JP2802713B2 - Package structure for mounting IC chip and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for mounting a high frequency-wide band IC chip for mounting a high frequency / wide band IC chip.

[0002]

2. Description of the Related Art Conventionally, a high-frequency IC chip is fixed to a package having a bathtub structure made of metal or ceramic by an adhesive or the like, and a wire, a ribbon or an IPF is provided between terminals.
They are electrically connected by a carrier or the like. Furthermore, I
The package on which the C chip is mounted is mounted on a case having a signal input / output coaxial connector. FIG.
Indicates a conventional package for mounting IC chips.
25 is a package, 26 is a package cap, 27 is an IC chip, 28 is a power supply line, 29 is a signal line, 30 is a ground, and 31 is a high-frequency cutoff capacity. IC chip 2
When the package 7 is mounted on the package 25, an inert gas is sealed therein to secure long-term reliability of the IC chip 27, and the package cap 26 is sealed with an adhesive or the like to prevent leakage. The input / output signal line 29 and the power supply line 28 of the package 25 have a coplanar line structure and a strip line structure as shown in FIG. 5, and the insertion loss and the reflection loss from the outside of the package 25 to the mounting portion of the IC chip 27 are reduced. It is designed to match the input / output impedance with the IC chip 27 in order to suppress it.

[0003]

However, in this structure, there is a problem in that high-frequency characteristics are deteriorated due to discontinuity of the line structure between the grounded coplanar line, the coaxial structure line, the grounded coplanar line, and the wire IC chip. Also,
The inside of the IC chip mounting package is larger than the IC chip, and the resonance frequency associated with the cavity size
There have been problems such as the inability to make full use of the characteristics of high frequency and broadband IC chips. Further, since the signal line and the power supply line have a coplanar line structure inside the chip mounting cavity, the electromagnetic field coupling between adjacent lines is high frequency I
This causes deterioration of high-frequency characteristics when the C chip is mounted.

An object of the present invention is to provide a package structure capable of minimizing deterioration of high frequency characteristics and a method of manufacturing the same.

[0005]

In order to achieve this object, an IC chip mounting package according to the present invention has a hollow portion in the center and has a side surface as a coaxial connector and a power supply terminal as high frequency signal input / output terminals. A four-sided integral frame-type structural frame forming a package side wall having at least one power supply bead; It is composed of three blocks of an upper metal block which is inserted from above the hollow portion so as to be in contact with each other, forms an upper cover of the package, and has a lower end surface where the upper end surface of the lower metal block inserted from below is fitted. The lower metal block that forms the bottom of the package and the upper metal block that forms the upper part of the package have a structure in which grooves are dug at the same position on the upper and lower surfaces that are in contact with each other for mounting signal lines, power supply lines, and IC chips. Before the only lower metal block at the bottom of the package is connected to the package frame, the wiring board and IC chip are adhered in the groove with an adhesive or the like. By integrating the frame-type structure frame and the lower metal block that forms the package bottom,
A package in which the signal line and the power supply line have a coaxial structure from the position of the coaxial connector and the power supply bead to the position immediately near the chip mounting is configured. Because of such a configuration, signal lines,
Electromagnetic field coupling between power supply lines can be reduced, and the high-frequency characteristics of the package can be improved. It differs from the prior art in the cavity size and the signal line and power supply line structure of the IC chip mounting portion.

[0006]

Embodiments of the present invention will be described below. FIG. 1 shows a first embodiment of a package for mounting an IC chip according to the present invention. In FIG. 1, reference numeral 1 denotes a four-frame integral frame type structure frame which forms a package side wall, and 2 denotes a lower metal block, and a hollow portion 1 a of the frame 1 from below so that the outer periphery is inscribed in an inner wall of the four-frame integral frame type structure frame 1. And a cross-shaped groove 2b, 2c for mounting a signal line, a power supply line, and a chip. Reference numeral 3 denotes an upper metal block, which is inserted from above into the hollow portion 1a of the frame 1 so that the outer periphery of the frame 1 is inscribed in the inner wall of the frame 1 and has a flange-like projection 3a forming a lid of the package. And a metal block having cruciform grooves 3b and 3c formed integrally with the lower metal block 2 so that the signal line and the power supply line have a coaxial structure. Reference numeral 4 denotes a coaxial connector for input / output signal lines, reference numeral 5 denotes a power supply bead, and reference numeral 6 denotes a fixing screw for fixing the frame 1 and the metal blocks 2 and 3.

