JP2901576B2 - Supply mechanism for semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a supply mechanism for a semiconductor manufacturing apparatus (hereinafter, referred to as a supply mechanism), and more particularly to a supply mechanism for surely supplying a stacked semi-finished product one by one in a semiconductor manufacturing apparatus. .

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, there is a lead cutting (or lead forming) step after resin encapsulation. However, one semiconductor device already sealed with resin is stacked on a lead cutting device. Suction and supply each time. At this time, as shown in FIG. 5, the semiconductor device 4 has a missing tooth in order to remove a resin sealing portion which has become defective for some reason in the resin sealing process.

[0003] If the semiconductor device 4 with the missing tooth is to be sucked up by the suction pad 2, there is a problem that the suction pad 2 sucks the resin sealing portion thereunder and lifts up two products. As an adverse effect of supplying two sheets, deterioration of MTBA in a lead cutting device, breakage of a lead cutting die, and the like are raised. Further, as a technique for solving a left-back mistake and a take-out mistake, there is a well-known example 1 (Japanese Patent Application Laid-Open No. Hei 7-136965), which discloses a suction pad when a hand having an object height sensor descends and the object height sensor detects an object. And a control means for performing control of sucking an object and transferring the object to a predetermined supply destination. Furthermore, a known example 2 (Japanese Patent Laid-Open No. 7-2416) of detecting whether or not one work is attracted is detected.
No. 38), which detects the weight of a sheet material sucked and lifted by a suction pad with a weight sensor and detects whether the sucked sheet material is one or not.

[0004]

A first problem is that, in the prior art, a weight detecting sensor, a storage means for storing a detected value,
A comparison means for comparing the released values and a judgment means for judging the comparison result are required. The reason is that not only the mechanism is complicated, but also a sensor with high accuracy is required, and a control circuit is also required, so that the supply device itself becomes expensive.

[0005] The second problem is that an object height sensor is required to detect a take-out mistake or a left-back mistake in the prior art. The reason for this is that a high-accuracy sensor is required, and erroneous detection due to movement of the sensor is a concern.

A first object of the present invention is to provide a simple mechanism in a hand unit so that stacked semiconductor devices can be reliably transferred one by one to a predetermined supply destination without performing complicated control. It is to provide a supply mechanism.

A second object of the present invention is to provide a supply mechanism capable of surely transferring a semiconductor device to a predetermined supply destination without taking out mistakes or leaving mistakes.

A third object of the present invention is to provide a supply mechanism capable of reliably transferring a stacked semiconductor device to a predetermined supply destination without damaging the semiconductor device.

[0009]

According to the present invention, there is provided a semiconductor device supply mechanism comprising: a plurality of resin-sealed portions which are separately supplied one by one from a stacked state of resin-sealed lead frames; A suction nozzle for sucking each of these resin sealing portions; a buffer means for buffering the suction nozzles so as not to exceed a predetermined pressing amount when pushed down or pushed up by the resin sealing portion; and A suction pad attached to the tip of the resin-sealed lead frame and sucking the resin-sealed lead frame; and a length fixed to the suction nozzle and at least in contact with each of the plurality of resin sealing portions adjacent to the resin sealing portion. The thickness of the resin sealing portion is half the thickness of the suction nozzle.

According to the present invention, the suction pad sucks up the semiconductor device below the semiconductor device from which the tooth has fallen out, by means of the jammer plate for restricting the vertical movement of the suction nozzle by the resin sealing portion adjacent to the semiconductor device from which the leaf has fallen. This makes it impossible to prevent two sheets from being attracted. Further, this mechanism has a simple structure, and can pick up semiconductor devices one by one without using a high-precision sensor or the like.

[0011]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a front view of a supply mechanism according to an embodiment of the present invention, and FIG. 2 is a side view of the supply mechanism of FIG. Referring to FIG. 1 and FIG. 2, the supply mechanism according to the best embodiment of the present invention has a length at least about half the thickness of the resin sealing portion above the suction surface of the suction pad 2. The jammer plate 1 is provided so as to be in contact with the adjacent resin sealing portion. Further, the jammer plate 1 is fixed to a suction nozzle 12, and the suction nozzle 12 is configured so as not to exceed a predetermined pressing amount when pressed down by a buffer spring 3. When the hand vertical air cylinder 7 reaches the lower limit, the vacuum
N can be separated one by one by sucking and lifting the resin sealing portion of the semiconductor device from the suction pad 2. In the case of sucking the missing semiconductor device 4, the suction pad 2 cannot be lifted because the suction pad 2 does not hit the resin sealing portion of the semiconductor device below the jammer plate 1. This makes it possible to prevent two sheets from being sucked and lifted at the same time even if there is a missing tooth.

