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JP2887382B2 - Bake equipment - Google Patents
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JP2887382B2 - Bake equipment - Google Patents

Bake equipment

Info

Publication number
JP2887382B2
JP2887382B2 JP4257291A JP25729192A JP2887382B2 JP 2887382 B2 JP2887382 B2 JP 2887382B2 JP 4257291 A JP4257291 A JP 4257291A JP 25729192 A JP25729192 A JP 25729192A JP 2887382 B2 JP2887382 B2 JP 2887382B2
Authority
JP
Japan
Prior art keywords
sublimate
pipe
bake
temperature
baking apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4257291A
Other languages
Japanese (ja)
Other versions
JPH0684782A (en
Inventor
徹朗 小山
秀彦 百瀬
英男 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Priority to JP4257291A priority Critical patent/JP2887382B2/en
Publication of JPH0684782A publication Critical patent/JPH0684782A/en
Application granted granted Critical
Publication of JP2887382B2 publication Critical patent/JP2887382B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、表面に回路パターンを
形成するガラス基板にフォトレジストを塗布する装置や
基板の現像を行う装置などに備わるベーク装置の改良に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a baking apparatus provided in an apparatus for applying a photoresist to a glass substrate having a circuit pattern formed on its surface, an apparatus for developing a substrate, and the like.

【0002】[0002]

【従来の技術】図2は液晶表示素子の製作の際に用いら
れる従来のベーク装置を示し、該装置はベークカバー1
1と下部カバー15とで形成される空間内に複数のベー
クプレート1,1とクールプレート2とを連続して配置
し、表面にレジストが塗布されたガラス基板(図示せ
ず)を、それぞれが所定温度に保持された上記ベークプ
レート1で加熱した後、ほぼ室温に保持された上記クー
ルプレート2で冷却し、回路不良を生じないように表面
のレジスト膜を硬化させるものであるが、その際、レジ
ストに含まれていた溶剤が揮発して昇華物が生じるの
で、下部カバー15に排気管16を取り付け、生じた昇
華物を矢印で示すように内部空気と共に外部に排出する
ようにしていた。
2. Description of the Related Art FIG. 2 shows a conventional baking apparatus used for manufacturing a liquid crystal display element.
A plurality of bake plates 1 and 1 and a cool plate 2 are continuously arranged in a space formed by the first cover 1 and the lower cover 15, and a glass substrate (not shown) having a surface coated with a resist is formed. After heating with the bake plate 1 kept at a predetermined temperature, it is cooled with the cool plate 2 kept at approximately room temperature, and the resist film on the surface is cured so as not to cause a circuit failure. Since the solvent contained in the resist volatilizes and sublimates are generated, an exhaust pipe 16 is attached to the lower cover 15 to discharge the generated sublimates to the outside together with the internal air as indicated by arrows.

【0003】[0003]

【発明が解決しようとする課題】上述した従来の装置で
は、レジストに含まれていた溶剤が揮発して生じた昇華
物の一部は、比較的温度の低いクールプレート上のベー
クカバー内側に付着堆積し、やがて処理される基板上に
落下してレジストパターンの形成不良を生じるという問
題点を有していた。本発明は、上記従来の問題点の解決
を課題とする。
In the above-mentioned conventional apparatus, a part of the sublimate generated by volatilization of the solvent contained in the resist adheres to the inside of the bake cover on a cool plate having a relatively low temperature. There is a problem in that the resist pattern is deposited and eventually falls on a substrate to be processed, thereby causing poor formation of a resist pattern. An object of the present invention is to solve the above conventional problems.

【0004】[0004]

【課題を解決する為の手段】本発明にかかるベーク装置
は、内部に昇華物が付着しない温度に保たれた昇華物防
着配管をクールプレートの上側と下部カバーの下側に接
続していると共に、昇華物混合気体中の昇華物を結晶化
して回収するトラップ部を各昇華物防着配管に連続して
設けていることを特徴とする
Baking apparatus according to the present invention means for solving the problems]
Connect the sublimate-prevention piping maintained at a temperature at which sublimate does not adhere to the upper side of the cool plate and the lower side of the lower cover.
Continue to have Rutotomoni, sublimation of the sublimate mixed gas crystallization
Characterized in that the trap portion which is recovered is provided continuously to each sublimate deposition preventive pipe.

【0005】[0005]

【作用】昇華物防着配管に配された熱線は、該昇華物防
着配管を内部に昇華物が付着しない温度に保つように作
用し、トラップ部に配された冷却配管は、ベーク装置か
らの排気を冷却し、排気中に含有されている昇華物を結
晶化させるように作用する。
The heating wire arranged in the sublimation-prevention pipe works so as to keep the sublimate-prevention pipe at a temperature at which sublimate does not adhere to the inside thereof. This cools the exhaust gas and acts to crystallize sublimates contained in the exhaust gas.

