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JP2870993B2 - Manufacturing method of superconducting wiring - Google Patents
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JP2870993B2 - Manufacturing method of superconducting wiring - Google Patents

Manufacturing method of superconducting wiring

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Publication number
JP2870993B2
JP2870993B2 JP2150816A JP15081690A JP2870993B2 JP 2870993 B2 JP2870993 B2 JP 2870993B2 JP 2150816 A JP2150816 A JP 2150816A JP 15081690 A JP15081690 A JP 15081690A JP 2870993 B2 JP2870993 B2 JP 2870993B2
Authority
JP
Japan
Prior art keywords
temperature
superconducting
wiring
pattern
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2150816A
Other languages
Japanese (ja)
Other versions
JPH0442584A (en
Inventor
一典 山中
拓也 渦巻
尋規 後藤
厚志 田中
伸男 亀原
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Fujitsu Ltd
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Fujitsu Ltd
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Filing date
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Priority to JP2150816A priority Critical patent/JP2870993B2/en
Publication of JPH0442584A publication Critical patent/JPH0442584A/en
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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

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  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Description

【発明の詳細な説明】 〔概要〕 超伝導配線の製造方法に関し、 超伝導臨界温度の高い酸化物超伝導体よりなる微少線
幅の配線パターンを形成することを目的とし、 Bi−Pb−Sr−Ca−Cu−O系酸化物高温超伝導体成分を
被処理基板上に堆積して配線パターンを形成した後、該
基板を該Bi−Pb−Sr−Ca−Cu−O系酸化物高温超伝導体
成分からなるダミーパターンを形成した基板に対向近接
させて焼成炉中に設置し、ダミーパターンの温度を少な
くとも配線パターンの温度より高く保持して焼成するよ
うに超伝導配線の製造方法を構成する。
DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a method for manufacturing a superconducting wiring, which aims to form a wiring pattern having a fine line width made of an oxide superconductor having a high superconducting critical temperature, and to form a Bi-Pb-Sr After depositing a Ca-Cu-O-based oxide high-temperature superconductor component on a substrate to be processed to form a wiring pattern, the substrate is separated from the Bi-Pb-Sr-Ca-Cu-O-based oxide high-temperature superconductor. A superconducting wiring manufacturing method is configured such that a dummy pattern composed of a conductor component is placed in a baking furnace so as to be opposed to and close to the substrate, and the dummy pattern is fired while maintaining the temperature of the dummy pattern at least higher than the temperature of the wiring pattern. I do.

〔産業上の利用分野〕[Industrial applications]

本発明は超伝導臨界温度の高い酸化物超伝導体よりな
り微少線幅の配線パターンの製造方法に関する。
The present invention relates to a method for manufacturing a wiring pattern having a fine line width and made of an oxide superconductor having a high superconducting critical temperature.

幾種類の金属,合金,金属間化合物,窒化物,酸化物
などについて超伝導現象を示すことは昔より知られてい
たが、金属元素については超伝導臨界温度(略称Tc)は
10K未満に止まり、また金属間化合物についてはNb3Geの
23.5Kが最高であった。
It has been known for a long time that superconducting phenomena are exhibited for several kinds of metals, alloys, intermetallic compounds, nitrides, oxides, etc., but the superconducting critical temperature (abbreviation T c ) for metallic elements is
Less than 10K, and Nb 3 Ge
23.5K was the best.

然し、1986年にBednorzとMullerによりランタン・バ
リウム・銅・酸素(La−Ba−Cu−O)系の酸化物セラミ
ックスについて高温超伝導現象が発見されて以来、各所
でTcの高い酸化物超伝導体の開発研究と、これを用いた
デバイスの実用化研究が行われている。
However, since Bednorz and Muller discovered high-temperature superconductivity in lanthanum-barium-copper-oxygen (La-Ba-Cu-O) -based oxide ceramics in 1986, oxide superconductors with high Tc have been found in various places. Conducting research on the development of conductors and research on the practical application of devices using them.

すなわち、情報処理装置、特に高速化を必要とする電
算機では、これら低温で効率よく動作する電子素子を搭
載する基板の回路配線を高温超伝導体で構成すれば極め
て効果的である。
That is, in an information processing apparatus, particularly in a computer that requires high speed, it is extremely effective to configure the circuit wiring of the substrate on which these electronic elements that operate efficiently at low temperatures with high-temperature superconductors.

