JP2804253B2 - Electronic device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device including a wiring made of aluminum or an aluminum alloy and a transparent electrode. 2. Description of the Related Art Conventionally, as a method for forming wirings or electrodes in various electronic devices, a photolithography technique for obtaining a desired pattern by removing an unnecessary portion from a conductor layer formed on a substrate has been generally known. ing. In an electronic device using a thin film technique, a metal thin film easily obtained by a vacuum deposition method or the like is used as the conductor layer. The material of the metal thin film is inexpensive and has low resistance. Therefore, Al and the like are widely used. In addition, as a resist used for etching, a photoresist using ultraviolet light such as g, h, and i rays is generally used. However, alkali-development is possible because the resist can be easily removed and used. The use of photoresist is now mainstream. [0004] However, since the developing solution of the photoresist used in such conventional wiring formation is an organic alkaline system, the surface of the metal thin film is developed together with the photoresist film during development. Has also been eroded, which has the disadvantage of causing disconnection of the wiring. [0005] One of the electronic devices based on the thin film technology, for example, I.P. T. O. (Indium Tin Oxid
e) In a display device having a transparent electrode such as described above, it is usual that the extraction electrode on the transparent electrode is formed by etching from the metal thin film in the same manner as the formation of the wiring. When the contact portion between the transparent electrode and the metal thin film is affected by the developing solution due to the influence of I. T. O. Has a problem that electrolytic corrosion occurs, which leads to the occurrence of display defects. Further, Al, which is generally used as a material of the metal thin film, has a high surface light reflectance,
At the time of resist exposure, protrusions on the surface of the resist film due to dust or the like mixed into the resist film scatter light, and as a result, the resist pattern is deformed, which also causes disconnection of the conductor wiring. An object of the present invention is to solve such a problem, and an object of the present invention is to provide an electronic device in which erosion of a transparent electrode or a metal thin film is prevented, and thereby the occurrence rate of display defects is extremely reduced. And According to the present invention, in order to achieve the above object, a first metal thin film made of aluminum or an aluminum alloy deposited on a substrate is formed in a desired pattern by etching using a resist. And a transparent electrode disposed without directly contacting the first metal thin film, wherein the wiring is made of molybdenum disposed on the first metal film.
A metal thin film is provided, and the first metal thin film is selectively removed together with the second metal thin film by the etching. According to the present invention, the above configuration prevents the metal thin film and the transparent electrode from being eroded during the development of the resist, thereby reducing the display defect occurrence rate. Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view showing a method of forming a wiring according to an embodiment of the present invention. As shown in FIG. 1, in this method, first, a metal thin film 2 made of, for example, Al or the like is deposited on an insulating substrate 1 by a vacuum evaporation method or a sbutter method, and then, for example, Mo or the like is formed on the metal thin film 2 The protective film 3 having alkali resistance is formed by a vacuum evaporation method or a sputter method. Thereafter, a positive or negative photosensitive resist is applied on the protective film 3 and dried to form, for example, a positive resist film 4 (FIG. 1A) and exposed through a desired photomask. Then, an exposed portion equal to the opening pattern of the photomask is formed in the positive resist film 4, and the exposed portion of the positive resist film 4 is removed using an organic alkali-based developer (FIG. 1B). Next, wet etching is performed using a predetermined etching solution, and the metal thin film 2 corresponding to the exposed portion of the protective film 3 is removed together with the protective film 3 to form a desired wiring pattern (FIG. 1C). . Then, the last remaining positive resist film 4
Is removed to complete the wiring forming step (FIG. 1-d). The protective film 3 remaining in this state may be removed as needed. Thus, according to the wiring forming method of this embodiment, since the protective film 3 made of Mo or the like having an alkali resistance is formed on the metal thin film 2, the metal thin film 2 is formed when the resist film is developed. The surface is not directly immersed in the developing solution, thereby making it possible to greatly reduce the incidence of defects. Further, since the surface light reflectance of Mo or the like used as the material of the protective film 3 of this embodiment is extremely lower than that of Al, the influence of the scattered light due to the surface projection at the time of resist exposure can be minimized, and the stability can be improved. The resist pattern thus formed can be formed, and the incidence of defective wiring can be further reduced. Next, another embodiment of the present invention will be described. FIG. 2 is a diagram showing a method of manufacturing a thin film transistor array used as a switching element in an active matrix type liquid crystal display element. As shown in FIG. 1, in this method of manufacturing a thin film transistor array, first, a gate electrode 12 made of, for example, Cr and having a thickness of about 2000 angstroms is formed on an insulating substrate 11 by using a photoetching method or the like. Further thereon, an insulating film 13 made of, for example, silicon oxide and having a thickness of about 3500 angstroms, an a-Si film 14 having a thickness of about 3000 angstroms and an a-Si: n + film 15 having a thickness of about 500 angstroms are sequentially vacuum deposited. It is deposited by a method or the like. Thereafter, the a-Si film 14 and a-Si:
A desired pattern of the n + film 15 is formed by a photo-etching method (FIG. 2A). Next, for example, I.P. T.
