JP2800064B2 - Electronic component mounting apparatus and electronic component mounting method using the same - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus that holds an electronic component and mounts it on a circuit board, and an electronic component mounting method using the same.

(Prior Art) An electronic component mounting apparatus used in a conventional mounting method will be described with reference to FIGS. 3 and 4. FIG. FIG. 3 is a perspective view showing a main part of a conventional electronic component mounting apparatus, and FIG. 4 is a schematic plan view for explaining its operation.

In FIG. 3, the conventional electronic component mounting apparatus mounts a component storage band 2 containing a large number of electronic components 1 and mounts the electronic component 1 on a motor (not shown) as shown in FIG.
A plurality of component supply devices 3 for feeding the electronic components to a supply position are mounted in parallel, and a moving table 4 that freely slides in a parallel direction by an electric motor (not shown) and an electronic component 1 (not shown) are mounted. An XZ in which an X table 8 and a Z table 9 driven by two electric motors 6 and 7 and slidably movable in the X-axis and Z-axis directions, respectively, is mounted on which a circuit board 5 is mounted.
A table 10 and ten component suction heads to which a suction nozzle 11 is detachably mounted at a lower end, and a suction shaft 13 to which a rotation gear 12 is fixed at an upper end portion is vertically movable and rotatable.
14 and driving devices 15 for raising and lowering the suction shaft 13 are arranged at equal intervals on the circumference, and further, as shown in FIG. 4, at positions (hereinafter referred to as P) 5 and P7 on the circumference, A rotating device 17 having a gear 16 meshing with the gear 12 was arranged,
It is composed of a transport table 19 intermittently rotated by the drive shaft 18 and a holding position determining device 20 arranged at P3 shown in FIG.

The operation of the electronic component mounting apparatus configured as described above will be described.

In FIG. 4, first, the moving table 4 is moved in the Z-axis direction, and the predetermined electronic component 1 stored in the component storage band 2 is moved.
It is positioned at the component supply position below the suction nozzle 11 stopped at P1. Next, the driving device 15 is operated to lower the suction shaft 13, and the electronic component 1 is sucked by the suction nozzle 11 at the tip, and then moved up. Subsequently, the transport table 19 is intermittently rotated by an angle of 36 degrees by the drive shaft 18, and the process proceeds to P2. At P3, the driving device 15 is operated again to lower the sucked electronic component 1 between the two pairs of setting claws of the holding position setting device 20. The holding position setting device 20 operates to set the relative position between the suction nozzle 11 and the electronic component 1. In P5, the rotation device 17 operates to rotate the suction shaft 13 so as to match the mounting direction of the circuit board 5.
In P6, the electric motors 6 and 7 of the XZ table 10 are operated, and the mounting position of the attached circuit board 5 is changed to the suction nozzle 11 of P6.
The position adjustment is performed so that the electronic component 1 is located directly below the electronic component 1, and then the driving device 15 is operated to mount the electronic component 1. In P7, the rotation is performed in the direction opposite to the rotation performed in P5, and the preparation for the next suction is completed.

(Problems to be Solved by the Invention) However, in the above configuration, the mounting errors of the suction shafts 13 in the circumferential direction (Z-axis direction) and the radial direction (X-axis direction), and the rotation of each suction shaft 13 If the electronic components 1 to be attracted are miniaturized due to the center error, there is a problem that a suction failure occurs to lower the suction rate, or a mounting position on the circuit board 5 is shifted to cause a mounting failure. there were.

SUMMARY OF THE INVENTION The present invention solves the above-described problems, and provides a highly reliable electronic component mounting method that does not cause suction failure or mounting failure.

(Means for Solving the Problems) In order to solve the above problems, the present invention measures the rotational center position of each suction shaft 13 and the mounting circumferential and radial positions in the assembly process of the electronic component mounting apparatus. The absolute displacement amount is stored, and the position is corrected in the mounting process of P6 or the component suctioning process of P1.

(Operation) With the above configuration, the absolute position deviation of the suction shaft at each position is corrected as the suction position correction data and the mounting position correction data, thereby achieving a stable component suction state of the component supply unit and accurate mounting. Becomes possible.

(Example) An example of the present invention will be described with reference to the drawings.

The appearance of the electronic component mounting apparatus according to the present invention is the same as that of the conventional example, and the drawings and description thereof are omitted. In addition to the operation for correcting the absolute displacement of the suction shaft 13 inserted before the suction operation of P1 and the mounting operation of P6 shown in FIG. Therefore, the description is omitted.

Next, the correcting operation according to the present invention will be described with reference to a process block diagram of FIG. 1 and an enlarged plan view of a main part of a model of FIG.

