JP2804155B2 - Electronic device cooling system - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electronic device used in an electronic computer or the like, and is particularly suitable for cooling an electronic device using a liquid cooling system. .

[Conventional technology]

A conventional cooling device for electronic devices is disclosed in Japanese Patent Application Laid-Open No. 60-160150.
As described in Japanese Unexamined Patent Publication (Kokai) No. 60-160151, a contact using a bellows is brought into contact with an electronic device to perform water cooling. However, in such an apparatus, the pressure of the water directly acts on the electronic device, which adversely affects the electronic device.

[Problems to be solved by the invention]

In the above prior art, no consideration is given to the effect of water pressure on the electronic device, and no consideration is given to the reliability of a soldered portion (CCB) of a semiconductor as an electronic device. For example, when the semiconductor is an LSI, the allowable load on the LSI is about 100 g per 1 cm ² . In the case of the conventional structure, considering the effect of water pressure, if the static pressure of water is 2 kg / cm ² , the force is L through the heat transfer contact surface.
The load applied to the SI greatly exceeds the allowable load.

An object of the present invention is to provide a cooling device for an electronic device that can improve the reliability of the electronic device by preventing the pressure of the refrigerant from being directly applied to the electronic device.

Another object of the present invention is to provide a cooling device for an electronic device that can control the contact pressure of the bellows to the electronic device with water pressure.

It is still another object of the present invention to provide a cooling device for an electronic device in which the pressing force against the electronic device can be controlled by balancing the internal pressure in the bellows.

[Means for solving the problem]

In order to achieve the above object, the present invention provides a plurality of electronic devices mounted on a wiring board, a contact which is in contact with the electronic device and cooled by touching a cooling medium, and A cooling device for an electronic device, comprising: a cooling jacket having a flow path of a cooling medium to be contacted; and a bellows connecting between the cooling jacket and the contact and flowing a cooling medium in the jacket toward the contact. At
A movable plate is attached to the jacket via a bellows at a position of the cooling jacket facing the contact, and the contact and the movable plate are connected by a connecting member.

Another feature of the present invention is that heat transfer is provided in which a movable body is provided via a telescopic member in a part of a coolant flow path in which a coolant flows, and a part of the movable body is brought into contact with the electronic device to cool the electronic device. In the mechanism, a sub movable body is attached to a refrigerant flow path at a position facing the heat transfer mechanism via a telescopic member, and the movable body and the sub movable body are connected by a connecting member.

Still another feature of the present invention is an electronic device soldered on a wiring board, a contact that is in contact with the electronic device and cools the electronic device, and a coolant flow path for flowing a coolant through the contact. An expansion and contraction member for connecting the refrigerant flow path and the contact to circulate the refrigerant in the refrigerant flow path to the contact side, and an expansion and contraction member in the refrigerant flow path at a position facing the contact. A movable member attached via the connecting member, and a connecting member connecting the contact member and the movable member.

Still another feature of the present invention is that an electronic device provided in the coolant flow path, a contact that is in contact with the back surface of the electronic device, and the electronic device together with the contact separates the electronic device from the coolant and has a contact A telescopic member that allows displacement, a connecting member coupled to the contact, an end member provided at an end of the connecting member on the opposite side to the contact, and configured in parallel with the contact; An object of the present invention is to provide a telescopic member for flexibly attaching the member to the partition wall of the coolant channel, and an adjusting means for adjusting a pressing force of the contact against the electronic device.

Still another feature of the present invention is that a main movable body is provided in a part of a refrigerant flow passage in which a refrigerant flows, and a part of the main movable body is brought into contact with an electronic device to cool the electronic device. A sub movable body is provided in a coolant flow path at a position facing the main movable body, and the main movable body and the sub movable body are connected by a connecting member.

Another feature of the present invention is that a refrigerant flow path in which a refrigerant flows is formed by a first flow path wall on the electronic device side and a second flow path wall on the anti-electronic device side.
The first flow path wall is formed of a thin wall in the vicinity of the electronic device, the thin wall is configured to be in contact with the electronic device, and the second flow path wall portion facing the thin wall is also formed. A thin portion is provided, wherein the thin portions of the first and second flow path walls are connected to each other by a connecting member.

