JP2830301B2 - Alumina-filled resin cured product - Google Patents
Alumina-filled resin cured productInfo
- Publication number
- JP2830301B2 JP2830301B2 JP3245990A JP3245990A JP2830301B2 JP 2830301 B2 JP2830301 B2 JP 2830301B2 JP 3245990 A JP3245990 A JP 3245990A JP 3245990 A JP3245990 A JP 3245990A JP 2830301 B2 JP2830301 B2 JP 2830301B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- cured product
- particle size
- filled resin
- silane coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims description 42
- 229920005989 resin Polymers 0.000 title claims description 13
- 239000011347 resin Substances 0.000 title claims description 13
- 239000002245 particle Substances 0.000 claims description 25
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 5
- 239000012756 surface treatment agent Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 241001354243 Corona Species 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 239000007785 strong electrolyte Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 A.産業上の利用分野 本発明は、高電圧機器の絶縁材料及び構造材料として
好適なアルミナ充填樹脂硬化物に関する。DETAILED DESCRIPTION OF THE INVENTION A. Industrial Field of the Invention The present invention relates to a cured alumina-filled resin suitable as an insulating material and a structural material for high-voltage equipment.
B.発明の概要 本発明は、マトリックスとしてエポキシ樹脂を用いる
と共にアルミナを充填材とする硬化物において、アルミ
ナとして特定の粒度分布を有すると共に角がとれ且つ必
要に応じてシランカップリング剤で表面処理されている
ものを用いることにより、硬化物の機械強度の向上を図
るものである。B. Summary of the Invention The present invention relates to a cured product using an epoxy resin as a matrix and alumina as a filler, having a specific particle size distribution as alumina, having a sharp corner, and optionally surface-treating with a silane coupling agent. The use of a cured product improves the mechanical strength of the cured product.
C.従来の技術 従来より、高電圧機器の絶縁材料及び構造材料とし
て、エポキシ樹脂をマトリックスとした高分子複合硬化
物、いわゆるモールド注型品が広く用いられている。そ
して、構造材料としてのモールド注型品の充填材には、
低熱膨張率化とモールド品の低コスト化のため、シリカ
が多く用いられている。C. Prior Art Conventionally, as an insulating material and a structural material of a high-voltage device, a polymer composite cured product using an epoxy resin as a matrix, a so-called molded product, has been widely used. And the filler of the mold casting as a structural material,
Silica is often used to reduce the coefficient of thermal expansion and the cost of a molded product.
しかし、シリカは、超高圧機器のガス絶縁システムに
用いられる六フッ化硫黄（SF6）の分解ガスと反応して
しまうという問題を有している。すなわち、SF6は機器
中のアークやコロナ等の放電により、次の化学式のよう
に分解され、 SF6→SF4,SF2,SOF2など SF4＋H2O→SOF2＋2HF SOF2＋H2O→SO2＋2HF SF4分解ガスであるフッ化水素（HF）がシリカ（Si
O2）と次のように反応する。However, silica has a problem in that it reacts with a decomposition gas of sulfur hexafluoride (SF 6 ) used in a gas insulation system of an ultra-high pressure device. That is, SF 6 is decomposed as shown in the following chemical formula by the discharge of arcs and coronas in the equipment, and SF 6 → SF 4 , SF 2 , SOF 2 etc. SF 4 + H 2 O → SOF 2 + 2HF SOF 2 + H 2 O → SO 2 + 2HF SF 4 Hydrogen fluoride (HF) as decomposition gas is converted to silica (Si
O 2 ) reacts as follows.
SiO2＋4HF→SiF4＋2H2O SiF4＋2HF→H2SiF6 ここで、四フッ化ケイ素（SiF4）は沸点が−86℃の気
体であり、このSiF4とHFとが反応して生成するH2SiF6は
強電解質で表面抵抗を下げてしまう作用を有する。SiO 2 + 4HF → SiF 4 + 2H 2 O SiF 4 + 2HF → H 2 SiF 6 Here, silicon tetrafluoride (SiF 4 ) is a gas having a boiling point of −86 ° C., which is produced by the reaction between SiF 4 and HF. H 2 SiF 6 has the effect of lowering the surface resistance with a strong electrolyte.
D.発明が解決しようとする課題 前述したように、シリカはSF6分解ガスと反応してし
まうので、シリカを充填材とするモールド注型品はガス
絶縁システムを具える超高圧機器には用いることができ
ないという問題がある。また、TiO2,ZrO2,Sb2O3,K2SO4,
タルクなどの充填材も、SF6分解ガスと反応する点では
シリカと同様である。D. INVENTION As has problems aforementioned you try solving, silica so reacts with SF 6 decomposition gas, molded castings silica-filler is used in an ultra high pressure apparatus comprising a gas insulated system There is a problem that you can not. TiO 2 , ZrO 2 , Sb 2 O 3 , K 2 SO 4 ,
Fillers such as talc, in terms of reacting with SF 6 decomposition gas is the same as the silica.
