JP7645101B2 - Electronic components and manufacturing method thereof - Google Patents

Description

The present invention relates to electronic components and methods for manufacturing electronic components.

2. Description of the Related Art Conventionally, there has been known an electronic component in which an electronic element is hermetically sealed in a hollow package having an internal cavity (see Patent Document 1 below).
For example, in the case of a sensor element, which is one type of electronic element, it is required to hermetically seal the element in a vacuum state in a hollow package in order to improve sensing accuracy, or in other cases, to hermetically seal the element in a hollow package in order to improve vibration characteristics.

Various methods have been proposed for hermetically sealing an electronic element in a hollow package. For example, a common method is to mount an electronic element on a mounting board or a lead frame, and then form a frame on the mounting board or the lead frame as a side wall surrounding the electronic element (in this case, for example, a preformed frame is attached, or the frame is formed using a molding die, etc.). Then, a lid material is placed and bonded on the frame so as to close the opening of the frame.
Furthermore, a method is also known in which an electronic element is mounted on a bottomed cylindrical base plate in which a mounting substrate and a frame are integrally formed in advance, and then a lid material is adhered to close the opening of the base plate.

In any of the above methods, when attaching a lid, a commonly used method is to cover the lid with a thermosetting adhesive, and then heat-set the thermosetting adhesive while applying pressure to the lid in a vacuum atmosphere.

JP 2009-69629 A

However, the thermosetting adhesive has a property that the viscosity of the adhesive decreases once during the thermal curing process, and then increases to a high viscosity before curing. Therefore, when the viscosity of the thermosetting adhesive decreases, the lid material is easily moved due to the pressure applied to the lid material, and there is a risk of the thermosetting adhesive curing while the lid material is misaligned. This can easily lead to a deterioration in the quality and performance of electronic components, leading to a decrease in reliability.
Furthermore, since the process of pressurizing and adhering the lid material using a thermosetting adhesive needs to be carried out in a vacuum atmosphere, the manufacturing process becomes complicated, which tends to result in reduced production efficiency and increased manufacturing costs, leaving room for improvement.

The present invention was made in consideration of these circumstances, and its purpose is to provide an electronic component and a method for manufacturing an electronic component that can perform airtight sealing with high reliability, while also improving production efficiency and reducing costs.

(1) An electronic component according to the present invention comprises an electronic element, a base on which the electronic element is mounted, and a lid joined to the base via a thermosetting adhesive to hermetically seal the electronic element in a cavity, wherein the base or the lid has an air hole formed therein that connects the inside of the cavity to the outside, the air hole being hermetically sealed by hardening of an ultraviolet-curing adhesive filled in the air hole , and the ultraviolet-curing adhesive is characterized in that an anaerobic catalyst or a thermosetting catalyst is contained in a base resin having a modified acrylate .

According to the electronic component of the present invention, the base or lid has a vent hole that connects the inside of the cavity with the outside. After mounting the electronic element on the base and assembling the lid to the base via the thermosetting adhesive, the thermosetting adhesive can be heated, for example, by using a vacuum heating furnace or the like, while discharging the gas in the cavity through the vent hole. This allows the cavity to be depressurized to a predetermined vacuum level, and the lid can be sucked using the depressurization, so that the lid can be pressed against the base. In particular, the lid can be kept evenly pressed against the base, so that the base and lid can be precisely fixed together without misalignment by the heat curing of the thermosetting adhesive.

After the base and lid are fixed together, the vent hole is filled with an ultraviolet-curing adhesive, which is then irradiated with ultraviolet light to harden it, thereby hermetically sealing the inside of the vent hole. In particular, since an ultraviolet-curing adhesive is used, unlike the case of using a thermosetting adhesive, for example, it is possible to harden it in a short time (instantaneously) by irradiating it with ultraviolet light. This improves the airtight sealing in the cavity, resulting in an electronic component with improved moisture resistance and operational reliability. Furthermore, since a mechanism for pressurizing the lid, as in the past, is no longer necessary, production efficiency can be improved and costs can be reduced.

Furthermore , since the base resin, which is the main component of the ultraviolet curing adhesive, contains at least one of an anaerobic catalyst or a heat curing catalyst, the curing of the ultraviolet curing adhesive can be promoted not only by the curing caused by the irradiation of ultraviolet rays, but also by the effect of blocking oxygen due to the reduced pressure in the cavity and the effect of heat curing. Therefore, when the ultraviolet curing adhesive filled in the air hole is irradiated with ultraviolet rays, even if there are parts where the ultraviolet rays are difficult to pass through or reach, these parts can be cured appropriately. Therefore, the entire ultraviolet curing adhesive can be reliably cured, and the airtight sealing of the air hole can be further improved.

( 2 ) The ultraviolet curing adhesive may have a viscosity before curing in the range of 100 mPa·s (millipascal seconds) to 100,000 mPa·s.

In this case, since the ultraviolet curing adhesive has a certain viscosity, when the ultraviolet curing adhesive is filled into the vent hole, it is possible to prevent the ultraviolet curing adhesive from flowing from the vent hole into the cavity side. Therefore, it is possible to prevent inconveniences such as the ultraviolet curing adhesive dripping or dripping into the cavity, eliminating the effect on the electronic element and making it easier to further improve operational reliability.

( 3 ) The ultraviolet curing adhesive may contain a photopolymerization initiator having a reaction wavelength in the range of 300 nm to 500 nm.

In this case, since the ultraviolet-curing adhesive contains a photopolymerization initiator having a reaction wavelength within the above range, when ultraviolet light is irradiated onto the ultraviolet-curing adhesive filled in the air hole, it is easy to avoid the influence of visible light (scattered light indoors), and it is possible to effectively use the 365 nm wavelength, which has the greatest amount of light in spot irradiation by commonly used ultraviolet LEDs. Therefore, production efficiency can be further improved, and the ultraviolet-curing adhesive can be easily cured in an even shorter time.

( 4 ) The ventilation hole may be formed so that the opening diameter of the outer opening that opens to the outside is within the range of 0.05 mm to 1.0 mm.

In this case, the ventilation hole is formed so that the opening diameter of the outer opening falls within the above range, so the ventilation hole can be made very small, the ultraviolet curing adhesive can be filled into the ventilation hole in a short time, and the ultraviolet curing adhesive can be easily filled into the ventilation hole without gaps. This further improves the airtight sealing of the ventilation hole.

( 5 ) The air vent may have a length between an outer opening that opens to the outside and an inner opening that opens to the cavity side that is 5 mm or less.

In this case, since the length of the ventilation hole is 5 mm or less, the irradiated ultraviolet light can reach the entire ultraviolet curing adhesive filled in the ventilation hole appropriately. This can further improve the airtight sealing of the ventilation hole.

( 6 ) The air vent may be formed in a cross-sectional tapered shape in which the diameter gradually decreases from an outer opening that opens to the outside toward an inner opening that opens to the cavity side.

In this case, the vent hole is formed with a tapered cross section, with the diameter gradually decreasing toward the cavity side, making it easier to fill the vent hole with ultraviolet curing adhesive and to fill the vent hole without leaving any gaps. This further improves the airtight sealing of the vent hole.

( 7 ) The cavity may be filled with an inert gas.

In this case, the cavity is filled with an inert gas such as nitrogen or a rare gas, which can improve, for example, moisture resistance and corrosion resistance, and can further improve operational reliability.

