surface, that is, a gripping position is calculated. The coordinates (Px, Py) of the suction position are obtained by the calculation of the following equation (1) or (2).

Where Gx and Gy are the previously calculated barycentric position coordinates, and G
P is the distance from the center of gravity to the suction position, and is determined in advance for each component type. θ _GP is the distance between the center of gravity and the suction position, θ _GP is the angle between the line connecting the center of gravity and the suction position and the principal axis of inertia, and is determined in advance for each component type. Θ _MX is the angle formed by the inertia main axis and the horizontal direction in step S13.

As shown in FIG. 15 (A), in the case of the R state (table) in which the longitudinal portion of the component extends rightward, the above equation (1) is used.
15L in which the longitudinal portion of the part extends leftward as shown in FIG.
In the case of the state (back), equation (2) is used.

When the adsorption position coordinates Px and Py are obtained in this way, the flag F is set to 1 (step S17), and then the step S17 is performed.
Return to 3.

If it is determined in step S1 that F = 1, the next window data stored in step S12 is fetched for the current time without capturing image data (step S18), and the flag F Is set to zero (step S19), and then the process proceeds to step S13.

Thus, steps S13 to S17 are executed again, and the process enters step S3 to search for the next part.
If the part is not found, the process returns to the main routine. At this time, the conveyor is moved by one pitch (step S20).

As is apparent from the above description, according to the component recognition method in the image recognition device according to the present invention, when determining the presence or absence of a component from an image signal obtained by imaging the component mounting surface, the level of all pixel data is determined. Instead of determining the brightness level of a pixel at a grid position set at predetermined pixels, the presence / absence of a component can be determined quickly even with a computer with a low calculation speed. Speed is improved.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an image recognition component mounting apparatus for executing the component recognition method of the present invention, and FIGS.
FIG. 6 is a perspective view for explaining the operation for aligning the terminals of the target component. FIG. 6 is a flowchart showing a subroutine of control means for controlling the image recognition operation in the apparatus shown in FIG. 1, and FIGS. 7 to 15 (A). 7 (B) are diagrams showing the operation contents of the operation of the subroutine shown in FIG.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yasuhiko Mizutani 25-1, Nishimachi, Yamada-ji, Kawaji-shi, Saitama Prefecture Inside the Pioneer Corporation Kawagoe Plant (72) Tetsuya Ishiguro 25-1, Nishimachi, Yamada-ji, Kawaji-shi, Saitama Pioneer Inside the Kawagoe Factory, Inc. (72) Inventor Yoshito Tachibana 25-1, Nishimachi, Yamada, Kawajie-shi, Saitama Prefecture Pioneer Corporation Kawagoe Factory (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/08 H05K 13/04

Claims (2)

(57) [Claims] An image of an electronic component randomly supplied on a component mounting surface is generated to generate an image signal, and the image signal is processed to generate pixel data forming a two-dimensional screen. A component recognition method in an image recognition component mounting apparatus that recognizes the presence of the electronic component on the component placement surface based on a grid as a coordinate position at predetermined pixels in horizontal and vertical directions of the two-dimensional screen. A discrimination storage step of discriminating that the luminance level of the pixel data is at a black level indicating the presence of a component and storing a black level grid; and a black level grid exists on a boundary of a window area based on the black level grid. And a black level stored by the storage means in accordance with the determination output from the boundary determination step. A simple area determining step of determining that the number of grids is within a predetermined range and generating a determination output; and a black level pixel number within the window area within a predetermined range according to the determination in the simple area determining step. A component recognition method in an image recognition component mounting apparatus, comprising: an area detail determination step of determining presence of the component. 2. A method according to claim 1, further comprising a range discriminating step for discriminating that the existence range of the black level pixels in said window area is within a predetermined range according to the discrimination in said simple area discriminating step. Component recognition method in the image recognition component mounting apparatus of the invention.