JP2850818B2 - Surface mount type semiconductor integrated circuit device and socket for connecting an emulator connector to the device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device in which functional elements such as a microprocessor are integrated.
In particular, the present invention relates to a surface-mount type semiconductor integrated circuit device having a structure considering an emulation environment.

[0002]

2. Description of the Related Art Conventionally, in a printed circuit board such as a microprocessor board which requires an emulation environment, a semiconductor integrated circuit device to be emulated, such as a microprocessor, has been developed in order to enable emulation. At first, the mounting format was changed to use an insertion mounting type package, and finally to use a surface mounting type package which is less expensive than the insertion mounting type. Hereinafter, this conventional technique will be described.

First, at the beginning of printed circuit board development,
Using an insertion-mount type semiconductor integrated circuit device, it is not directly bonded to a printed circuit board, but is mounted via an insertion-mounting socket, and development is promoted.

At the time of evaluation of a printed circuit board, the insertion-mount type semiconductor integrated circuit device is removed from the socket, and instead, a connector of an emulator is connected to the socket to perform emulation.

After the evaluation of the printed circuit board, the insertion-mount type semiconductor integrated circuit device is changed to a surface mount type, and the surface mount type semiconductor integrated circuit device is directly joined to the printed circuit board without using a socket.

[0006]

However, such a conventional technique has the following problems.

When an insertion-mount type semiconductor integrated circuit device is mounted on a printed circuit board via a socket, the socket terminals are inserted into the printed circuit board and penetrate all wiring layers of the printed circuit board. Since the pattern is limited and occupies a large area on the printed circuit board, the degree of freedom in designing the printed pattern wiring generally decreases. This is contrary to the high-density mounting of the printed circuit board and the shortening of the device system. Also,
Since the development cost of the insertion mounting type semiconductor integrated circuit device is also required, the cost cost is also increased.

Finally, the semiconductor integrated circuit device of the insertion mounting type is finally changed to the surface mounting type, and is directly joined to the printed circuit board without using a socket. At this time, a new wiring man-hour is required. You spend extra time and money.

The present invention has been proposed in view of such circumstances, and an object of the present invention is to provide a surface-mounted semiconductor integrated circuit device capable of performing emulation work in a state of being directly bonded to a printed circuit board. It is in.

Japanese Patent Application Laid-Open No. 63-48854 discloses that in a semiconductor integrated circuit device in which a plurality of macro cells including a CPU are formed on a common semiconductor substrate, the CPU is electrically connected to other macro cells based on an external input. A switching circuit for disconnecting and a signal bus for connecting another macrocell separated by the switching circuit and an external terminal (pad) of the semiconductor integrated circuit device are provided, and the switching circuit electrically connects the CPU from other macrocells. There is disclosed a technique for disconnecting the emulator and connecting the emulator to an external terminal to which the signal bus is connected to verify the entire system. However, in this technology, when applied to a semiconductor integrated circuit device mounted on a printed board, it is an extremely difficult task to further connect an emulator terminal to an external terminal of the semiconductor integrated circuit device connected to the wiring pattern of the printed board. Accompanied by

Therefore, another object of the present invention is to provide a surface mount type semiconductor integrated circuit having an external terminal for connecting an emulator in addition to an external terminal connected to a wiring pattern of a printed circuit board in order to facilitate connection of an emulator. It is to provide a circuit device.

[0012]

According to the present invention, there is provided a surface-mount type semiconductor integrated circuit device comprising: an input signal line ; an output signal line;
In a surface-mount type semiconductor integrated circuit device provided with a plurality of external terminals for connecting a signal line and a wiring pattern on a printed board to a package, a plurality of emulator connection terminals connected to the external terminals on the package And the input signal line , the output signal line and the output signal line of the semiconductor chip in the package based on an external input.
Any of a state in which the input / output signal line is electrically disconnected from the external terminal and a state in which the input / output signal line is electrically connected to the external terminal.
It has a selector to switch to either . This selector is, for example, the input signal line of the semiconductor chip ,
Is inserted into the serial output signal line and the output signal line, the input signal line on the basis of the external input, Oyo said output signal line
And a tri-state buffer for controlling signals passing through the input / output signal lines . In a preferred embodiment of the present invention, the external terminals of the package
Terminals not connected to any signal lines of the semiconductor chip
Emulator connection pin which is connected to the non-connect pin is is used as a terminal for applying the external input.

According to the present invention, a socket for directly connecting a connector of an emulator to a surface-mount type semiconductor integrated circuit device includes an emulator connection connected to the external terminal serving as a ground among the plurality of emulator connection terminals. And a signal line for connecting a socket terminal corresponding to the external terminal and a socket terminal corresponding to the emulator connection terminal for applying the external input.