〔従来の技術〕[Conventional technology]

酸化物系の高温超伝導体には今まで各種の組成のもの
が発見されている。
Various compositions of oxide-based high-temperature superconductors have been discovered so far.

すなわち、イットリウム・バリウム・銅・酸素(Y−
Ba−Cu−O)系およびYを含む希土類元素−Ba−Cu−O
系についてTcが約90Kを示す酸化物超伝導体が発見され
た。
That is, yttrium / barium / copper / oxygen (Y-
Ba-Cu-O) system and rare earth element containing Y-Ba-Cu-O
An oxide superconductor with a Tc of about 90 K for the system was discovered.

その後、100K以上のTcを示すBi−Sr−Ca−Cu−O系や
125KのTcを示すTl−Ba−Ca−Cu−O系などが発表されて
いる。
Then, Bi-Sr-Ca-Cu-O system showing Tc of 100K or more,
A Tl-Ba-Ca-Cu-O system showing a Tc of 125K has been published.

こゝで、マグネシア,アルミナなどの被処理基板上に
酸化物超伝導体よりなる導体線路を形成する方法として
はマスク蒸着あるいはスパッタにより酸化物超伝導体よ
りなる薄膜パターンを形成した後に焼成して結晶化する
ことにより超伝導相に変える方法が挙げられる。
Here, as a method of forming a conductor line made of an oxide superconductor on a substrate to be processed, such as magnesia or alumina, a thin film pattern made of an oxide superconductor is formed by mask evaporation or sputtering and then fired. There is a method of changing to a superconducting phase by crystallization.

また、超伝導セラミックスを粉末を用いて導電体ペー
ストを形成し、これをスクリーン印刷して微細パターン
を形成した後、これを焼成して結晶化し、超伝導相に変
える方法があ挙げられる。
In addition, there is a method in which a conductor paste is formed by using powder of a superconducting ceramic, which is screen-printed to form a fine pattern, which is then fired and crystallized to change into a superconducting phase.

発明者等は後者の方法による導体配線を形成する研究
でバルク試料の超伝導セラミックスおよびペーストを焼
成する方法で100K以上の値を得ている。
The inventors have obtained a value of 100 K or more by a method of firing superconducting ceramics and paste of a bulk sample in a study of forming a conductor wiring by the latter method.

然し、仔細に検討してみるとTcのみかけ上の値は配線
幅を依存することが判った。
However, a closer examination revealed that the apparent value of Tc depends on the wiring width.

すなわち、配線幅が狭くなるに従ってTcが低下するも
のゝ、線幅が1.0mmまでは100K以上のTcを示すが、これ
以下の線幅ではTcは急激に低温側へ移行する。
That is, those T c according to the wiring width is reduced is reducedゝ, although the line width of up to 1.0mm shows a more T c 100K, the T c at which a line width less than rapidly transitions to a low.

一方、情報処理装置などで、電子部品を搭載する回路
基板は高密度実装が必要であり、微細な線幅まではTc
液体窒素の温度(77 K)以上である必要がある。
On the other hand, a circuit board on which electronic components are mounted in an information processing device or the like requires high-density mounting, and Tc must be equal to or higher than the temperature of liquid nitrogen (77 K) up to a fine line width.

然し、100 K以上のTc相をもつBi−Pb−Sr−Ca−Cu−
O膜について、従来の焼成法では配線幅が狭くなるに従
って特性の劣化が生じ、この対策が必要であった。
However, Bi-Pb-Sr-Ca -Cu- with more than 100 K of T c phase
With respect to the O film, in the conventional baking method, the characteristics deteriorate as the wiring width becomes narrower, and this measure is required.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

超伝導セラミックスを用いて作った導体ペーストをス
クリーン印刷し、これを焼成する方法でも100 K以上のT
cを示す超伝導体配線を形成することができるが、線幅
が約1.0mm以下になるとTcが急激に低下し、液体窒素(N
2)の温度(77 K)でも超伝導状態を示さなくなる。
Screen printing of a conductive paste made using superconducting ceramics and firing it also requires a T of 100 K or more.
A superconductor wiring showing c can be formed, but when the line width becomes about 1.0 mm or less, T c drops sharply, and liquid nitrogen (N
Even at the temperature of 2 ) (77 K), it does not show a superconducting state.