( 8 ) The base has a frame portion surrounding the electronic element, the air vent is formed in the frame portion, the lid portion is formed of an optically transparent material, and the electronic element may be an optical element.

In this case, since the ventilation holes are formed in the frame, light can be incident on the optical element in the cavity through the optically transparent lid, and light can be emitted from the optical element in the cavity to the outside through the lid, making it suitable for use as an optical electronic component such as an image sensor.

( 9 ) A method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component including an electronic element, a base on which the electronic element is mounted, and a lid joined to the base via a thermosetting adhesive to hermetically seal the electronic element in a cavity, the method including a mounting step of mounting the electronic element on the base, a superposition step of superposing the base or the lid, each having an air hole that communicates the inside of the cavity with the outside, on top of each other via the thermosetting adhesive, a first sealing step of curing the thermosetting adhesive by heating while reducing the pressure inside the cavity to a predetermined vacuum level by discharging gas inside the cavity to the outside through the air hole, and a filling step of filling an ultraviolet curing adhesive into the air hole while maintaining the vacuum level inside the cavity. and a second sealing step of hardening the ultraviolet-curing adhesive filled in the air hole by irradiating it with ultraviolet light, thereby hermetically sealing the air hole . The filling step includes a setting step of setting an ejection nozzle for ejecting the ultraviolet-curing adhesive so as to face an outer opening of the air hole that opens to the outside with a predetermined clearance, and an ejection step of ejecting the ultraviolet-curing adhesive into the air hole to fill it so that the ultraviolet-curing adhesive comes into contact with the entire periphery of the opening of the outer opening. During the ejection step, the ejection is performed with the ejection nozzle tilted so that the nozzle axis of the ejection nozzle is at an angle of 20 degrees to 70 degrees with respect to the center line of the air hole .

According to the method for manufacturing electronic components of the present invention, when performing the first sealing step, after overlapping the base and lid with the thermosetting adhesive, the thermosetting adhesive can be heated, for example, by using a vacuum heating furnace or the like, while discharging the gas in the cavity through the air hole. This allows the cavity to be depressurized to a predetermined vacuum level, and the depressurization can be used to suck the lid, which acts to press the lid against the base. In particular, since the lid can be kept evenly pressed against the base, the base and lid can be precisely fixed together without misalignment by the heat curing of the thermosetting adhesive.

Next, in the filling process, the air hole is filled with ultraviolet curing adhesive while maintaining the degree of vacuum in the cavity. Then, in the second sealing process, the ultraviolet curing adhesive filled in the air hole is irradiated with ultraviolet light to harden it, thereby hermetically sealing the air hole. In particular, since an ultraviolet curing adhesive is used, unlike the case of using a thermosetting adhesive, for example, it is possible to harden it in a short time (instantaneously) by irradiating it with ultraviolet light. Therefore, the airtight sealing in the cavity can be improved, and an electronic component with improved moisture resistance and operational reliability can be obtained. Furthermore, since a mechanism for pressurizing the lid portion as in the conventional method is no longer necessary, production efficiency can be improved and costs can be reduced.

Furthermore , the discharge nozzle is set facing the outer opening of the ventilation hole with a predetermined clearance, and then the ultraviolet curing adhesive is discharged from the discharge nozzle toward the inside of the ventilation hole to fill it. In particular, the ultraviolet curing adhesive is discharged from the discharge nozzle so that the ultraviolet curing adhesive contacts the entire circumference of the opening periphery of the outer opening of the ventilation hole, so that the ultraviolet curing adhesive that contacts the opening periphery of the outer opening can be guided into the ventilation hole by using surface tension in addition to the momentum of the discharge. Therefore, even if the opening size of the ventilation hole is small, the ultraviolet curing adhesive can be efficiently discharged and filled into the ventilation hole, improving workability. Furthermore, the discharge nozzle is set with a predetermined clearance from the outer opening of the ventilation hole, so that, for example, inconveniences such as the ultraviolet curing adhesive unintentionally adhering to the periphery of the ventilation hole before discharge can be suppressed. Therefore, it is easy to efficiently discharge the ultraviolet curing adhesive only into the inside of the ventilation hole without waste.

Furthermore , since the ultraviolet curing adhesive is discharged into the air hole while the discharge nozzle is tilted at the above-mentioned angle with respect to the center line of the air hole, even if the ultraviolet curing adhesive discharged from the discharge nozzle behaves in such a way that it drips from the discharge nozzle due to the influence of gravity, the dripping ultraviolet curing adhesive can be brought into contact with the entire circumference of the opening edge at the outer opening of the air hole. Therefore, even if it is influenced by gravity, the ultraviolet curing adhesive can be appropriately guided into the air hole.

( 10 ) During the discharging step, the discharge nozzle may be moved along the opening surface of the outer opening while discharging the ultraviolet curable adhesive.

In this case, the discharge nozzle is slid within the opening surface of the outer opening while the ultraviolet curing adhesive is being discharged, so even if the ultraviolet curing adhesive behaves in such a way that it drips from the discharge nozzle due to the influence of gravity, for example, it is easy to make contact with the entire periphery of the opening edge of the outer opening. Therefore, even if it is influenced by gravity, the ultraviolet curing adhesive can be guided into the air hole.

The present invention makes it possible to perform airtight sealing with high reliability, while improving production efficiency and reducing costs.

FIG. 1 is a longitudinal sectional view of an optical electronic component (electronic component) according to an embodiment of the present invention. FIG. 2 is a perspective view of the optical electronic component shown in FIG. 1 . 2 is an enlarged cross-sectional view of the periphery of the ventilation hole shown in FIG. 1 . FIG. 2 is a cross-sectional view showing a process for manufacturing the optical electronic component shown in FIG. 1, in which an optical element is mounted on a die pad portion of a lead frame. 5 is a cross-sectional view showing a state in which a base portion is created by combining a base portion and a peripheral wall portion in which an air vent is formed with the lead frame shown in FIG. 4 . 6 is a cross-sectional view showing a state in which a lid portion is superimposed on the base portion shown in FIG. 5 via a thermosetting adhesive. 7 is a cross-sectional view showing a state in which a discharge nozzle is set to the vent hole shown in FIG. 6. 8 is a cross-sectional view showing a state in which an ultraviolet curing adhesive is being discharged into an air hole from the discharge nozzle shown in FIG. 7 . FIG. 9 is a cross-sectional view showing a state in which ultraviolet light is irradiated onto the ultraviolet curing adhesive filled in the vent hole shown in FIG. 8 . FIG. FIG. 11 is a vertical cross-sectional view showing a modified example of the optical electronic component. FIG. 13 is a perspective view showing another modified example of the optical electronic component. FIG. 12 is a perspective view showing an air hole in the optical electronic component shown in FIG. 11 . FIG. 11 is a vertical cross-sectional view showing still another modified example of the electronic component. FIG. 11 is a vertical cross-sectional view showing still another modified example of the electronic component.

The following describes an embodiment of an electronic component and electronic component according to the present invention with reference to the drawings. In this embodiment, an optical electronic component in which an optical element is sealed in a cavity will be described as an example of the electronic component.

As shown in Figures 1 and 2, the optical electronic component 1 of this embodiment includes an optical element (electronic element according to the present invention) 2, a base 3 on which the optical element 2 is mounted, and a lid 4 that is bonded to the base 3 via a thermosetting adhesive 5 and hermetically seals the optical element 2 in a cavity 6.

