JP3744066B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method using a multi-nozzle type transfer head.
[0002]
[Prior art]
2. Description of the Related Art Electronic component mounting apparatuses that include a rotary head are widely used as electronic component mounting apparatuses that automatically mount electronic components on a substrate. In this electronic component mounting apparatus, while the transfer head is index-rotated with the rotary head, the electronic components provided in the parts feeder are vacuum-sucked and picked up by the nozzle of the transfer head, and the substrate is positioned on the XY table unit. It is designed to be implemented. In this case, the coordinate position for mounting the electronic component on the board is given in advance by a program, and the electronic component is mounted at a predetermined coordinate position by driving the XY table unit and horizontally moving the board in the XY direction. It is supposed to be.
[0003]
The amount of movement of the substrate is related to the tact time, and the larger the amount of movement, the longer the time required for movement and the longer the mounting time. Therefore, in order to increase the mounting speed, it is advantageous to make the movement amount of the substrate as small as possible.
[0004]
In view of this, the present applicant, in a rotary head type electronic component mounting apparatus equipped with a multi-nozzle type transfer head, mounts an electronic component capable of shortening the amount of movement of the substrate by driving the XY table unit and increasing the mounting speed. A method was proposed (Japanese Patent Laid-Open No. 4-107987). This is because the transfer head is rotated about its axis by driving a motor, and the nozzle that vacuum-sucks the electronic component is moved in the X and Y directions, and the X direction by driving the XY table unit, A part of the movement amount in the Y direction is borne.
[0005]
FIG. 6 is an explanatory view of an electronic component mounting method using a conventional multi-nozzle type transfer head, and is a plan view of a substrate on which electronic components are mounted. In the figure, S is a substrate, P1 to P5 are electronic components that are sequentially mounted at predetermined coordinate positions (mounting positions) of the substrate S, and H1 to H5 are transfer heads for mounting the electronic components P1 to P5. . These electronic components P1 to P5 are chip-type electronic components having no polarity directionality, such as resistor chips and chip capacitors. In FIG. 6, there are five electronic components P1 to P5, but any number of electronic components may be mounted on the substrate S.
[0006]
As shown in the figure, the electronic components P1 to P5 are sequentially mounted on the substrate S by transfer heads H1 to H5 that rotate in an index along the circumference of the rotary head. In this case, each of the electronic components P1 to P5 is mounted. The substrate S moves horizontally in the X and Y directions by driving an XY table unit (not shown) so that it can be mounted at a predetermined coordinate position. In FIG. 6, for the sake of drawing, the transfer heads H <b> 1 to H <b> 5 are drawn with respect to the substrate S, but actually, the transfer heads H <b> 1 to H <b> 5 place the electronic components P <b> 1 to P5 on the substrate S. The position where the mounting operation is performed is fixed, and the substrate S is moved horizontally in the X direction and the Y direction. In FIG. 6, the transfer heads H <b> 1 to H <b> 5 are multi-nozzle types having a plurality of nozzles, and rotate horizontally around the axis O in order to increase the amount of movement of the substrate S in the horizontal direction (arrows). R1 to R3).
[0007]
[Problems to be solved by the invention]
In FIG. 6, the total movement distance ΣL ′ = L1 ′ + L2 ′ + L3 ′ + L4 ′ of the horizontal direction of the substrate S. In order to mount a large number of electronic components on the substrate S at a high speed, it is desirable to reduce the total ΣL ′ of the moving distance as much as possible. However, this point is not taken into consideration in the above-described conventional method. When mounting individual electronic components on a substrate, the total distance traveled by the substrate was quite long, and the reduction in tact time was not sufficient.
[0008]
Accordingly, the present invention provides an electronic component mounting method that enables mounting of electronic components on a substrate at a high speed by reducing the total distance of movement of the substrate when mounting a large number of electronic components on the substrate. With the goal.
[0009]
[Means for Solving the Problems]
The present invention provides two rotations of the transfer head capable of setting a reference point for distance calculation inside a plurality of electronic components mounted on a substrate and mounting the electronic component at a predetermined coordinate position in a predetermined posture. The distance between the axis of the transfer head at the position and the reference point is calculated, and the rotational position data of the transfer head in the case of the calculated shorter distance is stored in the memory, so that the distance is short. The rotating position of the direction is selected by the transfer head, and the electronic component is mounted.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
According to the present invention, the rotation position where the movement amount of the substrate is shortened is selected by each transfer head, and a large number of electronic components are mounted at a predetermined coordinate position on the substrate at a predetermined posture at a high speed. I can go.