In the surface-mount type semiconductor integrated circuit device of the present invention, a socket for connecting an emulator connector to an emulator connection terminal provided on the package when directly connected to a printed board. When the emulator is mounted, the emulator connection terminal connected to the ground external terminal among the plurality of emulator connection terminals is electrically connected to the emulator connection terminal for external input application, and the external input is applied. The emulator connection terminal is grounded. This ground becomes an external input, and a tri-state buffer constituting a selector provided in the surface-mounted semiconductor integrated circuit device electrically connects an input signal line , an output signal line, and an input / output signal line of the semiconductor chip to the external terminals. In a disconnected state. Therefore,
If the connector of the emulator is connected to the socket, the emulator is connected to the wiring pattern on the printed circuit board through the socket, the emulator connection terminal of the surface mount type semiconductor integrated circuit device, and the external terminal, thereby enabling emulation. When the socket is removed, the emulator connection terminal for external input application is opened, so that the tri-state buffer constituting the selector can transmit signals on the signal lines of the semiconductor chip, and the surface-mount type semiconductor integrated The original operation of the circuit device becomes possible.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of one embodiment of a surface-mount type semiconductor integrated circuit device according to the present invention. In FIG. 1, reference numeral 12 denotes a surface mount type package realized by QFP, BGA, or the like, which is used to connect a wiring pattern on a printed board (not shown) to a signal line of a semiconductor chip (not shown) housed in the package. Package external terminals 11 are provided in the peripheral portion. The package 12 has a large number of emulator connection terminals 13 at predetermined locations on the upper surface thereof.

In this embodiment, the number of package external terminals 11 and the number of emulator connection terminals 13 are the same, and the number of package external terminals 11 and the number of emulator connection terminals 13 are one.
One-to-one correspondence. Here, in FIG. 1, among the package external terminals 11, a non-connect (hereinafter, NC)
) Terminals are denoted by reference numerals 11a and 11b, and ground (hereinafter referred to as GND) terminals are denoted by reference numerals 11c and 11d to distinguish them from other package external terminals. Hereinafter, package external terminals 11a and 11b
Are called NC package external terminals, and the package external terminals 11c and 11d are called GND package external terminals. Emulator connection terminals 13 corresponding to the NC package external terminals 11a and 11b are denoted by reference numerals 13a and 13b, and emulator connection terminals 13 corresponding to the GND package external terminals 11c and 11d are denoted by reference numerals 13c and 13b.
"d" is added to distinguish it from other emulator connection terminals. Hereinafter, the emulator connection terminals 13a and 13b are set to N
The C emulator connection terminals are called, and the emulator connection terminals 13c and 13d are called GND emulator connection terminals.

FIGS. 2 to 4 show a surface mount type package 1.
2 is an electric circuit diagram of a selector embedded in a semiconductor chip and peripheral portions thereof, FIG. 2 shows a selector portion for an output terminal, FIG. 3 shows a selector portion for an input terminal, and FIG. 2 shows a selector section for each.

In FIG. 2, reference numeral 32 denotes a package external terminal serving as an output terminal, and reference numeral 31 denotes a signal line for guiding an output signal generated by a semiconductor chip and to be output to the outside to the package external terminal 32. A tri-state buffer 35 constituting an output terminal selector is inserted. An emulator connection terminal 33 corresponding to the package external terminal 32 is always connected to the package external terminal 32 by a signal line 34. Furthermore, 3
6 is an NC emulator connection terminal (that is, 13a in FIG. 1).
Or 13b). NC emulator connection terminal 3
6 is connected to the control input of the tri-state buffer 35 by a signal line 37 and to the power supply V _DD via a resistor. When the level of the control input drops to ground, the tristate buffer 35 is disabled, and the input and output of the tristate buffer 35 are in a floating state. On the other hand, when a predetermined voltage is applied to the control input, the control input is enabled and a signal can be transmitted.

In FIG. 3, reference numeral 42 denotes a package external terminal serving as an input terminal, and reference numeral 41 denotes a signal line for guiding an input signal applied to the package external terminal 42 to a predetermined portion of the semiconductor chip. Is inserted with a tri-state buffer 45 constituting an input terminal selector. An emulator connection terminal 43 corresponding to the package external terminal 42 is always connected to the package external terminal 42 by a signal line 44. Furthermore,
Reference numeral 46 denotes an NC emulator connection terminal (that is, 13 in FIG. 1).
a) or 13b), which is connected to the control input of the tri-state buffer 45 by a signal line 47 and to the power supply V _DD via a resistor. When the level of the control input falls to the ground,
The state is disabled, and when the voltage is a predetermined voltage, the state is enabled.