FIG. 2 shows the IC chip 7 in the center of the cross-shaped grooves 2b and 2c of the metal block 2 shown in the first embodiment, the input / output signal line 8 in one groove 2b, and the inside of the other groove 2c. A power supply line 9, a high-frequency cutoff capacitor 10, and an earth post 11 are mounted on the input / output line 8 and the terminals of the IC chip 7, the power supply line 9 and the terminals of the high-frequency cutoff capacitor 10, the high-frequency cutoff capacitor 10 and the IC chip 7, respectively. Between terminals, earth post 1
1 shows a state in which the terminals 1 and the IC chip 7 are electrically connected by a ribbon.

First, in assembling a package for mounting a high-frequency IC chip according to the present invention, parts are separately mounted and mounted on each of the four-frame integral frame structure frame 1 and the lower metal block 2. That is, the coaxial connector 4 for input / output signal lines and the beads 5 for power supply are previously attached to the four-in-one integrated frame structure frame 1. For the lower metal block 2, the IC chip 7 is attached to the lower metal block 2.
Are fixed to the center of the cross-shaped grooves 2b and 2c with an adhesive such as silver paste or the like, and the components of the input / output signal line 8, the power supply line 9, the high-frequency cutoff capacitor 10, and the ground post 11 are It is fixed to the grooves 2b and 2c as shown in the figure, and further, required electrical connection is made. Further, the lower metal block 2 is inserted into the hollow portion 1a of the frame 1 from below, and the lower surface of the frame 1 and the upper end surface of the flange-shaped protrusion 2a provided on the four sides at the lower end of the lower metal block 2 are airtightly contacted for fixing. Fix with screws 6. Thereafter, the input / output signal line 8 and the coaxial connector 4 and the power supply line 9 and the power supply beads 5
Are electrically connected to each other by means of silver paste or the like, the upper metal block 3 is inserted into the hollow portion 1a of the frame 1 from above, and flange-shaped protrusions provided on the upper surface of the frame 1 and the upper end of the lower metal block 2 are provided on all sides. By bringing the lower surface 3a into airtight contact with the lower surface 3a and fixing it with the fixing screw 6, the input / output line 8 and the power supply line 9 have a coaxial structure, and at the same time, a high-frequency and wideband IC package is completed.

FIG. 6 shows a simulation result of input / output isolation characteristics at the time of chip-end mounting as a characteristic comparison between the conventional package of FIG. 5 and the package of the present invention of FIG. 6, the horizontal axis is the frequency, the vertical axis represents the S parameter shows the S ₁₁ characteristics and S ₂₁ characteristics. Generally Although isolation characteristic S ₂₁ is needed than about -30 (dB), the conventional package 20
In contrast, the package according to the present invention has a small characteristic degradation while the cavity degradation in the package occurs near (GHz), confirming the effectiveness of the package according to the present invention.

FIG. 3 shows a second embodiment of a package for mounting an IC chip according to the present invention. In contrast to the first embodiment which has a package structure for a one-chip package, FIG. It shows a package structure when a chip is mounted. In the figure, reference numeral 12 denotes a four-frame integrated frame structure frame corresponding to the four-frame integrated frame structure frame 1 of the IC chip mounting package shown in FIG. Reference numeral 13 denotes a lower metal block having a flange-shaped protrusion serving as a bottom of the package corresponding to the lower metal block 2 in FIG. 1, and a plurality of power supply line mounting grooves 13c to form a plurality of cross-shaped grooves. A plurality of IC chips are mounted at positions where the signal line mounting grooves 13b and the power supply line grooves 13c intersect. Reference numeral 14 denotes an upper metal block serving as a lid of a package corresponding to the upper metal block 3 in FIG. 1, and a plurality of cross-shaped grooves are dug to correspond to the grooves of the lower metal block 13.