[Action]

According to the present invention, a contact to an electronic device is provided in a cooling jacket (refrigerant flow path) via a bellows or the like, and a movable plate displaced by a refrigerant pressure in the same cooling jacket is provided at a position facing the contact. , The contact and the movable plate are connected to each other, so that the contact and the movable plate tend to be displaced in opposite directions by the refrigerant pressure. Those movements are offset,
The contact is pressed against the electronic device with an appropriate pressing force.

Further, by providing a means for applying an arbitrary spring force to the contact, the pressing force against the electronic device can be controlled. This pressing force can also be adjusted by means such as applying an arbitrary spring force to the movable plate.

〔Example〕

 Hereinafter, specific examples of the present invention will be described.

FIG. 1 is a system diagram showing an entire system of a cooling device for an electronic device. The refrigerant is cooled by the refrigerant circulation pump 100,
It is supplied to the coolant flow path of the LSI module 10 on the wiring board installed on the gantry 101. A semiconductor (LSI), which is an electronic device, is cooled by a contact heat transfer mechanism configured in a coolant channel. The semiconductor-cooled refrigerant is introduced into a refrigerant chiller unit 103 by a refrigerant pipe 102 and cooled to a low temperature.
The circulation system is configured such that the refrigerant cooled to a low temperature is again supplied to the refrigerant flow path 3 by the refrigerant circulation pump 100. FIG. 2 is a sectional view taken along the line AA 'of FIG.
FIG. 3 is a diagram showing an example of the internal configuration of an I-module 104. Refrigerant introduced from the refrigerant inlet 50 into the refrigerant supply path 27 of the refrigerant flow path 3
11 is guided to the contact 5 from the jet port 26 to cool the contact 5. The contact 5 contacts the LSI 2 and cools the heat generated by the LSI 2. The heat transfer performance is further improved when a good heat conductor (for example, heat conductive grease) is interposed between the contact surface of the contact 5 and the LSI 2. The refrigerant whose temperature has risen by cooling the contact 5 is discharged from the refrigerant outlet 51 through the refrigerant discharge passage. The force for flowing the refrigerant is given by the refrigerant circulation pump 100 shown in FIG. This force, as the pressure of the refrigerant, affects the entire system in which the refrigerant flows. Contact 5 in FIG.
Is attached to the coolant flow path 3 by the main bellows 4 to absorb the displacement (for example, thermal expansion and contraction) of the LSI 2, and forms a movable wall. As a result, the main bellows 4 extends due to the pressure of the refrigerant, and the contact 5
Pressed to I2. Although allowable pressure of LSI2 is usually 100g position, due to the pressure of the refrigerant (water lines sometimes become 2 kg / cm ^2-position), a state that can not guarantee the strength of the LSI. In the present invention, in order to remove the refrigerant pressure, as shown in FIG. 2, a bellows end plate (movable plate) 8 is provided in the refrigerant supply passage 27 via the sub-bellows 7, and this is connected to the contactor 5. The connection by the member 10 cancels the refrigerant pressure.

The detailed structure near one LSI 2 shown in FIG. 2 will be described with reference to FIG.

3 is configured to supply the refrigerant 11 to the contact 5 from the jet port 26. The refrigerant 11 supplied from the refrigerant supply path 27 through the jet port 26 exerts refrigerant pressure on the contact 5 to discharge the refrigerant. Discharged from road 28. The refrigerant pressure gives a pressing force 13 to the contact 5 and exerts that force on the LSI 2. Here, the contact 5 is connected to the bellows end plate 8 by a connecting member 10. Since the pressing force 14 is given to the bellows end plate 8 by the refrigerant pressure, the bellows end plate 8 has a balance effect with the pressing force 13 of the contact 5. As a result, the contact 5 can cool the heat generated by the LSI 2 without exerting the influence of the refrigerant pressure on the LSI 2.

 Next, another example of the refrigerant structure near the LSI 2 will be described.