そこで、この問題の解決が課題である。 Therefore, solving this problem is an issue.

〔課題を解決するための手段〕[Means for solving the problem]

上記の課題は、Bi−Pb−Sr−Ca−Cu−O系酸化物高温
超伝導体成分を被処理基板上に堆積して配線パターンを
形成した後、該基板を該Bi−Pb−Sr−Ca−Cu−O系酸化
物高温超伝導体成分からなるダミーパターンを形成した
基板に対向近接させて焼成炉中に設置し、ダミーパター
ンの温度を少なくとも配線パターンの温度より高く保持
して焼成するように構成された超伝導配線の製造方法に
よって解決することができる。
The above problem is solved by depositing a Bi-Pb-Sr-Ca-Cu-O-based oxide high-temperature superconductor component on a substrate to be processed to form a wiring pattern, and then forming the substrate on the Bi-Pb-Sr- It is placed in a firing furnace so as to be opposed to and close to a substrate on which a dummy pattern made of a Ca-Cu-O-based oxide high-temperature superconductor component is formed, and is fired while maintaining the temperature of the dummy pattern at least higher than the temperature of the wiring pattern. The problem can be solved by the manufacturing method of the superconducting wiring configured as described above.

〔作用〕[Action]

超伝導成分を堆積し、焼成して得た酸化物超伝導体の
Tcが配線幅の低下と共に急激に低温側に移行する理由に
ついて発明者等は超伝導体を構成する成分の内、特に蒸
気圧の高い成分の蒸発による組成比のずれによると考え
ている。
Oxide superconductor obtained by depositing and firing superconducting components
The inventors believe that the reason why Tc rapidly shifts to the low temperature side as the wiring width decreases is due to a shift in the composition ratio due to evaporation of a component having a high vapor pressure, among components constituting the superconductor.

すなわち、発明者等が実用化研究を進めているBi−Pb
−Sr−Ca−Cu−O系については、蒸気圧が高く、また特
性に著しい影響を及ぼす成分はPbOであって、温度と蒸
気圧の関係を示すと第1表のようになる。
That is, Bi-Pb for which the inventors are conducting research for practical use
In the -Sr-Ca-Cu-O system, the component having a high vapor pressure and having a significant effect on the characteristics is PbO, and the relationship between temperature and vapor pressure is shown in Table 1.

そして、焼成により結晶化して超伝導相とする温度は
850℃前後であることから、PbOの蒸気圧は高く、この過
程で蒸発が容易に起こり組成ずれが起るのである。
The temperature at which it is crystallized by firing to become a superconducting phase is
Since the temperature is around 850 ° C., the vapor pressure of PbO is high, and in this process, evaporation easily occurs and a composition deviation occurs.

また、線幅が狭くなるに従って組成ずれが容易に起こ
りTcが急激に低下する理由については、線幅が狭くなる
のに従って単位体積当たりの露出面積が大きくなり、従
ってPbOの蒸発量が大きいことゝ、自己を含め周囲より
の蒸発によるPbOの分圧が低いため、成分の蒸発が抑制
されないためと考えた。
In addition, the reason why the composition deviation easily occurs as the line width decreases and the Tc sharply decreases is that the exposed area per unit volume increases as the line width decreases, and therefore the evaporation amount of PbO is large. (4) It was thought that the partial pressure of PbO due to evaporation from the surroundings including itself was low, so that the evaporation of components was not suppressed.

そこで、本発明は成分の蒸発を防ぐ方法として第1図
の原理図に示すように配線パターン1を印刷した基板2
に対向してダミーパターン3を印刷した基板4を配置し
て焼成を行うものである。
Accordingly, the present invention provides a method for preventing evaporation of components, as shown in the principle diagram of FIG.
The substrate 4 on which the dummy pattern 3 is printed is disposed so as to face the substrate and is baked.

こゝで、配線パターン1とダミーパターン3とはなる
べく近接させることが必要である。
Here, it is necessary to make the wiring pattern 1 and the dummy pattern 3 as close as possible.