FIG. 4 shows the lower metal block 13 shown in FIG.
Input / output signal line 18, power supply line 19, chip-to-chip connection signal line 20, IC chip 21, high-frequency cut-off capacitor 2
2, an earth post 23 and an interstage capacitor 24 are mounted, and between the input / output signal line 18 and the terminal of the IC chip 21;
And the terminal of the high-frequency cut-off capacitor 22, the terminal of the high-frequency cut-off capacitor 22 and the terminal of the IC chip 21, and the ground post 23 and the terminal of the IC chip 21 are electrically connected by a ribbon. FIG. 3 is a diagram showing a state where a capacitor is mounted.

In this case, as in the case of the first embodiment, first, parts are separately mounted and mounted on each of the four-frame integrated frame structure frame 12 and the lower metal block 13 as in the first embodiment. That is, the coaxial connector 15 for the input / output signal line and the beads 16 for the power supply are previously attached to the frame 12 having the four-part frame. In addition, a plurality of IC chips 21 are fixed to the lower metal block 13 at positions where the signal line grooves 13b and the power supply line grooves 13c intersect with an adhesive or the like. Line 19, inter-chip connection signal line 2
0, the high-frequency cutoff capacitor 22, and the ground post 23 are fixed in the predetermined grooves 13b, 13c of the lower metal block 13, and a desired electrical connection is made. Further, the lower metal block 13 is connected to the hollow portion 12
The lower metal block 13 is airtightly connected to the lower metal block 13 using a fixing screw 17 at the lower end of the lower metal block 13. Thereafter, the input / output signal line 18 and the coaxial connector 15 and the power supply line 19 and the power supply beads 16 are electrically connected by means of silver paste or the like, and the upper metal block 14 is inserted into the hollow portion 12a of the frame 12 from above. The upper surface of the flange-shaped projection 14a and the upper surface of the frame 1 are air-tightly connected with the upper surface of the frame 1 using fixing screws 17 in a state where the lower surface of the lower metal block 13 is in contact with the upper surface of the lower metal block 13. Signal line 18, power supply line 1
9. The high-frequency IC package is realized at the same time that the inter-chip connection signal line 20 has the coaxial structure.

As described above, the package for mounting a high-frequency IC according to the present invention is obtained by dividing the structure of the conventional bathtub into a frame surrounding the four-frame frame, a metal block forming the bottom of the package, and a metal block forming the lid of the package. As a result, the high frequency I
Since the C chip, the input / output signal line, the power supply line, the high-frequency cutoff capacitor, the ground post, and the like can be mounted, the assembling work becomes easy. In addition, since the frame surrounding the frame with the coaxial connector mounted thereon has an airtight structure, the high-frequency IC chip can be directly mounted, so that the need for the conventional airtight package is eliminated and the size of the package can be reduced. . Further, by integrating the IC chip mounting portion and the hermetic package portion, the input / output signal line and the power supply line are shortened to reduce transmission loss, and the line structure is coaxial from the coaxial connector to the immediate vicinity of the IC chip portion. Due to the structure, the characteristic degradation can be prevented by removing the discontinuous portion of the line structure seen in the conventional bathtub structure package.

[0014]

As described above, the package for mounting a high-frequency IC according to the present invention is inserted from below so as to be inscribed in a frame with a four-part frame, and is inscribed in the frame with a metal block forming the bottom of the package. And a metal cover, which is inserted from above into the package lid and is integrated with the lower metal block to realize a coaxial structure in the line structure. Each of the three structures is hermetically connected. The structure was made possible. As described above, the three-block independent structure of the package makes it possible to independently structure each structure, and the chip mounting, the input / output signal line, the power supply line, the high-frequency cut-off capacitance, and the mounting of the ground post are enclosed. This is possible without the integral frame type frame. Also,
Removal of unnecessary reflection caused by discontinuity of line structure by integrating coaxial connector for input / output signal and bead for power supply line into frame with integrated frame structure and coaxial structure from the connector to chip. Since the cavity mounting frequency is increased due to the fact that the chip mounting portion is substantially the same as the chip size, it is effective as a package in a high frequency band. Furthermore, since the signal line and the power supply line have a coaxial structure from the position of the external connector and the power supply bead to the vicinity of the chip portion, the input / output signal line,
By spatially separating adjacent lines such as a power supply line, electromagnetic field coupling can be reduced, and the performance of a high-frequency, wideband IC mounting package can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a package showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which an IC chip, an input / output signal line, a power supply line, a high-frequency cutoff capacitor, and an earth post are mounted on the package of FIG. 1 and are electrically connected by a ribbon.