The optical electronic component 1 of this embodiment is a chip component that is formed in a thin rectangular parallelepiped shape, with the length in the front-rear direction L1 and the length in the left-right direction L2 being equal. However, the shape of the optical electronic component 1 is not limited to this case, and may be changed as appropriate depending on, for example, the application or the size of the optical element 2.
In this embodiment, in the thickness direction of the optical electronic component 1, the direction from the base 3 to the cover 4 is referred to as the upper direction, and the opposite direction is referred to as the lower direction. Furthermore, one direction in the front-rear direction L1 is referred to as the front, and the other direction is referred to as the rear.

The base 3 is formed in a cylindrical shape with a bottom that opens upward. Specifically, the base 3 includes a lead frame 10, and a base portion 20 and a peripheral wall portion (frame portion according to the present invention) 25 that are integrally combined with the lead frame 10.

The lead frame 10 is a component that supports and fixes the optical element 2 and electrically connects it to external wiring (not shown), and mainly comprises a die pad portion 11 on which the optical element 2 is mounted, and multiple lead portions 12.

The die pad portion 11 is formed, for example, in a square or rectangular shape in a plan view. The optical element 2 is mounted on the die pad portion 11 by, for example, a conductive adhesive or solder bonding.
The lead portion 12 includes an inner lead portion 12a whose inner end is electrically connected to an electrode (not shown) of the optical element 2 via a metal wire 7, a bent portion 12b bent downward from the outer end of the inner lead portion 12a, and an outer lead portion 12c bent further from the lower end of the bent portion 12b and electrically connected to an external wiring (not shown). Thus, the outer lead portion 12c functions as an external connection terminal of the optical electronic component 1.

The lead portion 12, which has the inner lead portion 12a, the bent portion 12b, and the outer lead portion 12c, is arranged, for example, spaced apart in the front-rear direction L1 and the left-right direction L2 so as to surround the periphery of the die pad portion 11 (see FIG. 2). As a result, the outer end of the outer lead portion 12c is exposed to the outside while being spaced apart along the front-rear direction L1 and the left-right direction L2. However, the shape of the lead portion 12 is not limited to this case.

The lead frame 10 is formed by punching (pressing) or etching a thin metal plate (e.g., Cu alloy material, iron alloy material, etc.) that has excellent mechanical strength, electrical conductivity, heat transfer, corrosion resistance, etc.

The base portion 20 is, for example, an insulating substrate, and is embedded without any gaps below the die pad portion 11 and inside the bent portions 12b of the multiple lead portions 12. This ensures a high level of sealing between the base portion 20 and the lead portions 12, and blocks communication between the inside of the cavity 6 and the outside through the gap between the base portion 20 and the lead portions 12.
The base portion 20 is not limited to a specific material, but may be made of, for example, an inorganic material such as ceramic, a heat-resistant resin material, or a fiber-reinforced resin material in which a heat-resistant resin material is reinforced with reinforcing fibers. Furthermore, the base portion 20 may be integrally formed with the lead frame 10 by, for example, molding a synthetic resin.

The peripheral wall portion 25 is formed in a frame shape so as to surround the periphery of the optical element 2, and is integrally combined with the outer lead portions 12c so as to overlap from above while surrounding the bent portions 12b of the multiple lead frames 10 from the outside.
Specifically, the peripheral wall portion 25 is formed in a rectangular frame shape in a plan view, having a front wall 26 and a rear wall 27 arranged to face each other in the front-rear direction L1 with the optical element 2 therebetween, and a pair of side walls 28 arranged to face each other in the left-right direction L2 with the optical element 2 therebetween. The peripheral wall portion 25 is fitted tightly to the inside of the bent portion 12b and the outer lead portion 12c. This ensures a high level of sealing between the peripheral wall portion 25 and the lead portion 12, and communication between the inside of the cavity 6 and the outside through the gap between the peripheral wall portion 25 and the lead portion 12 is blocked.

The peripheral wall 25 is not limited to a specific material, but may be, for example, an inorganic material such as ceramic, a heat-resistant resin material, or a fiber-reinforced resin material in which a heat-resistant resin material is reinforced with reinforcing fibers. The peripheral wall 25 may be, for example, a member formed in advance into a frame shape separately from the lead frame 10, or may be a resin mold formed into a frame shape using a molding die.
The thickness (wall thickness) of the peripheral wall portion 25 is not particularly limited, but is, for example, within the range of 0.5 mm to 1.0 mm, and is formed to be thin. However, in each drawing, the thickness of the peripheral wall portion 25 is exaggerated for ease of viewing.

As described above, the base 3 of this embodiment includes a lead frame 10, a base portion 20 and a peripheral wall portion 25 that are integrally combined with the lead frame 10, and is formed as a bottomed cylinder that opens upward as a whole.

The lid 4 is formed in the shape of a thin plate that closes the opening of the base 3 from above. The lid 4 is formed in an outer shape that corresponds to the outer shape of the peripheral wall 25. Therefore, the lid 4 is formed in a rectangular shape in a plan view with the same length along the front-rear direction L1 and the same length along the left-right direction L2. Furthermore, in this embodiment, the lid 4 is an optically transparent glass substrate.

The lid 4 is arranged so that its entire outer peripheral edge overlaps the upper opening edge of the peripheral wall 25, i.e., the upper opening edges of the front wall 26, the rear wall 27, and the pair of side walls 28, via the thermosetting adhesive 5, and is firmly fixed by the hardening of the thermosetting adhesive 5. This ensures a high level of sealing between the lid 4 and the peripheral wall 25, and prevents communication between the inside of the cavity 6 and the outside through the gap between the lid 4 and the peripheral wall 25.

By combining the lid 4 integrally with the base 3 in this manner, the internal space surrounded by the lid 4, the peripheral wall 25, and the lead frame 10 functions as a hermetically sealed cavity 6. The optical element 2 is then placed in the hermetically sealed cavity 6. Therefore, the base 3 and the lid 4 function as a hollow package 8 that seals the optical element 2 in the cavity 6 formed therein.

The thermosetting adhesive 5 is not particularly limited, but for example, a general epoxy resin can be used. In this case, it is preferable to include a silica filler in the epoxy resin. The ratio is preferably, for example, 10 to 20% epoxy resin and 80 to 90% silica filler.
In this way, by including silica filler, the thermal conductivity of the thermosetting adhesive 5 can be increased, and when the optical element 2 sealed in the cavity 6 is, for example, a silicon semiconductor element, it becomes possible to match the thermal expansion coefficient of the silicon semiconductor element.

The thermosetting adhesive 5 is formed with a uniform thickness around the entire circumference of the upper open end of the peripheral wall portion 25. In this case, the thickness of the thermosetting adhesive 5 is, for example, a minimum thickness of 0.3 mm, and preferably 0.5 mm or more. In order to reduce the thickness of the optical electronic component 1 while suppressing warping of the lid portion 4, it is preferable that the minimum thickness of the thermosetting adhesive 5 is 0.3 mm, and in order to achieve even higher reliability, it is preferable that the thickness of the thermosetting adhesive 5 is 0.5 mm or more.

Either the base 3 or the lid 4 configured as described above has an air hole 30 formed therein, which connects the inside of the cavity 6 with the outside.
In this embodiment, the ventilation hole 30 is formed in the front wall 26 of the peripheral wall portion 25 that constitutes the base 3. The ventilation hole 30 is formed so as to penetrate the front wall 26 in the front-rear direction L1. Specifically, the ventilation hole 30 is formed in one place in a portion that is located in the center of the front wall 26 in the left-right direction L2 and is located near the upper end opening edge (see FIG. 2). However, the position where the ventilation hole 30 is formed is not limited to this case.
The ventilation holes 30 are formed during the formation of the peripheral wall portion 25 before the peripheral wall portion 25 is combined with the lead frame 10 .