このようにして焼成を行うと、ダミーパターンから盛
んに行われるPbOの蒸発によって配線パターン1からのP
bOの蒸発が抑制されるのでTcの高い微細配線パターンを
作ることができる。
When baking is performed in this manner, the evaporation of PbO from the dummy pattern causes the PbO from the wiring pattern 1 to evaporate.
Since the evaporation of bO is suppressed, a fine wiring pattern having a high Tc can be formed.

なお、印刷した超伝導パターンを焼成する場合に、結
晶粒成長のため、焼成予定温度よりもPbOの蒸発が盛ん
に起こらない程度に少し高くして短時間焼成して後、元
に戻して焼成すると、結晶粒界に隙間が少なく、膜の緻
密化が促進れさた超伝導配線を作ることができる。
When firing the printed superconducting pattern, in order to grow crystal grains, bake for a short period of time so that the evaporation of PbO does not actively occur, and then return to the original state and fire Then, a superconducting wiring in which a gap is small in a crystal grain boundary and densification of a film is promoted can be formed.

本発明はこのようにダミーパターンを近接させて焼成
を行うことにより、蒸気圧の高い成分特にPbOの蒸発を
抑制することができ、1mm以下の線幅の配線に対しても1
mm以上の場合と同じようなTcをもつ超伝導体線路を形成
することができる。
The present invention can suppress evaporation of a component having a high vapor pressure, particularly PbO, by baking the dummy patterns in close proximity to each other, as well as for a wiring having a line width of 1 mm or less.
It is possible to form a superconductor line having a Tc similar to that of the case of mm or more.

〔実施例〕〔Example〕

実施例1:(配線パターンの形成と焼成炉) Bi2O3,PbO,SrCO3,CaCO3およびCuOの原料粉末を用意
し、Bi:Pb:Sr:Ca:Cuのモル比が0.7:0.3:1:1:1.8になる
ように混合し、混合した粉末を845℃で150時間焼成して
超伝導セラミックスを作った。
Example 1: (Formation of wiring pattern and firing furnace) Raw powders of Bi 2 O 3 , PbO, SrCO 3 , CaCO 3 and CuO were prepared, and the molar ratio of Bi: Pb: Sr: Ca: Cu was 0.7: 0.3. : 1: 1: 1.8, and the mixed powder was fired at 845 ° C. for 150 hours to produce a superconducting ceramic.

このセラミックスを乳鉢で粗粉砕した後、ボールミル
を用いて整粒した。
This ceramic was roughly pulverized in a mortar and then sized using a ball mill.

この粉末にテルピネオールを粘性調整剤として加え、
アセトンを溶剤として混練した後、乾燥させてアセトン
を除き、ベンゼンを混合した後、乾燥させて粘度調整を
行い、超伝導ペーストを作成した。
Terpineol is added to this powder as a viscosity modifier,
After kneading with acetone as a solvent, the mixture was dried to remove acetone, mixed with benzene, dried and adjusted for viscosity to prepare a superconducting paste.

このペーストを用い、15mm角で厚さが0.5mmのマグネ
シア(MgO)単結晶基板を複数個用意し、この上に、線
幅が0.5mmで長さが10mmの導体線路と、10mm角のダミー
ターンを別々にスクリーン印刷して乾燥した。
Using this paste, a plurality of magnesia (MgO) single crystal substrates with a thickness of 0.5 mm and a thickness of 0.5 mm are prepared, on which a conductor line with a line width of 0.5 mm and a length of 10 mm and a dummy with a 10 mm square are placed. The turns were screen printed separately and dried.

次に、第3図に示すような焼成炉を用意した。 Next, a firing furnace as shown in FIG. 3 was prepared.

すなわち、石英ガラス製のフレーム7に熱源(ヒー
タ)5,6を背後に備えたアルミナ・セラミック板8,9を挿
着した後、MgO製スペーサ10を用いてセラミック板8,9の
上に同図に示すように基板2,4を対向させて配置した。
That is, after alumina ceramic plates 8 and 9 having heat sources (heaters) 5 and 6 behind them are inserted into a quartz glass frame 7, the alumina plates 10 and 9 are placed on the ceramic plates 8 and 9 using MgO spacers 10. As shown in the figure, the substrates 2 and 4 were arranged facing each other.

このようにすることにより配線パターン1とダミーパ
ターンとの間隔を0.5mmに保った。
By doing so, the distance between the wiring pattern 1 and the dummy pattern was kept at 0.5 mm.