そこで、SF6分解ガスと反応しないアルミナ（Al2O3）
を充填材として用いたアルミナ充填樹脂硬化物が高電圧
機器の絶縁材料や構造材料に用いられることが多い。Therefore, alumina (Al 2 O 3 ) that does not react with SF 6 decomposition gas
Alumina-filled resin cured products using as a filler are often used as insulating materials and structural materials for high-voltage equipment.
しかし、アルミナ充填樹脂硬化物は、シリカを充填材
としたものと比べて機械的強度が低いという問題があ
る。例えば引張り強度を比べるとシリカ充填系硬化物が
8kg・mm-2の値であるのに対して、アルミナ系硬化物で
は7kg・mm-2程度である。したがって、アルミナ充填樹
脂硬化物を用いると、機器のコンパクト化を図ることが
できず、製品の長期信頼性にも問題がある。However, there is a problem that the cured product of the alumina-filled resin has a lower mechanical strength than that of a resin containing silica. For example, if you compare the tensile strength,
While the value is 8 kg · mm -2 , it is about 7 kg · mm -2 for the alumina-based cured product. Therefore, when the cured product of alumina-filled resin is used, the size of the device cannot be reduced, and there is a problem in long-term reliability of the product.
本発明はこのような事情に鑑み、機械的強度を高くし
て材料の信頼性を向上させたアルミナ充填樹脂硬化物を
提供することを目的とする。In view of such circumstances, an object of the present invention is to provide a cured product of an alumina-filled resin in which the mechanical strength is increased and the reliability of the material is improved.
E.課題を解決するための手段 前記目的を達成する本発明に係るアルミナ充填樹脂硬
化物は、マトリックスとしてエポキシ樹脂を用い、アル
ミナを充填材として含有する硬化物であって、上記アル
ミナとして粒径１〜1.5μｍ及び20μｍにそれぞれピー
クがある粒度分布を有し且つ角がとれたものを用いたこ
とを特徴とし、また、上記アルミナがさらに表面処理剤
としてのシランカップリング剤で表面処理されているこ
とを特徴とする。E. Means for Solving the Problems The cured product of the alumina-filled resin according to the present invention that achieves the above-mentioned objects is a cured product containing an epoxy resin as a matrix and containing alumina as a filler, and has a particle size as the alumina. It has a particle size distribution having peaks at 1 to 1.5 μm and 20 μm, respectively, and is characterized by having a sharp corner, and the alumina is further surface-treated with a silane coupling agent as a surface treatment agent. It is characterized by being.
本発明においてマトリックスとして用いるエポキシ樹
脂は、従来のモールド注型品に用いられているものでよ
く、例えばビスフェノールタイプのエポキシ、又はビス
フェノールタイプにグリシジルエステルタイプや脂環式
エステルタイプをブレンドしたエポキシに、酸無水物な
どの硬化剤を混合したものを挙げることができる。ま
た、かかるエポキシ樹脂には必要に応じて可塑剤などを
加えてもよい。Epoxy resin used as a matrix in the present invention may be those used in conventional mold castings, for example, bisphenol type epoxy, or bisphenol type epoxy and glycidyl ester type or alicyclic ester type epoxy blended, A mixture of a curing agent such as an acid anhydride can be used. Further, a plasticizer or the like may be added to the epoxy resin as needed.
一方、本発明で用いるアルミナは、特定の粒度分布を
有し且つ角がとれたものであること以外は従来と同様な
ものである。On the other hand, the alumina used in the present invention is the same as the conventional one except that it has a specific particle size distribution and has a sharp corner.
本発明で用いるアルミナは、粒径１〜1.5μｍ及び20
μｍのところにそれぞれピークがある粒度分布を有し且
つ角がとれたものであるので、高充填できる粒子特性を
有していると言える。例えば、粒度分布のピークが何れ
か一方にしかないものでは、後述する比較例にも示すよ
うに、硬化物の機械的強度の向上を図ることはできな
い。The alumina used in the present invention has a particle size of 1 to 1.5 μm and 20 μm.
Each particle has a particle size distribution having a peak at μm, and has a sharp corner, so that it can be said that the particles have high filling properties. For example, if only one of the peaks of the particle size distribution is present, it is not possible to improve the mechanical strength of the cured product, as shown in a comparative example described later.