1 and 3, the ventilation hole 30 is formed to penetrate the front wall 26 in the front-rear direction L1, and has an outer opening 31 that opens to the outside (front side) and an inner opening 32 that opens to the cavity 6 side. The length of the ventilation hole 30 corresponds to the wall thickness of the front wall 26. In other words, the length of the ventilation hole 30 in the front-rear direction L1 between the outer opening 31 and the inner opening 32 is set to 0.5 mm to 1.0 mm.
Furthermore, the ventilation hole 30 is formed to have a tapered cross section in which the diameter gradually decreases from the outer opening 31 toward the inner opening 32. In this case, the opening diameter of the outer opening 31 is formed to be within a range of 0.05 mm to 1.00 mm, for example. Among these, it is preferable that the opening diameter of the outer opening 31 is within a range of 0.1 mm to 0.4 mm.

The ventilation hole 30 formed as described above is hermetically sealed by the ultraviolet curing adhesive 40 filled in the ventilation hole 30 being cured.
The ultraviolet-curing adhesive 40 is discharged in a paste state into the air hole 30 from a discharge nozzle 51 of a dispenser 50 described later, filling the air hole 30, and then cured by irradiation with ultraviolet rays UV from an ultraviolet irradiator 55 described later.
As a result, communication between the inside of the cavity 6 and the outside through the ventilation hole 30 is blocked, and the inside of the cavity 6 is maintained in a sealed state.

It is preferable to use an ultraviolet curing adhesive 40 that has characteristics such as being non-toxic and non-mutagenic. In particular, it is preferable to use an ultraviolet curing adhesive 40 that has a base resin containing modified acrylate as its main component, and that contains at least one of an anaerobic catalyst or a thermosetting catalyst in this base resin. Specifically, it is preferable to use an anaerobic-imparting modified acrylate or a thermosetting-imparting modified acrylate as the ultraviolet curing adhesive 40.

When an anaerobic modified acrylate is used as the ultraviolet curing adhesive 40, it is possible to impart an anaerobic curing function in addition to ultraviolet curing. This makes it possible to cure parts that are difficult to irradiate with ultraviolet light by the anaerobic curing action. Note that in order to give the modified acrylate the anaerobic adhesive curing function, it is necessary for it to contain a dimethacrylate having an acryloyl group or a methacryloyl group.
When a thermosetting modified acrylate is used as the ultraviolet curing adhesive 40, a thermosetting function can be imparted in addition to ultraviolet curing. This makes it possible to cure even parts that are difficult to irradiate with ultraviolet light by the action of thermosetting.

The optimum viscosity of the ultraviolet curing adhesive 40 before curing varies depending on the size of the air vent 30, but it is possible to use a viscosity starting from 1 mPa·s (millipascal second) at room temperature (around 25°C), for example.
However, from the viewpoint of appropriately hermetically sealing the vent hole 30, the viscosity of the ultraviolet curing adhesive 40 is preferably within the range of 100 mPa·s to 100,000 mPa·s. Among these, the viscosity is preferably within the range of 500 mPa·s to 20,000 mPa·s, and more preferably within the range of 1,000 mPa·s to 15,000 Pa·s.

Furthermore, the ultraviolet curing adhesive 40 preferably contains a photopolymerization initiator (e.g., benzoin ethers or amines) that has a reaction wavelength in the range of 300 nm to 500 nm. Among them, it is even more preferable that the ultraviolet irradiator 55 contains a photopolymerization initiator that has a maximum absorption near a wavelength of 365 nm, which is the wavelength with the greatest amount of light when spot irradiated by a commonly used LED-UV irradiator.

(Method of manufacturing optical electronic components)
Next, a method for manufacturing the optical electronic component 1 configured as above will be described.
4, a step (mounting step according to the present invention) is performed in which the optical element 2 is mounted on a die pad portion 11 of a lead frame 10 (whose outer shape has been formed in advance by press working or the like) constituting the base 3. Specifically, the optical element 2 is mounted on the die pad portion 11 by, for example, a conductive adhesive or solder bonding, and an electrode (not shown) of the optical element 2 is electrically connected to the inner lead portion 12a by using a metal wire 7.

Next, a step of overlapping the base portion 3 or the cover portion 4 provided with the air vent 30 with the thermosetting adhesive 5 therebetween is performed (an overlapping step according to the present invention).
In this step, as shown in FIG. 5, the base portion 20 is combined with the lead frame 10 on which the optical element 2 is mounted, and the peripheral wall portion 25 in which the air holes 30 are formed in advance is combined with the lead frame 10.

In this case, as described above, the preformed base portion 20 and the peripheral wall portion 25 in which the ventilation holes 30 are formed may be combined integrally with the lead frame 10, or the base portion 20 and the peripheral wall portion 25 may be combined integrally with the lead frame 10 by molding synthetic resin using a molding die or the like. When the peripheral wall portion 25 is formed by molding, the ventilation holes 30 may be formed after molding.
As a result, a bottomed cylindrical base 3 can be obtained, which includes the lead frame 10, the base portion 20, and the peripheral wall portion 25 in which the ventilation holes 30 are formed.

6, a thermosetting adhesive 5 is applied to the entire periphery of the upper opening edge of the peripheral wall portion 25 with an even thickness, and then the lid portion 4 is placed over the upper opening of the base portion 3. This closes the cavity 6 in which the optical element 2 is disposed, and a temporary part 45 consisting of the base portion 3 and the lid portion 4 placed over each other with the thermosetting adhesive 5 interposed therebetween is completed.
In the stage of the temporary part 45 , the inside of the cavity 6 is in communication with the outside through the vent hole 30 .

Next, a process (first sealing process according to the present invention) is performed in which the thermosetting adhesive 5 is hardened by heating while reducing the pressure inside the cavity 6 to a predetermined vacuum level by discharging the gas (air) inside the cavity 6 to the outside through the air vent 30.
Specifically, the temporary part 45 shown in Fig. 6 is placed in a vacuum heating furnace (not shown). After placement, the vacuum heating furnace is gradually depressurized and the temperature is increased. This allows the thermosetting adhesive 5 to be heated while the gas in the cavity 6 is discharged through the air vent 30. Therefore, the cavity 6 can be depressurized to a predetermined vacuum level, and the depressurization can be utilized to suck the lid 4, which can act to press the lid 4 against the base 3 from above.

In particular, the cover 4 can be kept evenly pressed from above against the peripheral wall 25 that constitutes the base 3, so that the base 3 and the peripheral wall 25 can be precisely fixed together (glued and fixed) without misalignment by heating and hardening the thermosetting adhesive 5.

Next, while maintaining the degree of vacuum within the cavity 6, a step of filling the ventilation hole 30 with the ultraviolet curing adhesive 40 (filling step according to the present invention) is carried out.
In this process, a dispenser 50 filled with a paste-like ultraviolet curing adhesive 40 is used. Specifically, as shown in Fig. 7, the discharge nozzle 51 of the dispenser 50 is set to face the outer opening 31 of the vent hole 30 that opens in the front wall 26 of the peripheral wall portion 25 with a predetermined clearance H (setting process according to the present invention). In this case, the clearance H is, for example, about 50 μm to 100 μm. However, the clearance H is not limited to this case and may be changed as appropriate.