In FIG. 4, in order to cool the LSI 2 disposed on the wiring board 1, a main concave part flow path 6 is formed by a main bellows 4 and a contact 5 in a part of the refrigerant flow path 3, Child 5 is LSI2
It is configured to be brought into contact with. In addition, the refrigerant passage 3
The refrigerant flow path 3 at a position opposite to the main recess flow path 6 provided in
The sub-bellows 7 and the bellows end plate 8 constitute a sub-recess channel 9, and the contact 5 and the bellows end plate 8 are connected by a connecting member 10. The heat generated by the LSI 2 is transmitted to the refrigerant 11 through the contact 5 through the contact portion A, and is released to the outside. With respect to the thermal expansion and contraction of the LSI 2, the contact 5 operates following the displacement of the LSI 2 by the elastic deformation of the main bellows 4, and the contact between the LSI 2 and the contact 5 is maintained. Here, the refrigerant 11 is circulated by a pump and has a pressure. The contact 5 receives a pressing force 13 from the inside by the pressure of the refrigerant 11 and exerts a force in the direction of extending the main bellows 4. The bellows end plate 8 also receives a pressing force 14 from the inside by the pressure of the refrigerant 11, and exerts a force in the direction of extending the sub-bellows 7. Here, the contact 5 and the bellows end plate 8 are connected by a connecting member 10, and a pressing force 13
And 14 have the same refrigerant pressure and are balanced,
Can be prevented from being displaced by the pressure of the refrigerant 11. Also in this example, the pressure of the refrigerant 11 flowing through the refrigerant flow path 3 can be balanced by canceling out the pressure by the contact 5 and the bellows end plate 8. The heat transfer mechanism can be configured by contacting the contacts 5. As a result, LSI2 is protected,
In addition, since an excessive force is not applied to the joining member (eg, solder) 12 connecting the LSI 2 and the wiring board 1, the strength of the joining member 12 can be maintained, and the joining member 12 can be maintained.
There is a great effect that an excessive strength design requirement is unnecessary.

FIG. 5 is a partial cross-sectional perspective view showing the entire configuration (LSI module) of the contact heat transfer mechanism (cooling structure) shown in FIG.
The contact heat transfer mechanism is arranged at a position corresponding to the position of the LSI 2 on the wiring board 1 on the planar coolant flow path 3. With this configuration, the influence of the refrigerant pressure is not exerted on the LSI 2,
Many LSIs 2 can be cooled at the same time.

FIG. 6 shows another example. In this case, a spring 15, an adjusting screw 16 and a fixing seat 17 are provided on the device shown in FIG.
The configuration is such that the pressing force and displacement of the contact surface A can be controlled in accordance with the height position of 2. According to this example, the height position of the contact 5 can be adjusted in response to a change in the height position of the contact surface A due to a mounting error of the LSI 2 or the like. In particular, when a plurality of concave flow paths 6 and 9 are provided in the refrigerant flow path 3, each contact 5 can be adjusted, and variation in the LSI 2 can be corrected to control the pressing force and displacement of the contact surface A. The adjusting action is as follows. If the concave flow paths 6 and 9 are formed with the same structure, the contact 5 does not expand and contract due to the pressure of the refrigerant 11. Combine this with contact 5 and LSI2
The spring 15 is compressed by an adjusting screw 16 on a fixed seat 17 in order to make contact. The contact 5 comes into contact with the LSI 2 by the pressing force 18 generated by the compression of the spring 15. Here, the magnitude of the pressing force 18 can be adjusted by changing the compression length of the spring 15. Next, considering the case where the LSI 2 thermally expands (indicated by an arrow 19), the displacement of the contact 5 is absorbed by the compression of the spring 15 through the connecting member 10 and the bellows end plate 8 because the contact 5 is pushed back. Pressing force when thermal expansion 19 disappears
Return to the original at 18.

FIG. 7 shows still another example. Instead of the spring 15, the adjusting screw 16 and the fixing seat 17 shown in FIG. 6, it is constituted by a threaded displacement adjusting member 20, nuts 21 and 22. Further, the configuration of the pressing force adjuster and the leaf spring 23 is adopted. According to this example, in order to bring the contact 5 into contact with the LSI 2, the displacement adjusting member 20 is moved by the pressing force adjusters 21 and 22 to adjust the position of the contact 5 and the magnitude of the pressing force 18. . The magnitude of the pressing force 18 is determined by the amount of deflection of the leaf spring 23. Thermal expansion of LSI2
The displacement of the contact 5 due to 19 or the like is absorbed by the deflection of the leaf spring 23 through the connecting member 10, the bellows end plate 8 and the displacement adjusting member 20. Note that, in this example, the pressing force 18
, The nut 22 may be omitted.

In the example shown in FIG. 8, the bellows portion shown in the example of FIG. 7 is changed to the structure of the main diaphragm 24 and the sub-diaphragm 25, and the operation function is the same as that of FIG. By using the diaphragm mechanism, the volumes of the main concave channel 6 and the sub concave channel 9 can be reduced, and the amount of protrusion from the refrigerant channel 3 can be reduced.