O. A transparent electrode film 16 having a thickness of about 1200 angstroms is formed by sputtering or the like, and a desired pattern is formed by a photo-etching method (FIG. 2).
b). Next, a protective film 17 made of, for example, Mo and having an alkali resistance, and Al or Al as a main component are formed on a substrate.
An electrode thin film 18 made of an Al alloy or the like and a protective film 19 similar to the above are sequentially deposited by a vacuum evaporation method or a sputtering method (FIG. 2C). Thereafter, a positive or negative photosensitive resist is applied on the protective film 19 and dried to form, for example, a positive resist film 20 (FIG. 2D), through a desired photomask. Exposure is performed to form an exposed portion on the positive resist film 20 equal to the opening pattern of the photomask, and the exposed portion of the positive resist film 20 is removed using an alkaline developing solution (FIG. 2E). Then, etching is performed using a predetermined etching solution, and the exposed portion of the protective film 19 is removed together with the metal thin film 18 and the protective film 17 under the protective film 19 to remove the desired pattern of the source electrode, the drain electrode and the signal wiring. Is formed, and then the remaining positive resist film 20 is removed to complete the process (FIG. 2F). In this way, it is possible to obtain a wiring for electrically connecting the transparent electrode film 16 and a thin film transistor as an active element for controlling the amount of electric charge stored therein. Thus, according to this embodiment, since the protective films 17 and 19 made of Mo or the like having alkali resistance are formed above and below the metal thin film 18, the surface of the metal thin film 18 is developed when the resist film is developed. It is no longer directly immersed in the developing solution, so that the occurrence rate of defects can be reduced, and the contact portion between the transparent electrode film 16 and the metal thin film 18 is not exposed to the developing solution. 1
6 can be prevented from being electrolytically corroded, whereby the occurrence rate of display defects can be extremely reduced. Further, since the surface light reflectance of Mo or the like used as the material of the protective films 17 and 19 in this embodiment is extremely lower than that of Al, the influence of the scattered light due to the surface projections during the exposure of the resist is minimized. Is possible, and the occurrence rate of wiring defects can be further reduced. In the above embodiment, the case where Mo is used as the material of the protective film has been described. Therefore, it can be used for a protective film. According to the present invention as described above, according to the present invention, A
First metal thin film made of aluminum or aluminum alloy
And a second metal thin film made of molybdenum disposed thereon.
Wherein the first metal thin film is etched together with the second metal thin film.
Metal thin films are not selectively exposed to the developer , which greatly increases the number of manufacturing steps.
It is possible to greatly reduce the defect occurrence rate without causing the failure.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of each main process for explaining a wiring forming method according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of each main process for explaining another embodiment of the present invention. [Description of Signs] 1, 11: insulating substrate 2, 18: metal thin film 3, 17, 19: protective film 4, 20: positive resist film

Claims (1)

(57) [Claims] A wiring in which a first metal thin film made of aluminum or an aluminum alloy deposited on a substrate is formed in a desired pattern by etching using a resist, and a transparent electrode arranged without directly contacting the first metal thin film. An electronic device comprising: the wiring includes a second metal thin film made of molybdenum disposed on the first metal film; and the first metal thin film is selectively removed by the etching together with the second metal thin film. An electronic device characterized by being formed.