In FIG. 4, reference numeral 52 denotes a package external terminal serving as an input / output terminal;
A signal line for guiding an input signal applied to the semiconductor chip to a predetermined portion of the semiconductor chip and guiding an output signal generated by the semiconductor chip and to be output to the outside to a package external terminal 52. A bi-directional tri-state buffer 55 constituting a selector for use is inserted.
An emulator connection terminal 53 corresponding to the package external terminal 52 is always connected to the package external terminal 52 by a signal line 54. Furthermore, 56 is N
A C emulator connection terminal (that is, 13a or 13b in FIG. 1), which is connected to a control input of the bidirectional tristate buffer 55 by a signal line 57 and to a power supply _VDD via a resistor. The bidirectional tristate buffer 55 is disabled when the level of the control input falls to ground, and enabled when the voltage is a predetermined voltage.

It should be noted that among the package external terminals 11, N
Since the signal lines of the semiconductor chip are not connected to the C package external terminals 11a and 11b, the above-described selectors are not provided at corresponding locations.

FIG. 5 is a plan view showing an embodiment of a socket for connecting a connector of an emulator to the surface-mount type semiconductor integrated circuit device 1 of FIG. The socket 2 illustrated in FIG. 1 includes a plurality of socket terminals 21 that are provided on the upper surface of the package 12 in FIG.
It has. The socket terminal 21 has a shape that fits into the shape (pin shape or hole shape) of the mating terminal (emulator connection terminal and emulator connector terminal). And among these socket terminals 21,
The socket terminals 13a 'and 13b' corresponding to the NC emulator connection terminals 13a and 13b in FIG.
Socket terminals 13c 'and 13d' corresponding to the D emulator connection terminals 13c and 13d are connected by connection lines 22 and 23, respectively.

FIG. 6 is a side view showing a state where the connector 7 of the emulator is connected to the surface-mounted semiconductor integrated circuit device 1 mounted on the printed board 6 via the socket 2.

The surface-mounted semiconductor integrated circuit device 1 is directly bonded to the printed circuit board 6, and a wiring pattern (not shown) on the printed circuit board 6 and a package external terminal 11 of the surface-mounted semiconductor integrated circuit device 1 are connected to an NC package. Except for the external terminals 11a and 11b, they are electrically connected. When an emulator is connected, the socket 2 is mounted on the package 12 shown in FIG. 1 of the surface-mount type semiconductor integrated circuit device 1, and the connector 7 of the emulator is further mounted thereon, and the connector terminal 71 is connected to the socket of the socket 2. Terminal 21
Through the connection to the emulator connection terminal 13 of the surface-mounted semiconductor integrated circuit device 1.

When the connection is made in this manner, the socket terminal 13a 'and the socket terminal 13d' and the socket terminal 13b 'and the socket terminal 13c' are connected in the socket 2, respectively. 1 NC emulator connection terminals 13a and 13b are GN
The terminals are automatically connected to the D emulator connection terminals 13c and 13d and fall to the ground level. Therefore, the tri-state buffers 35, 45, and 55 described in FIGS. 2 to 4 provided in the surface-mount type semiconductor integrated circuit device 1 are disabled. The emulator connection terminal 13 is connected to the signal lines 34 and 4 as described with reference to FIGS.
4 and 54, the connector terminals 71 are electrically connected to the package external terminals 11 because they are connected to the corresponding package external terminals 11. Therefore,
The package external terminal 11 functions as an emulator terminal, and an evaluation environment for a printed circuit board can be constructed.

On the other hand, when the socket 2 is removed from the package 12, the NC emulator connection terminals 13a and 13b are opened, so that the tri-state buffers 35, 45 and 55 constituting the selector transmit signals on the signal lines of the semiconductor chip. It becomes possible, and the original operation of the surface-mounted semiconductor integrated circuit device becomes possible.

[0028]

As described above, according to the present invention, the following effects can be obtained.

Since emulation work can be performed in a state of being directly bonded to a printed circuit board, a printed circuit board on which an integrated circuit requiring an emulation environment, such as a microprocessor board, is mounted. The printed circuit board can be designed assuming the semiconductor integrated circuit device described above, wiring with a margin can be performed, and high-density mounting of the printed circuit board is possible.

Since there is no need to develop an insertion-mounted semiconductor integrated circuit device for emulation work, the cost can be reduced accordingly.

Since it is not necessary to change the mounting type from the insertion mounting type to the surface mounting type as in the conventional case, the number of man-hours for new wiring routing can be reduced, and time and cost are not wasted.

