JP2887992B2 - Manufacturing method of hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hybrid integrated circuit device, and more particularly to a method for manufacturing a hybrid integrated circuit device in which semiconductor elements, chip components, and the like are mounted on an organic substrate.

[0002]

2. Description of the Related Art Conventionally, a circuit pattern is formed on a single substrate for the purpose of streamlining production mainly by using an organic substrate (hereinafter, referred to as a substrate) such as a glass epoxy substrate, a phenol composite substrate, and a modified polyimide substrate. Edited multiple individual boards, mounted semiconductor elements, package parts, chip parts, etc. on each individual board.
In a method of dividing a substrate of a hybrid integrated circuit, which is divided into individual substrates when predetermined processes such as exterior and stamping are completed, cutting is performed by a press cutter using a mold.

That is, as shown in FIGS. 3A and 3B, an end of each individual substrate is fixed by a die 14 and a pad 13, and a predetermined cutting portion is cut by a punch 12. When performing punching and cutting with a mold, it is possible to punch around each individual substrate, but in order to facilitate punching, a part of the periphery of each individual substrate is left and connected to an outer frame or an adjacent individual substrate. There is also a method of forming a suspension pin and cutting it. Normally, in the case of a hybrid integrated circuit manufactured by such a method, the thickness of the substrate used is 0.6 to 2.0.
The width of the suspension pin in this case is about 1.0 mm.
About 5 mm. Depending on the product, an entire side may be left.

[0004]

In the conventional dividing method using a die press cutting machine, it is necessary to provide a margin for pressing a pad at least around a punch for cutting. The width of this pad is 1 to 2 mm, and the width around the punch is 2-3 mm in consideration of the positional accuracy.
mm margin is required. Since it is not preferable to provide a conductor pattern in a portion corresponding to the punch, there is a problem that a blank portion directly causes loss of the substrate.

In the case of punching with a mold, the hanging pin portion remains as a projection due to poor positional accuracy of 0.1 to 0.2 mm, and burrs remain on the cut portion due to wear of the punch, pad and die. However, there is a problem that the dimensional accuracy of the product is easily deteriorated.

Further, in the case of die press cutting and V-groove cutting, mechanical stress is applied to the periphery of the cut portion, so that there is a high risk of occurrence of trouble on the substrate or connection of mounted components. Was.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device having no loss of a substrate, high dimensional accuracy, and no trouble in connection of a substrate or connection of mounted components due to mechanical stress.

[0008]

SUMMARY OF THE INVENTION The present invention includes a semiconductor device, a package component, and a chip component on an individual substrate of an organic substrate including a glass epoxy substrate, a phenol composite substrate, and a modified polyimide substrate on which a circuit is formed. In the method of manufacturing a hybrid integrated circuit device on which components are mounted, a frame is provided around the organic substrate in which the plurality of individual substrates are edited, and the individual substrate is connected to the individual substrate adjacent to the frame. A step of providing a suspension pin having no conductor pattern and cutting the suspension pin with a laser beam.

[0009]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a laser beam cutting machine for explaining an embodiment of the present invention.

As shown in FIG. 1, a laser beam is applied to the hanging pins 9 of an individual substrate 11 to be cut from a substrate 1 placed on a stage 7 of a cutting machine, and the substrate 1 is cut. Divided into The laser cutting machine that emits a laser beam is configured by an optical system including a reflecting mirror 3 for adjusting an optical axis, a beam expander 4, a condenser lens 6, and the like for a laser beam 2 as a light source. Since the laser light 2 serving as a light source needs a relatively high output, a CO ₂ laser or the like can be used. The output of the laser beam 2 is
Depending on the thickness and material of
When cutting using an O ₂ laser, the substrate 1 can be cut to a thickness of about 2 mm at an output of 15 W. It is necessary to change the scanning speed of the laser beam on the substrate 1 due to the difference in the thickness of the substrate 1. The speed is, for example, 6 mm for a 1 mm thick glass epoxy substrate.
mm / S, 2m for 1.6mm thick glass epoxy board
An appropriate speed is about m / S.

FIG. 2 is a plan view of a board obtained by editing an individual board to be cut by the cutting machine shown in FIG.

As shown in FIG. 2, a plurality of individual substrates 11 are connected to the frame 8 or an adjacent individual substrate 11 by means of suspension pins 9, and the suspension pins 9 are required at the time of manufacturing the substrate. Do not include conductor patterns such as plated lead wires. Lead wires required for substrate manufacturing,
Alternatively, the conductor pattern for confirming the characteristics may be the individual substrate 11
Is placed in a slit part punched out by a mold around. Accordingly, it is possible to keep the laser cutting portion 10 free of the conductor pattern, and it is possible to easily divide the laser beam into the individual substrates 11 by using the above-described laser beam cutting method.

[0014]

As described above, the present invention provides the following effects by providing a suspension pin which does not include a conductor pattern on a board obtained by editing an individual board, and cutting the suspension pin by laser light. Is obtained.

(1) Space is not required for holding down the pad mold, which has conventionally been required for cutting with a mold, and substrate loss is eliminated.

(2) In the case of cutting with a metal mold, there is a tendency that projections or burrs are generated on individual substrates due to positional accuracy of the apparatus or abrasion of the metal mold, but a laser beam is used. In this case, although the cut portion is in a blown state, a cut surface almost flat is obtained.

(3) A cutting machine using a laser beam can easily add a position confirmation function, and can obtain a high dimensional accuracy of 0.1 mm or less.

(4) Since the conductor pattern is not provided on the suspension pin, there is no danger of an electrical failure.

(5) No mechanical stress is applied at the time of cutting, as in die press cutting or V-groove cutting, and the occurrence of product failure due to mechanical stress is eliminated.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a laser beam cutting machine illustrating an embodiment of the present invention.

FIG. 2 is a plan view of a substrate obtained by editing an individual substrate to be cut by the cutting machine of FIG. 1;

FIG. 3 is a cross-sectional view of a mold press shown in the order of steps for explaining an example of a conventional substrate cutting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Laser beam 3 Reflector for optical axis adjustment 4 Beam expander 5 Reflector 6 Condenser lens 7 Stage 8 Frame 9 Hanging pin 10 Laser cutting part 11 Single substrate 12 Punch 13 Pad 14 Die

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/56 H05K 3/00

Claims (1)

(57) [Claims] 1. A hybrid integrated circuit in which a component including a semiconductor element, a package component, and a chip component is mounted on an individual substrate of an organic substrate including a glass epoxy substrate, a phenol composite substrate, and a modified polyimide substrate on which a circuit is formed. In the method of manufacturing an apparatus, a frame around the organic substrate in which the plurality of individual substrates are edited, and a suspension pin having no conductor pattern connecting the individual substrate to the individual substrate adjacent to the frame. And providing a step of cutting the suspension pin with a laser beam.