JP3116404B2 - Manufacturing method of printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used for various electronic devices.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller, thinner, and lighter, electronic components have been mounted at higher density, and accordingly, demands for thinner and higher precision printed wiring boards have been increasing. . In addition, from the viewpoint of resource and energy savings, design methods and manufacturing methods to obtain as many printed wiring boards as possible and efficiently from copper-clad laminates of a certain size, which is the main material of printed wiring boards, and efficient use of electronic components Therefore, there is a necessity for grouping a plurality of printed wiring boards in order to perform a proper mounting.

In a conventional printed wiring board, when a plurality of individual printed wiring boards are assembled to form a single printed wiring board, the configuration is as shown in FIGS.

FIG. 3 (a) shows printed wiring boards 1, 2, 2
FIG. 3 is a plan view of a conventional collective printed wiring board in which three, four, and five are assembled by a discard plate 6 and a round hole 7 for division, and a deformed hole 8 for division is provided between the printed wiring boards. FIG.
(B) is a sectional view thereof.

FIG. 4A shows the printed wiring boards 1 and 2.
2, 3, 4, and 5 are gathered by the discarding plate 6 and the deformation hole 8 for division, and a plan view of a conventional collective printed wiring board designed to provide V cuts 9 from the front and back between printed wiring boards. is there. FIG. 4B is a sectional view.

[0006]

Conventionally, when a plurality of printed wiring boards are used as one collective printed wiring board, the space between adjacent printed wiring boards is shown in FIG.
4 (a) and 4 (b), a V-cut for the division is required, so that a processing width 10 at a constant interval is required. Therefore, in a collective printed wiring board in which a plurality of printed wiring boards are assembled, the outer dimensions of the collective printed wiring board are increased by the diameters of the dividing round holes 7 and the deformed holes 8 and the V-cut margin. For this reason, it is often alienated to efficiently obtain a collective printed wiring board from a copper-clad laminate of a certain size, which causes a problem such as a loss of material and an increase in manufacturing cost.
In addition, a V-cut that can make the processing margin relatively small can process only a straight line, and cannot form a V-cut for division with R or a step. In such a case, a round hole for division or a deformed hole is required. Must be provided. Furthermore, when a glass cloth epoxy resin laminated board is used as the laminated board, the state after division of the round hole for deformation, the deformed hole, the V-cut discarded board, the printed wiring board, and the connection portion between the printed wiring board and the printed wiring board is as follows. Glass fiber that has protruded from the board end surface and epoxy resin chips before peeling adhere to the board, significantly degrading the external dimensional accuracy of the printed wiring board after splitting, and the epoxy resin chips can affect the operation of precision components in electronic devices. Adversely affect.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a method of connecting a plurality of individual printed wiring boards each having a conductive pattern formed on at least one side thereof, and forming an adjacent individual printed wiring board. The plate ends are arranged side by side so as to contact each other without any gap, and the cross-sectional shape of the plate ends is rectangular. Further, in the present invention, a shearing process is performed by using a mold having a cutting edge partially provided only where necessary.

[0008]

The outer dimensions of a printed wiring board can be minimized by eliminating the space between adjacent individual printed wiring boards in the printed wiring board. Since the rectangular shape is separated by the shearing process and has no clearance, the rectangular shape can be easily separated at the time of division, and the generation of debris due to the division can be prevented.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIGS. 1 (a) and 1 (b) show a printed wiring board according to an embodiment of the present invention. In the drawing, a discard plate 6, a dividing round hole 7 and a dividing deformed hole 8 are used. Individual printed wiring board (thickness 0.5 mm) 11, 12, 13, 14, 1
5 are combined. Shear surface 1 between individual printed wiring boards 11, 12, 13, 14, 15
The intervals between 6, 17, 18, and 19 are 0 mm.

A method for obtaining such a printed wiring board will be described. First, a copper-clad laminate of a certain size is equally divided to obtain one panel, and an etching resist is applied.
A conductor pattern is formed by etching. The production films required for forming the conductor patterns are already assembled at the design stage, and the spacing between the individual printed wiring boards is designed to be 0 mm. Thereafter, a solder resist is applied, and punching and shearing of the outer shape, holes, portions necessary for division, and the like are performed by a mold according to the present invention to obtain a collective printed wiring board.

FIG. 2 is a schematic view of a mold used for punching shearing. In FIG. 2, reference numeral 20 denotes a die of a die, 21 denotes a punching punch which is elastically supported on the die 20 by a spring 22, and 23 denotes a printed wiring board.

In the embodiment of the present invention, the thickness of the printed wiring board is set to 0.5 mm. However, the present invention is not limited to this, and the separation between individual printed wiring boards is set to 0 mm. Although the portion is straight, it goes without saying that a radius or a step may be used.

[0014]

As described above, according to the present invention, in a printed wiring board in which a plurality of individual printed wiring boards are assembled, a structure and a shearing method that do not require the interval between the printed wiring boards are adopted. It is possible to minimize the size of the printed wiring board as a whole, and to obtain a printed wiring board efficiently from a copper-clad laminate of a certain size, eliminating material loss and eliminating the need for V-cut processing. It is effective in reducing manufacturing costs such as Further, the external dimensional accuracy of the printed wiring board after the division is remarkably improved, and the generation of debris of the laminated board from the end of the divided portion can be extremely reduced, so that the operation of the electronic device is not adversely affected.

[Brief description of the drawings]

1A is a plan view of a printed wiring board according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA of FIG.

2A is a plan view of a mold used for processing the printed wiring board of the present invention. FIGS. 2B and 2C are cross-sectional views taken along lines AA and BB in FIG.

FIG. 3A is a plan view of a conventional printed wiring board. FIG. 3B is a cross-sectional view taken along line AA in FIG.

FIG. 4A is a plan view of another example of the conventional printed wiring board. FIG. 4B is a cross-sectional view taken along line AA of FIG.

[Explanation of symbols]

 6 Discard plate 7 Round hole for division 8 Deformation hole for division 11, 12, 13, 14, 15 Individual printed wiring board 16, 17, 18, 19 Shear surface

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 1/02 H05K 3/00

Claims (1)

(57) [Claims] 1. A conductive pattern is formed on at least one surface.
Of a fixed size with multiple individual printed wiring boards
No stamping of the outer shape and the hole for dividing the laminated plate with the first mold
Performing a cutting process to obtain a collective printed wiring board;
Straight line between adjacent printed wiring boards of combined printed wiring
Contact with a shape or shape with a curve or step
Process for punching and shearing with the second die
To manufacture printed wiring boards.