JP2826412B2 - Solder plating method and jig used for the method - Google Patents
Solder plating method and jig used for the methodInfo
- Publication number
- JP2826412B2 JP2826412B2 JP4109017A JP10901792A JP2826412B2 JP 2826412 B2 JP2826412 B2 JP 2826412B2 JP 4109017 A JP4109017 A JP 4109017A JP 10901792 A JP10901792 A JP 10901792A JP 2826412 B2 JP2826412 B2 JP 2826412B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder plating
- electrodes
- surface mounting
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
Landscapes
- Coating With Molten Metal (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【技術分野】本発明は半田メッキ方法およびそれに用い
る治具に関し、特に表面実装用部品の電極先端部への定
量半田メッキ工法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder plating method and a jig used for the method, and more particularly, to a method for quantitatively performing solder plating on a tip of an electrode of a surface mounting component.
【０００２】[0002]
【従来技術】従来、この種の定量半田メッキ工法におい
ては、平板に半田ペーストをスクリーン印刷によって印
刷し、その半田ペースト上に表面実装用部品を実装して
から加熱することで、表面実装用部品の電極先端部に一
定量の半田メッキを施している。2. Description of the Related Art Conventionally, in a quantitative solder plating method of this kind, a solder paste is printed on a flat plate by screen printing, and a surface mounting component is mounted on the solder paste and then heated, whereby the surface mounting component is heated. A certain amount of solder plating is applied to the tip of the electrode.
【０００３】このような従来の定量半田メッキ工法で
は、表面実装用部品の実装後の位置ずれなどによって半
田メッキ量のばらつきが多くなるという問題がある。ま
た、スクリーン印刷による半田供給量の増減は限界があ
り、半田供給量のコントロールが難しいという問題があ
る。さらに、表面実装用部品の電極先端部に対して一定
量の半田メッキを施すのに、多量の段取り工数を必要と
するという問題がある。[0003] In such a conventional quantitative solder plating method, there is a problem that a variation in the amount of solder plating increases due to a displacement of the surface mounting component after mounting. Further, there is a limit in increasing or decreasing the amount of supplied solder by screen printing, and there is a problem that it is difficult to control the amount of supplied solder. Further, there is a problem that a large amount of setup man-hours is required to apply a fixed amount of solder plating to the electrode tip of the surface mounting component.
【０００４】[0004]
【発明の目的】本発明は上記のような従来のものの問題
点を除去すべくなされたもので、表面実装用部品の電極
先端部に容易に一定量の半田メッキを施すことができる
半田メッキ方法およびそれに用いる治具の提供を目的と
する。SUMMARY OF THE INVENTION The present invention has been made in order to eliminate the above-mentioned problems of the prior art, and a solder plating method capable of easily applying a fixed amount of solder plating to an electrode tip of a surface mounting component. And a jig used for the same.
【０００５】[0005]
【発明の構成】本発明による半田メッキ方法は、表面実
装用部品の複数の電極各々の先端部に定量の半田メッキ
を行う半田メッキ方法であって、前記表面実装用部品の
複数の電極各々に対応して設けられかつ前記複数の電極
各々の先端部に溶着させる半田ペーストを収納する複数
の凹部を有する平板を設け、前記平板に前記半田ペース
トを印刷して前記複数の凹部各々に前記半田ペーストを
収納させてから、前記複数の電極各々の先端部を前記複
数の凹部各々に挿入した後に前記平板を加熱して前記複
数の電極各々の先端部に定量の半田メッキを行うように
したことを特徴とする。Solder plating method according to the present invention SUMMARY OF THE INVENTION] is a solder plating method for performing solder plating quantification the distal end of the plurality of electrodes each component for surface mounting, a plurality of electrodes each component the surface mount A flat plate having a plurality of recesses correspondingly provided and accommodating a solder paste to be welded to the tips of the plurality of electrodes is provided, and the solder paste is provided on the flat plate.
And printing the solder paste in each of the plurality of recesses.
After being stored, the tip of each of the plurality of electrodes is inserted into each of the plurality of recesses, and then the flat plate is heated to perform a fixed amount of solder plating on the tip of each of the plurality of electrodes. And
【０００６】本発明による半田メッキ治具は、表面実装
用部品の複数の電極各々の先端部に定量の半田メッキを
行う半田メッキ方法に用いる半田メッキ治具であって、
前記表面実装用部品の複数の電極各々に対応して設けら
れかつ前記複数の電極各々の先端部に溶着させる半田ペ
ーストを収納する複数の凹部を有する平板からなり、前
記平板に前記半田ペーストを印刷することで前記複数の
凹部各々に前記半田ペーストを収納するようにしたこと
を特徴とする。A solder plating jig according to the present invention is a solder plating jig used in a solder plating method for performing a fixed amount of solder plating on the tip of each of a plurality of electrodes of a surface mounting component.