In FIG. 2, first, in the manufacturing process of the electronic component mounting apparatus, the absolute positional deviation amount D ₁ (n) between the component suction head 14 supporting the suction shaft 13 and the suction shaft 13 and the design of the transport table 19 are described. The mounting position and the absolute displacement amount D ₂ (n) between the component suction head 14 and each position and the component suction head 14 fixed thereto are measured (step # 1).
At the time of completion, this is input as correction data unique to the apparatus (step # 2).

Next, in the mounting process, first, in P1, the above D
₁ Correction values in the X-axis direction and the Z-axis direction are calculated from the correction data of ₁ (1) and D ₂ (1) (step # 3), and drive motors of the component supply device 3 and the moving table 4 (both not shown) ), And after moving the component supply position (step # 4), the electronic component 1 is sucked (step # 5).

Next, the mounting process of P6 will be described. First, the rotation device 17 is operated at P5, and the suction shaft 13 is rotated by an angle of 90 degrees.
In the correction data of the above-mentioned D ₁ (1) is a correction value of the Z-axis in the X-axis direction in advance to convert the code correction value of X-axis in the Z-axis direction, to which D ₂ (1) The correction data is calculated by adding the correction data (step # 6), a command is given to the electric motors 6 and 7 of the XZ table 10, and the X table 8 and the Z table 9 are moved (step # 7). 1 is mounted on the circuit board 5 (step # 8).

(Effects of the Invention) As described above, according to the present invention, since the apparatus has the absolute positional deviation amounts of the plurality of component suction heads as the position correction data, the suction failure due to the poor positioning accuracy of the suction shaft and the circuit. There is no displacement of the mounting position on the substrate, and a highly reliable electronic component mounting apparatus can be obtained.

Further, since the assembly position accuracy (position shift) of the plurality of component suction heads does not affect the suction rate and the component mounting position accuracy, it is possible to assemble with low accuracy and obtain an inexpensive electronic component mounting apparatus.

[Brief description of the drawings]

FIG. 1 is a process block diagram showing a position correcting operation according to the present invention, FIG. 2 is an enlarged plan view of a principal part showing a manufacturing error of the component suction head, and FIG. 3 is a conventional electronic component mounting apparatus. FIG. 4 is a schematic plan view of the essential part of FIG. DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Component storage band, 3 ... Component supply device, 4 ... Movable table, 5 ... Circuit board, 6,7 ... Electric motor, 8 ... X table, 9 ... Z table , 10 …… XZ
Table, 11 ... Suction nozzle, 12, 16 ... Gear, 13 ...
Suction shaft, 14 ... Suction head for parts, 15 ... Driver, 17 ...
... Rotating device, 18 ... Drive shaft, 19 ... Transport table, 20 ...
... A holding position setting device.

──────────────────────────────────────────────────の Continued on the front page (72) Inventor Takeshi Okada 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In-company (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/02 H05K 13/04

Claims (3)

(57) [Claims] 1. A plurality of component supply devices for sending electronic components housed in a component storage band or the like to a supply device by a drive device having a motor are mounted in parallel, and are freely movable in a parallel direction by a drive device having a motor. Sliding, a moving table for positioning the electronic component at a suction position, and a circuit board for mounting the electronic component at a mounting position,
An XZ table that slides in the axial direction perpendicular to each other with a drive device that has a motor, a suction nozzle that is detachably attached to the lower end, and a suction shaft that has a rotating gear fixed to the upper end is attached vertically and rotatably. Multiple component suction heads
Along with the driving device for raising and lowering the suction shaft, a transport table mounted at equal intervals on the circumference, and a rotating device provided with gears that mesh with the gears, disposed at positions before and after the mounting position of the transport table. In an electronic component mounting apparatus comprising a holding position determining device disposed after the suction position and a general management device for managing the operation of each device, the absolute position of the suction shaft and the component suction head obtained at the time of assembling the above device. An electronic component mounting apparatus characterized by storing a shift amount, a design mounting position of a transfer table, and an absolute position shift amount of a mounted component suction head. 2. A step of operating a component supply device to send out electronic components onto a component supply line, a step of operating a supply table to position a predetermined electronic component at a suction position, and setting a holding position of the sucked electronic component. , Turning the suction shaft to align the direction of the sucked electronic component with the mounting direction, operating the XZ table to position the circuit board at the mounting position, and raising and lowering the suction shaft to mount the electronic component And a step of rotating the rotation angle in the opposite direction according to the mounting direction in the electronic component mounting method. A step of correcting the suction position by driving the electric motor of the component supply device and the supply table using the positional deviation amount of the component suction head with respect to the design mounting position of the component. Electronic component mounting method according to claim Rukoto. 3. The electronic component mounting method according to claim 2, wherein the positional deviation of the suction shaft with respect to the component suction head and the design mounting position of the mounting head of the component suction head of the transport table stored in the apparatus. An electronic component mounting method, comprising: a step of driving a motor of an XZ table to correct a mounting position by using a displacement amount of a mounting head.