The discharge nozzle 51 is preferably formed in a cylindrical shape centered on the nozzle axis O1, with an outer diameter larger than the diameter of the outer opening 31 of the air hole 30 and an inner diameter smaller than the diameter of the outer opening 31. For example, the inner diameter of the discharge nozzle 51 is preferably 0.08 mm to 1 mm, and more preferably 0.1 mm to 0.4 mm.

Next, after setting the discharge nozzle 51, a process (discharge process according to the present invention) is performed in which the ultraviolet-curing adhesive 40 is discharged from the discharge nozzle 51 into the air vent 30 so that the ultraviolet-curing adhesive 40 contacts the entire circumference of the opening edge at the outer opening 31 of the air vent 30, thereby filling the air vent 30.
Specifically, as shown in FIG. 8, the discharge nozzle 51 is tilted downward so that the nozzle axis O1 of the discharge nozzle 51 is at an inclination angle θ in the range of 20 degrees to 70 degrees with respect to the center line O2 of the air hole 30 while discharging.

This allows the ultraviolet curing adhesive 40 to be discharged without waste and efficiently filled into the vent hole 30. This point will be described in detail.
When the ultraviolet curing adhesive 40 is discharged from the discharge nozzle 51 toward the inside of the ventilation hole 30, the ultraviolet curing adhesive 40 is discharged so as to come into contact with the entire periphery of the opening at the outer opening 31 of the ventilation hole 30, so that the ultraviolet curing adhesive 40 that comes into contact with the opening periphery of the outer opening 31 can be guided into the ventilation hole 30 by utilizing surface tension in addition to the force of discharge. Therefore, even if the opening size of the ventilation hole 30 is small, the ultraviolet curing adhesive 40 can be efficiently discharged and filled into the ventilation hole 30, improving workability.

In particular, the UV-curable adhesive 40 is discharged into the vent hole 30 while the discharge nozzle 51 is tilted downward at an inclination angle θ with respect to the center line O2 of the vent hole 30. Therefore, even if the UV-curable adhesive 40 discharged from the discharge nozzle 51 behaves in such a way that it drips from the discharge nozzle 51 due to the influence of gravity, for example, it is possible to make the dripping UV-curable adhesive 40 come into contact with the entire circumference of the opening periphery at the outer opening 31 of the vent hole 30. Therefore, even if it is influenced by gravity, the UV-curable adhesive 40 can be appropriately guided into the vent hole 30.

Furthermore, since the discharge nozzle 51 is set with a predetermined clearance H from the outer opening 31 of the ventilation hole 30, it is possible to prevent inconveniences such as the ultraviolet curing adhesive 40 unintentionally adhering to the periphery of the ventilation hole 30 before discharge. Therefore, it is easy to efficiently discharge the ultraviolet curing adhesive 40 only into the targeted interior of the ventilation hole 30 without waste.

As described above, after the filling of the ultraviolet curing adhesive 40 into the ventilation hole 30 is completed, a process (a second sealing process according to the present invention) is performed in which the ultraviolet curing adhesive 40 is irradiated with ultraviolet rays UV to harden it and hermetically seal the ventilation hole 30, as shown in Fig. 9. Specifically, an ultraviolet irradiator 55 is used to spot irradiate ultraviolet rays UV toward the ultraviolet curing adhesive 40 from the front of the front wall 26 of the peripheral wall portion 25. This makes it possible to harden the ultraviolet curing adhesive 40 inside the ventilation hole 30, and to hermetically seal the ventilation hole 30.
In particular, since the ultraviolet curing adhesive 40 is used, it can be cured in a short time (instantaneously) by irradiation with ultraviolet rays UV, unlike the case where, for example, a thermosetting adhesive 5 is used, etc. Therefore, it is possible to improve the airtight sealing property within the cavity 6, and to provide an optical electronic component 1 with improved moisture resistance and operational reliability.

1 and 2 manufactured as described above, the cavity 6 can be hermetically sealed with high reliability, resulting in a high-quality electronic component with improved operational reliability. Therefore, light can be made incident from the outside onto the optical element 2 in the cavity 6 through the optically transparent lid 4, and light can be made to exit from the optical element 2 in the cavity 6 to the outside through the lid 4, making the optical electronic component 1 suitable for use as, for example, an image sensor.
Furthermore, since the lid 4 can be pressed against the base 3 by utilizing the reduced pressure in the cavity 6 through the vent hole 30, a mechanism for pressurizing the lid 4 as in the conventional art is not required. Therefore, the manufacturing process can be simplified, and production efficiency can be improved and costs can be reduced.

Furthermore, since an anaerobic modified acrylate or a heat-curing modified acrylate can be used as the ultraviolet curing adhesive 40, in addition to curing by irradiation with ultraviolet rays UV, the curing of the ultraviolet curing adhesive 40 can be promoted by the effect of blocking oxygen due to the reduced pressure in the cavity 6 and the effect of heat curing.
Therefore, when the ultraviolet ray curing adhesive 40 filled in the ventilation hole 30 is irradiated with ultraviolet ray UV, even if there are some parts through which the ultraviolet ray UV has difficulty passing or which the ultraviolet ray UV has difficulty reaching, these parts can be appropriately cured. Therefore, the entire ultraviolet ray curing adhesive 40 can be reliably cured, and the airtight sealing property of the ventilation hole 30 can be further improved.

In addition, because the UV-curable adhesive 40 has a certain viscosity (within the range of 100 mPa·s to 100,000 mPa·s), when the UV-curable adhesive 40 is filled into the vent hole 30, it is possible to prevent the UV-curable adhesive 40 from flowing from the vent hole 30 into the cavity 6. This makes it possible to prevent problems such as the UV-curable adhesive 40 dripping or dripping into the cavity 6, eliminating any effects on the optical element 2 and making it easier to further improve operational reliability.

Furthermore, if the ultraviolet curing adhesive 40 contains a photopolymerization initiator with a reaction wavelength in the range of 300 nm to 500 nm, it is easy to avoid the influence of visible light (indoor scattered light), for example, when irradiating the ultraviolet curing adhesive 40 filled in the ventilation hole 30 with ultraviolet rays UV. In addition, by using a commonly used LED-UV irradiator as the ultraviolet irradiator 55 for spot irradiation, it is possible to effectively promote the curing of the ultraviolet curing adhesive 40 by utilizing the wavelength of 365 nm, which has the greatest amount of light. Therefore, production efficiency can be further improved, and the ultraviolet curing adhesive 40 can be easily cured in an even shorter time.

In addition, when using the ultraviolet curing adhesive 40, for example, a one-liquid type with a pot life of six months can be used, so strict deadline management is not required and workability is excellent. Furthermore, the ultraviolet curing adhesive 40 is reliable in terms of safety, durability, heat resistance, etc., and does not deteriorate easily, so it is easy to use and has excellent convenience.
Furthermore, the ultraviolet curing adhesive 40 containing a photopolymerization initiator having a maximum absorption near a wavelength of 365 nm is the most efficient in terms of ultraviolet curing, is inexpensive, and can be most preferably used from the viewpoint of resource conservation.