【0006】[0006]

【実施例】図1は本発明にかかるベーク装置の実施例を
示す略図であり、このベーク装置は、従来例と同様
ークカバー3と下部カバー8とで囲繞され空間内に
それぞれが所定温度に保持される複数のベークプレート
1,と、室温に保持されるクールプレート2とを連続
して配置したものである。そして、この際における下部
カバー8の下側には、昇華物が付着しない温度に保つ
線(図示せず)が内部に配された昇華物防着配管9が、
装置内部と連通した排気用の配管として接続されてい
る。さらに、この昇華物防着配管9は、内部に冷却配管
13されたトラップ部10を介したうえで排気管1
2と連続的に接続されている。
DETAILED DESCRIPTION FIG. 1 is Ri schematic der showing an embodiment of a baking apparatus according to the present invention, the baking apparatus of this, as in the conventional example, in which is surrounded by a baking cover 3 and the lower cover 8 space,
A plurality of bake plates 1, ... , each of which is maintained at a predetermined temperature, and a cool plate 2, which is maintained at a room temperature, are arranged continuously. A sublimation-prevention pipe 9 in which a heating wire (not shown) for keeping the temperature at which the sublimate does not adhere is disposed below the lower cover 8 at this time .
It is connected as exhaust piping communicating with the inside of the device.
You. Furthermore, the sublimate deposition preventive pipe 9, the exhaust pipe 1 upon via the trap portion 10 to the cooling pipe 13 to the inside is distribution
2 and are continuously connected.

【0007】又、クールプレート2の上には、ベーク
カバーに代わる排気取入口14、つまり、下端漸拡状
とされた排気取入口14設けられておりこの排気取
入口14には、昇華物が付着しない温度に保つ熱線(図
示せず)が内部に配された昇華物防着配管4接続され
ている。そして、この昇華物防着配管4も内部に冷却
配管6されたトラップ部5を介して排気管7と連続
的に接続されている。
[0007] In addition, in the upper side of the click Rupureto 2, bake
Inlet 14 taken generations Waru exhaust to cover, in other words, the lower end gradually拡状
And to exhaust inlet 14 is provided with, on the exhaust inlet 14, (not shown) heat rays to keep the temperature of the sublimate is not adhered sublimate deposition preventing pipe 4 arranged inside are connected <br/> The continuous this sublimate deposition preventing pipe 4 also, the exhaust pipe 7 via the trap portion 5 which cooling pipes 6 inside is distribution
They are connected to each other.

【0008】以上のように本発明のベーク装置は、装置
内部を熱線を配した昇華物防着配管と、該昇華物防着配
管と連続し、内部に冷却配管を配したトラップ部を介し
て外部と連通している。
[0008] As described above, the baking apparatus of the present invention comprises a sublimation-prevention pipe in which the inside of the apparatus is provided with a heating wire, and a trap section which is continuous with the sublimate-prevention pipe and in which a cooling pipe is disposed. Communicates with the outside world.

【0009】次に上記構成を有する本発明のベーク装置
の働きについて述べると、本発明のベーク装置は、従来
と同様に内部に搬入された液晶基板(図示せず)などの
表面に塗布されたレジストを所定温度に保持されたベー
クプレート1で加熱した後、クールプレート2で冷却
し、硬化させることにより、次工程でのエッチング精度
を向上させるものであるが、ここにおいて本発明のベー
ク装置では、上述したように装置の上下に、熱線を配し
た昇華物防着配管4,9が接続されているので、加熱し
た際にレジストに含まれていた溶剤が揮発して生じる昇
華物(図示せず)は、高温の内部空気と共に該昇華物防
着配管4,9から矢印で示すように吸い出される。よっ
て、発生した昇華物が温度低下により結晶化し、装置内
部に付着堆積することがなく、この堆積物がパターン形
成基板表面のレジスト膜上に落下することが原因のパタ
ーン不良の発生が防止される。そして上記昇華物防着配
管4,9から吸い出された昇華物混合気体は、冷却水な
どが循環する冷却配管6,13を配したトラップ部5,
10で冷却され、混入していた昇華物はここで結晶化
し、回収される。そして冷却後の空気は、排気管7,1
2から外部へと排出されるものである。
Next, the operation of the baking apparatus of the present invention having the above structure will be described. The baking apparatus of the present invention is applied to the surface of a liquid crystal substrate (not shown) or the like carried in similarly to the conventional one. After the resist is heated by the bake plate 1 kept at a predetermined temperature, it is cooled by the cool plate 2 and hardened, thereby improving the etching accuracy in the next step. Here, in the bake apparatus of the present invention, As described above, since the sublimation-preventing pipes 4 and 9 provided with heat rays are connected to the upper and lower portions of the apparatus, the sublimate generated by volatilization of the solvent contained in the resist when heated (FIG. Is sucked out from the sublimation-proof pipes 4 and 9 together with the high-temperature internal air as shown by arrows. Therefore, the generated sublimate does not crystallize due to a decrease in temperature and does not adhere and deposit inside the apparatus, and the occurrence of a pattern defect due to the deposit falling on the resist film on the surface of the pattern forming substrate is prevented. . The sublimate mixed gas sucked from the sublimate-prevention pipes 4 and 9 is supplied to a trap section 5 provided with cooling pipes 6 and 13 through which cooling water and the like are circulated.
The sublimate which has been cooled at 10 and mixed therein is crystallized and recovered here. The cooled air is supplied to the exhaust pipes 7 and 1
2 to the outside.

