JP2863025B2 - Method of assembling bonded structure - Google Patents
Method of assembling bonded structureInfo
- Publication number
- JP2863025B2 JP2863025B2 JP3145425A JP14542591A JP2863025B2 JP 2863025 B2 JP2863025 B2 JP 2863025B2 JP 3145425 A JP3145425 A JP 3145425A JP 14542591 A JP14542591 A JP 14542591A JP 2863025 B2 JP2863025 B2 JP 2863025B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- thickness
- meth
- anaerobic
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 16
- 239000000853 adhesive Substances 0.000 claims description 55
- 230000001070 adhesive effect Effects 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 10
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- -1 hydroxypropyl Chemical group 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- LBUJPTNKIBCYBY-UHFFFAOYSA-N 1,2,3,4-tetrahydroquinoline Chemical compound C1=CC=C2CCCNC2=C1 LBUJPTNKIBCYBY-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 150000004992 toluidines Chemical class 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- QNZRVYCYEMYQMD-UHFFFAOYSA-N copper;pentane-2,4-dione Chemical compound [Cu].CC(=O)CC(C)=O QNZRVYCYEMYQMD-UHFFFAOYSA-N 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、回転ヘッド装置におけ
るトランスとドラム、同じく回転ヘッド装置におけるヘ
ッド支持体とドラム、あるいはハードディスク装置に設
けられるヘッド支持アームとヘッドなどのように複数の
部材が接着層(接着剤)を介して固定された接着構造体
の組立方法に係り、特に部材相互間の寸法を、接着層の
厚み調整によって設定できる接着構造体の組立方法に関
する。BACKGROUND OF THE INVENTION The present invention relates to a plurality of members such as a transformer and a drum in a rotary head device, a head support and a drum in a rotary head device, or a head support arm and a head provided in a hard disk device. It relates to the assembly method of the adhesive structure that is fixed via a layer (adhesive), in particular the dimension between members mutually, method of assembling the adhesive structure which can be set by the thickness adjustment of the adhesive layer.
【0002】[0002]
【従来の技術】電子機器あるいは他の機器において各種
部品が接着剤を介して固定される場合があるが、一般に
接着剤は硬化する際に収縮する性質を有しているなど、
接着層の厚さ寸法は不安定である。よって寸法精度を高
く維持しなくてはならない構造体の場合には、接着工程
において種々の対策が必要になる。2. Description of the Related Art There are cases where various parts are fixed via an adhesive in electronic equipment or other equipment. Generally, the adhesive has a property of contracting when cured.
The thickness dimension of the adhesive layer is unstable. Therefore, in the case of a structure that must maintain high dimensional accuracy, various measures are required in the bonding process.
【0003】この種の接着剤を使用した構造体におい
て、寸法精度の維持を図る対策として、従来は接着層の
厚みを一定にすることが考えられていた。例えば、接着
剤の中に一定の粒子径を持つガラスビーズを添加し、接
着される部品どうしを加圧することにより、接着剤層の
厚さをガラスビーズの粒子径と同一にする方法、または
接着層に一定の厚みをもったシムを介在させ、接着され
る部品どうしを加圧して、接着層の厚さをシムの厚みと
同一にするなどの方法がとられている。Conventionally, as a measure for maintaining the dimensional accuracy of a structure using this type of adhesive, it has been considered to make the thickness of the adhesive layer constant. For example, a method of adding glass beads having a certain particle size to an adhesive and pressing the parts to be bonded together to make the thickness of the adhesive layer the same as the particle size of the glass beads, or bonding. There has been adopted a method in which a shim having a certain thickness is interposed in the layer, and the parts to be bonded are pressed to make the thickness of the bonding layer equal to the thickness of the shim.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記の
対策では、接着層の厚みを一定とするために、外径寸法
のばらつきの少ない高価なガラスビーズを選択して使用
したり、厚さ寸法を高精度に設定したシムを使用してい
るために、全体としてコストが高く、また部品間に均一
な圧力を与えて接着作業を行う必要があり、作業工程が
複雑でまた熟練した組み立て技術が必要になる。However, in the above-mentioned measures, in order to keep the thickness of the adhesive layer constant, expensive glass beads having small variation in outer diameter are selected and used, or the thickness is reduced. The use of shims set with high precision requires high costs as a whole, requires the application of uniform pressure between parts to perform the bonding work, requires complicated work processes, and requires skilled assembly techniques. become.