After the evaluation of the printed circuit board is completed, even if the printed circuit board is mass-produced and a manufacturing defect is mixed, it is possible to immediately cope with the emulation environment.

[Brief description of the drawings]

FIG. 1 is a plan view of one embodiment of a surface-mount type semiconductor integrated circuit device of the present invention.

FIG. 2 is an electric circuit diagram of an output terminal selector embedded in a semiconductor chip in a surface mount type package and peripheral portions thereof.

FIG. 3 is an electric circuit diagram of an input terminal selector embedded in a semiconductor chip in a surface mount type package and peripheral portions thereof.

FIG. 4 is an electric circuit diagram of an input / output terminal selector embedded in a semiconductor chip in a surface mount type package and its peripheral portion.

FIG. 5 is a plan view of one embodiment of a socket for connecting a connector of an emulator to a surface-mount type semiconductor integrated circuit device.

FIG. 6 is a side view showing a state in which a connector of an emulator is connected to a surface-mounted semiconductor integrated circuit device mounted on a printed board via a socket.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Surface mount type semiconductor integrated circuit device 11 ... Package external terminal 11a, 11b ... NC package external terminal which is a non-connect terminal 11c, 11d ... GND package external terminal to be a ground terminal 12 ... Surface mount type package 13 ... Emulator connection Terminals 13a, 13b: NC emulator connection terminals corresponding to package external terminals that are non-connect terminals 13c, 13d: GND emulator connection terminals corresponding to package external terminals that serve as ground terminals 2: Socket 21: Socket terminal 22 , 23 ... connection lines 13a ', 13b' ... NC emulator connection terminals 13
a, 13b corresponding socket terminals 13c ', 13d' ... GND emulator connection terminal 1
Socket terminals corresponding to 3c and 13d 6 ... Printed circuit board 7 ... Emulator connector 71 ... Connector terminal 31 ... Signal line for transmitting an output signal to be output from the semiconductor chip to the outside 32 ... Package external terminal to be an output terminal 33 ... Outside the package Emulator connection terminal corresponding to terminal 32 Signal line 35 Tristate buffer constituting selector for output terminal 36 NC emulator connection terminal corresponding to package external terminal serving as non-connect terminal 37 Signal line 41 A signal line for transmitting an input signal to be input to the semiconductor chip 42. A package external terminal 43 serving as an input terminal 43. A terminal for emulator connection corresponding to the package external terminal 42 44. A signal line 45... 46 ... Non-connect end NC emulator connection terminal corresponding to the package external terminal serving as a child 47 signal line 51 signal line transmitting input / output signals to be input / output to / from the semiconductor chip 52 package external terminal serving as input / output terminal 53 package external terminal 52 Emulator connection terminal 54... Signal line 55... Bidirectional tristate buffer constituting an input / output terminal selector 56... NC emulator connection terminal corresponding to a package external terminal to be a non-connect terminal 57. _DD ... power supply

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G01R 31/28-31/3193 G01R 31/26 G06F 11/22 340

Claims (4)

(57) [Claims] 1. An input signal line and an output line of a semiconductor chip to be housed.
In a surface-mounted semiconductor integrated circuit device provided with a plurality of external terminals for connecting a force signal line and an input / output signal line to a wiring pattern on a printed board, the external terminal is connected to the package. A plurality of emulator connection terminals; and the input signal line , the output signal line, and the input / output of the semiconductor chip in the package based on an external input.
In a state where the signal line is electrically disconnected from the external terminal, or in a state in which the signal line is electrically connected to the external terminal.
A surface-mounted semiconductor integrated circuit device comprising a selector for switching . 2. The semiconductor device according to claim 1, wherein said selector is inserted into said input signal line , said output signal line, and said input / output signal line of said semiconductor chip, and said input signal line , said input signal line ,
2. The surface-mounted semiconductor integrated circuit device according to claim 1, comprising a tri-state buffer for controlling a signal passing through the output signal line and the input / output signal line . 3. An external terminal of a package which is housed.
Terminals not connected to any signal lines of the semiconductor chip
Surface mounting semiconductor integrated circuit device according to claim 2, wherein the emulator connection pin which is connected to the non-connect pin is characterized by comprising a terminal for applying the external input is. 4. A socket for directly connecting a connector of an emulator to the surface-mounted semiconductor integrated circuit device according to claim 3, wherein the socket is connected to the external terminal serving as a ground among the plurality of emulator connection terminals. A surface mounting type semiconductor integrated circuit having a signal line for connecting a socket terminal corresponding to the emulator connection terminal and a socket terminal corresponding to the emulator connection terminal for applying the external input to each other. sockets for connecting the emulator connector device.