本発明に係るアルミナを用いると、充填されたときの
アルミナ粒子間の距離が小さくなり、また、アルミナ粒
子と樹脂との界面接着面積が大きくなるという作用によ
り、硬化物の機械的強度が向上すると考えられる。When the alumina according to the present invention is used, the distance between the alumina particles when filled is reduced, and the mechanical strength of the cured product is improved by the effect that the interfacial adhesion area between the alumina particles and the resin is increased. Conceivable.
なお、本発明で用いる角のとれたアルミナとは、例え
ば粉砕したアルミナに角をまるめる処理を施したものを
いい、好ましくは球体若しくは球体形状に近いものがよ
い。The rounded alumina used in the present invention refers to, for example, one obtained by subjecting pulverized alumina to a rounding treatment, preferably a sphere or a shape close to a sphere.
また、本発明ではアルミナの充填量は10〜60重量％と
するのがよい。これより少ないと充填材の効果が発揮さ
れず、一方、高充填特性を有しているとはいえ60容量％
を超えると混合，注型が困難になるからである。In the present invention, the filling amount of alumina is preferably 10 to 60% by weight. If the amount is less than this, the effect of the filler will not be exerted. On the other hand, although it has high filling characteristics, 60% by volume
This is because mixing and casting become difficult when the ratio exceeds.
本発明では、上記アルミナにさらに表面処理を施すと
よい。表面処理剤としてはシランカップリング剤を用
い、その配合量はアルミナに対して0.1〜5.0重量％、好
ましくは0.5〜2.0重量％とするのがよい。In the present invention, the alumina may be further subjected to a surface treatment. As the surface treatment agent, a silane coupling agent is used, and its compounding amount is 0.1 to 5.0% by weight, preferably 0.5 to 2.0% by weight based on alumina.
このようにアルミナにさらにシランカップリング剤で
表面処理を施すと、樹脂とアルミナ粒子との界面におけ
る接着力が高まるためか、硬化物の機械的強度がさらに
向上する。When the surface treatment is further performed on alumina with a silane coupling agent, the mechanical strength of the cured product is further improved, probably because the adhesive force at the interface between the resin and the alumina particles is increased.
なお、シランカップリング剤が上記範囲を外れて少な
いとその効果が顕著ではなく、一方、多いと硬化剤の特
性に好ましくないからである。If the amount of the silane coupling agent is less than the above range, the effect is not remarkable.
F.実施例 以下、本発明を実施例に基づいて説明する。F. Examples Hereinafter, the present invention will be described based on Examples.
エポキシ樹脂として、ビスフェノールタイプのCT−20
0（チバガイギー社製）と硬化剤としての酸無水物HHPA
（新日本理化社製）とを化学量論的に加えたものを用
い、これに充填材としてアルミナAS−40（昭和電工社
製）を第１表に示す割合（Vol％）で配合し、100℃で16
時間及び150℃で８時間の条件で硬化させた。なお、ア
ルミナAS−40は粒径１〜1.5μｍ及び20μｍにそれぞれ
ピークがある粒度分布を有すると共に角のとれた球体形
状に近いものである。Bisphenol type CT-20 as epoxy resin
0 (manufactured by Ciba-Geigy) and acid anhydride HHPA as a curing agent
(Manufactured by Nippon Rika Co., Ltd.) and stoichiometrically added thereto, and as a filler, alumina AS-40 (manufactured by Showa Denko KK) was blended in the ratio (Vol%) shown in Table 1, 16 at 100 ° C
The curing was carried out at 150 ° C. for 8 hours. Alumina AS-40 has a particle size distribution having peaks at particle sizes of 1 to 1.5 μm and 20 μm, respectively, and is close to a spherical shape with sharp corners.
各硬化物について、ガラス転移温度（Tg），線膨張係
数（αｌ），曲げ強度及び曲げ弾性率，引張り強度及び
引張り弾性率，並びに耐クラック性を測定し、結果を第
１表に示した。For each cured product, the glass transition temperature (Tg), coefficient of linear expansion (α 1 ), flexural strength and flexural modulus, tensile strength and tensile modulus, and crack resistance were measured, and the results are shown in Table 1. .