【0005】さらに従来の対策は、前記ガラスビーズや
シムなどにより、接着層の厚みを一定にすることしか考
えられていなかったため、実際の構造体では、接着され
る部品の寸法のばらつきを吸収することができず、完成
した構造体では、各部品の寸法のばらつきに、前記接着
層の厚さのばらつきが合算されることになり、一方の部
品の基準面から他方の部品のある位置までの寸法を高精
度に維持することは困難であった。そのため、前記シム
を使用した構造体の場合には、実際に使用する部品の実
寸法を測定して、その誤差を求め、誤差にもとづいて複
数種のシムの中から所定寸法のものを選択する作業が必
要になって、作業が非常に煩雑になっている。[0005] Further, the conventional measures have been considered only to make the thickness of the adhesive layer constant by the glass beads or shims, so that the actual structure absorbs the dimensional variation of the parts to be bonded. In the completed structure, the variation in the thickness of the adhesive layer is added to the variation in the dimensions of each component, and the variation from the reference plane of one component to a position of the other component is added. It has been difficult to maintain dimensions with high precision. Therefore, in the case of a structure using the shim, the actual dimensions of the parts to be actually used are measured, the error is obtained, and one having a predetermined dimension is selected from a plurality of types of shims based on the error. Work becomes necessary, and the work becomes very complicated.
【0006】本発明は上記従来の課題を解決するもので
あり、接着層の硬化による収縮などの不安定さをなく
し、さらに完成した構造体の全体の寸法を高精度に設定
できるようにした接着構造体の組立方法を提供すること
を目的としている。The present invention solves the above-mentioned conventional problems, and eliminates instability such as shrinkage due to curing of an adhesive layer, and furthermore, an adhesive capable of setting the overall dimensions of a completed structure with high accuracy. It is an object to provide a method for assembling a structure.
【0007】[0007]
【課題を解決するための手段】本発明は、第1の部材と
第2の部材とを接着して構成される接着構造体の組立方
法において、少なくとも一方の部材の接着面に硬化促進
プライマーを塗布した状態で、両部材の接着面どうしを
対向させて、前記接着面間に、嫌気性硬化および紫外線
硬化が可能な接着剤組成物を充填し、その後、接着構造
体全体の厚さが所定寸法値になるように両部材を保持
し、前記接着剤組成物に紫外線を照射して両部材を接合
することを特徴とするものである。Means for Solving the Problems] This onset Ming, adhesion of the first member and the assembly side <br/> method consists bonded structure by bonding the second member, at least one member With the curing acceleration primer applied to the surface,
Oppositely, an anaerobic-curable and ultraviolet-curable adhesive composition is filled between the adhesive surfaces , and then the adhesive structure
The present invention is characterized in that both members are held so that the thickness of the whole body becomes a predetermined dimension value, and the adhesive composition is irradiated with ultraviolet rays to join the two members .
【0008】本発明では、図1に示すように、寸法L1
にばらつきがある部品Aと同じく寸法L2にばらつきが
ある部品Bを接着層Cを介して接合する際に、接着層C
に接着剤を充填した後に、両部品の必要とする寸法(例
えば部品Aの底面と部品Bの上面)Lが規定寸法となる
ように保持し、この保持状態で接着剤を硬化させる。こ
れによりそれぞれの部品の寸法L1とL2のばらつきにか
かわらず、規定寸法Lを得ることができ、前記ばらつき
L1とL2は接着層Cの厚さ寸法δにより吸収される。In the present invention, as shown in FIG.
When the component B having the same variation in the dimension L2 as the component A having the variation in
After the adhesive is filled, the required size (for example, the bottom surface of the component A and the upper surface of the component B) L of both components is held to a specified size, and the adhesive is cured in this held state. Thus, the specified dimension L can be obtained regardless of the variation in the dimensions L1 and L2 of each component, and the variations L1 and L2 are absorbed by the thickness dimension δ of the adhesive layer C.