In the example shown in FIG. 9, the diameter of one end of the telescopic movable body is large and the diameter of the other end is relatively small.
This example is effective when the diameter of the movable body mounting portion 29 of the refrigerant flow path 3 is different from the diameter of the contact 5 or the bellows end plate 8, and the adjustment range of the spring constant of the bellows 4, 7 is also Can be large. Furthermore, in this example, the pressing force of the contact 5 can be generated by making the area of the bellows end plate 8 smaller than the area of the contact 5. Tenth
In the example shown in the figure, the bellows end plate 8 is compared with the area of the contact 5.
And a stopper 30 for determining the adjustment allowance of the spring 15 and the adjusting screw 16 is provided. According to this configuration, since the area of the bellows end plate 8 is larger than that of the contact 5, the contact 5 is separated from the LSI 2 by the difference in the pressing force due to the refrigerant pressure, that is, the difference between the pressing force 14 and the pressing force 13. Receiving the separation force 31
Pushing force 18 to push contact 5 against LSI2, overcoming 31
Is provided by a spring 15 and an adjusting screw 16.
Also, a stopper 30 is provided so that the bellows end plate 8 does not rise too much by the separating force 31 and the contact 5 is separated from the LSI 2. As a result, the refrigerant pressure does not exert a force on the LSI 2 and the contact 5 can maintain a stable contact state.

In the example shown in FIG. 11, in order to improve the heat transfer performance of the contact 5, the contact 5 is provided with a radiating fin 32, and the main bellows 4 is divided into a main bellows inlet side 4a and a main bellows outlet side 4b. In this configuration, a plurality of connecting members 10a and 10b are provided in a configuration in which the refrigerant easily flows through the heat radiation fin 32 of the contactor 5. Thereby, stable contact of the contact 5 having a wide contact surface can be obtained.

In the example shown in FIG. 12, the sub-bellows 7 is provided in the coolant channel 3. According to this example, it is possible to adopt a configuration in which the portion of the sub-bellows 7 does not protrude outside the coolant channel 3. The sub-bellows 7 provided in the coolant flow path 3 also has an effect of guiding the flow of the coolant 11 toward the contact 5.

In the example shown in FIG. 13, the LSI 2 is provided in the refrigerant flow path 3, and the refrigerant 11 does not touch the LSI 2. The contact portion between the adjusting screw contact end 33 and the upper end 34 of the connecting member has an arc-shaped uneven shape. According to this example, since the connecting member 10 can be inclined, the surface of the contact 5 follows and absorbs the unevenness of the horizontality of the contact surface 2A of the LSI 2 to improve the contact state between the LSI 2 and the contact 5. Can be kept.

In the example of FIG. 14, the movable member 35 is made of a rigid body, and a sealing O-ring 37 is provided on the boss portion 36 provided in the coolant channel 3 so that the movable member 35 is reciprocated while contacting the O-ring 37. Things. This movable member 35 becomes the contact 5 directly. Further, the connecting member 10 for connecting the movable members 35 to each other and the movable member
The joint with 35 is an arc-shaped uneven surface, that is, a concave portion of the movable member.
38 and a connecting member convex portion 39. Contact 5 (35) and LSI2
The contact force is obtained by adjusting the adjusting screw 16 mounted on the fixed seat 17 and the spring 15. According to this example, a solid contact heat transfer mechanism that does not deform due to the refrigerant pressure can be configured.

The example shown in FIG. 15 is a combination of the main bellows 4 of the telescopic movable body and the movable member 35 as the sub movable body. In this example, the contact element 5 can be moved vertically and laterally, and the movable member 35 can be provided as a sub movable body to provide a rigid structure. Further, the refrigerant passage 3 and the movable body
There is an advantage that the process of assembling 4,35 can be performed from one direction.

In the example of FIG. 16, the main movable body constituting the contact 5 and the sub movable body disposed at a position facing the main movable body are integrally formed as a rigid movable block 40, and the movable block 40 has a donut shape. It is suspended in the refrigerant channel 3 by a (hollow disk-shaped) main diaphragm 24 and sub-diaphragm 25. Further, an O-ring may be used instead of the diaphragms 24, 25. The movable block 40 is provided with a through passage 41,
It is a flow path for the refrigerant. Since the through-passage 41 receives the same refrigerant pressure over the entire circumference, a contact heat transfer mechanism can be obtained without exerting the influence of the refrigerant pressure on the LSI 2.

