JP2845612B2 - Chip type identification device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION (Industrial Application Field) The present invention relates to a chip type discriminating apparatus for easily discriminating a chip type adsorbed on a nozzle of a transfer head and transferred and mounted on a substrate. Means.

(Prior art) A mounting device that automatically mounts chips such as ICs, LSIs, resistor chips, and capacitor chips on a substrate adsorbs chips mounted on a chip supply unit such as a tape feeder or a tube feeder to nozzles of a transfer head. And take it up and transfer it to the substrate.

(Problems to be Solved by the Invention) In recent years, chips have been increasingly diversified, and with this,
The chip supply unit is provided with an extremely large number of parts feeders. For this reason, there is an increasing problem that a part feeder equipped with a chip of a different kind is erroneously set in a chip supply unit, a nozzle takes up a chip of a different kind, and the chip is erroneously mounted on a substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a means for easily discriminating a type of a chip mounted on a substrate by a transfer head and avoiding erroneous mounting.

(Means for Solving the Problems) The present invention relates to a chip mounting apparatus for adsorbing a chip of a chip supply unit to a nozzle of a transfer head and transferring and mounting the chip on a substrate positioned on the XY table. The table is horizontally movable in the X direction and the Y direction. When the nozzle descends on this table, the electrode portion of the chip adsorbed by the nozzle lands, and the characteristics of the chip are inspected. A plurality of types of electrode bodies are provided according to the type of chip.

(Operation) In the above configuration, before mounting the chip on the substrate, the electrode portion of the chip adsorbed by the nozzle is landed on the electrode body, and the characteristics of the chip are inspected, so that the type of the chip can be easily determined. .

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of the chip mounting apparatus. A rotary head 1 has a plurality of transfer heads 2.
Reference numeral 3 denotes a nozzle for sucking chips. On the back side of the rotary head 1, a chip supply unit 5 is provided. 6
Denotes a movable table, on which a number of parts feeders 7 are juxtaposed. Each part feeder 7 is equipped with various types of chips. Reference numeral 8 denotes a feed screw, and the moving table 9 on which the parts feeder 7 is mounted
And the predetermined parts feeder 7 is stopped at the take-up position A of the nozzle 3.

Reference numeral 11 denotes a substrate 12 provided on the front side of the rotary head 1.
2 is an XY table as a positioning unit. When the rotary head 1 rotates by the index, the chip of the nozzle 3 and the part feeder 7 of the transfer head 2 is sucked and taken up, and is transferred and mounted on the substrate 12 at the mounting position B. Reference numeral 20 denotes a chip type discriminating device mounted on the XY table 11, which will be described in detail with reference to FIG.

Reference numeral 21 denotes a table provided on a side portion of the XY table 11, and a pair of electrode bodies 22a and 22b is provided on an upper surface thereof. A suction hole for vacuum suction is provided between the electrode bodies 22a and 22b.
23 are formed. Further, on the side of the table 21, a blowing section 24 for blowing air is provided. Next, the operation will be described.

Prior to mounting the chip P on the substrate 12, the XY table 11
Is driven to position the electrode bodies 22a and 22B at the mounting position B. Next, the chips P of the parts feeder 7 of the moving table 6 are sequentially sucked by the nozzles 3 to take up the chips P, and are transferred above the table 21. Next, the nozzle 3 is lowered, and the electrode portions ka and Kb of the chip P are landed on the electrode bodies 22a and 22b on the table 21, and the characteristics of the chip P such as resistance and capacitance are inspected.
Determine the variety. In this case, the electrode parts Ka and Kb are connected to the electrode parts 22a and 22a.
The chip P is sucked by the suction hole 23 so that the chip P is reliably grounded.

If the type of the chip P is determined in this way,
Air is blown out from the blow-out part 24 to blow off the chips P from the table 21 and remove them. Such a type discrimination inspection of the chip P is performed for all the chips mounted on the substrate 12. If it is found that a chip P of a different kind is mounted on the parts feeder 7, a notification is made by a buzzer, a monitor television or the like, and the parts feeder 7 is replaced with the parts feeder 7 equipped with the correct chip P. After the replacement, the mounting of the chip P on the substrate 12 is started.

As a grounding means for reliably grounding the chip P to the electrode bodies 22a and 22b, instead of the suction hole 23, the chip P may be mechanically pressed against the electrode bodies 22a and 22B from above by pressing means. Alternatively, the tip P is connected to the electrode 22 by the nozzle 3.
a, 22b. If the table 21 is provided on the XY table 11 and can be moved horizontally in the X and Y directions similarly to the substrate 12, the electrode bodies 22a and 22b can be mounted at the mounting position (when the nozzle 3 moves up and down, the chip P moves to the substrate 12). There is an advantage that the inspection can be performed by moving the nozzle 3 to the mounting position B and performing the normal elevating operation of the nozzle 3 at the mounting position B (mounting operation of the chip P).

If it is found that there is no error in the type of the chip P, the chip P is not removed from the table 21 by the blowing unit 24,
It may be sucked by the nozzle 3 and transferred and mounted on the substrate 12 as it is.

Embodiment 2 FIG. 3 shows another embodiment of the discrimination device. The table of the discriminating device 30 includes a rotating body 31. The rotator 31 is rotatably mounted on the side of the XY table, and can move horizontally in the X and Y directions as in the first embodiment. The rotating body 31 is a polyhedron, and each surface has a plurality of types of electrode bodies 32a, 32b, 33a, 33b, 33c, 34a, 34b. .
Are provided respectively. A chip having three electrode parts such as mini-transistors lands on the electrode bodies 33a to 33c. Therefore, the electrode body can be selected by rotating the rotating body 31 according to the type of chip. Reference numeral 28 denotes a rotating arm serving as a removing means, and when the rotating arm 28 horizontally rotates, the inspected chip P
Is removed from the rotating body.

(Effects of the Invention) As described above, according to the present invention, before mounting a chip on a substrate, the type of the chip is automatically determined,
It is possible to prevent different types of chips from being erroneously mounted on the substrate. Moreover, since the table provided with the electrode body is provided on the XY table for positioning the substrate by horizontally moving the substrate in the X and Y directions, the XY table is driven in the same manner as when positioning the substrate at a predetermined position. By positioning the electrode body provided on the table at the chip mounting position, the nozzle can be moved up and down normally, that is, the operation of mounting the chip on the substrate, and a variety of chips can be easily inspected. it can.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a plan view of an electronic component mounting apparatus, FIG. 2 is a perspective view of a kind discriminating apparatus, and FIG. 3 is a perspective view of another embodiment. . 2 Transfer head 3 Nozzle 5 Chip supply unit 11 Positioning unit 12 Substrates 21, 31 Tables 22a, 22b, 32a to 34b Electrode P Chip Ka, Kb … Electrode

Claims (1)

(57) [Claims] 1. A chip mounting apparatus for adsorbing a chip of a chip supply unit to a nozzle of a transfer head and transferring and mounting the chip on a substrate positioned on an XY table. When the nozzle descends on this table, the electrode portion of the chip adsorbed by the nozzle lands, and the electrode body for inspecting the characteristics of the chip is moved according to the type of the chip. A chip type discriminating device, wherein a plurality of types are provided.