[0011]
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a vertically inverted perspective view of a transfer head provided in the electronic component mounting apparatus, and FIG. 3 is based on the electronic component mounting apparatus. FIG. 4 is an explanatory diagram of the electronic component mounting method, FIG. 4 is a flowchart of the electronic component mounting, and FIG. 5 is an explanatory diagram of selection of the rotational position of the transfer head of the electronic component mounting apparatus.
[0012]
First, a schematic configuration of the electronic component mounting apparatus will be described with reference to FIG. Reference numeral 1 denotes a rotary head, and a plurality of transfer heads 2 are provided along the circumferential direction thereof. Reference numeral 4 denotes an electronic component supply device, which includes a table 6, a plurality of parts feeders 5 such as a tape unit and a tube feeder provided on the table 6, and a feed for horizontally moving the parts feeder 5 in the X direction. It is comprised from the screw 7 grade | etc.,.
[0013]
Reference numeral 9 denotes an XY table unit provided on the opposite side of the electronic component supply device 4 on which a substrate 8 is placed. When the XY table unit 9 is driven, the substrate 8 is moved horizontally in the X direction and the Y direction, and the mounting position of the electronic component is positioned immediately below the nozzle of the transfer head 2.
[0014]
As shown in FIG. 2, the transfer head 2 is a multi-nozzle type transfer head, and has a plurality of nozzles 11a to 11d in the circumferential direction thereof. In FIG. 1, reference numeral 3 denotes a motor for rotating the transfer head 2 around its axis O by a belt 10. The shape dimensions of the nozzles 11a to 11d vary, and any one of the nozzles 11a to 11d is selected by rotating the transfer head 2 in accordance with the type of electronic component. The selected nozzle (nozzle 11a in the example of FIG. 2) protrudes downward. These nozzles 11a~11d is at a position eccentric from the axis O of the transfer head. In this electronic component mounting apparatus, in FIG. 1, the transfer head 2 and the rotary head 1 are index-rotated in the direction of the arrow N, and the electronic component provided in the parts feeder 5 at the pickup station PST is placed at the lower end of any nozzle. The substrate is picked up by vacuum suction and mounted on the substrate 8 by performing a mounting operation (lifting operation) at the mount station MST. In this case, the XY table unit 9 is driven to horizontally move the substrate 8 in the X direction or the Y direction so that the electronic component is mounted at a predetermined coordinate position. In addition, the motor 3 is driven so that the orientation of the electronic component is correct, and the orientation is adjusted.
[0015]
The electronic component mounting apparatus has the above-described configuration. Next, a method for mounting the electronic component on the substrate will be described with reference to FIGS. In this example, as shown in FIG. 3, five electronic parts P1 to P5 are transferred to the predetermined coordinate positions (x1, y1), (x2, y2), (x3, y3) on the substrate 8 by the transfer heads 21 to 25. ), (X4, y4), (x5, y5). In FIGS. 3 and 5, reference numerals 21 to 25 are assigned to distinguish the five transfer heads. Further, in order to easily understand the relative positional relationship between each transfer head 2 and the substrate 8, the substrate 8 is illustrated with reference to the substrate 8 as in FIG. 6. First, in step 1 of FIG. 4, the center of gravity G (x0, y0) of five coordinate positions is obtained. The center of gravity G is inward of the electronic components P1 to P5 mounted on the substrate 8, and serves as a reference point for distance calculation described later. Note that the calculation and determination of the flow shown in FIG. 4 are performed by a computer.
[0016]
Next, in step 2, the data regarding the mounting coordinates and mounting angles of the electronic components P1 to P5 having no polarity directionality are read by a storage unit (not shown) of the control device. The flow of step 3 and step 4 is not performed in the case of an electronic component having a polarity directionality, and is performed only in the case of an electronic component having no polarity directionality. That is, in this electronic component mounting method, the transfer head 2 is rotated by 180 ° about its axis O, and the electronic component is mounted on the substrate 8 while selecting one of the two rotational positions. Depending on the rotational position, the orientation of the electronic component is reversed 180 degrees horizontally. Therefore, only electronic components having no polarity directionality, such as resistor chips and capacitor chips, are subject to the flow of step 3 and subsequent steps. However, it does not apply to those that have directionality in polarity, such as electronic components with leads. In the present embodiment, for convenience of explanation, it is assumed that the electronic components P1 to P5 have no polarity directionality.