実施例2: 実施例1で記したように、線幅が0.5mm,厚さが30μm,
長さが10mmの導体線路を印刷したMgO基板二枚を第3図
に示した焼成炉に装着し、0.5mmの間隔をおいて対向さ
せ、下部の導体線路をダミーパターンとした。
Example 2: As described in Example 1, the line width was 0.5 mm, the thickness was 30 μm,
Two MgO substrates on which conductor lines each having a length of 10 mm were printed were mounted on the firing furnace shown in FIG. 3 and were opposed to each other with an interval of 0.5 mm, and the lower conductor lines were used as dummy patterns.

そして、第1図のように大気中で熱源5,6に通電し、
両者を860℃で10分間加熱した後、上部の基板2の温度
を840℃に下げ、一方、下部の基板4を温度は850℃にし
た状態で6時間焼成して超伝導相を変え、上部の基板2
の導体線路について抵抗率の温度依存性を測定した。
Then, as shown in FIG. 1, the heat sources 5 and 6 are energized in the atmosphere,
After heating both at 860 ° C. for 10 minutes, the temperature of the upper substrate 2 was lowered to 840 ° C., while the lower substrate 4 was baked at 850 ° C. for 6 hours to change the superconducting phase. Substrate 2
The temperature dependence of the resistivity was measured for the conductor lines of FIG.

実施例3: 線幅が0.5mm,厚さが30μm,長さが10mmの導体線路を印
刷したMgO基板を上に、また、10mm角のベタパターンを
印加したMgO基板を下にして第3図に示した焼成炉に装
着し、0.5mmの間隔をおいて対向させ、下部の導体線路
をダミーパターンとした。
Example 3: FIG. 3 with the MgO substrate printed with a conductor line having a line width of 0.5 mm, a thickness of 30 μm, and a length of 10 mm on the top, and the MgO substrate applied with a solid pattern of 10 mm square on the bottom. Was mounted in a firing furnace as shown in Fig. 4 and opposed to each other with an interval of 0.5 mm, and the lower conductor line was used as a dummy pattern.

そして、大気中で熱源5,6に通電し、両者を共に860℃
で10分間加熱した後、両基板2,4の温度を840℃に下げ、
そのまゝの状態で6時間焼成して超伝導相に変え、上部
の基板2の導体線路について抵抗率の温度依存性を測定
した。
Then, heat is applied to the heat sources 5 and 6 in the atmosphere, and both are heated to 860 ° C.
After heating for 10 minutes, reduce the temperature of both substrates 2 and 4 to 840 ° C,
In that state, it was baked for 6 hours to change to the superconducting phase, and the temperature dependence of the resistivity of the conductor line of the upper substrate 2 was measured.

比較例1: 線幅が0.5mm,厚さが30μm,長さが10mmの導体線路を印
刷したMgO基板を上に、また、パターン印刷のないMgO基
板を下にして第3図に示した焼成炉に装着し、0.5mmの
間隔をおき、大気中で熱源5,6に通電し、両者を共に860
℃で10分間加熱した後、両基板2,4の温度を840℃に下
げ、そのまゝ状態で6時間焼成して超伝導相に変え、上
部の基板2の導体線路について抵抗率の温度依存性を測
定した。
Comparative Example 1: The firing shown in FIG. 3 with the MgO substrate on which a conductor line having a line width of 0.5 mm, a thickness of 30 μm, and a length of 10 mm was printed on the top and an MgO substrate without a pattern printed on the bottom. Attach to heat source 5 and 6 in the atmosphere at 0.5mm interval,
After heating at ℃ for 10 minutes, the temperature of both substrates 2 and 4 was lowered to 840 ° C, and then baked for 6 hours to change to a superconducting phase, and the temperature dependence of the resistivity of the conductor lines of the upper substrate 2 The properties were measured.

第2図は実施例2,3および比較例1についての結果で
あり、実施例2,3のTcは約98Kと約100 Kであるのに対
し、比較例1は相転移は認められるものゝ、残留抵抗は
12mΩ・cmと大きく、超伝導状態になっていない。
FIG. 2 shows the results of Examples 2 and 3 and Comparative Example 1. In Examples 2 and 3, Tc was about 98 K and about 100 K, whereas Comparative Example 1 showed a phase transition.ゝ, the residual resistance is
It is as large as 12 mΩ · cm and is not in a superconducting state.