FIG. 3 is a perspective view of a package when a plurality of IC chips exist as a second embodiment of the present invention.

FIG. 4 shows a state in which an IC chip, an input / output signal line, a power supply line, an inter-chip connection signal line, a high-frequency cutoff capacitor, an earth post, and an interstage capacitor are mounted on the package of FIG. FIG.

FIG. 5 is a perspective view of a conventional bathtub-shaped package.

FIG. 6 is a diagram illustrating isolation characteristics of a conventional package and a package of the present invention by simulation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Four-frame integral frame type frame 1a Hollow part 2 Lower metal block with flange-shaped protrusion 2a Flange-shaped protrusion 2b, 2c Cross-shaped groove 3 Upper metal block with flange-shaped protrusion 3a Flange-shaped protrusion 3b, 3c Cross-shaped groove Reference Signs List 4 coaxial connector 5 power supply bead 6 fixing screw 7 IC chip 8 signal line 9 power supply line 10 high-frequency cutoff capacity 11 earth post 12 frame type frame 12a hollow portion 13 lower metal block with flange-like protrusion 13a flange-like protrusion 13b, 13c Cross-shaped groove 14 Upper metal block with flange-shaped protrusion 15 Coaxial connector 16 Power supply bead 17 Fixing screw 18 Signal line 19 Power supply line 20 Chip-to-chip connection signal line 21 IC chip 22 High frequency cutoff capacity 23 Earth post 24 Interstage capacity 25 Package 26 Package Cap 27 IC Chip 28 Power Line 29 signal line 30 ground 31 RF breaking capacity

Claims (4)

(57) [Claims] 1. A frame surrounding a central hollow portion to form a package side wall, and a frame which is inserted from below into the hollow portion of the frame so as to be inscribed in an inner wall of the frame. A lower metal block forming a bottom of the lower metal block, which is inserted from above into the hollow portion of the frame so as to be inscribed in an inner wall of the frame, forms an upper lid of the package, and is simultaneously inserted from below with an upper end surface of the lower metal block. A frame having at least one coaxial connector as a high-frequency signal input / output terminal and at least one power supply bead as a power supply terminal on a side surface; Both the lower metal block and the upper metal block are spread in four directions on the opposite side to the upper end surface or the lower end surface which are in contact with each other. Package structure for mounting an IC chip having a flanged projection structure. 2. The lower metal block forming the bottom of the package, before being connected to the frame surrounding the integral frame type structure forming the side wall of the package, the upper surface end located on the opposite side of the flange-like projection structure has a signal. 2. The IC chip according to claim 1, wherein a groove for wiring, a power supply line substrate and an IC chip is formed, and the wiring substrate is adhered in the groove by an adhesive or the like. Package structure for mounting. 3. The package according to claim 1, wherein the upper metal block forming an upper part of the package has a structure in which a groove is dug at the same position as a groove on the upper end surface of the lower metal block forming a bottom of the package. In a state integrated with the four-in-one integrated frame type frame and the lower metal block,
3. The package structure for mounting an IC chip according to claim 1, wherein the signal line and the power supply line have a coaxial structure from a coaxial connector and a position of a power supply bead to a position immediately adjacent to the chip mounting. 4. A four-sided integrated frame structure frame formed around a central hollow portion to form a package side wall and having a signal coaxial connector and a power supply bead on the side wall, and a signal line, A step of inserting and fixing, from below, a lower metal block mounted in a groove in which the power supply line and the IC chip are dug in the upper end surface; and a step of inserting and fixing the lower metal block in which the signal line, the power supply line and the IC chip are mounted. A corresponding upper metal block having a lower end surface in which a groove is dug at the same position is placed in the hollow portion of the four-sided integral frame type structural frame so that the upper end surface and the lower end surface of the lower metal block come into contact with each other from above. A method of manufacturing an IC chip mounting package including a step of inserting and fixing.