In the example shown in FIG. 17, a part of the refrigerant flow path 3 is made thinner, and the lower flow path wall 3a is used as the contact 5, and the upper flow path wall facing the contact 5 is formed.
3b is a sub movable body, and both are connected by a connecting member 10. Further, to obtain the pressing force 18, the fixed seat 1
7, a spring 15 and an adjusting screw 16 are provided. With this configuration,
Since a contact heat transfer mechanism can be obtained without making a hole for attaching a movable body to the coolant flow path 3, a problem of leakage of the coolant 11 can be prevented. Also, the structure is simple,
A mechanism with less failure can be realized.

FIG. 18 is a modified example of FIG.
Thin portions 3a ₁ and 3b ₁ are formed on 3a and 3b, respectively.

In the example shown in FIG. 19, the contact 5 and the bellows end plate 8 are connected by a connecting member 10 made of a flexible material such as a chain, a spring, and a string. By appropriately setting the length and the tensile force of the connecting member 10 made of this flexible material, it is possible to balance with the refrigerant pressure.

According to the present embodiment, since the force acting on the heat transfer contact surface due to the refrigerant pressure can be eliminated or reduced, a special structure that can withstand water pressure is not required, and the structure is simplified and the manufacturing process is simplified. Simplification and reduction of production costs become mobile.

As described above, a specific example of the present invention has been described in which the contact heat transfer mechanism is configured as a refrigerant flow path. However, the present invention is not limited to this, and the movable partition (for example, a bellows end plate) is operated from outside to control the flow. A system configuration for controlling the road pressure and giving a pulsation may be adopted. Further, it is also possible to provide a function of balancing the pressure fluctuation in the flow path by applying a constant preload to the movable partition.

In the above description, cooling of the LSI has been described. However, the present invention is applicable to electronic devices that require various contact refrigerants in addition to the LSI.

〔The invention's effect〕

According to the present invention, since the pressure of the refrigerant is not directly applied to the electronic device, a contact for cooling the electronic device can be pressed against the electronic device with an appropriate pressing force, and There is an effect that a cooling device for an electronic device that can improve reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is a system diagram showing an entire system of a cooling device for an electronic device, FIG. 2 is a sectional view taken along the line AA ′ of FIG. 1, and shows a specific embodiment of the present invention. FIG. 4 is a partial longitudinal sectional view showing a detailed structure near one electronic device shown in FIG. 2, and FIG. 4 is a main part showing a detailed structure near an electronic device showing a partially modified example of the cooling structure shown in FIG. Longitudinal section, fifth
The figure is a partial cross-sectional perspective view showing the entire structure (LSI module) of the cooling structure shown in FIG. 4, and FIGS. 6 to 19 are partially modified examples of the cooling structure shown in FIG. 3 or FIG. FIG. 3 is a vertical sectional view of a main part showing a detailed structure near the electronic device shown in FIG. DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... LSI, 3 ... Refrigerant flow path (cooling jacket), 4 ... Main bellows, 5 ... Contact, 6 ...
Main concave channel, 7 ... sub-bellows, 8 ... bellows end plate,
9 ... sub-recess passage, 10 ... connecting member, 11 ... refrigerant, 12 ...
… Joint member (solder), 15… Spring, 16… Adjustment screw,
17 ... fixed seat, 20 ... displacement adjusting member, 21, 22 ... pressing force adjuster (nut), 23 ... leaf spring, 24 ... main diaphragm, 25 ... sub-diaphragm, 26 ... jet port, 27 …… Cool supply path, 28 …… Refrigerant discharge path, 29 …… Motor mounting part, 30…
… Stopper, 32… heat radiation fin, 33… adjustment screw contact end, 34… upper end of connecting member, 35… movable member, 36 boss part, 37… O-ring, 38… movable member recess, 39 …… Joint member convex part, 40 …… Movable block, 41 …… Penetration path, 50 ……
Refrigerant inlet, 51 ... refrigerant outlet, 100 ... refrigerant circulation pump, 1
01 ... Stand, 102 ... refrigerant pipe, 103 ... refrigerant chiller unit, 104 ... LSI module.