【0009】上記接着層Cに使用される接着剤は、二液
性のエポキシ樹脂やウレタン樹脂、加熱硬化型のエポキ
シ樹脂、嫌気性接着剤などが使用可能であるが、二液性
のエポキシ樹脂やウレタン樹脂は硬化時間が長く、また
硬化時間を短くすると二液混合後の可使時間が極端に短
くなり実用的でない。一液性の加熱硬化型のエポキシ樹
脂も使用可能であるが、接着剤充填後に長時間の加熱が
必要であり実用的ではない。嫌気性接着剤も使用可能で
あるが、部品間からのはみ出し部分が硬化しないので実
用的ではない。As the adhesive used for the adhesive layer C, a two-component epoxy resin, a urethane resin, a heat-curable epoxy resin, an anaerobic adhesive or the like can be used. The urethane resin or the urethane resin has a long curing time, and if the curing time is shortened, the pot life after mixing the two components becomes extremely short, which is not practical. A one-part heat-curable epoxy resin can be used, but it is not practical because a long time of heating is required after filling the adhesive. Anaerobic adhesives can also be used, but are not practical because the protruding parts between the parts do not cure.
【0010】よって本発明に使用される接着剤として
は、嫌気性付与型の紫外線硬化性樹脂が最も適する。接
着層Cでは、紫外線の照射不可能な箇所は嫌気性で硬化
し、はみ出し部は紫外線にて硬化する。Therefore, as the adhesive used in the present invention, an anaerobic imparting type ultraviolet curable resin is most suitable . In the bonding layer C, a portion where irradiation with ultraviolet light is impossible is hardened anaerobically, and a protruding portion is hardened with ultraviolet light.
【0011】また、部品材質が嫌気性硬化に対し不活性
な場合、または接着層Cの厚みが大きい場合、さらには
硬化時間の短縮により工程時間を短縮したい場合には、
硬化促進プライマーをいずれか一方の部品または両方の
部品に塗布後、嫌気性付与型の紫外線硬化性樹脂接着剤
を充填する。これにより接着層Cの内部は嫌気硬化が促
進される。When the component material is inert to anaerobic hardening, or when the thickness of the adhesive layer C is large, and when it is desired to shorten the process time by shortening the hardening time,
After applying the curing accelerating primer to one or both parts, an anaerobic imparting type ultraviolet curable resin adhesive is filled. This promotes anaerobic curing inside the adhesive layer C.
【0012】このように、本発明では、厚みδの調整に
よって形成された接着層Cを有する接着構造体としてい
るため、シムなどが不要となって工程の簡略化が可能で
あり、製造工程時間の短縮が図れる。また接着構造体の
全体の寸法精度を高く設定でき、寸法精度を必要とする
部品として使用可能である。As described above, in the present invention, since the adhesive structure having the adhesive layer C formed by adjusting the thickness δ is used, no shim or the like is required, and the process can be simplified, and the manufacturing process time can be reduced. Can be shortened. Further, the overall dimensional accuracy of the bonded structure can be set high, and the bonded structure can be used as a component requiring dimensional accuracy.
【0013】ここで、本発明の接着層Cに使用される嫌
気性付与型の紫外線硬化性樹脂接着剤とは、両端または
側鎖に一個以上のアクリル基またはメタアクリル基を有
するプレポリマーと、アクリル単量体およびメタクリル
単量体から選ばれた少なくとも一種の重合可能な単量体
と、光重合開始剤と、嫌気性触媒とによって構成される
嫌気性硬化および紫外線硬化が可能な接着剤組成物であ
る。本接着剤組成物は硬化性が早く作業性に優れ、しか
も耐水性を有し、長期信頼性を有する。Here, the anaerobic imparting type ultraviolet curable resin adhesive used for the adhesive layer C of the present invention is a prepolymer having one or more acrylic or methacrylic groups at both ends or side chains. An anaerobic-curable and ultraviolet-curable adhesive composition composed of at least one polymerizable monomer selected from an acrylic monomer and a methacrylic monomer, a photopolymerization initiator, and an anaerobic catalyst. Things. The present adhesive composition has a quick curing property, is excellent in workability, has water resistance, and has long-term reliability.
【0014】はみ出し部は、空気中の酸素により硬化が
阻害され、液状のままで存在するために紫外線照射にて
硬化させる。紫外線照射の不可能な部分は、嫌気性硬化
する接着剤である。The protruding portion is hardened by irradiation of ultraviolet rays because its hardening is inhibited by oxygen in the air and remains in a liquid state. The part that cannot be irradiated with ultraviolet light is an adhesive that hardens anaerobically.
