JPH0654698B2 - Chip component lead wire solder coating method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for applying paste solder onto lead wires efficiently and quantitatively when a rod-like lead wire is soldered to a large chip component. Is.

[Contents and Problems of Prior Art] As a method of soldering a rod-shaped lead wire to a chip component, in general, in the case of a small chip component, as shown in FIG. The method of re-melting this solder by solder attached to the periphery of the lead wire when it is dipped and pulled up and soldered to the chip component 3 is used, but in the case of a large chip (for example, 10 mm × 10 mm × 3 mm or more) In the above method, the amount of solder attached to the lead wire is too small, so that the chip component and the lead wire cannot be sufficiently soldered. Therefore, in the case of a large-sized chip component, generally, as shown in FIG. 6, a method is used in which the paste-like solder 4 is squeezed out from the fixed amount dispenser 5 and applied onto the lead wire. However, with this method, it is difficult to accurately control the paste discharge amount due to the change in the viscosity of the paste-like solder. In addition, this method has a drawback in that when performing simultaneous work with the coating work, the required number of constant-volume dischargers are required for the work, and the mass productivity is poor. At the same time, as one of the treatment methods, there is a method of immersing the lead wire in a paste solder bath, but this is often difficult in terms of controlling the paste amount.

[Object of the Invention]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for efficiently applying a fixed amount of paste-like solder to a lead wire in order to eliminate these drawbacks.

[Structure of Invention]

The present invention provides a slit in a plate having a thickness and a size in order to obtain a required amount of paste-like solder in advance when applying the paste-like solder to a lead wire to be soldered to a chip component. Part is filled with paste-like solder to quantify the amount of solder, and then the paste-like solder filled in this slit is scraped off with a lead wire, so that the quantified paste-like solder is used as a lead of the chip component. It is characterized by being applied on a line. That is, the present invention is a method for soldering a lead wire to an external connection electrode of a chip component, in which a plate is provided with a slit having a rectangular shape on one side and a rectangular parallelepiped shape, and the width, length and thickness of the slit are paste-like as necessary. Chip component lead wire solder, characterized in that paste-like solder is filled in the slits based on the volume and length of the solder, and the paste-like solder filled in the slits with the lead wire is applied to the end face of the chip component electrode together with the lead wire. Application method.

[Explanation by Examples]

 Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 shows a paste quantification plate 7 (hereinafter referred to as a plate) for quantifying paste solder used in the present invention. The plate 7 has a thickness t, and a necessary number of slits 8 having a width a and a length b are provided in a part thereof. The required amount of paste-like solder is determined by the values of a, b and t. In FIG. 2, the paste-like solder 9 is moved to the slit 8 by rotating the roller 10 in the direction of the arrow on the plate 7. The state of filling inside is shown. Next, as shown in FIG. 3, the lead wire 2 is arranged immediately below the slit 8 and the lead wire 2 is pushed right above, so that the paste-like solder 9 inserted in the slit 8 is leaded as shown in FIG. The wire 2 is scraped off and a certain amount of paste-like solder 9 is applied on the lead wire 2.

In this way, if a simple slit is provided in a part of the plate and this slit part is filled with paste-like solder, the amount of paste filled will be independent of the viscosity of the paste (except when the viscosity is extremely low). A certain amount is secured, and if this is directly scraped off with a lead wire, a certain amount of paste solder is applied on the lead wire, the lead wire with solder is attached to the chip end surface, and the solder surface is molded by infrared heating etc. It is heated and melted, and the lead wire is fixed to the chip end surface.

〔The invention's effect〕

As described above, according to the present invention, the structure is simple and the amount of paste-like solder can be quantified, and the lead having the advantage that the quantified paste-like solder can be directly applied onto the lead wire efficiently It has become possible to provide a method for applying paste-like solder on a wire.

[Brief description of drawings]

FIG. 1 is a perspective view of a plate provided with slits for quantifying the amount of solder according to the present invention. FIG. 2 is a front view of filling a slit of a plate having slits with paste-like solder. FIG. 3 is a perspective view in which slits of a plate are filled with paste-like solder. FIG. 4 is a perspective view in which the paste-like solder filled in the slit of the plate is transferred to the lead wire. FIG. 5 shows a conventional method of soldering a lead wire to a chip component. (A) is a sectional view of the lead wire inserted into a solder bath, (b)
FIG. 3 is a perspective view in which a lead wire is connected to an external electrode of a chip component. FIG. 6 is a perspective view showing a conventional method for quantitatively applying paste-like solder for connecting a chip component and a lead wire. 1 ... Solder bath. 2 ... Lead wire. 3 ... Chip parts. 4, 9 ... Paste solder. 5: Fixed-quantity dispenser. 7 ... Quantification plate. 8 …… Slit. 10 ... Laura.

Claims (1)

[Claims] 1. A method of soldering a lead wire to an external connection electrode of a chip component, wherein a plate is provided with a slit having one side having a plate thickness and a rectangular parallelepiped shape, and the width, length and plate thickness of the slit are required amounts of paste. The volume and length of the solder paste, the paste solder is filled in the slits, and the paste solder filled in the slits with the lead wire is scooped and the solder is applied together with the lead wire to the end surface of the chip component electrode. Solder application method.