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Norio Kazuo 1 Horiyamashita, Hadano-shi, Kanagawa Prefecture Kanagawa Plant, Hitachi, Ltd. (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 23/473

Claims (17)

(57) [Claims] A plurality of electronic devices mounted on a wiring board, a contact that is in contact with the electronic device and is cooled by contact with a cooling medium, and a cooling medium that is in contact with the contact. A cooling device for an electronic device, comprising: a cooling jacket having a flow path; and a bellows connecting between the cooling jacket and the contact and flowing a cooling medium in the jacket toward the contact. A cooling device for an electronic device, wherein a movable plate is mounted on the jacket via bellows at positions of opposed cooling jackets, and the contact and the movable plate are connected by a connecting member. 2. A fixing seat according to claim 1, wherein a fixed seat is fixed to the cooling jacket so as to cover the outside of the movable plate, and a spring having one end attached to the fixed seat and the other end fixed to the movable plate is provided. A semiconductor cooling device, wherein a pressing force of the contact against the semiconductor device is obtained by a spring. 3. A heat transfer mechanism that cools an electronic device by providing a movable body through a telescopic member at a part of a coolant flow path through which a coolant flows, and bringing a part of the movable body into contact with the electronic device. A cooling device for an electronic device, wherein a sub-movable body is attached to a refrigerant flow path at a position facing the heat transfer mechanism via an elastic member, and the movable body and the sub-movable body are connected by a connecting member. 4. The cooling device for an electronic device according to claim 3, further comprising a spring adjusting mechanism for pressing the auxiliary movable body toward the electronic device outside the auxiliary movable body. 5. The cooling device for an electronic device according to claim 3, wherein the elastic member is a diaphragm. 6. The cooling device for an electronic device according to claim 3, wherein the area of the movable body is larger than the area of the sub movable body. 7. The cooling device for an electronic device according to claim 3, wherein the area of the sub movable body is larger than the area of the movable body. 8. The cooling device for an electronic device according to claim 3, wherein the connecting member is made of a flexible material. 9. An electronic device soldered on a wiring board, a contact that is in contact with the electronic device and cools the electronic device, a refrigerant flow path for flowing a refrigerant through the contact, and a refrigerant flow. A telescopic member for connecting the path and the contact and allowing the refrigerant in the refrigerant flow path to circulate toward the contact, and attached to the refrigerant flow path at a position facing the contact via a telescopic member; A cooling member for an electronic device, comprising: a movable member; and a connecting member that couples the contact and the movable member. 10. The cooling device for an electronic device according to claim 9, wherein said movable member is provided in a coolant flow path. 11. An electronic device provided in a coolant channel, a contact contacted with the back surface of the electronic device, and the electronic device together with the contact isolates the electronic device from a refrigerant and permits displacement of the contact. A telescopic member, a connecting member coupled to the contact, an end member provided at an end of the connecting member on the opposite side to the contact and configured in parallel with the contact, and A cooling device for an electronic device, comprising: a telescopic member for flexibly attaching to a partition of a road; and adjusting means for adjusting a pressing force of the contact to the electronic device. 12. A cooling device in which a main movable body is provided in a part of a refrigerant flow path through which a refrigerant flows, and a part of the main movable body is brought into contact with an electronic device to cool the electronic device. A cooling device for an electronic device, wherein a sub-movable body is provided in a refrigerant flow path at a position opposed to the main movable body, and the main movable body and the sub-movable body are connected by a connecting member. 13. The cooling device for an electronic device according to claim 12, wherein the auxiliary movable body is slidably provided on a partition wall of the coolant channel via a sealing material. 14. The cooling device for an electronic device according to claim 13, wherein a main movable body is slidably provided on a partition wall of the coolant channel via a sealing material. 15. The cooling device for an electronic device according to claim 13, wherein the main movable body is attached to the refrigerant flow path partition via a bellows. 16. The cooling device for an electronic device according to claim 12, wherein an end of a connecting member connecting the main movable body and the sub movable body has a spherical joint structure. 17. A refrigerant flow passage in which a refrigerant flows is constituted by a first flow passage wall on the electronic device side and a second flow passage wall on the anti-electronic device side, and a thin portion of the first flow passage wall near the electronic device is provided. And the thin portion is brought into contact with the electronic device, and the portion of the second channel wall facing the thin portion is also a thin portion, and the thin portions of the first and second channel walls are connected to each other by a connecting member. A cooling device for electronic devices, wherein the cooling devices are connected to each other.