【0015】両端または側鎖に一個以上のアクリル基ま
たはメタアクリル基を有するプレポリマーとは、ウレタ
ン(メタ)アクリルプレポリマー、エポキシ(メタ)ア
クリルプレポリマー、ポリエステル(メタ)アクリルプ
レポリマー、ポリブタジエン(メタ)アクリルプレポリ
マーなどがあげられ、これらの一種が使用され、または
二種以上の混合物が使用できる。The prepolymer having one or more acrylic or methacrylic groups at both ends or side chains includes urethane (meth) acrylic prepolymer, epoxy (meth) acrylic prepolymer, polyester (meth) acrylic prepolymer, polybutadiene ( (Meth) acrylic prepolymers and the like, one of which is used, or a mixture of two or more thereof.
【0016】アクリル単量体およびメタクリル単量体か
ら選ばれた少なくとも一種の重合可能な単量体とは、2
ヒドロキシエチル(メタ)アクリレート、2ヒドロキシ
プロピル(メタ)アクリレート、テトラヒドロフルフリ
ル(メタ)アクリレート、ブトキシエチル(メタ)アク
リレート、エチルジエチレングリコール(メタ)アクリ
レート、2エチルヘキシル(メタ)アクリレート、シク
ロヘキシル(メタ)アクリレート、フェノキシエチル
(メタ)アクリレート、 2ヒドロ3フェニルオキシプ
ロピル(メタ)アクリレート、ジシクロペンタジエン
(メタ)アクリレート、トリメチロールプロパントリ
(メタ)アクリレート、(ポリ)エチレングリコールジ
(メタ)アクリレート、1,6ヘキサンジオールジ(メ
タ)アクリレート、ネオペンチルグリコールジ(メタ)
アクリレート、トリ(メタ)アクリロキシエチルフォス
フェート、などがあげられ、これらの一種が使用され、
または二種以上の混合物が使用できる。At least one polymerizable monomer selected from an acrylic monomer and a methacrylic monomer is 2
Hydroxyethyl (meth) acrylate, 2 hydroxypropyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, butoxyethyl (meth) acrylate, ethyldiethylene glycol (meth) acrylate, 2ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, Phenoxyethyl (meth) acrylate, 2-hydro-3-phenyloxypropyl (meth) acrylate, dicyclopentadiene (meth) acrylate, trimethylolpropane tri (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, 1,6 hexane Diol di (meth) acrylate, neopentyl glycol di (meth)
Acrylate, tri (meth) acryloxyethyl phosphate, and the like, and one of these is used,
Alternatively, a mixture of two or more can be used.
【0017】光重合開始剤とは、2,2ジメトキシ2フ
ェニルアセトフェノン、2,2ジエトキシアセトフェノ
ン、1ヒドロキシシクロヘキシルフェニルケトン、ベン
ゾイルアルキルエーテル、ベンゾフェノン、メチルベン
ゾイルフォーマート、などがあげられ、これらの一種が
使用され、または二種以上の混合物が使用できる。Examples of the photopolymerization initiator include 2,2 dimethoxy-2-phenylacetophenone, 2,2 diethoxyacetophenone, 1-hydroxycyclohexylphenyl ketone, benzoylalkyl ether, benzophenone, methylbenzoyl formate, and the like. Or a mixture of two or more.
【0018】嫌気性触媒とは、有機過酸化物とアミン触
媒である。有機過酸化物とは、ジアシルパーオキサイ
ド、ケトンパーオキサイド、ハイドロパーオキサイド、
ジアルキルパーオキサイド、パーオキシエステルなどで
あって、具体的には、ベンゾイルパーオキサイド、クメ
ンハイドロパーオキサイド、t−ブチルハイドロパーオ
キサイド、メチルエチルケトンパーオキサイド、tブチ
ルパーオキシアセテートなどの公知のフリーラジカル発
生剤があげられ、これらの一種が使用され、または二種
以上の混合物が使用できる。Anaerobic catalysts are organic peroxides and amine catalysts. Organic peroxides include diacyl peroxide, ketone peroxide, hydroperoxide,
Dialkyl peroxide, peroxyester and the like, specifically, known free radical generators such as benzoyl peroxide, cumene hydroperoxide, t-butyl hydroperoxide, methyl ethyl ketone peroxide, t-butyl peroxyacetate One of these can be used, or a mixture of two or more can be used.