[0017]
Next, in step 3, the distance between the center (rotation center) of the transfer head and the center of gravity G at two rotation positions of the mountable transfer head is calculated. Here, two rotational positions of the mountable transfer head will be described with reference to FIG. In FIG. 5, the electronic components P1 to P5 are mounted at the illustrated coordinate positions in the illustrated posture. In this case, there are two rotational positions that the transfer heads 21 to 25 can take. These two rotational positions are indicated by a solid line and a broken line in FIG. FIG. 5A shows an enlarged case where the electronic component P1 is mounted. In FIG. 5A, the transfer head 21 can mount the electronic component P1 in a predetermined posture at two rotation positions, a rotation position indicated by a solid line and a rotation position indicated by a broken line. That is, by driving the motor 3 and rotating the transfer head 21 indicated by the broken line by 180 ° about the axis O, the transfer head 21 indicated by the solid line can be obtained. When the transfer head 21 is rotated 180 ° in this way, the electronic component P1 is reversed left and right, but there is no problem because the electronic component P1 has no polarity directionality.
[0018]
Therefore, in step 3, distances D1 and D1 ′ (FIG. 3) between the center (O and O ′) and the center of gravity G of the transfer head at two mountable rotational positions are calculated. Then, the rotational position data of the transfer head 21 in the case of the shorter distance (axial center O ′) (ie, D1) is stored in the memory of the computer. Similarly, for the other electronic components P2 to P5, the distances (D2, D2 ′) to (D5, D5 ′) between the axis of the transfer head and the center of gravity G at the two rotational positions that can be mounted in step 3. In step 4, the rotational position data of the transfer heads 22 to 25 for the shorter distances D2 to D5 is selected and stored in the memory. 5B and 5C show cases where the electronic components P3 and P5 are mounted by vacuum suction using the nozzles 11d and 11b, respectively.
[0019]
As described above, when all the electronic components P1 to P5 are stored in the memory with the rotational position data of the transfer heads 21 to 25 when mounted on the substrate 8, the electronic components P1 to P5 are mounted on the substrate 8. The operation to start is started. That is, as described above, while the transfer head 2 is index-rotated along the rotary head 1, the electronic components provided in the parts feeder 5 are vacuum-sucked to the lower ends of the nozzles 11 a to 11 d and picked up to the substrate 8. In this case, the transfer head 2 is driven to rotate the transfer head 2 so that the transfer head 2 takes the rotation position indicated by the solid line in FIGS. The table unit 9 is driven to move the substrate 8 to a predetermined position (step 5).
[0020]
With reference to FIG. 3, the advantages of the method are well understood. That is, the total movement distance ΣL ′ = L1 ′ + L2 ′ + L3 ′ + L4 ′ of the substrate 8 indicated by a broken line (this is the same as the conventional example of FIG. 6) and the total movement distance ΣL of the substrate 8 indicated by a solid line. = L1 + L2 + L3 + L4 is compared, the latter (ΣL) is shorter than the former (ΣL ′). Accordingly, the moving distance of the substrate 8 by driving the XY table unit 9 can be shortened, and a large number of electronic components can be mounted on the substrate at a high speed.
[0021]
In the above embodiment, the position of the center of gravity G of a large number of electronic components is calculated, and this is used as a reference point for distance comparison. However, the determination of the reference point is not limited to this. The center of gravity G is calculated in step 1 in FIG. 4 as a method for determining the reference point.
[0022]
【The invention's effect】
According to the present invention, the amount of movement of the substrate by driving the XY table portion can be shortened, and a large number of electronic components can be mounted on the substrate at high speed.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a vertically inverted perspective view of a transfer head provided in the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of an electronic component mounting method by an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a flowchart of electronic component mounting according to an embodiment of the present invention. FIG. 6 is an explanatory diagram for selecting a rotational position of a transfer head of an electronic component mounting apparatus. FIG. 6 is an explanatory diagram of an electronic component mounting method using a conventional multi-nozzle transfer head.
DESCRIPTION OF SYMBOLS 1 Rotary head 2, 21-25 Transfer head 3 Motor 5 Parts feeder 8 Board | substrate 9 XY table part P1-P5 Electronic component

Claims (1)

While rotating the rotary head having a plurality of transfer heads having multi-nozzles, the electronic component provided in the parts feeder is picked up by vacuum suction to the lower end of any nozzle, and this electronic component is picked up on the XY table. In mounting at a predetermined coordinate position of the substrate positioned on the substrate, the transfer head is rotated about its axis by driving a motor to move the nozzle in the horizontal direction, thereby horizontally moving the XY table unit. An electronic component mounting method that bears a part of the amount of movement in the direction,
A reference point for distance calculation is set inward of the plurality of electronic components mounted on the substrate, and the electronic component can be mounted at a predetermined coordinate position in a predetermined posture at the two rotational positions of the transfer head. The distance between the axis of the transfer head and the reference point is calculated, and the rotation position data of the transfer head in the case of each calculated shorter distance is stored in the memory, and the shorter distance is rotated. An electronic component mounting method, comprising mounting an electronic component by causing the transfer head to select a position.

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