〔発明の効果〕〔The invention's effect〕

以上記したように本発明の実施により、超伝導相とす
るために行う焼成において生ずる組成ずれを最小限に押
えることが可能となり、これにより0.5mm以下の線幅の
微細パターンを形成する場合でも1mm以上の線幅と変わ
らぬTcの高い超伝導配線を作ることができる。
As described above, by implementing the present invention, it is possible to minimize the composition deviation that occurs in firing performed to make a superconducting phase, and thereby even when forming a fine pattern with a line width of 0.5 mm or less. Superconducting wiring with a high Tc that is the same as a line width of 1 mm or more can be made.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の原理図、 第2図は実施例について抵抗率の温度依存性を示す図、 第3図は本発明の実施に使用した焼成炉の断面図、であ
る。 図において、 1は配線パターン、2,4は基板、 3はダミーパターン、5,6は熱源、 である。
FIG. 1 is a diagram showing the principle of the present invention, FIG. 2 is a diagram showing the temperature dependence of the resistivity of the embodiment, and FIG. 3 is a sectional view of a firing furnace used for carrying out the present invention. In the figure, 1 is a wiring pattern, 2 and 4 are substrates, 3 is a dummy pattern, and 5 and 6 are heat sources.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 田中 厚志 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 亀原 伸男 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 平1−100825(JP,A) 特開 平1−239051(JP,A) 特開 平1−294560(JP,A) 特開 平2−38302(JP,A) (58)調査した分野(Int.Cl.6,DB名) H01L 39/00 - 39/02 H01L 39/22 - 39/24 H01L 39/06 H01B 12/00 - 12/16 H01B 13/00 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Atsushi Tanaka 1015 Uedanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Nobuo Kamehara 1015 Kamikodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited ( 56) References JP-A-1-100825 (JP, A) JP-A-1-2399051 (JP, A) JP-A-1-294560 (JP, A) JP-A-2-38302 (JP, A) ) Surveyed fields (Int.Cl. 6 , DB name) H01L 39/00-39/02 H01L 39/22-39/24 H01L 39/06 H01B 12/00-12/16 H01B 13/00

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】Bi−Pb−Sr−Ca−Cu−O系酸化物高温超伝
導体成分を被処理基板上に堆積して配線パターンを形成
した後、該基板を該Bi−Pb−Sr−Ca−Cu−O系酸化物高
温超伝導体成分からなるダミーパターンを形成した基板
に対向近接させて焼成炉中に設置し、ダミーパターンの
温度を少なくとも配線パターンの温度より高く保持して
焼成することを特徴とする超伝導配線の製造方法。
After a Bi-Pb-Sr-Ca-Cu-O-based oxide high-temperature superconductor component is deposited on a substrate to be processed to form a wiring pattern, the substrate is removed from the Bi-Pb-Sr- It is placed in a firing furnace so as to be opposed to and close to a substrate on which a dummy pattern made of a Ca-Cu-O-based oxide high-temperature superconductor component is formed, and is fired while maintaining the temperature of the dummy pattern at least higher than the temperature of the wiring pattern. A method for manufacturing a superconducting wiring, comprising:
【請求項2】請求項1記載のダミーパターンが配線パタ
ーンまたはベタパターンであることを特徴とする超伝導
配線の製造方法。
2. A method for manufacturing a superconducting wiring according to claim 1, wherein the dummy pattern is a wiring pattern or a solid pattern.
JP2150816A 1990-06-08 1990-06-08 Manufacturing method of superconducting wiring Expired - Lifetime JP2870993B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2150816A JP2870993B2 (en) 1990-06-08 1990-06-08 Manufacturing method of superconducting wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2150816A JP2870993B2 (en) 1990-06-08 1990-06-08 Manufacturing method of superconducting wiring

Publications (2)

Publication Number Publication Date
JPH0442584A JPH0442584A (en) 1992-02-13
JP2870993B2 true JP2870993B2 (en) 1999-03-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP2870993B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312803A (en) * 1990-10-17 1994-05-17 Fujitsu Limited Process for producing Bi- and Pb-containing oxide superconducting wiring films

Also Published As

Publication number Publication date
JPH0442584A (en) 1992-02-13

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