一方、比較のため、粒径10μｍにピークがある粒度分
布を有するが粉砕したままで角のとれていないアルミナ
AL−33（住友化学社製）、また、粒径0.8〜４μｍにブ
ロードなピークと粒径10〜15μｍに急峻なピークとを有
してAS−40に似た粒度分布を有し、粒径20μｍ以上のも
のはカットしたアルミナLA−1200（太平洋ランダム社
製）をそれぞれ上記AS−40の代りに用いて同様に硬化物
をつくり、同様な物性を測定した。これらの結果は第２
表及び第３表に示す。On the other hand, for comparison, alumina having a particle size distribution with a peak at
AL-33 (manufactured by Sumitomo Chemical Co., Ltd.) has a particle size distribution similar to AS-40 with a broad peak at a particle size of 0.8 to 4 μm and a steep peak at a particle size of 10 to 15 μm. For those having a particle size of 20 μm or more, a cured product was prepared in the same manner by using cut alumina LA-1200 (manufactured by Taiheiyo Random) instead of the above AS-40, and the same physical properties were measured. These results are the second
The results are shown in Tables and Table 3.
これらの結果から明らかなように、アルミナとして粒
径１〜1.5μｍ及び20μｍにそれぞれピークがある粒度
分布を有し且つ角がとれたものを用いた場合のみ硬化物
の特性が向上しており、機械強度で1.2〜1.3倍の向上が
認められた。 As is apparent from these results, the properties of the cured product are improved only when alumina having a particle size distribution having peaks at particle diameters of 1 to 1.5 μm and 20 μm and having sharp corners is used, A 1.2 to 1.3 times improvement in mechanical strength was observed.
また、上記実施例では、このような機械的強度の向上
と共に熱膨張率がモールド品の埋め込み部品（金具，ガ
ラス等）に近くなったことにより、モールドの割れ易さ
の指標である耐クラック性が向上している。In addition, in the above embodiment, since the coefficient of thermal expansion is close to that of the embedded parts (metal fittings, glass, etc.) of the molded product together with the improvement of the mechanical strength, the crack resistance which is an index of the easiness of the mold cracking is improved. Is improving.
次に、上記実施例で用いたアルミナAS−40にさらにシ
ランカップリング剤で表面処理したものを充填材として
用いて同様に硬化物を製造し、同様な試験を行った。な
お、シランカップリング剤としては、KBM−403（信越シ
リコーン社製）を使用した。これらの結果は第４表及び
第５表に示すが、第４表の実施例７〜12はシランカップ
リング剤KBM−403をアルミナに対して１重量％使用して
アルミナの充填量を変化させたもの、第５表の実施例13
〜18はアルミナ充填量を50重量％とし、シランカップリ
ング剤KBM−403を0.1〜5.0重量％の間で変化させた例を
示す。Next, a cured product was produced in the same manner by using a material obtained by subjecting the surface of the alumina AS-40 used in the above example to a surface treatment with a silane coupling agent as a filler, and conducting a similar test. In addition, KBM-403 (manufactured by Shin-Etsu Silicone Co., Ltd.) was used as the silane coupling agent. The results are shown in Tables 4 and 5. In Examples 7 to 12 in Table 4, the silane coupling agent KBM-403 was used in an amount of 1% by weight with respect to the alumina, and the amount of alumina charged was changed. Example 13 in Table 5
Nos. 18 to 18 show examples in which the alumina loading was 50% by weight and the silane coupling agent KBM-403 was varied between 0.1 and 5.0% by weight.
第４表及び第５表の結果から明らかなように、特定の
粒度分布を有し且つ角のとれたアルミナにさらにシラン
カップリング剤により表面処理を施すと、硬化物の特性
がさらに向上し、機械的強度は従来の約1.5倍程度まで
向上する。 As is clear from the results of Tables 4 and 5, when the surface treatment with a silane coupling agent is further performed on alumina having a specific particle size distribution and having sharp corners, the characteristics of the cured product are further improved, The mechanical strength is improved to about 1.5 times the conventional strength.
G.発明の効果 以上説明したように、本発明に係るアルミナ充填樹脂
硬化物は、特定の粒度分布を有し且つ角がとれており、
必要に応じてシランカップリング剤により表面処理され
たアルミナを用いているので、機械強度が大幅に高くな
り材料の信頼性が向上したものである。これによりかか
る硬化物を構造材料等として用いた機器の信頼性が向上
し、コンパクト化が可能になる。G. Effects of the Invention As described above, the cured alumina-filled resin according to the present invention has a specific particle size distribution and has sharp corners,
Since alumina surface-treated with a silane coupling agent is used as necessary, the mechanical strength is greatly increased and the reliability of the material is improved. As a result, the reliability of a device using such a cured product as a structural material or the like is improved, and the device can be made compact.