Furthermore, since the opening diameter of the outer opening 31 opening in the front wall 26 of the peripheral wall portion 25 is within the range of 0.05 mm to 1.00 mm, the ventilation hole 30 can be made very small, the ultraviolet curing adhesive 40 can be filled into the ventilation hole 30 in a short period of time, and the ultraviolet curing adhesive 40 can be easily filled into the ventilation hole 30 without any gaps.
In addition, since the ventilation hole 30 is formed with a tapered cross section in which the diameter gradually decreases toward the cavity 6 side, it is easy to fill the ventilation hole 30 with the ultraviolet curing adhesive 40 and to fill the ventilation hole 30 without leaving any gaps. Therefore, the airtight sealing of the ventilation hole 30 can be further improved.

Furthermore, the length of the ventilation hole 30 is within the range of 0.5 mm to 1.0 mm corresponding to the wall thickness of the peripheral wall portion 25, so that the irradiated ultraviolet rays UV can reach the entire ultraviolet curing adhesive 40 filled in the ventilation hole 30 appropriately. Therefore, the airtight sealing property of the ventilation hole 30 can be further improved.

(Modification)
In the above embodiment, the length of the ventilation hole 30 is within a range of 0.5 mm to 1.0 mm corresponding to the wall thickness of the peripheral wall portion 25, but is not limited to this case. The upper limit of the length of the ventilation hole 30 may be determined based on the film thickness curing performance of the ultraviolet curing adhesive 40, and the lower limit may be determined based on the adhesive strength between the material of the hollow package 8 and the ultraviolet curing adhesive 40. In the case of a typical ultraviolet curing adhesive 40, the film thickness curing performance value depends on the reachable limit of ultraviolet rays UV, so it can be said that 5 mm or less is preferable. Therefore, the length of the ventilation hole 30 is preferably 5 mm or less.

In this case, it is not necessary to fill the entire vent hole 30 with the ultraviolet curing adhesive 40, but it is sufficient to fill the ultraviolet curing adhesive 40 so that it is filled at least a certain distance from the outer opening 31. The certain distance must be at least 0.3 mm, for example, so that reliable curing is possible with irradiation of ultraviolet rays UV for a few seconds, and in order to obtain reliable airtight sealing of the vent hole 30 due to curing, and it is more preferable to secure 0.5 mm.

Furthermore, in the above embodiment, when the ultraviolet curing adhesive 40 is discharged from the discharge nozzle 51 into the air hole 30, the discharge nozzle 51 is tilted downward so that the nozzle axis O1 of the discharge nozzle 51 is at an inclination angle θ in the range of 20 degrees to 70 degrees with respect to the center line O2 of the air hole 30, but the discharge nozzle 51 may also be tilted upward in the opposite manner.
Even in this case, the same effect can be achieved, and even if the ultraviolet-curing adhesive 40 discharged from the discharge nozzle 51 behaves in such a way that it drips from the discharge nozzle 51 due to the influence of gravity, the ultraviolet-curing adhesive 40 can easily come into contact with the entire circumference of the opening edge at the outer opening 31 of the air vent 30, and can be properly guided into the air vent 30.

However, when the ultraviolet curing adhesive 40 is discharged from the discharge nozzle 51, as long as the ultraviolet curing adhesive 40 can be discharged so as to come into contact with the entire periphery of the opening at the outer opening 31 of the ventilation hole 30, it is not necessary to tilt the discharge nozzle 51.

For example, the ultraviolet-curing adhesive 40 may be discharged while the discharge nozzle 51 is positioned horizontally so that the nozzle axis O1 is parallel to the center line O2 of the air vent 30, and the discharge nozzle 51 may be moved vertically (in a direction along the opening surface of the outer opening 31) while discharging.
In this case, since the discharge nozzle 51 is slid while discharging the ultraviolet curing adhesive 40, even if the ultraviolet curing adhesive 40 behaves as if it drips from the discharge nozzle 51 due to the influence of gravity, it is possible to make contact with the entire periphery of the opening edge of the outer opening 31. Therefore, the same effect can be achieved.
In this case, the discharge nozzle 51 may be tilted downward or upward and further slid up and down.

In addition, in the above embodiment, the ventilation hole 30 is formed with a tapered cross section, but this is not limited to this case, and it may be formed, for example, in a straight shape. Furthermore, the straight ventilation hole 30 may be formed at an angle.

Furthermore, in the above embodiment, an example has been described in which one optical electronic component 1 is manufactured, but in an actual manufacturing process, it is considered that a large number (e.g., several hundred to several tens of thousands) of optical electronic components 1 are manufactured simultaneously in order to reduce costs, etc. Even in such a case, it is possible to employ the manufacturing method according to the present invention.
In this case, a lead frame assembly is prepared by connecting a plurality of lead frames 10, each including a die pad portion 11 corresponding to the number of optical electronic components 1, with, for example, a connecting frame. Then, a temporary component 45 is produced for each lead frame 10 based on the above-mentioned manufacturing method, and the lead frame assembly is then placed in a vacuum heating furnace to reduce pressure and heat it. Then, for each temporary component 45, an ultraviolet curing adhesive 40 is filled in the vent hole 30 and ultraviolet curing is performed. Finally, the lead frame assembly is cut to separate the plurality of optical electronic components 1 into smaller pieces, thereby making it possible to obtain a plurality of optical electronic components 1 at once.

Next, the optical electronic component 1 was actually manufactured based on the above embodiment, and the results of a confirmation test performed to confirm the filling operability of the ultraviolet curing adhesive 40 will be described.
In this confirmation test, optical electronic components 1 were manufactured in which the opening diameter of the outer opening 31 of the ventilation hole 30, the inner diameter of the discharge nozzle 51 of the dispenser 50, and the inclination angle θ of the discharge nozzle 51 relative to the center line O2 of the ventilation hole 30 were each changed, and the filling workability of the ultraviolet curing adhesive 40 for each optical electronic component 1 was confirmed.

In manufacturing each of the optical electronic components 1, the following conditions were common to all the components.
An anaerobic modified acrylate exhibiting an anaerobic curing function was used as the ultraviolet curing adhesive 40. Furthermore, the ultraviolet curing adhesive 40 had a viscosity of 10,000 mPa·s (milliPascal seconds) and contained a photopolymerization initiator having an absorption maximum at 365 nm.
The ultraviolet irradiator 55 was an LED-UV irradiator that irradiates ultraviolet rays UV with a wavelength of 365 nm, which has the greatest amount of light, and the ultraviolet curing adhesive 40 was spot-irradiated with ultraviolet rays UV.

(First confirmation test)
As a first confirmation test, when performing the filling process in the above-mentioned embodiment (a process of filling the ultraviolet curing adhesive 40 into the air vent 30 while maintaining the vacuum in the cavity 6), tests were conducted with the opening diameter of the outer opening 31 in the air vent 30 in three different ranges: within the range of 0.05 mm to 0.1 mm, within the range of 0.1 mm to 0.4 mm, and within the range of 0.4 mm to 1.0 mm.
For each of the three modes, the ultraviolet curing adhesive 40 was filled using the discharge nozzle 51 of the dispenser 50 having an inner diameter of 0.08 mm to 0.1 mm, 0.1 mm to 0.4 mm, and 0.4 mm to 1.0 mm.