【0019】アミン触媒とは、トリエチルアミン、トリ
プロピルアミン、ジメチルアニリン、トルイジン、オル
ソスルホベンズイミド、テトラハイドロキノリンなどが
あげられ、これらの一種が使用され、または二種以上の
混合物が使用できる。Examples of the amine catalyst include triethylamine, tripropylamine, dimethylaniline, toluidine, orthosulfobenzimide, tetrahydroquinoline and the like. One of these can be used, or a mixture of two or more can be used.
【0020】硬化促進プライマーとは、チオ尿素、エチ
レンチオ尿素、アセチルチオ尿素などの、チオ尿素類や
塩化第一銅、ナフテン酸銅、アセチルアセトン銅などの
銅化合物、ジメチルアニリン、トルイジンなどのアミン
化合物の一種が使用され、または二種以上の混合物が使
用できる。The curing accelerating primer is a kind of thioureas, copper compounds such as cuprous chloride, copper naphthenate and copper acetylacetone, such as thiourea, ethylenethiourea and acetylthiourea; and amine compounds such as dimethylaniline and toluidine. Or a mixture of two or more.
【0021】[0021]
【実施例】(実施例1)図1に示す部品Aとして、アル
ミニウム合金製の回転ヘッド装置用固定ドラムを使用
し、部品Bとしてフェライト製のロータリトランス用コ
アを使用した。ロータリトランス用コアをマグネットに
より保持して両者の隙間δを50μmに設定し、隙間δ
内に以下の表1に示す(接着剤1)を充填した。またロ
ータリトランス用コア(部品B)の接着面に以下の表3
に示す硬化促進プライマーを塗布した。接着剤を充填し
た後、隙間δの周囲に150mw/cm2の紫外線を照射し
て、接着剤を硬化させ、接着層Cを得た。EXAMPLE 1 A fixed drum for a rotary head device made of an aluminum alloy was used as a component A shown in FIG. 1, and a ferrite rotary transformer core was used as a component B. The rotary transformer core is held by a magnet, and the gap δ between the two is set to 50 μm.
Was filled with (adhesive 1) shown in Table 1 below. In addition, the following Table 3 shows the bonding surface of the rotary transformer core (part B).
Was applied. After filling the adhesive, the periphery of the gap δ was irradiated with ultraviolet rays of 150 mw / cm 2 to cure the adhesive and obtain an adhesive layer C.
【0022】(実施例2)以下の表1に示す(接着剤
2)を使用して、上記(実施例1)と同じ方法および条
件により接着層Cを得た。(Example 2) An adhesive layer C was obtained by using the (adhesive 2) shown in Table 1 below and by the same method and conditions as in the above (Example 1).
【0023】(実施例1)に使用した(接着剤1)と
(実施例2)に示した(接着剤2)の成分を以下の表1
に示す。表1において右欄は各成分の重量比である。The components of (Adhesive 1) used in (Example 1) and (Adhesive 2) shown in (Example 2) are shown in Table 1 below.
Shown in In Table 1, the right column shows the weight ratio of each component.
【0024】[0024]
【表1】 [Table 1]
【0025】上記(接着剤1)と(接着剤2)の物性は
以下の表2に示す通りである。The physical properties of (Adhesive 1) and (Adhesive 2) are as shown in Table 2 below.
【0026】[0026]
【表2】 [Table 2]
【0027】上記表2内の物性の試験方法は以下のとお
りである。The test methods for the physical properties in Table 2 are as follows.
【0028】試験方法 1)UV硬化性 150mw/cm2の紫外線を照射して、引張接着強度が最大値
になるまでの紫外線積算光量 2)引張接着強度 5×50×50mmの透明硝子と13mmφの丸鉄棒に各接着剤組
成物を塗布し、5000mj/cm2の紫外線積算光量を照射し
て、接着剤組成物を硬化させる。硬化後、10mm/minの
引張速度で引張接着強度を測定した。Test method 1) UV curability Irradiation of 150 mw / cm 2 of ultraviolet light, the integrated amount of ultraviolet light until the tensile adhesive strength reaches the maximum value 2) Tensile adhesive strength 5 × 50 × 50 mm transparent glass and 13 mmφ Each adhesive composition is applied to a round iron bar, and irradiated with an integrated amount of ultraviolet light of 5000 mj / cm 2 to cure the adhesive composition. After curing, the tensile adhesive strength was measured at a tensile speed of 10 mm / min.