Next, the operation of the embodiment of the present invention will be described.

FIGS. 3A to 3F are side views showing the order of steps for explaining the suction operation of the supply mechanism according to one embodiment of the present invention. In the suction operation of the supply mechanism according to the embodiment of the present invention, first, the suction hand 2 moves from the standby position (a) to the position (b) where the semiconductor devices are stacked. The suction hand descends from that position (c) The hand descends until the suction pad 2 contacts the resin sealing portion of the semiconductor device and the suction nozzle 12 floats by about 5 mm. When the suction hand lowers to the lower limit, the vacuum is turned on, and the suction pad 2 sucks the semiconductor device 5 with no missing teeth. Next, the suction hand 2 rises to the upper limit (d). Thereafter, the suction hand moves to the first standby position in (e). Further, the suction hand is lowered at that position, and when it reaches the lower limit, the vacuum is turned off, suction is released, and the semiconductor device 5 without tooth loss is released (f). Thereafter, the suction hand rises and returns to the first standby position. The above operation is repeated.

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 4 is an enlarged side view of the jammer plate portion of the supply mechanism according to one embodiment of the present invention. Referring to FIG. 4, the jammer plate portion of the supply mechanism according to the embodiment of the present invention has the g
Is set to be at least 1/3 of the length of the resin-sealed portion regardless of the type of the semiconductor device, and the dimension h is set within the thickness of the resin-sealed portion. When the suction nozzle 12 has a cylindrical shape, a detent is provided so that the jammer plate 1 does not rotate.

Next, the operation of the embodiment of the present invention will be described.

Referring to FIG. 4, this state is a state in which the suction pad 2 is at the lower limit, the suction pad 2 hits the resin sealing portion of the semiconductor device, and the suction nozzle 12 escapes by the buffer spring 3. . The missing semiconductor device 4 cannot be sucked and lifted because the suction pad 2 cannot contact the resin sealing portion of the lower semiconductor device because the jammer plate 1 hits the resin sealing portion on both sides and the suction pad 2 cannot contact the resin sealing portion of the lower semiconductor device. Therefore, it is possible to prevent two wafers from being sucked, and to suck and lift the semiconductor devices 5 without missing teeth one by one.

[0019]

The first effect is that the operation rate of the supply mechanism of the semiconductor manufacturing apparatus is improved by eliminating the suction of two sheets. The reason for this is that if two sheets are adsorbed, the supply destination is determined to be abnormal, and the apparatus stops, resulting in a short stop and a deterioration in the operation rate.

The second effect is that the breakage of the lead cutting die is reduced by eliminating the suction of two sheets. The reason is 2
This is because, if the supply destination cannot be determined to be abnormal even though the sheets are adsorbed, two sheets flow to the lead cutting die and the cutting die punch is damaged when punched.

[Brief description of the drawings]

FIG. 1 is a front view of a supply mechanism according to an embodiment of the present invention.

FIG. 2 is a side view of the supply mechanism of FIG.

3 (a) to 3 (f) are side views showing the order of steps for explaining the suction operation of the supply mechanism according to the embodiment of the present invention.

FIG. 4 is an enlarged side view of a jamming plate portion having a supply function according to an embodiment of the present invention.

FIGS. 5A and 5B are a plan view and a side view of a semiconductor device in a toothless state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Jammer plate 2 Suction pad 3 Buffer spring 4 Toothed semiconductor device 5 Toothless semiconductor device 6 Stop ring 7 Hand vertical air cylinder 8 Transfer guide shaft 9 Transfer air cylinder 10 Transfer rail 11 Hose 12 Suction nozzle 21 Lead frame 22 Resin sealing

Claims (3)

(57) [Claims] 1. A supply mechanism of a semiconductor device for separately supplying a resin-sealed lead frame one by one from a stacked state, comprising: a plurality of resin sealing portions; and a suction nozzle for sucking each of the resin sealing portions. Buffer means for buffering these suction nozzles so as not to exceed a predetermined pressing amount when pushed down or pushed up to the resin sealing portion, and the resin-sealed lead frame attached to the tip of the suction nozzle. A suction pad fixed to the suction nozzle and at least half of the thickness of the resin sealing portions, the length being in contact with the respective resin sealing portions adjacent to the plurality of resin sealing portions; A supply mechanism for a semiconductor device, comprising a jammer plate receded from a suction surface of a nozzle. 2. The supply mechanism of a semiconductor device according to claim 1, wherein the suction surface is a suction surface of a suction pad that suctions through a vacuum. 3. The semiconductor device supply mechanism according to claim 1, wherein said buffer means is a buffer spring.