The results are shown below.
(1) In the embodiment where the opening diameter of the outer opening 31 of the ventilation hole 30 is 0.05 mm to 0.1 mm. When the inner diameter of the discharge nozzle 51 is 0.08 mm to 0.1 mm, the ultraviolet curable adhesive 40 can be filled into the ventilation hole 30 in a short time, and the filling process can be performed well.
When the inner diameter of the discharge nozzle 51 was 0.1 mm to 0.4 mm, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. In particular, when the inner diameter of the discharge nozzle 51 was 0.1 mm, the ultraviolet curing adhesive 40 could be filled in a short time, and the filling process could be carried out well.
When the inner diameter of the discharge nozzle 51 is 0.4 mm to 1.0 mm, the ultraviolet curing adhesive 40 can be filled into the air hole 30 and the filling process can be carried out properly, but the ultraviolet curing adhesive 40 tends to adhere to the periphery of the air hole 30 and discharge marks tend to remain.

(2) In the case where the diameter of the outer opening 31 of the vent hole 30 is 0.1 mm to 0.4 mm When the inner diameter of the discharge nozzle 51 is 0.08 mm to 0.1 mm, the ultraviolet curable adhesive 40 can be filled into the vent hole 30, and the filling process can be carried out well. Note that the filling time was slightly longer than when the diameter of the outer opening 31 is 0.05 mm to 0.1 mm.
When the inner diameter of the discharge nozzle 51 was 0.1 mm to 0.4 mm, the ultraviolet curing adhesive 40 could be filled into the vent hole 30 in a short time, and the filling process could be carried out satisfactorily.
When the inner diameter of the discharge nozzle 51 is 0.4 mm to 1.0 mm, the ultraviolet curing adhesive 40 can be filled into the air hole 30 and the filling process can be carried out properly, but the ultraviolet curing adhesive 40 tends to adhere to the periphery of the air hole 30 and discharge marks tend to remain.

(3) In the case where the diameter of the outer opening 31 of the vent hole 30 is 0.4 mm to 1.0 mm When the inner diameter of the discharge nozzle 51 is 0.08 mm to 0.1 mm, the ultraviolet curable adhesive 40 can be filled into the vent hole 30, and the filling process can be carried out well. Note that the filling time was slightly longer than when the diameter of the outer opening 31 is 0.1 mm to 0.4 mm.
When the inner diameter of the discharge nozzle 51 was 0.1 mm to 0.4 mm, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out satisfactorily.
When the inner diameter of the discharge nozzle 51 was 0.4 mm to 1.4 mm, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out satisfactorily.

From the above, the results of the first confirmation test confirmed that when the inner diameter of the discharge nozzle 51 is equal to or smaller than the opening diameter of the ventilation hole 30, the ultraviolet curing adhesive 40 can be filled smoothly into the ventilation hole 30 in a short time, and the filling process can be carried out smoothly.
Therefore, when the opening diameter of the outer opening 31 in the ventilation hole 30 is within the range of 0.05 mm to 1.0 mm, it has been confirmed that it is preferable to use a discharge nozzle 51 having an inner diameter within the range of 0.08 mm to 1.0 mm, and it is even more preferable to use a discharge nozzle 51 having an inner diameter within the range of 0.1 mm to 0.4 mm.

After the first confirmation test, the ultraviolet curing adhesive 40 was spot-irradiated with ultraviolet light (minimum curing time: 2 seconds) using an LED-UV irradiator for all optical electronic components 1, and the ultraviolet curing adhesive 40 was cured to complete the optical electronic components 1. After that, a pressure resistance test was performed for 200 hours on the optical electronic components 1, applying a pressure of 2 atmospheres under high temperature and humidity, and a reliability test was performed to confirm the function of the optical electronic components 1 after 200 hours. This reliability test corresponds to a test after 2000 hours in a high temperature and humidity (85%, 85 degrees) environment. As a result, it was confirmed that all optical electronic components 1 operated well, and it was confirmed that the present invention can perform airtight sealing with high reliability and can actually lead to the manufacture of optical electronic components 1 with excellent moisture resistance, etc.

(Second Confirmation Test)
As a second confirmation test, when performing the filling process in the above-mentioned embodiment, tests were conducted in three configurations in which the opening diameter of the outer opening 31 in the ventilation hole 30 was in the range of 0.05 mm to 0.1 mm, in the range of 0.1 mm to 0.4 mm, and in the range of 0.4 mm to 1.0 mm.
For each of the three aspects, the ultraviolet curable adhesive 40 was filled using a discharge nozzle 51 of the dispenser 50 with an inclination angle θ (downward inclination angle θ) of less than 20 degrees, a discharge nozzle 51 of 20 degrees to 30 degrees, a discharge nozzle 51 of 30 degrees to 60 degrees, or a discharge nozzle 51 of 60 degrees to 70 degrees.

The results are shown below.
(1) In the embodiment where the opening diameter of the outer opening 31 of the ventilation hole 30 is 0.05 mm to 0.1 mm When the inclination angle θ of the discharge nozzle 51 is less than 20 degrees, the ultraviolet curable adhesive 40 can be filled into the ventilation hole 30, but a small amount of the ultraviolet curable adhesive 40 leaks out of the ventilation hole 30.
When the inclination angle θ of the discharge nozzle 51 was between 20 degrees and 30 degrees, the ultraviolet curing adhesive 40 could be filled into the air hole 30, and the filling process could be carried out appropriately.
When the inclination angle θ of the discharge nozzle 51 was between 30 degrees and 60 degrees, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. Furthermore, the filling time could be shortened compared to when the inclination angle θ was between 20 degrees and 30 degrees.
When the inclination angle θ of the discharge nozzle 51 was between 60 degrees and 70 degrees, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. Furthermore, the filling time was equivalent to that when the inclination angle θ was between 20 degrees and 30 degrees.

(2) In the embodiment where the opening diameter of the outer opening 31 of the ventilation hole 30 is 0.1 mm to 0.4 mm When the inclination angle θ of the discharge nozzle 51 is less than 20 degrees, the ultraviolet curable adhesive 40 can be filled into the ventilation hole 30, but a small amount of the ultraviolet curable adhesive 40 leaks out of the ventilation hole 30.
When the inclination angle θ of the discharge nozzle 51 was between 20 degrees and 30 degrees, the ultraviolet curing adhesive 40 could be filled into the air hole 30, and the filling process could be carried out appropriately.
When the inclination angle θ of the discharge nozzle 51 was between 30 degrees and 60 degrees, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. Furthermore, the filling time was shorter than when the inclination angle θ was between 20 degrees and 30 degrees. In particular, the filling time was the shortest in the entire second confirmation test.
When the inclination angle θ of the discharge nozzle 51 was between 60 degrees and 70 degrees, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. Furthermore, the filling time was equivalent to that when the inclination angle θ was between 20 degrees and 30 degrees.

(3) In the embodiment where the opening diameter of the outer opening 31 in the ventilation hole 30 is 0.4 mm to 1.0 mm When the inclination angle θ of the discharge nozzle 51 is less than 20 degrees, the ultraviolet curing adhesive 40 can be filled into the ventilation hole 30, but a small amount of the ultraviolet curing adhesive 40 leaks out of the ventilation hole 30.
When the inclination angle θ of the discharge nozzle 51 was between 20 degrees and 30 degrees, the ultraviolet curing adhesive 40 could be filled into the air hole 30, and the filling process could be carried out appropriately.
When the inclination angle θ of the discharge nozzle 51 was between 30 degrees and 60 degrees, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. Furthermore, the filling time was equivalent to that when the inclination angle θ was between 20 degrees and 30 degrees.
When the inclination angle θ of the discharge nozzle 51 was between 60 degrees and 70 degrees, the ultraviolet curing adhesive 40 could be filled into the vent hole 30, and the filling process could be carried out appropriately. Furthermore, the filling time was equivalent to that when the inclination angle θ was between 20 degrees and 30 degrees.