Ri Do from flat plate having a plurality of recesses for accommodating a solder paste to be welded to the front end portion of the provided and the plurality of electrodes each corresponding to the plurality of electrodes each component the surface mounting, before
By printing the solder paste on the flat plate,
The solder paste is accommodated in each of the concave portions .
【０００７】[0007]
【実施例】次に、本発明の一実施例について図面を参照
して説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【０００８】図１は本発明の一実施例の部分拡大図であ
り、図２は本発明の一実施例の斜視図であり、図３は本
発明の一実施例による定量半田メッキの状態を示す図で
ある。これらの図において、半田メッキ治具１はセラミ
クスなどの半田に濡れにくい材質の平板からなってい
る。半田メッキ治具１上には表面実装用部品５の各電極
４の間隔と同間隔で、各電極４に対応して半貫通穴２が
設けられている。FIG. 1 is a partially enlarged view of one embodiment of the present invention, FIG. 2 is a perspective view of one embodiment of the present invention, and FIG. 3 shows a state of quantitative solder plating according to one embodiment of the present invention. FIG. In these figures, the solder plating jig 1 is made of a flat plate made of a material such as ceramics which is hardly wetted by solder. Semi-through holes 2 are provided on the solder plating jig 1 at the same intervals as the electrodes 4 of the surface mounting component 5 corresponding to the respective electrodes 4.
【０００９】表面実装用部品５の電極４の先端部に半田
メッキを施す場合、まず半田メッキ治具１上に半田ペー
スト３をむらなく印刷し、その半田ペースト３が塗布さ
れた半貫通穴２に表面実装用部品５の各電極４を実装す
る（図２参照）。When solder plating is performed on the tip of the electrode 4 of the surface mounting component 5, first, a solder paste 3 is printed evenly on a solder plating jig 1 and the semi-through hole 2 coated with the solder paste 3 is applied. Each electrode 4 of the surface mounting component 5 is mounted on the surface (see FIG. 2).
【００１０】この後に、半田メッキ治具１を加熱するこ
とによって半田ペースト３が溶融し、溶けた半田ペース
ト３が半貫通穴２内に挿入された表面実装用部品５の各
電極４の先端部に付着する（図１参照）。これによっ
て、表面実装用部品５の各電極４の先端部に定量の半田
メッキ６を施すことができる（図３参照）。Thereafter, the solder paste 3 is melted by heating the solder plating jig 1, and the melted solder paste 3 is inserted into the semi-through hole 2, and the tip of each electrode 4 of the surface mounting component 5 is inserted. (See FIG. 1). Thus, a fixed amount of solder plating 6 can be applied to the tip of each electrode 4 of the surface mounting component 5 (see FIG. 3).
【００１１】このように、半田に濡れにくい材質の平板
からなる半田メッキ治具１上に表面実装用部品５の各電
極４の間隔と同間隔で半貫通穴２を設け、半田ペースト
３を半田メッキ治具１上にむらなく印刷した後に各電極
４を半貫通穴２に実装したまま加熱することによって、
従来の位置ずれなどによる半田メッキ量のばらつきが生
ずることはない。よって、表面実装用部品５の各電極４
の先端部に定量の半田メッキ６を施すことが可能とな
り、表面実装用部品５の電極４の先端部に容易に一定量
の半田メッキ６を施すことができる。As described above, the semi-through holes 2 are provided on the solder plating jig 1 made of a flat plate made of a material which is not easily wetted by the solder at the same intervals as the intervals between the electrodes 4 of the surface mounting component 5, and the solder paste 3 is soldered. After printing evenly on the plating jig 1, the electrodes 4 are heated while being mounted in the semi-through holes 2, so that
There is no variation in the amount of solder plating due to the conventional displacement. Therefore, each electrode 4 of the surface mounting component 5
A constant amount of the solder plating 6 can be applied to the tip of the electrode 4 of the surface mounting component 5.