また、機械強度の向上と共に高充填化が可能になった
ことから、硬化物の熱膨張率がその埋め込み部品に近く
なったので、耐クラック性が向上し、この点からも機器
の信頼性が向上する。In addition, the higher the packing capacity and the higher the mechanical strength, the higher the coefficient of thermal expansion of the cured product, which is closer to that of the embedded part, and the better the crack resistance and the reliability of the equipment. improves.
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) C08L 63/00 - 63/10 C08K 9/06 C08K 3/22Continuation of the front page (58) Field surveyed (Int. Cl. 6 , DB name) C08L 63/00-63/10 C08K 9/06 C08K 3/22
Claims (2)
アルミナを充填材として含有する硬化物であって、上記
アルミナとして粒径１〜1.5μｍ及び20μｍにそれぞれ
ピークがある粒度分布を有し且つ角がとれたものを用い
たことを特徴とするアルミナ充填樹脂硬化物。An epoxy resin is used as a matrix,
A cured product containing alumina as a filler, wherein the alumina has a particle size distribution having peaks at particle diameters of 1 to 1.5 μm and 20 μm, respectively, and has a sharp corner. Cured resin.
おいて、アルミナが、表面処理剤としてのシランカップ
リング剤で表面処理されていることを特徴とするアルミ
ナ充填樹脂硬化物。2. A cured alumina-filled resin according to claim 1, wherein the alumina is surface-treated with a silane coupling agent as a surface treatment agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3245990A JP2830301B2 (en) | 1990-02-15 | 1990-02-15 | Alumina-filled resin cured product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3245990A JP2830301B2 (en) | 1990-02-15 | 1990-02-15 | Alumina-filled resin cured product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03237151A JPH03237151A (en) | 1991-10-23 |
| JP2830301B2 true JP2830301B2 (en) | 1998-12-02 |
Family
ID=12359558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3245990A Expired - Fee Related JP2830301B2 (en) | 1990-02-15 | 1990-02-15 | Alumina-filled resin cured product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2830301B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11866635B2 (en) * | 2015-11-19 | 2024-01-09 | Sekisui Chemical Co., Ltd. | Thermosetting material and cured product |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3175979B2 (en) * | 1992-09-14 | 2001-06-11 | 株式会社東芝 | Resin-sealed semiconductor device |
| DE4446944A1 (en) * | 1994-12-28 | 1996-07-04 | Abb Research Ltd | High voltage system |
| JP4577759B2 (en) * | 2004-07-09 | 2010-11-10 | Ｎｅｃトーキン株式会社 | Magnetic core and wire ring parts using the same |
-
1990
- 1990-02-15 JP JP3245990A patent/JP2830301B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11866635B2 (en) * | 2015-11-19 | 2024-01-09 | Sekisui Chemical Co., Ltd. | Thermosetting material and cured product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03237151A (en) | 1991-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3614425A1 (en) | Resin composition for sealing electronic control device, electronic control device, and method for manufacturing same | |
| JP2830301B2 (en) | Alumina-filled resin cured product | |
| JPH07109337A (en) | Epoxy resin casting material | |
| US3645899A (en) | Molded epoxy resin electrical insulating body containing alumina and silica | |
| JPH0563507B2 (en) | ||
| JPS61113642A (en) | Epoxy resin composition for semiconductor sealing use | |
| JPH03237152A (en) | Cured product of alumina-filled resin | |
| Petrović et al. | Study of epoxy resin—filler interaction | |
| JPH0725993B2 (en) | Epoxy resin composition | |
| JPS648658B2 (en) | ||
| JP2004099690A (en) | Curing composition for epoxy | |
| CN113924328A (en) | Casting resins, shaped bodies made therefrom and uses of shaped bodies | |
| KR20030056495A (en) | Epoxy resin compositions for mold transformer and method for manufacturing the same | |
| JP3383134B2 (en) | Epoxy resin composition and cast insulator obtained therefrom | |
| CN113105745A (en) | Preparation method of high-hardness high-strength liquid molded silicone rubber composition | |
| JP2939221B2 (en) | SF6 Epoxy resin composition for gas insulated equipment | |
| JP3020995B2 (en) | Filler for resin | |
| JPH10298407A (en) | Epoxy resin composition for semiconductor sealing | |
| JPS6010533B2 (en) | Molding resin composition | |
| JP2007051189A (en) | Cured cast resin and method for producing the same | |
| JPH0616904A (en) | Epoxy resin molding material for sealing | |
| JP2658714B2 (en) | Epoxy resin sealing material | |
| JPH0770412A (en) | Epoxy resin composition for sulfur hexafluoride gas insulation equipment | |
| JPS61190550A (en) | Epoxy resin molding compound for semiconductor sealing | |
| JPS5818217A (en) | Epoxy resin cast products |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |