JP2801749B2 - Probe mechanism - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe mechanism that is provided with a lead wire protruding from an electronic component facing the electronic component for connection to a lead wire of the electronic component held at a predetermined position. .

[Prior Art] Conventional positioning mechanisms include, for example, those shown in FIGS. 7 and 8.

The one shown in the figure is for determining the position of the electronic component W which is a small work and inspecting it. Gears 2a and 2b are fixed to the base of the chuck 1 composed of arms 1a and 1b which open in a C shape, Rotate the gear 2a with the air cylinder 4 to arm 1a, 1b
Are opened and closed, and the electronic component W is clamped between the distal ends of the arms 1a and 1b.

Then, the contact terminals 5 for grounding are brought into contact with the main body of the electronic component W under the arms 1a and 1b, and the pin-shaped probes 6a and 6b urged by the compression coil spring 7 are moved by the air cylinder 8 to the electronic components. The current for inspection is caused to flow by pressing against the W lead wires W1 and W2.

However, in such a conventional technique, since the pin-shaped probes 6a and 6b are pressed against the lead wires W1 and W2 of the electronic component W from the front, the lead wires W1 and W2 When the electronic component W is supplied, it is necessary to manage the bending of the lead wires W1 and W2, which is inefficient, and the small compression coil spring 7 shown in FIG. Therefore, it is difficult to control the urging force because the probes 6a and 6b are urged. If the force is too strong, the lead wires W1 and W2 are bent. If the force is too weak, poor contact is likely to occur.

The present invention has been made in view of such conventional problems, and has as its object to provide a probe mechanism capable of stably and surely contacting a probe with a lead wire.

"Means for Solving the Problems" The gist of the present invention for achieving the object is as follows: (1) In order to connect to a lead wire of an electronic component held at a predetermined position, a lead wire protruding from the electronic component is connected. In the probe mechanism to be provided, a probe plate which is formed of an elongated plate spring and has a bent linear contact end perpendicular to the lead wire at the tip thereof, and the elastic deformation of the probe plate is gentle from the upper part to the lower part. A biasing plate having a lower height and overlapping the lower back surface of the probe plate so as to have an auxiliary plate having a lower height and overlapping the back surface of the biasing plate; A contact drive means for causing the contact end to approach the lead wire from the side and resiliently contact the lead wire. .

(2) The probe mechanism according to item (1), further comprising a sub-probe plate having a contact end to a lead wire and a bent end formed at a tip thereof so as to overlap with the probe plate.

[Operation] When an electronic component is inspected, the probe unit is held at a position away from the lead wire until the electronic component is held at a predetermined position. The probe unit on which the electronic component is positioned is operated to bring the contact end into contact with a lead wire protruding from the electronic component.

When the contact drive means of the probe mechanism is operated, the probe unit comes close to the lead wire of the electronic component from the side, and the contact end of the probe plate elastically contacts the lead wire. The contact end has a width because it has a linear shape perpendicular to the lead wire, and can be contacted without any trouble even if the lead wire is slightly bent.

When the probe is advanced slightly from the position where the contact end of the probe plate just touches the lead wire, the tip of the probe plate, which is a long and thin plate spring, is resiliently displaced, and the biasing plate that overlaps the back is located at the bottom of the probe plate. Press resiliently to assist.

Due to the urging force between the urging plate and the probe plate, the contact end elastically contacts the lead wire from the side with a moderate strength. The elastic deformation of the probe plate is gentle from the upper part to the lower part, so that the fatigue against repeated load is small. Further, the auxiliary plate has a lower height and overlaps with the back surface of the urging plate to assist the gentle deformation of the probe plate.

When the sub-probe plate is provided, the sub-probe plate as well as the probe plate is in close proximity to the lead wire and its contact end overlaps and comes into contact with the lead wire, so that reliable electrical contact between the probe and the lead wire is made.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

 1 to 6 show an embodiment of the present invention.

5 and 6 show an inspection apparatus having a probe mechanism.
10 shows an outline, for inspecting an electronic component W which is a laser light emitting element while holding the electronic component W at a predetermined position.

The inspection device 10 is connected to a table 20 via a pivot 12 on a base 11.
Are pivotally supported by a feed mechanism (not shown) so as to be rotatable and held at a predetermined angle pitch, face the periphery of the table 20, and hold the electronic components W in accordance with various processes.
Are arranged, and a probe mechanism 40 is arranged on the base 11 corresponding to the positioning mechanism 30.

Hereinafter, the positioning mechanism 30 will be described in detail with reference to FIGS.

The electronic component W has lead wires W1 and W2 extending from the bottom, a flange W4 at the base of the head W3, and a notch W5 provided in the flange W4.

The holding holes 21, 21... Are formed to penetrate from the surface of the table 20 to the bottom and into which the electronic components W, which are small works, fit.

The holding hole 21 has an inner diameter that does not allow the flange W4 of the electronic component W to pass therethrough, a seat plate 22 is fixedly provided on the outer periphery of the holding hole 21, and an indentation seat 22a in which the flange W4 is fitted is formed in the seat plate 22. The positioning pin 23 that fits into the notch W5 of the electronic component W is fixed to the seat plate 22 by a screw 23a so as to protrude from the recess 22a.

The thickness of the table 22 or the depth of the holding hole 21 is such that when the notch W5 is seated on the indentation seat 22a and the electronic component W is fitted into the holding hole 21, the lead wires W1 and W2 project below the holding hole 21. Set to about.

The positioning mechanism 30 is a positioning drive unit that is an air cylinder held on the upper end of the column pivot 12 erected on the base 11.
31 and a pressing member 35 driven by the positioning driving means 31
It is composed of

The positioning drive means 31 is for displacing the holding member 35 between a holding position shown by a solid line in FIG. 4 and an opening position shown by an imaginary line.
It has a piston rod 33 that is displaced linearly in an oblique direction of about 45 degrees with respect to the 20 surfaces.

The holding member 35 is formed of a spring wire, and the piston rod 33
The base 36 is inserted into a split groove 33a provided at the end of the piston rod 33, and the split groove 33a is narrowed by a tightening screw 34, thereby being fixed to the end of the piston rod 33.

The tip of the holding member 35 is bent to form a holding portion 37 parallel to the surface of the table 20. When the piston rod 33 is retracted, the pressing portion 37 is disposed so as to abut on the corner between the head W3 and the flange W4 of the electronic component W obliquely from above and resiliently displace.

The holding member 35 also serves as a grounding contact terminal that is in elastic contact with the casing of the electronic component W and is electrically conductive.

The probe mechanism 40 corresponds to the positioning mechanism 30, and the holding hole 21
It is arranged facing the lead wires W1 and W2 protruding below.

As shown in FIG. 1 and FIG.
The probe units 45, 45 are supported by contact driving means 41, which is an air cylinder fixed to a support bracket 40a fixed to the base 11.

The contact driving means 41 includes hands 42, 42 which are symmetrically moved in parallel.
A probe support bracket 43 is fixed to the hands 42, 42 with screws 43a, 43a, respectively, and a holding plate 44 for holding a base of the probe unit 45 is provided.

The probe unit 45 includes a probe plate 46 formed of an elongated leaf spring having a bent contact end 46a having a linear edge perpendicular to the lead wires W1 and W2 at the tip, and a probe plate 46 overlapping the probe plate 46. A probe plate 47 having a bent contact end 47a with the lead wires W1 and W2, and a biasing plate 48 overlapping the rear surface of the lower portion of the probe plate 46.
And an auxiliary plate 49 that supports the back of the urging plate 48.

The sub-probe plate 47, the urging plate 48, and the auxiliary plate 49 are all made of leaf springs, and their bases and the base of the probe plate 46 are overlapped and held by the holding plate 44,
The probe 44 is fixed to the probe support bracket 43 by screws 44a. The contact driving means 41 is arranged such that the hands 42, 42 resiliently contact the probe plates 46, 47 contact ends 46a, 47a of the probe unit 45 with the lead wires W1, W2 in close proximity to the sides. .

 Next, the operation will be described.

When supplying the electronic component W which is a small work, the piston rod 33 of the positioning drive means 31 protrudes from the cylinder 32, and the holding member 35 is held at an open position so as not to be obstructed. By a mechanism, the seat plate 22 is fitted into the holding hole 21 of the table 20 in a predetermined posture.
Supplied to

When supplied, the flange W4 fits into the indentation seat 22a, the electronic component W is placed on the seat plate 22, and the notch W5 is provided with a positioning pin.
23 are fitted, and the lead wires W1 and W2 protrude downward from the holding hole 21. In this state, the electronic component W is simply placed, and is roughly positioned, but strictly still has a displacement.

Next, the positioning drive means 31 is operated to displace the piston rod 33 in the retracting direction. The pressing member 35 is displaced obliquely downward with respect to the surface of the table 20, and the pressing portion 37 is pressed against the corner between the head W3 and the flange W4, and comes into contact with the electronic component W obliquely from above. When the pressing position is slightly advanced after the contact, the pressing member 35 is resiliently displaced, and the electronic component W is pressed against the holding hole 21 without difficulty and the position is fixed and held.

When the electronic component W is transferred, the pressing member 35 is raised obliquely by the positioning drive means 31 to the open position. There is no pressing part of the electronic component W, and there is no interference even when the table 20 is rotated, and the electronic component W can be picked up and taken out.

When inspecting the electronic component W, the probe units 45, 45 which are disposed to face each other until the lead wires W1, W2 of the electronic component W protrude downward from the holding hole 21 of the table 20 and are positioned. As shown in FIG. 7A, it is held at a position away from the lead wires W1 and W2.

When the positioning is performed by pressing the electronic component W with the pressing member 35, the probe mechanism 40 is operated, and the protruding lead wire W
1. The probe units 45, 45 are brought close to W2.

When the contact driving means 41 of the probe mechanism 40 is operated, the hands 42, 42 move so as to approach each other, and the probe units 45, 45 approach the lead wires W1, W2 of the electronic component W from the side, and Contact ends 46a, 46a of certain probe plates 46, 46
Contacts the lead wires W1 and W2 first. The contact ends 46a, 46a have a width because they have a linear shape orthogonal to the lead wires W1, W2,
Even if the lead wires W1 and W2 are slightly bent, they come into contact without any trouble.

When the probe units 45, 45 are further advanced, the contact ends 47a, 47a of the sub-probe plates 47, 47 are similarly connected to the lead wire W.
Abuts 1, W2.

When the probe 45 is slightly advanced from the position where the contact ends 46a, 47a of the probe plate 46 and the sub-probe plate 47 just contact the lead wires W1, W2, the tip of the probe plate 46, which is an elongated plate spring, is resiliently displaced. Then, the urging plate 48 overlapping the back surface resiliently pushes the lower portion of the probe plate 46 to assist, and the urging force of the urging plate 48, the probe plate 46 and the sub-probe plate 47 causes the contact ends 46a and 47 to contact each other.
a makes elastic contact with the lead wires W1 and W2 from the side with moderate strength.

As shown in FIG. 2B, the contact end 47a of the sub-probe plate 47 overlaps the contact end 46a of the probe plate 46 and the lead wires W1 and W2 so that the probe unit 45 and the lead wires W1 and W2 Reliable electronic contact is made.

Since the probe plate 46 and the sub-probe plate 47 are gently deformed from the upper part to the lower part, the fatigue against repeated load is small. Further, the auxiliary plate 49 overlaps the back surface of the urging plate 48 with a reduced height, thereby assisting the gentle deformation of the probe plate 46.

The holding member 35 elastically contacts the outer surface of the electronic component W and functions as a ground contact terminal. So the probe unit
A current is applied to 45 and a voltage is applied to inspect the electronic component W.

When the inspection is completed, the contact drive means 41 is operated in the direction opposite to the direction at the start, and the probe unit 45 is retracted as shown in FIG. 2 (a).

In the above-described embodiment, the wire portion of the holding member is brought into contact with the corner of the small work. However, in the case of a small work without such a corner, an engaging portion for the small work is provided at the tip of the holding member. Needless to say, it may be provided.

[Effect of the Invention] According to the probe mechanism of the present invention, the linear contact end is brought into contact with the lead wire for reliable electrical connection in accordance with the positioning, and the probe plate is moved upward by the urging plate. From the lower part to the lower part, making it difficult for poor contact to occur even if the lead wire is bent.Also, the probe can be brought into contact with the lead wire with an appropriate elasticity, so it is too strong Therefore, the lead wire does not bend, and the contact failure due to being too weak does not occur. Since the deformation of the probe plate at the time of contact is gentle, the fatigue of the probe plate is small and the durability is high.

[Brief description of the drawings]

1 to 6 show one embodiment of the present invention.
FIG. 2 is an exploded perspective view of the probe mechanism, FIG. 2 is a front view of the probe mechanism in various operation states, FIG. 3 is an exploded perspective view of the positioning mechanism, FIG. 4 is a perspective view of the same, and FIG. 6, FIG. 6 is a plan view of the same, FIG. 7 and FIG. 8 show a conventional example, FIG. 7 is a plan view of a positioning mechanism and a probe mechanism, and FIG. 8 is FIG.
It is a VIII arrow view. 10 inspection apparatus, 11 base 20 table, 21 holding hole 30 positioning mechanism 31, positioning driving means 35 holding member 37 holding part 40 probe mechanism 41 … Contact drive means 45… Probe unit 46… Probe plate 47… Sub-probe plate 46a, 47a… Contact end, 48… Biasing plate

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G01R 1/073 G01R 31/26

Claims (2)

(57) [Claims] 1. A probe mechanism for connecting a lead wire of an electronic component held at a predetermined position to a lead wire protruding from the electronic component, the probe mechanism comprising an elongated leaf spring, and a tip end orthogonal to the lead wire. A probe plate having a bent linear contact end,
An urging plate that overlaps the lower surface of the lower portion of the probe plate with a lower height so that the elastic deformation of the probe plate becomes gentler from the upper portion to the lower portion, and a height is reduced on the rear surface of the urging plate. A probe mechanism, comprising: a probe unit having an overlapping auxiliary plate; and contact drive means for causing a contact end of the probe unit to approach a lead wire sideways and resiliently contact the lead wire. 2. A probe mechanism according to claim 1, further comprising a sub-probe plate having a bent end at a contact end with a lead wire, which is superimposed on the probe plate.