【0029】前記実施例に使用した硬化促進プライマー
は以下の表3に示す通りである。なお表3において右欄
の数値は重量比である。The curing acceleration primers used in the above examples are as shown in Table 3 below. In Table 3, the values in the right column are weight ratios.
【0030】[0030]
【表3】 [Table 3]
【0031】(結果)上記実施例1と実施例2におい
て、接着剤が硬化した後の接着層Cの厚みの変化を測定
したところ、厚みδの収縮変化量は2μm以下(測定精
度以下)であり、ほとんど厚さの変化は見られなかっ
た。(Results) In Examples 1 and 2, when the change in the thickness of the adhesive layer C after the adhesive was cured was measured, the shrinkage change in the thickness δ was 2 μm or less (measurement accuracy or less). There was almost no change in thickness.
【0032】なお、アルミ合金製のドラム(部品A)と
ロータリトランス用のフェライト製コア(部品B)とが
δ=50μmの接着層Cにより接着した前記実施例にお
いて、接着剤を塗布してから部品Bの保持を解除するま
での時間(セットタイム)は、実施例1において60
秒、実施例2において45秒であった(ただし環境温度
は25℃)。In the above embodiment in which an aluminum alloy drum (part A) and a ferrite core for a rotary transformer (part B) were bonded by an adhesive layer C of δ = 50 μm, after the adhesive was applied, The time (set time) until the holding of the component B is released is 60 in the first embodiment.
And 45 seconds in Example 2 (however, the ambient temperature was 25 ° C.).
【0033】したがって、図1において、両部品の隙間
内に前記実施例の接着剤を充填し、部品Aをマグネット
などにより保持して寸法Lを規格寸法値に設定し、紫外
線を照射するなどして接着剤を硬化させることにより、
誤差がほとんどない隙間寸法(接着層Cの厚さ寸法)δ
を得ることができ、このδの寸法によりそれぞれの部品
の寸法L1とL2のばらつきを調整(吸収)でき、規定寸
法Lが高精度に設定された接着構造体を得ることができ
る。[0033] Thus, in FIG. 1, the gap between both parts
Is filled with the adhesive of the above embodiment, and the part A is magnetized.
By setting the dimension L to the standard dimension value by holding the adhesive and curing the adhesive by irradiating ultraviolet rays,
Clearance dimension with little error (thickness dimension of adhesive layer C) δ
The variation of the dimensions L1 and L2 of each part can be adjusted (absorbed) by the dimension of δ, and an adhesive structure in which the specified dimension L is set with high precision can be obtained.
【0034】[0034]
【発明の効果】以上詳述した本発明によれば、安定した
厚みの接着層を得ることができ、またこの接着層の厚み
の調整により部品の寸法のばらつきを吸収でき、寸法精
度の高い接着構造体を得ることができるようになる。According to the present invention described in detail above, it is possible to obtain an adhesive layer having a stable thickness, and by adjusting the thickness of the adhesive layer, it is possible to absorb variations in the dimensions of parts and to obtain an adhesive with high dimensional accuracy. A structure can be obtained.
【図1】接着構造体の構成図。FIG. 1 is a configuration diagram of an adhesive structure.
A 第1の部品 B 第2の部品 C 接着層 A first component B second component C adhesive layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 光 東京都大田区雪谷大塚町1番7号 アル プス電気株式会社内 (72)発明者 斉藤 勉 東京都府中市若松町2−8−33 ケミテ ック株式会社内 (56)参考文献 特開 平2−73.508(JP,A) 特開 平2−140067(JP,A) 特開 昭57−65712(JP,A) (58)調査した分野(Int.Cl.6,DB名) C09J 5/00 - 5/02 H04N 5/00 - 5/95 G11B 5/53──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hikaru Sato 1-7 Yukitani Otsuka-cho, Ota-ku, Tokyo Alps Electric Co., Ltd. (72) Inventor Tsutomu Saito 2-8-33 Wakamatsucho, Fuchu-shi, Tokyo Chemite (56) References JP-A-2-73.508 (JP, A) JP-A-2-140067 (JP, A) JP-A-57-65712 (JP, A) (58) Field (Int.Cl. 6 , DB name) C09J 5/00-5/02 H04N 5/00-5/95 G11B 5/53
Claims (2)
成される接着構造体の組立方法において、少なくとも一
方の部材の接着面に硬化促進プライマーを塗布した状態
で、両部材の接着面どうしを対向させて、前記接着面間
に、嫌気性硬化および紫外線硬化が可能な接着剤組成物
を充填し、その後、接着構造体全体の厚さが所定寸法値
になるように両部材を保持し、前記接着剤組成物に紫外
線を照射して両部材を接合することを特徴とする接着構
造体の組立方法。A first member and a second member bonded to each other;
In the method for assembling an adhesive structure to be formed, in a state where a curing accelerating primer is applied to the adhesive surface of at least one member, the adhesive surfaces of both members are opposed to each other, and
Is filled with an anaerobic-curable and ultraviolet-curable adhesive composition, and thereafter, both members are held so that the thickness of the entire adhesive structure becomes a predetermined dimensional value, and ultraviolet light is applied to the adhesive composition. A method for assembling an adhesive structure, comprising irradiating and joining both members .