【0010】以上のように本発明のベーク装置では、液
晶基板が処理される際に生じる昇華物を、装置内で結晶
化させることなく吸い出し、回収するものである。
[0010] As described above, in the baking apparatus of the present invention, sublimates generated when a liquid crystal substrate is processed are sucked out and collected without being crystallized in the apparatus.

【0011】[0011]

【発明の効果】以上のように本発明のベーク装置では、
液晶基板が処理される際に生じる昇華物を、装置内で結
晶化させることなく吸い出し、トラップ部で回収するの
で、昇華物がパターン上に再付着することが原因のパタ
ーン不良を防止することができ、微細回路パターン形成
の際の製品歩留まりを向上させることができるという優
れた効果を奏する。
As described above, in the baking apparatus of the present invention,
Sublimates generated when the liquid crystal substrate is processed are sucked out without being crystallized in the apparatus, and collected in the trap section, so that pattern defects caused by the sublimates re-adhering to the pattern can be prevented. Thus, there is an excellent effect that the product yield in forming a fine circuit pattern can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明実施例の略図である。FIG. 1 is a schematic diagram of an embodiment of the present invention.

【図2】従来例の略図である。FIG. 2 is a schematic view of a conventional example.

【符号の説明】[Explanation of symbols]

1 ベークプレート 2 クールプレート 3 ベークカバー 4,9 昇華物防着配管 5,10 トラップ部 6,13 冷却配管 7,12 排気管 8 下部カバー DESCRIPTION OF SYMBOLS 1 Bake plate 2 Cool plate 3 Bake cover 4, 9 Sublimation prevention pipe 5, 10 Trap part 6, 13 Cooling pipe 7, 12 Exhaust pipe 8 Lower cover

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平3−209714(JP,A) 特開 昭63−181321(JP,A) 実開 平3−41926(JP,U) (58)調査した分野(Int.Cl.6,DB名) H01L 21/027 G02F 1/13 G03F 7/16 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-209714 (JP, A) JP-A-63-181321 (JP, A) JP-A-3-41926 (JP, U) (58) Field (Int.Cl. 6 , DB name) H01L 21/027 G02F 1/13 G03F 7/16

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ベークカバーと下部カバーで囲繞され
た空間内に所定温度に保持される複数のベークプレート
とクールプレートとを併設して成るベーク装置におい
、クールプレートの上側と下部カバーの下側には、
昇華物が付着しない温度に保たれた昇華物防着配管
を接続すると共に、昇華物防着配管には、昇華物混合
気体中の昇華物を結晶化し回収するトラップ部を連続
して設けていることを特徴とするベーク装置。
1. A plurality of baking plates which are held at a predetermined temperature in a space surrounded by the bake cover and lower cover
And the baking apparatus comprising features a click Rupureto, with the upper and lower side of the lower cover of the click Rupureto connects the sublimate deposition preventive piping drip retaining the temperature at which the sublimate does not adhere to the inside, the sublimation the Monobogi pipe, baking apparatus characterized by being arranged to sublimate sublimate in the gas mixture continuously trap portion for recovering crystallized.
JP4257291A 1992-08-31 1992-08-31 Bake equipment Expired - Lifetime JP2887382B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4257291A JP2887382B2 (en) 1992-08-31 1992-08-31 Bake equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4257291A JP2887382B2 (en) 1992-08-31 1992-08-31 Bake equipment

Publications (2)

Publication Number Publication Date
JPH0684782A JPH0684782A (en) 1994-03-25
JP2887382B2 true JP2887382B2 (en) 1999-04-26

Family

ID=17304337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4257291A Expired - Lifetime JP2887382B2 (en) 1992-08-31 1992-08-31 Bake equipment

Country Status (1)

Country Link
JP (1) JP2887382B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200194A (en) * 2008-02-21 2009-09-03 Tokyo Electron Ltd Heat treating apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4121122B2 (en) * 2003-04-01 2008-07-23 東京エレクトロン株式会社 Heat treatment apparatus and temperature control method in heat treatment apparatus
JP4290579B2 (en) * 2004-01-19 2009-07-08 大日本スクリーン製造株式会社 Substrate heating apparatus and substrate heating method
JP2009099671A (en) * 2007-10-15 2009-05-07 Renesas Technology Corp Coating apparatus and method for manufacturing semiconductor device using the same
WO2011148716A1 (en) * 2010-05-25 2011-12-01 シャープ株式会社 Bake device
WO2012176670A1 (en) * 2011-06-20 2012-12-27 シャープ株式会社 Sublimate removal device
KR20170026872A (en) * 2015-08-31 2017-03-09 삼성디스플레이 주식회사 Baking chamber for manufacturing photo-alignment layer
CN112703821B (en) * 2018-09-26 2024-03-08 夏普株式会社 Manufacturing device and manufacturing method of display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200194A (en) * 2008-02-21 2009-09-03 Tokyo Electron Ltd Heat treating apparatus

Also Published As

Publication number Publication date
JPH0684782A (en) 1994-03-25

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