From the above, the results of the second confirmation test confirmed that it is effective to incline the nozzle axis O1 of the discharge nozzle 51 with respect to the center line O2 of the air vent 30 at an inclination angle θ in the range of 20 degrees to 70 degrees, and that it is preferable to set the inclination angle in the range of 30 degrees to 60 degrees.
After the second confirmation test, the reliability test described above was carried out, and it was confirmed that all the optical electronic components 1 functioned satisfactorily.

Although the embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. The embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. Examples of the embodiments and their variations include those that can be easily imagined by a person skilled in the art, those that are substantially the same, and those that are within the scope of equivalents.

For example, in the above embodiment, as shown in Fig. 10, the cavity 6 may be filled with an inert gas G such as nitrogen or a rare gas. In this case, for example, a vacuum heating furnace is used to reduce the pressure inside the cavity 6, and then a process of replacing the pressure with the inert gas G is performed to fill the cavity 6 with the inert gas G. Thereafter, an ultraviolet curing adhesive 40 is filled inside the ventilation hole 30, and the adhesive is cured by irradiation with ultraviolet rays UV, thereby hermetically sealing the ventilation hole 30.
In the case of such a configuration, it is possible to further improve the moisture resistance, corrosion resistance, etc., which can contribute to improving the operational reliability.

Furthermore, in the above embodiment, the ventilation hole 30 is formed so as to penetrate the front wall 26 of the peripheral wall portion 25 in the front-to-rear direction L1. However, as shown in Figures 11 and 12, for example, a ventilation hole 60 may be formed in a recessed shape at the upper opening end of the front wall 26 so as to penetrate the front wall 26 in the front-to-rear direction L1 and open further upward.
Even in this case, the same effects can be achieved.

Furthermore, in the above embodiment, an example was described in which the ventilation hole 30 was formed in the front wall 26 of the peripheral wall portion 25 that constitutes the base 3, but this is not limited to this case, and it is also acceptable to have an electronic component 70 in which the ventilation hole 30 is formed in the lid portion 4, as shown in Figure 13, for example.
In this case, it is preferable that the electronic element sealed in the cavity 6 is not an optical element but an electronic element 71 such as a semiconductor chip. Furthermore, in order to form the air hole 30 in the lid 4, the lid 4 may be made of, for example, a synthetic resin substrate having a certain rigidity rather than an optically transparent material such as glass.
The electronic component 70 configured in this manner can achieve the same effects as those of the above embodiment. Even when the vent hole 30 is formed in the lid portion 4, it is preferable to incline the discharge nozzle 51 in the front-rear direction L1 or the left-right direction L2.

Furthermore, in the above embodiment, the bottomed cylindrical base 3 is formed by the lead frame 10, the base portion 20, and the peripheral wall portion 25, but the lead frame 10 is not a required component and may not be included.

14 , an electronic component 80 may be provided that includes a flat base 81 and a cylindrical closed-top lid 83 having a peripheral wall 25 and a top wall 82, with ventilation holes 30 formed in the peripheral wall 25 that constitutes the lid 83. In this case, for example, an extraction electrode 84 or the like may be formed on the base 81, and the extraction electrode 84 and the electronic element 71 may be electrically connected by a metal wire 7.
The lid 83 is fixed to the base 81 via a thermosetting adhesive 5. Furthermore, the base 81 and the lid 83 function as a hollow package 8.
The electronic component 80 configured in this manner can achieve the same effects as those of the above embodiment.

G: inert gas O1: nozzle axis of discharge nozzle O2: center line of vent hole 1: optical electronic component (electronic component)
2...Optical element (electronic element)
3, 81: base portion 4, 83: lid portion 5: thermosetting adhesive 6: cavity 25: peripheral wall portion (frame portion)
30, 60: Ventilation hole 31: Outer opening of ventilation hole 32: Inner opening of ventilation hole 40: UV-curable adhesive 51: Discharge nozzle 70, 80: Electronic component 71: Electronic element

Claims (10)

An electronic element;
a base on which the electronic element is mounted;
a lid portion bonded to the base portion via a thermosetting adhesive and hermetically sealing the electronic element in the cavity;
A vent hole that communicates the inside of the cavity with the outside is formed in the base or the lid,
the ventilation hole is hermetically sealed by hardening an ultraviolet-curing adhesive filled in the ventilation hole ;
The electronic component is characterized in that the ultraviolet curing adhesive contains at least one of an anaerobic catalyst and a thermosetting catalyst in a base resin having a modified acrylate . 2. The electronic component according to claim 1 ,
The ultraviolet curing adhesive has a viscosity before curing in the range of 100 mPa·s (millipascal seconds) to 100,000 mPa·s. The electronic component according to claim 1 or 2 ,
The ultraviolet curing adhesive contains a photopolymerization initiator having a reaction wavelength in the range of 300 nm to 500 nm. The electronic component according to any one of claims 1 to 3 ,
The vent hole is formed so that the opening diameter of the outer opening that opens to the outside is within a range of 0.05 mm to 1.0 mm. The electronic component according to any one of claims 1 to 4 ,
The vent hole has a length between an outer opening that opens to the outside and an inner opening that opens to the cavity side of 5 mm or less. The electronic component according to any one of claims 1 to 5 ,
The vent hole is formed in a cross-sectional tapered shape such that the diameter gradually decreases from an outer opening that opens to the outside toward an inner opening that opens to the cavity. The electronic component according to any one of claims 1 to 6 ,
The cavity is filled with an inert gas. The electronic component according to any one of claims 1 to 7 ,
the base portion has a frame portion surrounding the periphery of the electronic element,
The ventilation hole is formed in the frame portion,
the lid is formed of an optically transparent material;
The electronic component, wherein the electronic element is an optical element. A method for manufacturing an electronic component including an electronic element, a base on which the electronic element is mounted, and a lid joined to the base via a thermosetting adhesive and hermetically sealing the electronic element in a cavity, the method comprising the steps of:
a mounting step of mounting the electronic element on the base;
a lamination step of laminating the base portion or the lid portion, each having an air hole communicating between the inside of the cavity and the outside, with the thermosetting adhesive therebetween;
a first sealing step of curing the thermosetting adhesive by heating while reducing the pressure in the cavity to a predetermined vacuum level by discharging gas in the cavity to the outside through the vent hole;
a filling step of filling the vent hole with an ultraviolet curing adhesive while maintaining the vacuum in the cavity;
a second sealing step of curing the ultraviolet curing adhesive filled in the air hole by irradiating the adhesive with ultraviolet light to hermetically seal the air hole ;
The filling step includes:
a setting step of setting a discharge nozzle for discharging the ultraviolet curing adhesive so as to face an outer opening of the vent hole that opens to the outside with a predetermined clearance therebetween;
and a discharge step of discharging the ultraviolet curing adhesive into the air hole so that the ultraviolet curing adhesive contacts the entire periphery of the outer opening, thereby filling the air hole,
a nozzle axis line of the discharge nozzle is inclined at an angle of 20 degrees to 70 degrees with respect to a center line of the air hole during the discharge step . 10. The method for producing an electronic component according to claim 9 ,
In the discharging step, the discharge nozzle is moved along an opening surface of the outer opening while discharging the ultraviolet curable adhesive.

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