以上のアクリル基またはメタアクリル基を有するプレポ
リマーと、アクリル単量体およびメタアクリル単量体か
ら選ばれた少なくとも一種の重合可能な単量体と、光重
合開始剤と、嫌気性触媒を有する請求項1記載の接着構
造体の組立方法。2. The adhesive composition comprises a prepolymer having one or more acrylic or methacrylic groups at both ends or side chains, and at least one polymerizable monomer selected from acrylic monomers and methacrylic monomers. 2. The method for assembling an adhesive structure according to claim 1, further comprising a novel monomer, a photopolymerization initiator, and an anaerobic catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145425A JP2863025B2 (en) | 1991-05-21 | 1991-05-21 | Method of assembling bonded structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145425A JP2863025B2 (en) | 1991-05-21 | 1991-05-21 | Method of assembling bonded structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05320584A JPH05320584A (en) | 1993-12-03 |
| JP2863025B2 true JP2863025B2 (en) | 1999-03-03 |
Family
ID=15384956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3145425A Expired - Fee Related JP2863025B2 (en) | 1991-05-21 | 1991-05-21 | Method of assembling bonded structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2863025B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AUPP247798A0 (en) * | 1998-03-18 | 1998-04-23 | Rudduck, Dickory | Fixing and release systems |
| JP2002225546A (en) * | 2001-01-31 | 2002-08-14 | Fuji Koki Corp | Temperature type expansion valve |
| JPWO2006051872A1 (en) * | 2004-11-11 | 2008-05-29 | 大同化成工業株式会社 | Anaerobic adhesive composition or photocurable anaerobic adhesive composition containing piperidine compound |
| JP4831395B2 (en) * | 2005-02-10 | 2011-12-07 | ミネベア株式会社 | Color wheel and manufacturing method thereof |
| JP5607978B2 (en) * | 2010-04-08 | 2014-10-15 | ミネベア株式会社 | Pivot assembly bearing |
| CN102896869B (en) * | 2011-07-25 | 2016-03-02 | 汉高股份有限公司 | Utilize the method for ultraviolet irradiation solidification-redox curing adhesive composition bond substrates |
| JP6447868B2 (en) * | 2014-12-22 | 2019-01-09 | 株式会社スリーボンド | Anaerobic curable adhesive |
| JP7645101B2 (en) * | 2021-03-10 | 2025-03-13 | セイコーグループ株式会社 | Electronic components and manufacturing method thereof |
| JPWO2023210718A1 (en) * | 2022-04-28 | 2023-11-02 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5765712A (en) * | 1980-10-11 | 1982-04-21 | Suriibondo:Kk | Curable composition |
| JPS57119970A (en) * | 1981-01-16 | 1982-07-26 | Matsushita Electric Ind Co Ltd | Bonding rotor to shaft |
| JPS59202277A (en) * | 1983-04-30 | 1984-11-16 | Anritsu Corp | Accurate fixation of components and adhesive therefor |
| JPS63188816A (en) * | 1987-01-30 | 1988-08-04 | Matsushita Electric Ind Co Ltd | Rotary drum unit |
| JPH01207371A (en) * | 1988-02-15 | 1989-08-21 | Seiko Epson Corp | Adhesive for small-sized waterproof device |
| JPH0273508A (en) * | 1988-09-08 | 1990-03-13 | Nec Kansai Ltd | Positioning and fixing method for magnetic head |
-
1991
- 1991-05-21 JP JP3145425A patent/JP2863025B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05320584A (en) | 1993-12-03 |
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