【００１２】[0012]
【発明の効果】以上説明したように本発明によれば、表
面実装用部品の複数の端子各々に対応しかつ複数の端子
各々の先端部に溶着させる半田ペーストを収納する複数
の凹部を有する平板を設け、この複数の凹部各々に複数
の端子各々の先端部を挿入した後に平板を加熱して複数
の端子各々の先端部に定量の半田メッキを行うようにす
ることによって、表面実装用部品の電極先端部に容易に
一定量の半田メッキを施すことができるという効果があ
る。As described above, according to the present invention, a flat plate having a plurality of recesses for accommodating a plurality of terminals of a surface mounting component and for storing solder paste to be welded to the tips of the plurality of terminals, respectively. By inserting a tip of each of the plurality of terminals into each of the plurality of recesses and then heating the flat plate to perform a fixed amount of solder plating on the tips of each of the plurality of terminals, the surface mounting component There is an effect that a fixed amount of solder plating can be easily applied to the tip of the electrode.
【図１】本発明の一実施例の部分拡大図である。FIG. 1 is a partially enlarged view of one embodiment of the present invention.
【図２】本発明の一実施例の斜視図である。FIG. 2 is a perspective view of one embodiment of the present invention.
【図３】本発明の一実施例による定量半田メッキの状態
を示す図である。FIG. 3 is a view showing a state of quantitative solder plating according to one embodiment of the present invention.
１ 半田メッキ治具 ２ 半貫通穴 ３ 半田ペースト ４ 電極 ５ 表面実装用部品 ６ 半田メッキ DESCRIPTION OF SYMBOLS 1 Solder plating jig 2 Semi-through hole 3 Solder paste 4 Electrode 5 Surface mounting component 6 Solder plating
Claims (3)
部に定量の半田メッキを行う半田メッキ方法であって、
前記表面実装用部品の複数の電極各々に対応して設けら
れかつ前記複数の電極各々の先端部に溶着させる半田ペ
ーストを収納する複数の凹部を有する平板を設け、前記
平板に前記半田ペーストを印刷して前記複数の凹部各々
に前記半田ペーストを収納させてから、前記複数の電極
各々の先端部を前記複数の凹部各々に挿入した後に前記
平板を加熱して前記複数の電極各々の先端部に定量の半
田メッキを行うようにしたことを特徴とする半田メッキ
方法。1. A solder plating method for performing a fixed amount of solder plating on the tip of each of a plurality of electrodes of a surface mounting component,
A plate having a plurality of recesses for accommodating a solder paste to be welded to the front end portion of the provided and the plurality of electrodes each corresponding to the plurality of electrodes each component the surface mounting provided, wherein
Printing the solder paste on a flat plate and forming each of the plurality of recesses
After the tip of each of the plurality of electrodes is inserted into each of the plurality of recesses, the flat plate is heated and a predetermined amount of solder is attached to the tip of each of the plurality of electrodes. A solder plating method, wherein plating is performed.
部に定量の半田メッキを行う半田メッキ方法に用いる半
田メッキ治具であって、前記表面実装用部品の複数の電
極各々に対応して設けられかつ前記複数の電極各々の先
端部に溶着させる半田ペーストを収納する複数の凹部を
有する平板からなり、前記平板に前記半田ペーストを印
刷することで前記複数の凹部各々に前記半田ペーストを
収納するようにしたことを特徴とする半田メッキ治具。2. A solder plating jig for use in a solder plating method for performing a fixed amount of solder plating on a tip of each of a plurality of electrodes of a surface mounting component, wherein the plurality of electrodes of the surface mounting component are provided.
Ri Do from flat plate having a plurality of recesses, the solder paste on the plate indicia for accommodating a solder paste to be welded to and distal portions of the plurality of electrodes each provided corresponding to pole each
Printing the solder paste in each of the plurality of recesses.
A solder plating jig characterized by being housed .
が付着しないような材質からなりかつ前記半田ペースト
の印刷時に前記複数の凹部各々に前記半田ペーストが収
納されるように構成したことを特徴とする請求項２記載
の半田メッキ治具。3. The method according to claim 1, wherein the flat plate is provided with the solder paste when heated.
Made of a material that does not adhere to the solder paste
The solder paste is contained in each of the plurality of recesses during printing
3. The solder plating jig according to claim 2, wherein the solder plating jig is configured to be accommodated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4109017A JP2826412B2 (en) | 1992-04-01 | 1992-04-01 | Solder plating method and jig used for the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4109017A JP2826412B2 (en) | 1992-04-01 | 1992-04-01 | Solder plating method and jig used for the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05279830A JPH05279830A (en) | 1993-10-26 |
| JP2826412B2 true JP2826412B2 (en) | 1998-11-18 |
Family
ID=14499474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4109017A Expired - Fee Related JP2826412B2 (en) | 1992-04-01 | 1992-04-01 | Solder plating method and jig used for the method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2826412B2 (en) |
-
1992
- 1992-04-01 JP JP4109017A patent/JP2826412B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05279830A (en) | 1993-10-26 |
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